CN218920537U

CN218920537U - Vehicle-mounted ADAS high-pixel camera temperature drift heat radiation structure

Info

Publication number: CN218920537U
Application number: CN202223298301.6U
Authority: CN
Inventors: 蒋冰林; 陈海洋; 李自峰
Original assignee: Chongqing Tianshi Automobile Electronics Co ltd
Current assignee: Chongqing Tianshi Automobile Electronics Co ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-04-25
Anticipated expiration: 2032-12-02

Abstract

The utility model discloses a vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure, which comprises a module cavity formed by combining a module rear cover and a module front cover, wherein a Power PCB and a Sensor PCB are sequentially arranged in the module cavity from the module rear cover to the module front cover, and the Power PCB and the Sensor PCB are ceramic substrates with large-area copper exposure structures on the front surfaces; the Power PCB and the Sensor PCB are correspondingly locked with the module rear cover and the module front cover through locking holes on the Power PCB and the Sensor PCB respectively, a plurality of through holes are circumferentially arranged around the locking holes, copper columns are matched in the through holes, the end parts of each locking hole are connected with the through holes around the locking holes through copper sheets, and the copper sheets are abutted against the copper columns; the large-area copper exposing structures and copper sheets on the Power PCB and the Sensor PCB are correspondingly contacted with the metal shells of the module rear cover and the module front cover. The utility model solves the problem of image quality and recognition precision of the product caused by high temperature by reducing the temperature difference between the inside and the outside of the module, and simultaneously improves the service life of the product.

Description

Vehicle-mounted ADAS high-pixel camera temperature drift heat radiation structure

Technical Field

The utility model relates to the technical field of vehicle-mounted camera heat dissipation, in particular to a vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure.

Background

At present, the power consumption of the vehicle-mounted ADAS high-pixel camera module is high when in work, and the heating value of an electronic element is high, so that the image quality, the recognition precision and the service life of the module are influenced. The main heat dissipation modes of the camera module are as follows, (1) the PCB adopts FR4 base material, and is contacted with the shell for heat dissipation through the copper exposure treatment of the edge of the PCB; (2) the thickness of the PCB copper sheet is increased; (3) and heat is conducted out by adding radiating fins or heat-conducting silica gel and the like. However, various problems generally exist, such as (1) the heat dissipation efficiency is low, the PCB and the shell can only contact with the shell through a small amount of contact surface at the edge of the plate, the electronic chip is often positioned in the middle area of the PCB, the heat generated by the electronic chip needs to be transferred into the PCB firstly, and then the PCB transfers the heat to the surface of the shell for heat dissipation through the contact surface with the shell, but the heat conduction coefficient of the PCB FR4 substrate is low, the heat conduction coefficient is generally about 0.25W/m-k, the heat dissipation efficiency is low, and the temperature difference between the inside temperature and the outside temperature of the camera module is large; (2) the working life of the product is low, the temperature of the chip in the product exceeds the junction temperature of the electronic chip, and the chip runs under overload for a long time, so that the working life of the chip is reduced; (3) the quality of the product image is poor, and the quality of the product image is reduced after the internal temperature of the product is too high, such as the problems of reduced definition, serious thermal noise in dark environment, color cast of the image and the like; (4) the assembly process is complicated, and camera inner space is compact, and the heating plate assembly is complicated.

Disclosure of Invention

Aiming at the defects in the prior art, the utility model provides the vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure, which solves the problem of image quality and recognition precision of a product caused by high temperature by reducing the temperature difference between the inside and the outside of a module, and improves the service life of the product.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a on-vehicle ADAS high pixel camera temperature floats heat radiation structure, includes module back lid, module protecgulum, module back lid, module protecgulum combination become the module cavity, be equipped with Power PCB board, sensor PCB board in proper order from the module back lid to module protecgulum direction in the module cavity, wherein, power PCB board, sensor PCB board all adopt the ceramic substrate of openly large tracts of land copper structure;

the Power PCB and the Sensor PCB are correspondingly locked with the module rear cover and the module front cover through locking holes on the Power PCB and the Sensor PCB respectively, a plurality of through holes are circumferentially formed around the locking holes, copper columns are matched in the through holes, the end parts of each locking hole are connected with the surrounding through holes through copper sheets, and the copper sheets are abutted against the copper columns;

and the large-area copper exposing structures and copper sheets on the Power PCB and the Sensor PCB are correspondingly contacted with the metal shells of the module rear cover and the module front cover.

Further, the Power PCB and the Sensor PCB are respectively matched with the locking holes through screws and correspondingly locked on the module rear cover and the module front cover, a sealing ring is arranged between the Power PCB and the module rear cover, and the rear end of the Power PCB penetrates through the module rear cover to be connected with the connector; the front end of the Sensor PCB is correspondingly provided with a lens, and the lens is positioned on the front cover of the module.

Furthermore, the large-area copper exposing structure is flush with the copper sheet on the front end surfaces of the Power PCB and the Sensor PCB.

Furthermore, concave round platforms which are coaxially arranged with the locking holes are arranged on the end faces of the Power PCB and the Sensor PCB, and the copper sheets are embedded on the concave round platforms.

The beneficial effects of the utility model include: the high-thermal-conductivity ceramic substrate is utilized, and the front surface of the ceramic substrate is exposed to copper in a large area and then is contacted with the front and rear cover metal shells of the module, so that heat generated by an electronic chip is rapidly conducted to the camera shell, the temperature difference between the inside and the outside of the camera module is reduced, the image quality of the camera module in a high-temperature environment is finally and effectively improved, the image quality problem and the recognition precision of the camera are ensured, and the service life of a product is prolonged. Meanwhile, copper columns around the locking holes are used for releasing locking stress, so that the situation that the ceramic substrate is broken due to the locking stress is avoided, and the service life of the product is further prolonged.

Drawings

Fig. 1 is a structural view of the present embodiment;

FIG. 2 is an exploded view of the structure of the present embodiment;

fig. 3 is a schematic structural diagram of a PCB locking hole in this embodiment.

Detailed Description

The utility model will be described in further detail with reference to specific embodiments and drawings.

The vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure as shown in fig. 1-3 comprises a module rear cover 14 and a module front cover 11, wherein the module rear cover 14 and the module front cover 11 are combined into a module cavity, a Power PCB 13, a Sensor PCB 12 are sequentially arranged in the module cavity from the module rear cover 14 to the module front cover 11, and the Power PCB 13 and the Sensor PCB 12 are ceramic substrates with a front large-area copper exposure structure 16;

the Power PCB 13 and the Sensor PCB 12 are correspondingly locked with the module rear cover 14 and the module front cover 11 through locking holes 120 on the Power PCB 13 and the Sensor PCB 12 respectively, a plurality of through holes 121 are circumferentially arranged around the locking holes 120, copper columns 122 are matched in the through holes 121, the end part of each locking hole 120 is connected with the surrounding through holes 121 through copper sheets 123, and the copper sheets 123 are abutted against the copper columns 122 and used for avoiding the ceramic substrate from being broken due to locking stress;

the large-area copper

exposing structures

16 and 123 on the Power PCB 13 and the Sensor PCB 12 are respectively contacted with the metal shells of the module rear cover 14 and the module front cover 11.

In the scheme, the Power PCB 13 and the Sensor PCB 12 utilize 135-175 w/m-k ceramic substrates with high heat conductivity coefficients, meanwhile, the multilayer wiring and the front large-area copper exposure of the ceramic substrates are utilized to realize contact with the metal shells of the module rear cover 14 and the module front cover 11, heat generated by an electronic chip is transferred to the metal shells of the module rear cover 14 and the module front cover 11 through the PCB express, and then the heat is dissipated by the metal shells.

Specifically, the Power PCB 13 and the Sensor PCB 11 are respectively matched with the locking hole 120 through screws and correspondingly locked on the module rear cover 14 and the module front cover 11, a sealing ring is arranged between the Power PCB 13 and the module rear cover 14, and the rear end of the Power PCB 13 penetrates through the module rear cover 14 to be connected with the connector 15; the front end of the Sensor PCB 11 is correspondingly provided with a lens 10, and the lens 10 is positioned on the module front cover 11.

In fig. 3, in the locking process, the locking hole 120 is provided with a via hole 121 and a copper pillar 122 to cooperate to disperse and release the locking stress due to the fragile characteristic of the ceramic substrate. In the present case, the large-area copper exposing structure 16 and the copper sheet 123 are aligned on the front end surfaces of the Power PCB 13 and the Sensor PCB 11, so as to ensure the stability of the product in the assembly process, and meanwhile, the copper sheet 123 can assist the large-area copper exposing structure 16 to conduct heat.

The Power PCB 13, sensor PCB 12 terminal surface on have with lock pay hole 120 coaxial concave round platform that sets up, copper sheet 123 inlay on concave round platform, and copper sheet 123 and copper post 122 contact carry out lock pay stress sharing and release, and then avoid because of lock pay stress cause ceramic substrate cracked.

The large-area copper exposure structure of the Power PCB 13 and the Sensor PCB 12 in the present application belongs to a special term in the industry, and those skilled in the art can understand that redundant explanation is not made here.

The foregoing has described in detail the technical solutions provided by the embodiments of the present utility model, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present utility model, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present utility model; meanwhile, as for those skilled in the art, according to the embodiments of the present utility model, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present utility model.

Claims

1. The utility model provides a on-vehicle ADAS high pixel camera temperature floats heat radiation structure, lid (14), module protecgulum (11) behind the module, lid (14) behind the module, module protecgulum (11) make up into the module cavity, by in the module cavity lid (14) are equipped with Power PCB board (13), sensor PCB board (12) in proper order to module protecgulum (11) direction, its characterized in that: the Power PCB (13) and the Sensor PCB (12) are ceramic substrates with large-area copper exposing structures (16) on the front surfaces;

the Power PCB (13) and the Sensor PCB (12) are correspondingly locked with the module rear cover (14) and the module front cover (11) through locking holes (120) on the Power PCB and the Sensor PCB respectively, a plurality of through holes (121) are circumferentially formed around the locking holes (120), copper columns (122) are matched in the through holes (121), the end parts of each locking hole (120) are connected with the surrounding through holes (121) through copper sheets (123), and the copper sheets (123) are propped against the copper columns (122);

the large-area copper exposing structures (16) and the copper sheets (123) on the Power PCB (13) and the Sensor PCB (12) are respectively contacted with the metal shells of the module rear cover (14) and the module front cover (11).

2. The vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure according to claim 1, wherein: the Power PCB (13) and the Sensor PCB (12) are respectively matched with the locking holes (120) through screws and correspondingly locked on the module rear cover (14) and the module front cover (11), a sealing ring is arranged between the Power PCB (13) and the module rear cover (14), and the rear end of the Power PCB (13) penetrates through the module rear cover (14) to be connected with the connector (15); the front end of the Sensor PCB (12) is correspondingly provided with a lens (10), and the lens (10) is positioned on the module front cover (11).

3. The vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure according to claim 1, wherein: the large-area copper exposing structure (16) and the copper sheet (123) are flush on the front end surfaces of the Power PCB (13) and the Sensor PCB (12).

4. The vehicle-mounted ADAS high-pixel camera temperature drift heat dissipation structure according to claim 3, wherein: the Power PCB (13) and the Sensor PCB (12) are provided with concave round tables coaxially arranged with the locking holes (120), and the copper sheet (123) is embedded on the concave round tables.