CN218896478U - Novel copper busbar convenient to heat dissipation intensity is high - Google Patents

Abstract

The utility model discloses a novel copper bus convenient to dissipate heat and high in strength, which comprises a copper bus body, wherein a heat dissipation through groove is formed in the copper bus body, a first heat conduction layer is arranged on the inner surface of the heat dissipation through groove, the first heat conduction layer is connected with a first heat dissipation copper rod, a second heat conduction layer is arranged on the outer surface of the copper bus body, a second heat dissipation copper rod is connected with the surface of the second heat conduction layer, and a protective layer is arranged at one end of the second heat dissipation copper rod. According to the utility model, the heat radiating through groove is formed to increase the heat radiating area and improve the heat radiating capacity, the first heat conducting layer transmits the heat of the copper bus body to the first heat radiating copper rod, the heat radiating through groove is internally provided with the air flow for radiating the heat radiating copper rod, the heat radiation from the inner surface is completed, the second heat conducting layer transmits the heat of the copper bus body to the second heat radiating copper rod for radiating, the heat is radiated from the outer surface, the inner surface and the outer surface are simultaneously and independently radiated, and the heat radiating efficiency is improved.

Description

Novel copper busbar convenient to heat dissipation intensity is high

Technical Field

The utility model relates to the technical field of copper buses, in particular to a novel copper bus with high heat dissipation strength.

Background

Copper bus bar is an indispensable conductive material for manufacturing motor windings, high and low voltage electric appliances, switch contacts, wires for power supply and distribution installation and the like, is a main variety of copper processing materials, has higher mechanical property, good electric conductivity and thermal conductivity, excellent corrosion resistance, electroplating property and brazing property, attractive and beautiful metallic luster, good forming processability and the like, and therefore various power transmission and transformation equipment, electric appliance equipment and the like manufactured by the copper bus bar are widely applied in the electric power field.

The prior art has the following problems:

the patent of publication number CN210627930U is granted, a copper busbar that is used for electrician's conductivity is high is disclosed, including the copper busbar main part, copper busbar main part surface top fixedly connected with connecting block, the copper busbar main part passes through connecting block fixedly connected with picture peg, copper busbar main part inside keep away from picture peg one side and seted up the spout corresponding with the picture peg, the screw groove has been seted up to copper busbar main part inside one side, copper busbar main part lateral wall keeps away from screw groove one side fixedly connected with screw post.

The above patents have some disadvantages: the copper bus can transfer heat when conducting current in the working state, the temperature of the copper bus can be raised once the heat is accumulated, the conductivity of the metal material can be reduced once the temperature is raised, the heat dissipation effect influences the conductivity of the copper bus,

therefore, a novel copper bus with high heat dissipation strength is provided to solve the defects.

Disclosure of Invention

The utility model aims to solve the defects in the prior art, and provides a novel copper bus with high heat dissipation strength.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a novel copper busbar convenient to heat dissipation intensity is high, includes the copper busbar body, the inside heat dissipation logical groove of having seted up of copper busbar body, heat dissipation logical inslot surface mounting has first heat conduction layer, first heat conduction layer is connected with first heat dissipation copper bar, copper busbar body surface mounting has the second heat conduction layer, and second heat conduction layer surface connection has the second heat dissipation copper bar, the inoxidizing coating is installed to second heat dissipation copper bar one end, polyethylene film is all installed with second heat conduction layer surface.

Preferably, the first connecting block is installed to copper busbar body right-hand member, the connecting block is installed to copper busbar body left end, the screw hole has all been seted up to first connecting block and second connecting block, threaded hole screwed connection has the bolt, bolt screwed connection has the nut.

Preferably, the heat dissipation through grooves are provided with two groups.

Preferably, the first connecting block and the second connecting block are made of pure copper.

Preferably, the first heat dissipation copper rod and the second heat dissipation copper rod are both provided with a plurality of groups.

Preferably, the first heat conducting layer and the second heat conducting layer are both made of heat conducting silica gel materials.

Preferably, the bolts are provided in two groups.

Compared with the prior art, the utility model has the beneficial effects that;

1. according to the utility model, through the arrangement of the heat dissipation through groove, the first heat conduction layer, the second heat conduction layer, the first heat dissipation copper rod and the second heat dissipation copper rod, the heat dissipation of the copper bus body is facilitated, the heat dissipation area is increased by arranging the heat dissipation through groove, the heat dissipation capacity is improved, the first heat conduction layer transfers the heat of the copper bus body to the first heat dissipation copper rod, the heat dissipation copper rod is dissipated by flowing air flow in the heat dissipation through groove, the heat dissipation from the inner surface is completed, the heat of the copper bus body is transferred to the second heat dissipation copper rod by the second heat conduction layer, the heat dissipation is carried out from the outer surface, the independent heat dissipation is carried out on the inner surface and the outer surface at the same time, the heat dissipation efficiency is improved, the heat accumulation is prevented, the influence on the electric conduction performance and the power transmission efficiency of the copper bus body is avoided, and the protective layer and the polyethylene film play a role in protecting the copper bus body.

2. According to the copper bus body connecting structure, the first connecting block, the second connecting block, the threaded holes, the bolts and the nuts are arranged for use in a matched mode, connection between the copper bus bodies is facilitated, the fixing effect is good, the second connecting block is inserted into the middle of the first connecting block in a sliding mode from the side face to form clamping limit, then the bolts are inserted into the threaded holes in a threaded mode, the nuts are used for fixing, connection and fixation of the copper bus bodies are achieved, mounting and dismounting are convenient, and flexibility is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments will be briefly described below.

FIG. 1 is a schematic diagram of a novel copper busbar with high heat dissipation strength;

FIG. 2 is a schematic cross-sectional view of a novel copper busbar with high heat dissipation strength;

FIG. 3 is a schematic diagram of a novel copper bus body connection with high heat dissipation strength;

fig. 4 is an enlarged schematic diagram of a novel copper busbar a with high heat dissipation strength.

Legend description:

1. a copper busbar body; 2. a first connection block; 3. a second connection block; 4. a threaded hole; 5. a bolt; 6. a nut; 7. a heat dissipation through groove; 8. a protective layer; 9. a first heat conductive layer; 10. a first heat dissipating copper rod; 11. a polyethylene film; 12. a second heat conductive layer; 13. and the second heat dissipation copper rod.

Detailed Description

The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.

Referring to fig. 1-4, a novel copper busbar with high heat dissipation strength is convenient, the novel copper busbar comprises a copper busbar body 1, a heat dissipation through groove 7 is formed in the copper busbar body 1, a first heat conduction layer 9 is installed on the inner surface of the heat dissipation through groove 7, the first heat conduction layer 9 is connected with a first heat dissipation copper rod 10, a second heat conduction layer 12 is installed on the outer surface of the copper busbar body 1, a second heat dissipation copper rod 13 is connected to the surface of the second heat conduction layer 12, a protective layer 8 is installed at one end of the second heat dissipation copper rod 13, polyethylene films 11 are installed on the surfaces of the first heat conduction layer 9 and the second heat conduction layer 12, and a plurality of groups of first heat dissipation copper rods 10 and second heat dissipation copper rods 13 are arranged.

In this embodiment: through setting up heat dissipation logical groove 7, first heat conduction layer 9, second heat conduction layer 12, the cooperation of first heat dissipation copper pole 10 and second heat dissipation copper pole 13 is used, be convenient for dispel the heat to copper busbar body 1, increase heat radiating area through seting up heat dissipation logical groove 7, promote heat dissipation ability, first heat conduction layer 9 is with the heat transfer of copper busbar body 1 to first heat dissipation copper pole 10, the air current that flows through of heat dissipation logical inslot 7 is dispel the heat to the heat dissipation copper pole, accomplish and dispel the heat from the internal surface, the heat transfer of second heat conduction layer 12 with copper busbar body 1 is to second heat dissipation copper pole 13, dispel the heat from the surface, the internal and external surface independently dispel the heat simultaneously, promote radiating efficiency, prevent that the heat from piling up, avoid influencing copper busbar's conductive property and transmission efficiency.

Specifically, the first connecting block 2 is installed to copper busbar body 1 right-hand member, the connecting block is installed to copper busbar body 1 left end, screw hole 4 has all been seted up to first connecting block 2 and second connecting block 3, threaded hole 4 internal screw connection has bolt 5, bolt 5 screwed connection has nut 6.

In this embodiment: through setting up the cooperation use of first connecting block 2, second connecting block 3, screw hole 4, bolt 5 and nut 6, be convenient for connect between the copper busbar body 1, and fixed effectual, through sliding the second connecting block 3 from the side insert in the middle of first connecting block 2, form the joint spacing, insert screw 5 screw thread into screw hole 4 inside again, fix through nut 6, accomplish and connect fixedly copper busbar body 1, the installation is dismantled conveniently, increase the flexibility.

Specifically, two groups of heat dissipation through grooves 7 are formed.

In this embodiment: by arranging two groups of heat dissipation through grooves 7, the heat dissipation area is increased.

Specifically, the first heat conducting layer 9 and the second heat conducting layer 12 are both made of heat conducting silica gel materials.

In this embodiment: the first heat conduction layer 9 and the second heat conduction layer 12 are made of heat conduction silica gel materials, so that the heat conduction silica gel has super heat conduction effect, and also has excellent dampproof, shock-resistant, corona-resistant, electric leakage-resistant and chemical medium-resistant performances.

Specifically, the bolts 5 are provided in two groups.

In this embodiment: by arranging two groups of bolts 5, the connection firmness is improved.

Working principle: offer heat dissipation through groove 7 and increase heat radiating area, promote heat radiation ability, first heat conduction layer 9 is with the heat transfer of copper busbar body 1 to first heat dissipation copper bar 10, the air current that flows through of heat dissipation through groove 7 is dispelled the heat to the heat dissipation copper bar, accomplish and dispel the heat from the internal surface, second heat conduction layer 12 is with the heat transfer of copper busbar body 1 to second heat dissipation copper bar 13, dispel the heat from the surface, heat dissipation is independently carried out on the internal and external surfaces simultaneously, promote radiating efficiency, prevent that the heat from piling up, avoid influencing copper busbar's conductive property and transmission efficiency, through inserting second connecting block 3 from the side slip in the middle of the first connecting block 2, form the joint spacing, it is inside to insert screw hole 4 with the bolt 5 spiral again, fix through nut 6, accomplish and connect fixedly to copper busbar body 1, the installation is dismantled conveniently, increase the flexibility.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (7)

1. The utility model provides a novel copper busbar convenient to heat dissipation intensity is high, includes copper busbar body (1), a serial communication port, copper busbar body (1) inside has seted up heat dissipation logical groove (7), heat dissipation logical inslot (7) internally mounted has first heat conduction layer (9), first heat conduction layer (9) are connected with first heat dissipation copper bar (10), copper busbar body (1) external surface installs second heat conduction layer (12), and second heat conduction layer (12) surface connection has second heat dissipation copper bar (13), inoxidizing coating (8) are installed to second heat dissipation copper bar (13) one end, polyethylene film (11) are all installed on first heat conduction layer (9) and second heat conduction layer (12) surface.

2. The novel copper busbar with high heat dissipation intensity convenient to use according to claim 1, wherein a first connecting block (2) is installed at the right-hand member of the copper busbar body (1), the connecting block is installed at the left-hand member of the copper busbar body (1), threaded holes (4) are all offered to the first connecting block (2) and the second connecting block (3), threaded holes (4) are internally and spirally connected with bolts (5), and nuts (6) are spirally connected with the bolts (5).

3. The novel copper bus bar with high heat dissipation strength is characterized in that two groups of heat dissipation through grooves (7) are formed.

4. The novel copper bus convenient to heat dissipation strength is high according to claim 2, wherein the first connecting block (2) and the second connecting block (3) are made of pure copper.

5. The novel copper bus bar with high heat dissipation strength convenient to use according to claim 1 is characterized in that the first heat dissipation copper bar (10) and the second heat dissipation copper bar (13) are provided with a plurality of groups.

6. The novel copper bus bar with high heat dissipation strength according to claim 1, wherein the first heat conduction layer (9) and the second heat conduction layer (12) are both made of heat conduction silica gel materials.

7. The novel copper busbar with high heat dissipation strength facilitating performance according to claim 2, wherein the bolts (5) are provided with two groups.

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