CN218891141U - Semiconductor device punching device - Google Patents
Semiconductor device punching device Download PDFInfo
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- CN218891141U CN218891141U CN202223473855.5U CN202223473855U CN218891141U CN 218891141 U CN218891141 U CN 218891141U CN 202223473855 U CN202223473855 U CN 202223473855U CN 218891141 U CN218891141 U CN 218891141U
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Abstract
The utility model discloses a semiconductor device punching device, comprising: the panel and the stamping device are fixedly arranged above the panel through the first supporting plate, the stamping motor is fixedly connected with the first supporting plate, the stamping plate is positioned between the stamping motor and the panel, and the output end of the stamping motor is fixedly connected with the stamping plate through the stamping post; the lower surface of the stamping plate is provided with a clearance groove, two sides of the clearance groove are provided with a strip groove, an opening groove communicated with the strip groove is arranged below the strip groove, a plurality of striking plates are arranged at the bottom of the strip groove and above the opening groove, the lower parts of the striking plates are connected with a rib cutting column through connecting sheets, the connecting sheets are positioned inside the opening groove, and the rib cutting column corresponds to the pin strips of the semiconductor sheet. The semiconductor device punching device not only realizes simultaneous rib cutting of a plurality of semiconductor devices and improves the processing efficiency, but also effectively reduces the integral fracture condition of the semiconductor strips and improves the integral yield.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor device punching device.
Background
The semiconductor is typically formed by mounting various semiconductor dice on a leadframe using a plurality of leads and then forming packages on the leadframe, after which the packages and a length of the leads are singulated from the unitary frame of the semiconductor device to form individual semiconductors, and the leads are simultaneously shaped during the singulation process, which is referred to as "dicing".
Most of the existing rib cutting devices adopt a stepping rib cutting method, namely, a semiconductor device is integrally placed into rib cutting equipment, and then packaging bodies on the semiconductor device are singly cut off one by one, so that the efficiency is low.
Disclosure of Invention
The utility model aims to provide a semiconductor device punching device which not only realizes the simultaneous rib cutting of a plurality of semiconductor devices and improves the processing efficiency, but also effectively reduces the integral fracture condition of semiconductor strips and improves the integral yield.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a semiconductor device die-cutting apparatus comprising: the panel and the stamping device are fixedly arranged above the panel through the first supporting plate, and a stamping area is arranged below the stamping device and positioned in the middle of the top surface of the panel;
the punching device further includes: the stamping motor is fixedly connected with the first supporting plate, the stamping plate is positioned between the stamping motor and the panel, and the output end of the stamping motor is fixedly connected with the stamping plate through the stamping post;
the lower surface of punching press board has one and keeps away the position groove, is located this both sides of keeping away the position groove and has all seted up a bar groove, is located the below of this bar groove and has an open slot with bar groove intercommunication, the top of bar groove is provided with a non-Newton fluid strip, is provided with a plurality of striking board in the bottom of this bar groove and above being located the open slot, and the below of this striking board is connected with a rib post through the connection piece, and this connection piece is located the open slot inside, the rib post corresponds with the pin strip of semiconductor piece.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, be provided with a plurality of locating hole in the both sides of punching press district the both sides fixed mounting of punching press board has the second backup pad, and the lower surface of this second backup pad is provided with a plurality of reference column, the reference column corresponds the cooperation with the locating hole.
2. In the above scheme, the positioning hole is a cross-shaped hole.
3. In the above scheme, the connecting sheet is an elastic sheet.
4. In the above scheme, the connecting sheet is of a wavy structure.
5. In the scheme, the inside of the avoidance groove is provided with the soft cushion.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model relates to a punching device for a semiconductor device, wherein a clearance groove is formed in the lower surface of a punching plate, two sides of the clearance groove are respectively provided with a strip groove, an opening groove communicated with the strip groove is formed below the strip groove, a non-Newtonian fluid strip is arranged at the top of the strip groove, a plurality of impact plates are arranged at the bottom of the strip groove and above the opening groove, the lower parts of the impact plates are connected with a rib cutting column through connecting pieces, the connecting pieces are positioned in the opening groove, the rib cutting column corresponds to pin strips of the semiconductor chip, and the cooperation of the non-Newtonian fluid strip, the impact plates and the rib cutting column realizes the simultaneous rib cutting of a plurality of semiconductor devices, improves the processing efficiency, and can greatly reduce the extrusion force of the semiconductor strips after the rib cutting is finished, thereby effectively reducing the integral fracture condition of the semiconductor strips and improving the integral yield. .
Drawings
FIG. 1 is a schematic view of a die-cutting apparatus for semiconductor devices according to the present utility model;
FIG. 2 is a schematic view of the structure of a semiconductor wafer of the present utility model;
FIG. 3 is a schematic view of the structure of the stamping plate of the present utility model;
fig. 4 is a schematic view of a part of the die-cutting apparatus of the present utility model.
In the above figures: 1. a panel; 101. a punching area; 2. a punching device; 3. a first support plate; 4. a stamping motor; 5. stamping a column; 6. a stamping plate; 8. a clearance groove; 9. a bar-shaped groove; 10. an open slot; 11. a non-newtonian fluid strip; 12. an impingement plate; 13. a connecting sheet; 14. cutting rib columns; 15. positioning holes; 17. a second support plate; 18. positioning columns; 19. a soft cushion; 100. a semiconductor wafer; 200. and a semiconductor pin.
Detailed Description
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: a semiconductor device die-cutting apparatus comprising: the panel 1 and the stamping device 2 are fixedly arranged above the panel 1 through a first supporting plate 3, and a stamping area 101 is arranged in the middle of the top surface of the panel 1 and below the stamping device 2;
the punching device 2 further includes: the stamping motor 4 is fixedly connected with the first supporting plate 3, the stamping plate 6 is positioned between the stamping motor 4 and the panel 1, and the output end of the stamping motor 4 is fixedly connected with the stamping plate 6 through the stamping column 5;
through setting up punching press motor and punching press post, can drive stamping device downward movement to semiconductor strip becomes the bending, and during operation, operating personnel makes punching press motor switch-in power and open punching press motor's switch, and punching press motor begins work, can drive punching press post downward impact, thereby makes stamping device punch out the semiconductor wafer, accomplishes and cuts the muscle work.
The lower surface of the stamping plate 6 is provided with a clearance groove 8, two sides of the clearance groove 8 are provided with a strip groove 9, an opening groove 10 communicated with the strip groove 9 is arranged below the strip groove 9, the top of the strip groove 9 is provided with a non-Newtonian fluid strip 11, the bottom of the strip groove 9 and the upper part of the opening groove 10 are provided with a plurality of impact plates 12, the lower parts of the impact plates 12 are connected with a rib cutting column 14 through connecting pieces 13, the connecting pieces 13 are positioned in the opening groove 10, and the rib cutting column 14 corresponds to the leg connecting strip 200 of the semiconductor wafer 100;
in the downward stamping process of the stamping plate, the rib cutting column can be extruded with the semiconductor strip, so that the semiconductor strip is deformed in rib cutting, the non-Newtonian fluid strip is arranged, when the stamping plate moves upwards rapidly, the rib cutting column cuts the semiconductor strip due to the physical characteristics of the non-Newtonian fluid strip, after the stamping device descends rapidly to finish rib cutting operation, the impact plate does not extrude the non-Newtonian fluid strip rapidly, at the moment, the non-Newtonian fluid strip presents soft physical characteristics, and the rib cutting column does not extrude the semiconductor strip forcefully under the cooperation of the wavy elastic sheet, so that the integral fracture condition of the semiconductor strip is reduced, and the safety of a semiconductor device is greatly improved.
The two sides of the stamping area 101 are provided with a plurality of positioning holes 15, the two sides of the stamping plate 6 are fixedly provided with a second supporting plate 17, the lower surface of the second supporting plate 17 is provided with a plurality of positioning columns 18, and the positioning columns 18 are correspondingly matched with the positioning holes 15.
The connecting piece 13 has a wavy structure.
The first support plate 3 is a C-shaped support plate.
Example 2: a semiconductor device die-cutting apparatus comprising: the panel 1 and the stamping device 2 are fixedly arranged above the panel 1 through a first supporting plate 3, and a stamping area 101 is arranged in the middle of the top surface of the panel 1 and below the stamping device 2;
the punching device 2 further includes: the stamping motor 4 is fixedly connected with the first supporting plate 3, the stamping plate 6 is positioned between the stamping motor 4 and the panel 1, and the output end of the stamping motor 4 is fixedly connected with the stamping plate 6 through the stamping column 5;
the lower surface of the stamping plate 6 is provided with a clearance groove 8, two sides of the clearance groove 8 are provided with a strip groove 9, an opening groove 10 communicated with the strip groove 9 is arranged below the strip groove 9, the top of the strip groove 9 is provided with a non-Newtonian fluid strip 11, the bottom of the strip groove 9 and the upper side of the opening groove 10 are provided with a plurality of impact plates 12, the lower side of the impact plates 12 is connected with a rib cutting column 14 through a connecting sheet 13, the connecting sheet 13 is positioned inside the opening groove 10, the rib cutting column 14 corresponds to the leading foot strip 200 of the semiconductor wafer 100, and the cooperation of the non-Newtonian fluid strip, the impact plates and the rib cutting column is realized, so that the processing efficiency is improved, the extrusion force of the semiconductor strip is greatly reduced after the rib cutting is finished, the whole breaking condition of the semiconductor strip is effectively reduced, and the whole yield is improved.
The two sides of the stamping area 101 are provided with a plurality of positioning holes 15, the two sides of the stamping plate 6 are fixedly provided with a second supporting plate 17, the lower surface of the second supporting plate 17 is provided with a plurality of positioning columns 18, and the positioning columns 18 are correspondingly matched with the positioning holes 15.
The positioning hole 15 is a cross-shaped hole; the positioning column 18 is a cross-shaped column.
The connecting piece 13 is an elastic piece.
A soft cushion 19 is provided in the clearance groove 8. The setting of cushion can realize buffering the semiconductor wafer main part at the in-process of punching press, avoids the condition that the hard contact leads to the semiconductor chip to damage.
The first support plate 3 is a C-shaped support plate.
The working principle of the utility model is as follows:
when the semiconductor strip bending machine is used, the stamping device can be driven to move downwards through the arrangement of the stamping motor and the stamping column, so that the semiconductor strip bending machine bends, and when the semiconductor strip bending machine works, an operator enables the stamping motor to be connected with a power supply and turns on a switch of the stamping motor, the stamping motor starts to work and drives the stamping column to impact downwards, and therefore the stamping device stamps the semiconductor strip, and rib cutting work is completed;
in the downward stamping process of the stamping plate, the rib cutting column can be extruded with the semiconductor strip, so that the semiconductor strip is deformed in rib cutting, the non-Newtonian fluid strip is arranged, when the stamping plate moves upwards rapidly, the rib cutting column cuts the semiconductor strip due to the physical characteristics of the non-Newtonian fluid strip, after the stamping device descends rapidly to finish rib cutting operation, the impact plate does not extrude the non-Newtonian fluid strip rapidly, at the moment, the non-Newtonian fluid strip presents soft physical characteristics, and the rib cutting column does not extrude the semiconductor strip forcefully under the cooperation of the wavy elastic sheet, so that the integral fracture condition of the semiconductor strip is reduced, and the safety of a semiconductor device is greatly improved.
When the semiconductor device punching device is adopted, the device is matched with the non-Newtonian fluid strips, the impact plate and the rib cutting columns, so that the rib cutting is performed on a plurality of semiconductor devices at the same time, the processing efficiency is improved, the extrusion force on the semiconductor strips can be greatly reduced after the rib cutting is finished, the overall breakage condition of the semiconductor strips is effectively reduced, and the overall yield is improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (6)
1. A semiconductor device die-cutting apparatus comprising: panel (1) and stamping device (2), its characterized in that: the stamping device (2) is fixedly arranged above the panel (1) through the first supporting plate (3), is positioned in the middle of the top surface of the panel (1), and is provided with a stamping area (101) below the stamping device (2);
the punching device (2) further includes: the device comprises a stamping motor (4), a stamping column (5) and a stamping plate (6), wherein the stamping motor (4) is fixedly connected with a first supporting plate (3), the stamping plate (6) is positioned between the stamping motor (4) and a panel (1), and the output end of the stamping motor (4) is fixedly connected with the stamping plate (6) through the stamping column (5);
the stamping device is characterized in that the lower surface of the stamping plate (6) is provided with a clearance groove (8), two sides of the clearance groove (8) are provided with a strip groove (9), an opening groove (10) communicated with the strip groove (9) is arranged below the strip groove (9), a non-Newtonian fluid strip (11) is arranged at the top of the strip groove (9), a plurality of impact plates (12) are arranged at the bottom of the strip groove (9) and above the opening groove (10), the lower part of the impact plates (12) is connected with a rib cutting column (14) through a connecting sheet (13), the connecting sheet (13) is positioned inside the opening groove (10), and the rib cutting column (14) corresponds to a pin strip (200) of the semiconductor chip (100).
2. The semiconductor device die-cutting apparatus according to claim 1, wherein: a plurality of positioning holes (15) are formed in two sides of the stamping area (101), a second supporting plate (17) is fixedly arranged on two sides of the stamping plate (6), a plurality of positioning columns (18) are arranged on the lower surface of the second supporting plate (17), and the positioning columns (18) are correspondingly matched with the positioning holes (15).
3. The semiconductor device die-cutting apparatus according to claim 2, wherein: the positioning holes (15) are cross-shaped holes.
4. The semiconductor device die-cutting apparatus according to claim 1, wherein: the connecting sheet (13) is an elastic sheet.
5. The semiconductor device die-cutting apparatus according to claim 1, wherein: the connecting sheet (13) is of a wave-shaped structure.
6. The semiconductor device die-cutting apparatus according to claim 1, wherein: a soft cushion (19) is arranged in the avoidance groove (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223473855.5U CN218891141U (en) | 2022-12-26 | 2022-12-26 | Semiconductor device punching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223473855.5U CN218891141U (en) | 2022-12-26 | 2022-12-26 | Semiconductor device punching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218891141U true CN218891141U (en) | 2023-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223473855.5U Active CN218891141U (en) | 2022-12-26 | 2022-12-26 | Semiconductor device punching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218891141U (en) |
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2022
- 2022-12-26 CN CN202223473855.5U patent/CN218891141U/en active Active
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