CN218890944U - Laser cleaning and polishing equipment - Google Patents

Abstract

The application provides a laser cleaning and polishing apparatus, comprising: the cabinet is provided with a workbench; the clamping assembly is arranged on the workbench and used for clamping the workpiece and rotating the workpiece; the light path system is arranged on the cabinet, the light outlet end of the light path system is provided with an adjusting mirror surface for adjusting the light path, the adjusting mirror surface is positioned above the clamping assembly, and the adjusting mirror surface can rotate relative to the clamping assembly; the laser processing head is used for laser cleaning and polishing. According to the laser cleaning and polishing equipment provided by the application, the curved surfaces of the complex workpieces can be cleaned and polished from a plurality of different angles, and the application range of the laser cleaning and polishing equipment is improved.

Description

Laser cleaning and polishing equipment

Technical Field

The application relates to the technical field of surface treatment, in particular to laser cleaning and polishing equipment.

Background

In the modern manufacturing industry, the surface of a workpiece is often required to be cleaned and polished, so that the surface of the workpiece is tidy, the polishing work is traditionally performed by adopting a manual operation mode, the polishing precision is poor, the efficiency is low, and the polishing quality lacks consistency and stability; moreover, the task of hand polishing is extremely tedious.

Aiming at the problems, the laser cleaning and laser polishing technology is developed, the laser cleaning and the laser polishing belong to non-contact machining processes, the automation of the machining processes can be realized through computer program control, the controllability is strong, and the advantages of high precision, high efficiency, high stability and the like are achieved.

However, the conventional laser cleaning and laser polishing has low efficiency, and can only clean or polish a workpiece with a simple structure or a single workpiece, and cannot effectively clean and polish the surface of a complex member, so that the application range of the laser cleaning and polishing device is small.

Disclosure of Invention

The application provides a laser cleaning and polishing equipment, can polish the surface of complicated work piece from different angles and wash, can improve laser polishing equipment's application range.

According to one aspect of the present application, there is provided a laser cleaning and polishing apparatus comprising:

the equipment comprises a cabinet, wherein a workbench is arranged on the cabinet;

the clamping assembly is arranged on the workbench and used for clamping a workpiece and rotating the workpiece;

the light path system is arranged on the cabinet, the light outlet end of the light path system is provided with an adjusting mirror surface for adjusting the light path, the adjusting mirror surface is positioned above the clamping assembly, and the adjusting mirror surface can rotate relative to the clamping assembly.

In one possible design manner, the optical path system includes a laser generator disposed in the cabinet and an optical fiber for transmitting light emitted by the laser generator, where a light emitting end of the optical fiber is located at one side of the adjusting mirror.

In one possible design, the optical path system further includes a position adjustment assembly, and the adjusting mirror is movably disposed on the position adjustment assembly.

In one possible design, the position adjusting assembly includes a column disposed on the cabinet and a first driving member slidably connected with the column, an output shaft of the first driving member has a connecting member, and the adjusting mirror is connected with the first driving member through the connecting member.

In one possible embodiment, the laser polishing device further comprises a laser cleaning head, which is connected to the laser generator by an optical fiber.

In one possible embodiment, the laser cleaning head is connected to the first drive element and can be moved relative to the table by the drive of the first drive element.

In one possible design, the clamping assembly includes a clamping member and a second driving member, the clamping member is rotationally connected with the workbench, an output shaft of the second driving member is connected with the clamping member, and the second driving member is used for driving the clamping member to rotate on the workbench.

In one possible design, the laser polishing apparatus further includes a gas path system for providing a shielding gas to the surface of the workpiece.

In one possible design, the air path system includes an air storage tank arranged in the cabinet and a protective cover covered on the clamping assembly, and the air storage tank is communicated with the inside of the protective cover through an air transmission pipeline.

In one possible design manner, the laser polishing apparatus further includes a controller, where the controller is disposed in the cabinet, and the controller is electrically connected to the clamping assembly and the optical path system, and is used to control the working states of the clamping assembly and the optical path system.

According to the laser cleaning and polishing device, the workpiece is rotated through the clamping assembly, the adjusting mirror surface is arranged at the light emitting end of the light path system, and the angle of laser irradiated to the workpiece is adjusted by rotating the adjusting mirror surface relative to the clamping assembly and then rotating the workpiece relative to the clamping assembly; thus, the laser can polish various angles of the complex workpiece in cooperation with the rotation of the workpiece by the clamping assembly. Compared with the prior art, each face and corner of the complex workpiece can be polished from a plurality of different angles, and the application range of the laser polishing equipment is improved.

The construction of the present application, as well as other objects and advantages thereof, will be described in detail with reference to the accompanying drawings, to ensure that the description of the preferred embodiments is more clearly understood.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief description will be given below of the drawings that are needed in the embodiments or the prior art descriptions, it being obvious that the drawings in the following description are some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.

FIG. 1 is a schematic view of the overall structure of a laser cleaning and polishing apparatus provided in an embodiment of a first aspect of the present application;

FIG. 2 is a right side view of a laser cleaning and polishing apparatus provided in accordance with an embodiment of the first aspect of the present application;

FIG. 3 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 2;

FIG. 4 is a front view of a laser cleaning and polishing apparatus provided in accordance with an embodiment of the first aspect of the present application;

FIG. 5 is a schematic view of the overall structure of a laser cleaning and polishing apparatus according to an embodiment of the second aspect of the present application;

fig. 6 is a front view of a laser cleaning and polishing apparatus provided in accordance with an embodiment of the second aspect of the present application.

Reference numerals illustrate:

10-a cabinet; 20-a clamping assembly; 30-an optical path system; 40-cleaning the head; 50-an air path system; 60-a controller;

11-a workbench; 21-a clamping member; 22-a second driving member; 31-adjusting the mirror; a 32-laser generator; 33-a position adjustment assembly; 51-an air storage tank; 52-protecting cover;

331-an upright; 332-a first driver; 333-connectors.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "inner," "outer," "upper," "bottom," "front," "rear," and the like indicate an orientation or a positional relationship (if any) based on that shown in fig. 1, merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.

With reference to fig. 1 to 3, fig. 1 isbase:Sub>A schematic view illustrating an overall structure ofbase:Sub>A laser cleaning and polishing apparatus according to an embodiment of the first aspect of the present application, fig. 2 isbase:Sub>A right side view of the laser cleaning and polishing apparatus according to an embodiment of the first aspect of the present application, and fig. 3 isbase:Sub>A cross-sectional view taken along linebase:Sub>A-base:Sub>A in fig. 2. According to an embodiment of the first aspect of the present application, there is provided a laser cleaning and polishing apparatus comprising: the cabinet 10, the cabinet 10 is provided with a workbench 11.

Specifically, in this embodiment of the present application, the cabinet 10 may be made of aluminum alloy, stainless steel or other metal or alloy materials, and an installation rack may be provided in the cabinet 10, and standard installation holes may be formed in the installation rack, so that components in the cabinet 10 may be installed and fixed conveniently.

It can be appreciated that, since other electronic devices can be installed in the cabinet 10, when the electronic devices are working, a certain amount of heat can be generated, in order to prevent dangerous situations caused by heat aggregation even if the electronic devices in the cabinet 10 are radiated, referring to fig. 1 and 3, in the embodiment of the application, a radiating hole is formed in the cabinet body of the cabinet 10 and is communicated with the inside and the outside of the cabinet 10, so that the convection of air inside and outside the cabinet 10 can be enhanced, and even if the electronic devices are radiated.

The material of the table 11 may be the same as or different from that of the cabinet 10, and in some possible examples, the table 11 may be made of polished metal plate and fixed on the top of the cabinet 10 by a connection member such as a screw, a screw or a screw rod. Alternatively, the table 11 may be a polished marble plate or a table of another material.

The clamping assembly 20, the clamping assembly 20 is located on the workbench 11, and the clamping assembly 20 is used for clamping the workpiece and rotating the workpiece.

Specifically, in the embodiment of the present application, the clamping assembly 20 may be a three-grip chuck or a four-grip chuck, and the clamping assembly 20 may be rotatably connected to the table 11, for example, may be rotatably connected to the table 11 through a bearing. In this way, the workpiece is clamped by the clamping unit 20 and then rotated on the table 11, so that the laser beam can be irradiated onto each surface of the workpiece, and each surface of the complex workpiece can be polished.

In some possible examples, the clamping assembly 20 may also be an electrically controlled permanent magnet chuck, and when a workpiece is required to be polished, the workpiece may be placed on the electrically controlled permanent magnet chuck, and the electrically controlled permanent magnet chuck is powered on by the control knob, so that the workpiece may be stably clamped, and a stable clamping force may be provided for the workpiece.

The optical path system 30 is arranged on the cabinet 10, the light emitting end of the optical path system 30 is provided with an adjusting mirror surface 31 for adjusting the optical path, the adjusting mirror surface 31 is positioned above the clamping assembly 20, the adjusting mirror surface 31 can rotate relative to the clamping assembly 20, and the adjusting mirror surface 31 is used for adjusting the angle of light irradiation on a workpiece.

Alternatively, in embodiments of the present application, the optical path system 30 may include a laser head disposed on the cabinet 10. The adjusting mirror surface 31 can be supported above the workbench 11 by a supporting member, and particularly can be supported above a workpiece, laser emitted by the laser head can irradiate the adjusting mirror surface 31, and the laser irradiates the surface of the workpiece after being reflected by the adjusting mirror surface 31, so that the surface of the workpiece is polished.

Specifically, in the embodiment of the present application, the adjusting mirror 31 may be rotatably connected to the support through a rotation shaft, so that when the adjusting mirror 31 is rotated, the irradiation angle and the irradiation direction of the laser may be adjusted.

In some possible ways, the rotation of the adjusting mirror 31 may be driven by a servo motor, a stepper motor or a synchronous motor, so that the rotation angle of the adjusting mirror 31 can be accurately controlled.

According to the laser cleaning and polishing device provided by the embodiment of the application, the workpiece is rotated through the clamping assembly 20, the adjusting mirror surface 31 is arranged at the light emitting end of the light path system 30, and the angle of laser irradiated on the workpiece is adjusted by rotating the adjusting mirror surface 31 relative to the clamping assembly 20 so as to rotate relative to the workpiece on the clamping assembly 20; in this way, the laser is able to polish various angles of a complex workpiece in coordination with the rotation of the workpiece by the clamping assembly 20. Compared with the prior art, each face and corner of the complex workpiece can be polished from a plurality of different angles, and the application range of the laser polishing equipment is improved.

Optionally, referring to fig. 3, in the embodiment of the present application, the optical path system 30 includes a laser generator 32 disposed in the cabinet 10 and an optical fiber (not shown in the drawing) for transmitting light emitted by the laser generator 32, where an light emitting end of the optical fiber is located at one side of the adjusting mirror 31.

In this embodiment, with laser generator 32 setting in rack 10, rack 10 can play the guard action to laser generator 32, effectively prolongs laser generator 32's life. In addition, the laser is transmitted through the optical fiber, so that the laser energy loss can be avoided, and the energy utilization rate can be improved.

It will be appreciated that the laser generator 32 may be connected to a power source and convert electrical energy provided by the power source into laser light energy.

The light emitting end of the optical fiber can be arranged on one side of the reflecting surface of the adjusting mirror surface 31, so that laser can be completely reflected by the adjusting mirror surface 31, energy loss can be avoided, and energy utilization rate is improved.

Optionally, with continued reference to fig. 1-3, in an embodiment of the present application, the optical path system 30 further includes a position adjustment assembly 33, and the adjusting mirror 31 is movably disposed on the position adjustment assembly 33.

Specifically, the position adjusting unit 33 may be an electric cylinder, a gas cylinder, a piston cylinder, or the like, and the adjusting mirror 31 is provided on the position adjusting unit 33.

In this way, the position of the adjustment mirror 31 can be adjusted by the position adjustment unit 33, so that the position where the laser beam is irradiated onto the workpiece can be changed, and polishing treatment can be performed on different positions of the workpiece.

In a specific example, the position adjusting assembly 33 includes a column 331 provided on the cabinet 10 and a first driving member 332 slidably connected to the column 331, an output shaft of the first driving member 332 has a connection member 333, and the adjusting mirror 31 is connected to the first driving member 332 through the connection member 333.

Specifically, in the embodiment of the present application, the bottom end of the upright 331 may be fixedly connected to the cabinet 10, for example, by a bolt, a screw, or a screw. It will be appreciated that in some possible ways, the post 331 may also be connected to the cabinet 10 by welding.

The first driving member 332 may be connected to the upright 331 through a slider, a sliding cylinder, or a linear cylinder or an electric cylinder, so that the first driving member 332 may be driven by the slider, the sliding cylinder, or the linear cylinder or the electric cylinder to move up and down along the upright 331, and thus, the position adjusting assembly 33 may drive the adjusting mirror 31 to move in a vertical direction, so as to polish a vertical surface of a complex workpiece.

Alternatively, in the embodiment of the present application, the first driving member 332 may be a cylinder, an electric cylinder, a piston cylinder, or the like, where the cylinder may be a linear cylinder, a sliding cylinder, or the like. The first driving member 332 can also drive the adjustment mirror 31 to move in the horizontal direction, so that the horizontal plane of the complex workpiece can be polished.

Alternatively, referring to fig. 1 and 2, in the embodiment of the present application, the clamping assembly 20 includes a clamping member 21 and a second driving member 22, where the clamping member 21 is rotationally connected to the table 11, an output shaft of the second driving member 22 is connected to the clamping member 21, and the second driving member 22 is used to drive the clamping member 21 to rotate on the table 11.

Specifically, in this embodiment of the present application, the clamping member 21 may be the foregoing three-jaw chuck, four-jaw chuck, or electric control permanent magnetic chuck, etc., the clamping member 21 may be specifically located above the working table 11, a rotating shaft and a bearing may be disposed at the bottom of the clamping member 21, and the bearing may be mounted on the working table 11, so that the clamping member 21 may rotate on the working table 11.

The second driving member 22 may be a servo motor, a stepper motor, a synchronous motor, or the like, a worm or a gear may be disposed on a rotor or an output shaft of the second driving member 22, a gear is correspondingly disposed on a rotating shaft of the clamping member 21, and the gear of the clamping member 21 is meshed with the worm or the gear on the output shaft of the second driving member 22, so as to drive the clamping member 21 to rotate.

The clamping piece 21 is driven to rotate through the stepping motor, the synchronous motor or the servo motor, so that the rotation angle of the clamping piece 21 can be accurately controlled, and the complex surface of the complex workpiece can be accurately polished.

It is understood that when polishing the surface of some metal workpieces (e.g., aluminum workpieces), the surface of the workpiece is easily oxidized by oxygen in the air after polishing, which results in insufficient luster of the surface of the workpiece and affects the beauty of the product. To avoid this, polishing is usually performed on some workpieces that are susceptible to oxidation, and polishing can be performed in an inert gas atmosphere. Specifically, referring to fig. 3, the laser polishing apparatus according to the first aspect of the present application further includes an air path system 50, where the air path system 50 is configured to provide a shielding gas for a surface of a workpiece.

Specifically, the gas circuit system 50 in the embodiment of the present application may provide inert gases such as nitrogen, helium, xenon, and the like, and deliver the inert gases to the polished surface of the workpiece, so as to remove air near the workpiece, and effectively protect the polished surface of the workpiece, and improve the glossiness of the polished surface of the workpiece.

Alternatively, referring to fig. 3, the air path system 50 includes an air tank 51 provided in the cabinet 10 and a protection cover 52 provided on the clamping assembly 20, and the air tank 51 is communicated with the inside of the protection cover 52 through an air transmission pipe.

Specifically, the gas tank 51 may be a pressurized tank or a high-pressure tank, and the inert gas may be stored in the gas tank 51. When polishing a workpiece, the protective cover 52 may be further disposed outside the workpiece Zhou Zhao, where the protective cover 52 may be made of the same material as the cabinet 10. Of course, the protection cover 52 may be made of a material different from that of the cabinet 10.

In particular use, a top cover may be provided on top of the protective cover 52 to encapsulate the workpiece, so that the workpiece is entirely in the inert gas separation, and the surface gloss of the workpiece after polishing can be maintained without oxidation during polishing.

It can be understood that, for the aforementioned optical path system 30, the clamping assembly 20, the air path system 50, etc., the laser polishing apparatus provided in this embodiment of the present application further includes a controller 60, where the controller 60 is disposed in the cabinet 10, and the controller 60 is electrically connected to the clamping assembly 20 and the optical path system 30, respectively, and is used for controlling the working states of the clamping assembly 20 and the optical path system 30.

Specifically, in the embodiment of the present application, the controller 60 may be a central processing unit (central processing unit, CPU), a micro control unit (Microcontroller Unit, MCU), or a Field programmable gate array (Field-programmable gate array, FPGA), etc.

Of course, in some possible examples, the controller 60 may also be a host computer or a device such as a computer provided with the above CPU, MCU or FPGA.

It can be appreciated that, in order to control each component in the laser polishing apparatus conveniently, the laser polishing apparatus provided in the embodiment of the application may also be provided with a display, and information such as current control parameters may be displayed through the display.

A fan can be further arranged in the cabinet 10, and heat is dissipated in the cabinet 10 through the fan, so that the convection intensity of air inside and outside the cabinet 10 can be improved, and the heat dissipation efficiency is improved.

Alternatively, referring to fig. 4, fig. 4 is a front view of a laser polishing apparatus according to an embodiment of the first aspect of the present application. In this embodiment, still be equipped with the cabinet door on the rack 10, the cabinet door rotates with rack 10 to be connected, can conveniently overhaul and change the internal equipment of cabinet like this.

According to a second aspect of the embodiments of the present application, referring to fig. 5 and 6, fig. 5 is a schematic view of the overall structure of a laser cleaning and polishing apparatus according to the second aspect of the embodiments of the present application, and fig. 6 is a front view of the laser cleaning and polishing apparatus according to the second aspect of the embodiments of the present application. The second aspect of the embodiment of the present application provides a laser cleaning and polishing apparatus that differs from the previous embodiments in that it further includes a laser cleaning head 40, the laser cleaning head 40 being connected to the laser generator 32 by an optical fiber.

It will be appreciated that, for some workpieces, dust may adhere to the surface of the workpiece or form an oxide layer after long-term use, which affects the appearance and quality of the workpiece, and at this time, the laser cleaning head 40 may clean the surface of the workpiece to maintain the luster of the surface of the workpiece.

Optionally, in this embodiment, the laser cleaning head 40 may be a hand-held cleaning head, and may be placed or stored in the cabinet 10 when not in use, and taken out from the cabinet 10 when the cleaning function is needed, and then connected with light for cleaning.

In one possible example, the laser cleaning head 40 is coupled to the first driving member 332 and is movable relative to the table 11 under the driving of the first driving member 332.

In particular, as described with reference to fig. 5 and 6, the laser cleaning head 40 may be located on the side opposite the connection 333. Thus, the laser cleaning head 40 can work together with the laser polishing at the same time, and work polishing and cleaning efficiency can be effectively improved.

Of course, in some possible examples, the connection 333 may be detachably connected (e.g., fastened, hung, etc.) to the first driving member 332, and when the surface of the workpiece needs to be cleaned, the connection 333 may be detached, and then the laser cleaning head 40 may be mounted on the first driving member 332.

Thus, the laser polishing equipment not only can realize the function of polishing the surface of the complex workpiece, but also can simultaneously carry out laser cleaning on the surface of the complex workpiece to remove dust, greasy dirt or oxide layers and the like on the surface of the complex workpiece. The application range of the laser polishing equipment can be effectively improved.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A laser cleaning and polishing apparatus comprising:

the equipment comprises a cabinet (10), wherein a workbench (11) is arranged on the cabinet (10);

the clamping assembly (20) is arranged on the workbench (11), and the clamping assembly (20) is used for clamping a workpiece and rotating the workpiece;

the light path system (30) is arranged on the cabinet (10), the light emitting end of the light path system (30) is provided with an adjusting mirror surface (31) for adjusting the light path, the adjusting mirror surface (31) is positioned above the clamping assembly (20), and the adjusting mirror surface (31) can rotate relative to the clamping assembly (20).

2. The laser cleaning and polishing apparatus according to claim 1, wherein the optical path system (30) includes a laser generator (32) provided in the cabinet (10) and an optical fiber for transmitting light emitted from the laser generator (32), and an light emitting end of the optical fiber is located at one side of the adjustment mirror (31).

3. The laser cleaning and polishing apparatus according to claim 2, wherein the optical path system further comprises a position adjustment assembly (33), the adjustment mirror (31) being movably disposed on the position adjustment assembly (33).

4. A laser cleaning and polishing apparatus according to claim 3, characterized in that the position adjustment assembly (33) comprises a column (331) provided on the cabinet and a first driving member (332) slidably connected to the column (331), an output shaft of the first driving member (332) having a connecting member (333), and the adjustment mirror (31) being connected to the first driving member (332) through the connecting member (333).

5. The laser cleaning and polishing apparatus according to claim 4, further comprising a laser cleaning head (40), the laser cleaning head (40) being connected to the laser generator (32) by an optical fiber.

6. The laser cleaning and polishing apparatus according to claim 5, wherein the laser cleaning head (40) is connected to the first driving member (332) and is movable relative to the table (11) by the driving of the first driving member (332).

7. The laser cleaning and polishing apparatus according to claim 1, wherein the clamping assembly (20) comprises a clamping member (21) and a second driving member (22), the clamping member (21) being rotatably connected to the table (11), an output shaft of the second driving member (22) being connected to the clamping member (21), the second driving member (22) being adapted to drive the clamping member (21) to rotate on the table (11).

8. The laser cleaning and polishing apparatus according to claim 1, further comprising a gas path system (50), the gas path system (50) being configured to provide a shielding gas to a surface of the workpiece.

9. The laser cleaning and polishing apparatus according to claim 8, wherein the gas path system (50) includes a gas tank (51) provided in the cabinet (10) and a protective cover (52) provided over the clamping assembly (20), the gas tank (51) being in communication with an inside of the protective cover (52) through a gas pipe.

10. The laser cleaning and polishing apparatus according to any one of claims 1 to 9, further comprising a controller (60), said controller (60) being provided within said cabinet (10), said controller (60) being electrically connected to said clamping assembly (20) and said optical path system (30), respectively, and being adapted to control the operating conditions of said clamping assembly (20) and said optical path system (30).

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