CN218888773U

CN218888773U - Universal hot-pressing bottom die assembly

Info

Publication number: CN218888773U
Application number: CN202223346015.2U
Authority: CN
Inventors: 邱太郎; 杨巨波; 林佳薇
Original assignee: Dongguan New Power Electronics Co ltd
Current assignee: Dongguan New Power Electronics Co ltd
Priority date: 2022-12-14
Filing date: 2022-12-14
Publication date: 2023-04-18
Anticipated expiration: 2032-12-14

Abstract

The utility model discloses a universal hot-pressing bottom die assembly, which comprises a frame, a bottom die for positioning a PCB circuit board and a tool device for positioning an assembled product; through be provided with on the die block be used for with the hot pressing on the reference column cooperation location's of mould hot pressing locating hole, and be provided with on the die block be used for with the outside mechanical hand on the reference column cooperation place the PCB circuit board when the PCB locating hole of location, the cooperation is provided with on the die block and is used for the absorbent first vacuum adsorption mechanism with PCB circuit board, this kind of die block structure can effectively fix the product and be applicable to different models, the product of equidimension not, the commonality is better, effectively with the golden finger of PCB circuit board and the golden finger hot pressing of equipment product circuit board, need not change different die blocks when the product of different models of production, the retooling time has been saved, and the operation is simple and convenient, greatly promote production efficiency, bring convenience for production, and can reduce production cost, satisfy current demand.

Description

Universal hot-pressing bottom die assembly

Technical Field

The utility model relates to a tool field technique especially indicates a general type hot pressing die block subassembly.

Background

The jig is a tool for carpenters, ironmen, pincers workers, machines, electric controls and other handicrafts, and is mainly used as a tool for assisting in controlling positions or actions. With the development of society, the types of jigs are more and more, and the jigs are more and more widely applied to industrial production. The jig can be divided into a process assembly type jig, a project test type jig and a circuit board test type jig. The process assembly type jig comprises an assembly jig, a welding jig, a disassembly jig, a dispensing jig, an irradiation jig, an adjustment jig, a shearing jig and the like; the project test type jig comprises a service life test type jig, a packaging test type jig, an environment test type jig, an optical test type jig, a shielding test type jig, a sound insulation test type jig and the like; the circuit board testing jig mainly comprises an ICT testing jig, an FCT function testing jig, an SMT furnace-passing testing jig, a BGA testing jig and the like.

With the development of social economy and the improvement of living standard of people, electronic products become ubiquitous; in the production process of electronic product, generally all can involve the connection operation of golden finger on the PCB circuit board, among the prior art, thereby generally can adopt hot pressing machine to carry out the hot pressing with fixed electric connection with the golden finger on two PCB circuit boards, the hot pressing die block has all been offered the fixed slot usually and has been used for the structure fixed with the product cooperation, this kind of hot pressing die block generally all is the product use that provides a model specially, because the product size variation of different models, then need change different die blocks during the product of production different models, the operation is comparatively loaded down with trivial details, production efficiency is lower, bring inconvenience for production, and manufacturing cost is higher, can not satisfy current demand. Therefore, it is necessary to develop a method for solving the above problems.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model discloses to the disappearance that prior art exists, its main objective provides a general type hot pressing die block subassembly, and it needs to change different die blocks when effectively solving the product of producing different models, and the operation is comparatively loaded down with trivial details, and production efficiency is lower, brings inconvenience for production, and the higher problem of manufacturing cost.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a universal hot-pressing bottom die assembly comprises a rack, a bottom die for positioning a PCB (printed circuit board) and a tool device for positioning an assembled product; the bottom die is arranged on the rack, a hot-pressing positioning hole used for being matched and positioned with a positioning column of the hot-pressing upper die is arranged on the bottom die, a PCB positioning hole used for being matched and positioned with the positioning column on the external manipulator when a PCB is placed is arranged on the bottom die, the PCB positioning hole is positioned beside the hot-pressing positioning hole, and a first vacuum adsorption mechanism used for adsorbing the PCB is arranged on the bottom die; the tool device is arranged on the rack and located on the front side of the bottom die, and a second vacuum adsorption mechanism used for adsorbing an assembled product is arranged on the tool device.

As a preferred scheme, the number of the hot pressing positioning holes is two, the two hot pressing positioning holes are symmetrically arranged on the front side of the bottom die in the left-right direction, the number of the PCB positioning holes is two, and the two PCB positioning holes are arranged on the left side and the right side of the bottom die and located on the rear sides of the two hot pressing positioning holes.

As a preferred scheme, be provided with closing device in the frame, this closing device is including support, cylinder and the clamp plate that is used for compressing tightly the equipment product circuit board, and this support has two connecting rods, and two connecting rods set up in the frame, and above-mentioned die block is located between two connecting rods, and this cylinder can make a round trip to set up on the support around, and this clamp plate sets up on the cylinder and makes a round trip to make a round trip by the cylinder drive, and this clamp plate is articulated with two connecting rods.

As a preferred scheme, the tooling device comprises a driving mechanism and a tooling fixture, the driving mechanism can be movably arranged on the frame along the X axis and the Y axis back and forth, the tooling fixture is arranged on the driving mechanism and driven by the driving mechanism to move back and forth along the X axis and the Y axis, and the second vacuum adsorption mechanism is arranged on the tooling fixture.

As a preferred scheme, the driving mechanism comprises a first stepping motor and a second stepping motor, the first stepping motor can be movably arranged on the rack back and forth along the Y axis, the second stepping motor can be movably arranged on the first stepping motor back and forth along the X axis and driven by the first stepping motor to move back and forth along the Y axis, and the tool jig is arranged on the second stepping motor and follows the second stepping motor to move back and forth along the X axis and the Y axis.

Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:

through be provided with on the die block be used for with the hot pressing on the reference column cooperation location's of mould hot pressing locating hole, and be provided with on the die block be used for with the outside mechanical hand on the reference column cooperation place the PCB circuit board when the PCB locating hole of location, the cooperation is provided with on the die block and is used for the absorbent first vacuum adsorption mechanism with PCB circuit board, this kind of die block structure can effectively fix the product and be applicable to different models, the product of equidimension not, the commonality is better, effectively with the golden finger of PCB circuit board and the golden finger hot pressing of equipment product circuit board, need not change different die blocks when the product of different models of production, the retooling time has been saved, and the operation is simple and convenient, greatly promote production efficiency, bring convenience for production, and can reduce production cost, satisfy current demand.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic perspective view of a preferred embodiment of the present invention;

FIG. 2 is a schematic perspective view of another embodiment of the present invention;

FIG. 3 is a top view of the preferred embodiment of the present invention;

FIG. 4 is a schematic view of the structure of the preferred embodiment of the present invention;

FIG. 5 is a schematic view of another embodiment of the present invention;

fig. 6 is an enlarged schematic view at a position a in fig. 5.

The attached drawings indicate the following:

10. frame 20, bottom die

21. Hot press positioning hole 22, PCB positioning hole

23. First vacuum adsorption mechanism 30 and tooling device

31. Second vacuum adsorption mechanism 32 and driving mechanism

321. First step motor 322, second step motor

33. Tooling jig 40 and PCB

50. Assembled product 51 and assembled product circuit board

60. Pressing device 61 and support

611. Connecting rod 62 and cylinder

63. And (7) pressing a plate.

Detailed Description

Referring to fig. 1 to 6, a specific structure of a preferred embodiment of the present invention is shown, which includes a frame 10, a bottom mold 20 for positioning a PCB 40, and a tooling device 30 for positioning an assembled product 50.

The bottom die 20 is arranged on the frame 10, a hot-pressing positioning hole 21 for matching and positioning with a positioning column of a hot-pressing upper die is arranged on the bottom die 20, a PCB positioning hole 22 for matching and positioning with a positioning column on an external manipulator when the PCB circuit board 40 is placed is arranged on the bottom die 20, the PCB positioning hole 22 is positioned beside the hot-pressing positioning hole 21, and a first vacuum adsorption mechanism 23 for adsorbing the PCB circuit board 40 is arranged on the bottom die 20; in this embodiment, there are two hot press positioning holes 21, two hot press positioning holes 21 are symmetrically disposed on the front side of the bottom mold 20, two PCB positioning holes 22 are disposed on the left and right sides of the bottom mold 20 and behind the two hot press positioning holes 21; the pressing device 60 is disposed on the frame 10, the pressing device 60 includes a support 61, an air cylinder 62 and a pressing plate 63 for pressing the assembled circuit board 51, the support 61 has two connecting rods 611, the two connecting rods 611 are disposed on the frame 10, the bottom mold 20 is disposed between the two connecting rods 611, the air cylinder 62 is movably disposed on the support 61 back and forth, the pressing plate 63 is disposed on the air cylinder 62 and is driven by the air cylinder 62 to move back and forth, and the pressing plate 63 is hinged to the two connecting rods 611.

The tooling device 30 is arranged on the frame 10 and positioned at the front side of the bottom die 20, and a second vacuum adsorption mechanism 31 for adsorbing the assembled product 50 is arranged on the tooling device 30; in this embodiment, the tooling device 30 includes a driving mechanism 32 and a tooling fixture 33, the driving mechanism 32 is movably disposed on the frame 10 back and forth along the X-axis and the Y-axis, the tooling fixture 33 is disposed on the driving mechanism 32 and driven by the driving mechanism 32 to move back and forth along the X-axis and the Y-axis, and the second vacuum adsorption mechanism 31 is disposed on the tooling fixture 33; the driving mechanism 32 includes a first stepping motor 321 and a second stepping motor 322, the first stepping motor 321 can be movably disposed on the frame 10 along the Y axis back and forth, the second stepping motor 322 can be movably disposed on the first stepping motor 321 along the X axis back and forth and driven by the first stepping motor 321 to move back and forth along the Y axis, and the tooling fixture 33 is disposed on the second stepping motor 322 and follows the second stepping motor 322 to move back and forth along the X axis and the Y axis.

Detailed description the working process of this embodiment is as follows:

firstly, an external manipulator adsorbs a PCB (printed circuit board) 40 and conveys the PCB to a bottom die 20, a positioning column of the external manipulator is matched and positioned with a PCB positioning hole 22 of the bottom die 20, the PCB 40 is placed at a fixed position after the positioning is finished, and a first vacuum adsorption mechanism 23 on the bottom die 20 adsorbs and fixes the PCB 40;

then, another external manipulator adsorbs the assembled product 50 and conveys the assembled product 50 to the tooling device 30, the assembled product 50 is placed at a fixed position after positioning, the second vacuum adsorption mechanism 31 on the tooling device 30 adsorbs and fixes the assembled product 50, and at the moment, the assembled product circuit board 51 is overlapped on the golden finger of the PCB 40;

then, photographing is performed through an external CCD detection device, alignment data is derived, and the first stepping motor 321 and the second stepping motor 322 are controlled to drive the tooling device 30 to move along the X axis and the Y axis for position correction, so that the golden fingers of the assembled product circuit board 51 are overlapped with the golden fingers of the PCB 40; then, the air cylinder 62 drives the pressing plate 63 to move forward, so that the pressing plate 63 presses the assembled product circuit board 51 tightly; and finally, the hot-pressing upper die moves downwards, and the positioning column of the hot-pressing upper die is matched and positioned with the hot-pressing positioning hole 21 of the bottom die 20 for hot pressing.

The utility model discloses a design focus lies in: through be provided with on the die block be used for with the hot pressing on the reference column cooperation location's of mould hot pressing locating hole, and be provided with on the die block be used for with the outside mechanical hand on the reference column cooperation place the PCB circuit board when the PCB locating hole of location, the cooperation is provided with on the die block and is used for the absorbent first vacuum adsorption mechanism with PCB circuit board, this kind of die block structure can effectively fix the product and be applicable to different models, the product of equidimension not, the commonality is better, effectively with the golden finger of PCB circuit board and the golden finger hot pressing of equipment product circuit board, need not change different die blocks when the product of different models of production, the retooling time has been saved, and the operation is simple and convenient, greatly promote production efficiency, bring convenience for production, and can reduce production cost, satisfy current demand.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims

1. The utility model provides a general type hot pressing die block subassembly which characterized in that: the PCB assembling machine comprises a rack, a bottom die for positioning a PCB and a tool device for positioning an assembled product; the bottom die is arranged on the rack, a hot-pressing positioning hole used for being matched and positioned with a positioning column of the hot-pressing upper die is arranged on the bottom die, a PCB positioning hole used for being matched and positioned with the positioning column on the external manipulator when a PCB is placed is arranged on the bottom die, the PCB positioning hole is positioned beside the hot-pressing positioning hole, and a first vacuum adsorption mechanism used for adsorbing the PCB is arranged on the bottom die; the tool device is arranged on the rack and located on the front side of the bottom die, and a second vacuum adsorption mechanism used for adsorbing an assembled product is arranged on the tool device.

2. The universal hot-pressing bottom die assembly according to claim 1, wherein: the hot pressing locating hole is two, and two hot pressing locating holes bilateral symmetry set up in the front side of die block, and this PCB locating hole is two, and two PCB locating holes set up in the left and right sides of die block and are located the rear side of two hot pressing locating holes.

3. The universal hot-pressing bottom die assembly according to claim 1, wherein: the pressing device is arranged on the rack and comprises a support, an air cylinder and a pressing plate used for pressing and assembling a product circuit board, the support is provided with two connecting rods, the two connecting rods are arranged on the rack, the bottom die is located between the two connecting rods, the air cylinder can be movably arranged on the support back and forth, the pressing plate is arranged on the air cylinder and driven by the air cylinder to move back and forth, and the pressing plate is hinged to the two connecting rods.

4. The universal hot-pressing bottom die assembly according to claim 1, wherein: the tool device comprises a driving mechanism and a tool fixture, the driving mechanism can be movably arranged on the rack along the X axis and the Y axis back and forth, the tool fixture is arranged on the driving mechanism and driven by the driving mechanism to move back and forth along the X axis and the Y axis, and the second vacuum adsorption mechanism is arranged on the tool fixture.

5. The universal hot-press bottom die assembly according to claim 4, wherein: the driving mechanism comprises a first stepping motor and a second stepping motor, the first stepping motor can be arranged on the rack in a reciprocating mode along the Y axis, the second stepping motor can be arranged on the first stepping motor in a reciprocating mode along the X axis and driven by the first stepping motor to move back and forth along the Y axis, and the tool is arranged on the second stepping motor and follows the second stepping motor to move back and forth along the X axis and the Y axis.