CN218860949U

CN218860949U - Electroplating treatment cooling device

Info

Publication number: CN218860949U
Application number: CN202223180431.XU
Authority: CN
Inventors: 李伍平; 張向筠
Original assignee: Dongguan Guanjie Metal Surface Treatment Co ltd
Current assignee: Dongguan Guanjie Metal Surface Treatment Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-04-14
Anticipated expiration: 2032-11-30

Abstract

The utility model discloses an electroplating treatment cooling device, which comprises a water tank; a first water pump is arranged at the bottom end of one side of the water tank, a plating tank is arranged on the side face of the water tank, a supporting plate is arranged at the bottom end inside the plating tank, and a second water pump is arranged at the top end of the side face inside the plating tank; the utility model discloses a backup pad and water service grille and supporting shoe structure, realize preventing that the inside water service pipe of plating bath from appearing damaging, suit the supporting shoe behind the water service pipe surface, the object that will electroplate is placed in the backup pad top on supporting shoe top, the water service grille who is located the backup pad top simultaneously makes the object be located the backup pad holding surface and electroplates, consequently, avoid electroplating the object and directly press on the water service pipe surface, make the water service pipe cool down the in-process through the cooling water of inside flow and obtain effectual protection, thereby prolong the life of water service pipe.

Description

Electroplating treatment cooling device

Technical Field

The utility model relates to an electroplating treatment cooling technology field specifically is an electroplating treatment cooling device.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.

When the cooling device flows cooling water through the interior of the electroplating bath through the water pipe, objects to be limited can be directly placed above the water pipe, so that the objects can be directly pressed on the surface of the water pipe when contacting the water pipe, the objects can extrude and damage the surface of the water pipe, cracks can possibly appear on the surface of the water pipe to cause cooling water leakage, and the service life of the cooling device is shortened;

in addition, when cooling device is cooling down to the inside plating solution of plating bath, place cooling water service pipe inside the plating bath usually, take away the inside heat of plating solution through cold water process water service pipe inside, and when the cooling water was taken away the inside heat of plating bath, the inside cooling water of water service pipe can only absorb the heat in the plating solution of periphery, and is relatively poor to the inside heat absorption effect of top plating solution in the plating bath for cooling device's cooling effect is relatively poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electroplating treatment cooling device to it is relatively poor to provide the inside heat absorption effect of the inside top plating solution of plating bath among the above-mentioned background art of solution, makes cooling device's the cooling effect relatively poor and the water service pipe surface probably appears the crack and leads to the cooling water to reveal, thereby causes the problem that cooling device's life shortens.

The utility model provides a following technical scheme: an electroplating treatment cooling device comprises a water tank; a first water pump is arranged at the bottom end of one side of the water tank, an electroplating bath is arranged on the side surface of the water tank, a supporting plate is arranged at the bottom end inside the electroplating bath, and a second water pump is arranged at the top end of the side surface inside the electroplating bath;

a water-passing grid is arranged in the center of the surface of the supporting plate, a supporting block is arranged at the bottom end of the water-passing grid, and the bottom end of the supporting block is in contact with the bottom end inside the electroplating bath;

second water pump one end is equipped with the drinking-water pipe, and the bottom surface of drinking-water pipe is equipped with the mouth that draws water, the one end of drinking-water pipe is located the below of backup pad.

Preferably, a water chilling unit is arranged at the top end of the water tank, and one end of the water chilling unit extends to the inside of the water tank through a guide pipe.

Preferably, one end of the first water pump is connected with the water chiller through a conduit, the other end of the first water pump is provided with a water pipe, and the water pipe is positioned at the bottom end inside the electroplating bath.

Preferably, the water pipe is located at the bottom end inside the electroplating tank and is of a back-and-forth structure, and the surface of the water pipe penetrates through the center inside the supporting block.

Preferably, the other end of the water pipe is connected with the side face of the top end of the water chilling unit, and the second water pump is fixed on the surface of the water pipe through the mounting block.

Preferably, the bottom end of the front surface of the water tank is provided with a water outlet, and the surface of the water outlet is provided with an electromagnetic valve.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a backup pad and water service grille and supporting shoe structure, realize preventing that the inside water service pipe of plating bath from appearing damaging, suit the supporting shoe behind the water service pipe surface, the object that will electroplate is placed in the backup pad top on supporting shoe top, the water service grille who is located the backup pad top simultaneously makes the object be located the backup pad holding surface and electroplates, consequently, avoid electroplating the object and directly press on the water service pipe surface, make the water service pipe cool down the in-process through the cooling water of inside flow and obtain effectual protection, thereby prolong the life of water service pipe.

2. The utility model discloses a second water pump and drinking-water pipe and mouth structure of drawing water, the realization carries out rapid cooling to the inside plating solution heat of plating bath, the second water pump works of drawing water, make the drinking-water mouth of drinking-water pipe bottom take out the plating solution around the inside bottom water service pipe of plating bath from, and the plating solution that will take out from spouts to plating bath top surface, the plating solution that is located the plating bath top simultaneously moves down, make the inside cooling water of water service pipe absorb the plating solution heat on the inside top of plating bath, consequently, avoid the inside heat of plating bath to absorb inadequately, make the cooling water efficient to the inside heat absorption of plating solution.

Drawings

FIG. 1 is a schematic view of a part of the internal structure of the present invention;

fig. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic view of the safety structure of the present invention;

fig. 4 is a schematic top view of the present invention.

In the figure: 1. a water tank; 101. a water chilling unit; 102. a water outlet; 103. an electromagnetic valve; 2. a first water pump; 201. a water pipe; 3. an electroplating bath; 4. a support plate; 401. a water grid is communicated; 402. a support block; 5. a second water pump; 501. a water pumping pipe; 502. a water pumping port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical solution of the present invention will be further described in detail with reference to the drawings and specific embodiments.

The first embodiment is as follows:

the application provides an electroplating treatment cooling device, which comprises a water tank 1; a first water pump 2 is arranged at the bottom end of one side of the water tank 1, an electroplating bath 3 is arranged on the side surface of the water tank 1, a supporting plate 4 is arranged at the bottom end inside the electroplating bath 3, and a second water pump 5 is arranged at the top end of the side surface inside the electroplating bath 3;

one end of the second water pump 5 is provided with a water pumping pipe 501, the bottom end surface of the water pumping pipe 501 is provided with a water pumping port 502, and one end of the water pumping pipe 501 is positioned below the support plate 4;

specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, when the plating solution is used, the second water pump 5 pumps the plating solution around the water pipe 201 through the water pumping pipe 501 at the input end, and the water pumping port 502 at one end of the water pumping pipe 501 increases the water pumping efficiency, and then sprays the pumped plating solution to the top inside the plating tank 3, and the plating solution at the top inside the plating tank 3 moves downward, so that the cooling water inside the water pipe 201 absorbs the heat of the plating solution at the top inside the plating tank 3, thereby avoiding insufficient heat absorption inside the plating tank 3, and making the cooling water have high heat absorption efficiency on the inside of the plating solution.

Further, a water chilling unit 101 is arranged at the top end of the water tank 1, and one end of the water chilling unit 101 extends into the water tank 1 through a guide pipe; one end of the first water pump 2 is connected with the water chilling unit 101 through a guide pipe, the other end of the first water pump 2 is provided with a water through pipe 201, and the water through pipe 201 is located at the bottom end of the interior of the electroplating tank 3; a water outlet 102 is arranged at the bottom end of the front surface of the water tank 1, and an electromagnetic valve 103 is arranged on the surface of the water outlet 102;

specifically, as shown in fig. 1 and 2, when the first water pump 2 flows the cooling water through the water pipe 201 through the plating liquid in the plating tank 3, the cooling water absorbs heat from the plating liquid and flows the cooling water absorbed by the water pipe 201 back into the water tank 1, and the cooling water is cooled again by the water chiller 101 at the top of the water tank 1.

Further, the other end of the water pipe 201 is connected with the side face of the top end of the water chilling unit 101, and the second water pump 5 is fixed on the surface of the water pipe 201 through a mounting block;

specifically, as shown in fig. 2, after the water in the water tank 1 is used for a long time, the electromagnetic valve 103 on the surface of the water outlet 102 needs to be opened to discharge the water for replacement.

In contrast to the first embodiment, the present invention further provides a second embodiment, where the second embodiment is used to solve the problem that when the cooling device cools down the plating solution inside the plating bath, the cooling water pipe is usually placed inside the plating bath, the cooling water takes away the heat inside the plating solution through the inside of the water pipe, and when the cooling water takes away the heat inside the plating bath, the cooling water inside the water pipe can only absorb the heat in the surrounding plating solution, and the heat absorption effect on the inside of the plating solution at the top end inside the plating bath is poor, so that the cooling effect of the cooling device is poor, the present application discloses an electroplating treatment cooling device, a water through grille 401 is disposed at the central position of the surface of the support plate 4, a support block 402 is disposed at the bottom end of the water through grille 401, and the bottom end of the support block 402 is in contact with the bottom end inside the plating bath 3; the water pipe 201 is positioned at the bottom end inside the electroplating tank 3 and is in a back-and-forth structure, and the surface of the water pipe 201 penetrates through the center inside the supporting block 402;

specifically, as shown in fig. 1 and 3, in use, the supporting plate 4 is fixed at the bottom end inside the electroplating bath 3 by the supporting block 402, so that an object to be electroplated can be placed on the surface of the water passing grille 401 at the central position of the surface of the supporting plate 4 later, and meanwhile, the water passing grille 401 above the supporting plate 4 enables the object to be positioned on the supporting surface of the supporting plate 4 for electroplating, and meanwhile, the water passing pipe 201 in a back-and-forth structure can maximally absorb heat of the electroplating solution, so that the electroplating object is prevented from being directly pressed on the surface of the water passing pipe 201, and the water passing pipe 201 is effectively protected in the process of cooling by the cooling water flowing inside, so that the service life of the water passing pipe 201 is prolonged.

The working principle is as follows: during the use, at first install the inside bottom of plating bath 3 with backup pad 4 through supporting shoe 402, make electroplating object support through backup pad 4, water grille 401 avoids electroplating object support position unable electroplating simultaneously, can protect water service pipe 201 to receive the crushing of electroplating object simultaneously, second water pump 5 takes out the plating solution of cooling around water service pipe 201 through drinking-water pipe 501 simultaneously and leaves plating bath 3's top surface, the plating solution that does not have the heat absorption cooling moves down simultaneously, make the inside cooling effect of cooling water of water service pipe 201 to plating bath 3 inside improve.

Finally, it is to be noted that: the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified and replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. An electroplating treatment cooling device comprises a water tank (1); the method is characterized in that: a first water pump (2) is arranged at the bottom end of one side of the water tank (1), an electroplating bath (3) is arranged on the side surface of the water tank (1), a supporting plate (4) is arranged at the bottom end inside the electroplating bath (3), and a second water pump (5) is arranged at the top end of the side surface inside the electroplating bath (3);

a water-through grid (401) is arranged in the center of the surface of the supporting plate (4), a supporting block (402) is arranged at the bottom end of the water-through grid (401), and the bottom end of the supporting block (402) is in mutual contact with the bottom end of the interior of the electroplating bath (3);

second water pump (5) one end is equipped with drinking-water pipe (501), and the bottom surface of drinking-water pipe (501) is equipped with draws water mouth (502), the one end of drinking-water pipe (501) is located the below of backup pad (4).

2. A plating process cooling apparatus according to claim 1, characterized in that: the top of water pitcher (1) is equipped with cooling water set (101), and the inside of pipe extension to water pitcher (1) is passed through to the one end of cooling water set (101).

3. A plating process cooling apparatus according to claim 1, characterized in that: one end of the first water pump (2) is connected with the water chilling unit (101) through a guide pipe, a water through pipe (201) is arranged at the other end of the first water pump (2), and the water through pipe (201) is located at the bottom end of the inner portion of the electroplating tank (3).

4. A plating process cooling apparatus according to claim 3, wherein: the water pipe (201) is located at the bottom end of the interior of the electroplating tank (3) and is of a back-and-forth structure, and the surface of the water pipe (201) penetrates through the central position of the interior of the supporting block (402).

5. A plating process cooling apparatus according to claim 3, wherein: the other end of the water service pipe (201) is connected with the side face of the top end of the water chilling unit (101), and the second water pump (5) is fixed on the surface of the water service pipe (201) through the mounting block.

6. A plating process cooling apparatus according to claim 1, wherein: a water outlet (102) is arranged at the bottom end of the front surface of the water tank (1), and an electromagnetic valve (103) is arranged on the surface of the water outlet (102).