CN218851037U

CN218851037U - Anticreep high heat conduction printed PCB circuit board

Info

Publication number: CN218851037U
Application number: CN202222875141.0U
Authority: CN
Inventors: 徐乃村; 徐乃敬; 王乐安
Original assignee: Zhejiang Lingchao Electronic Technology Co ltd
Current assignee: Zhejiang Lingchao Electronic Technology Co ltd
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-04-11
Anticipated expiration: 2032-10-28

Abstract

The utility model provides an anticreep high heat conduction printed PCB circuit board, including PCB circuit plug-in board, PCB circuit welded plate, heat conduction silica gel piece, louvre, recess one, recess two, the gas pocket, isolated groove, jack and locating hole, the below of PCB circuit plug-in board is connected with the top of PCB circuit welded plate, and there is heat conduction silica gel piece between PCB circuit plug-in board and the PCB circuit welded plate, the surface of this heat conduction silica gel piece runs through and has seted up the louvre; the upper surface of the PCB circuit plug-in board is provided with a first groove, a second groove, an air hole, an isolation groove, an insertion hole and positioning holes, and the positioning holes are uniformly distributed on the surface of the PCB circuit plug-in board; the PCB circuit welding plate comprises a PCB plate body, a third groove, a fourth groove, a first air hole, a rectangular frame, a welding hole and a positioning column. The utility model discloses link together the pin between each electronic components when can preventing the dust to avoid taking place the phenomenon of even electricity and electric leakage, when electronic component produced the heat, can in time distribute away the heat, be convenient for marketing and application.

Description

Anticreep high heat conduction printed PCB circuit board

Technical Field

The utility model discloses a PCB circuit board field especially relates to a high heat conduction printed PCB circuit board of anticreep.

Background

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components.

As is well known, in daily life, electronic devices used in the daily life cannot leave the shadow of the PCB. However, in the long-time use process of the existing printed PCB, a lot of dust is accumulated on the PCB, so that the phenomena of power connection and electric leakage of electronic components on the PCB occur.

Therefore, it is very necessary to invent an anti-creeping high-thermal-conductivity printed PCB.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides an anticreep high heat conduction printed PCB circuit board adopts's technical scheme does: the utility model provides a high heat conduction printed PCB circuit board of anticreep, includes PCB circuit plug-in components board, PCB circuit welded plate, heat conduction silica gel piece, louvre, recess one, recess two, the gas pocket, isolated groove, jack and locating hole, wherein: two sides below the PCB circuit plug-in board are connected with two sides above the PCB circuit welding board, a heat-conducting silica gel sheet is nested between the PCB circuit plug-in board and the PCB circuit welding board, and a heat dissipation hole is formed in the surface of the heat-conducting silica gel sheet in a penetrating mode; the upper surface of the PCB circuit plug-in board is respectively provided with a first groove, a second groove, an air hole, an isolation groove, an insertion hole and positioning holes, and the positioning holes are uniformly distributed at four corners of the surface of the PCB circuit plug-in board; the PCB circuit welding plate comprises a PCB plate body, a third groove, a fourth groove, a first air hole, a rectangular frame, a welding hole and a positioning column.

Preferably, the first groove and the second groove are arranged in a vertical cross mode, the air holes are uniformly distributed in the first groove and the second groove, the isolation grooves are uniformly distributed between the first groove and the second groove, and the insertion holes are uniformly distributed in the isolation grooves.

Preferably, the bottom surface of the PCB body is provided with a third groove, a fourth groove and a first air hole, the third groove and the fourth groove are arranged in a vertical crossing manner, and the first air hole is uniformly distributed in the third groove and the fourth groove; the rectangular frames are uniformly distributed between the third groove and the fourth groove, and welding holes are uniformly distributed in the rectangular frames; the positioning columns are arranged at four corners of the bottom surface of the PCB body, and the positions of the positioning columns correspond to the positions of the positioning holes.

Preferably, the heat conduction silica gel piece includes the silica gel piece main part, the cavity with insert the post, and the cavity has been seted up to the inside of silica gel piece main part, and the inside equipartition of this cavity is provided with a plurality of the same posts of inserting.

Preferably, the middle of the surface of each inserting column is provided with an inserting hole in a penetrating manner, and the inserting holes on the surface of each inserting column correspond to the inserting holes and the welding holes respectively; the inside of the cavity corresponds to the inside of the heat dissipation hole.

Compared with the prior art, the utility model has the advantages of:

1. the utility model discloses PCB circuit plug-in components board is through surface recess one, the setting of recess two and gas pocket, when its application is in electronic equipment, can make its inside good ventilation radiating effect that has, simultaneously behind PCB circuit plug-in components board accumulated dust, through the setting in isolated groove, can prevent that the dust from linking together the inside electron pin of jack to avoid taking place even electricity or electric leakage phenomenon between each electronic components, make its safety more.

2. The utility model discloses PCB circuit welded plate passes through surface recess three, recess four and the setting of gas pocket one, when using in electronic equipment, can make its bottom surface and fixed department have certain gap, thereby good ventilation radiating effect has, simultaneously through the setting of rectangle frame, when the surperficial long-pending more dust of collecting in order of PCB circuit welded plate, can block the dust, prevent that electronic component's pin from passing through the dust and linking together, thereby avoid taking place the appearance of even electricity or electric leakage between each electronic components, make its safety more.

3. The utility model discloses the setting of heat conduction silica gel piece is favorable to carrying out good radiating effect to the inside of PCB circuit plug-in components board and PCB circuit welding board, when PCB circuit plug-in components board and PCB circuit welding inboard part electronic components's pin produced heat, can in time go out the heat.

Drawings

Fig. 1 is a schematic view of the overall upper surface structure of the present invention.

Fig. 2 is a schematic view of the overall bottom structure of the present invention.

Fig. 3 is a schematic view of the partial cutting enlarged structure of the present invention.

In the figure:

PCB circuit plug-in board 1, PCB circuit welded plate 2, PCB plate body 21, recess three 22, recess four 23, gas pocket one 24, rectangle frame 25, welding hole 26, reference column 27, heat conduction silica gel piece 3, silica gel piece main part 31, cavity 32, insert post 33, louvre 4, recess one 5, recess two 6, gas pocket 7, isolated groove 8, jack 9, locating hole 10.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

In the description of the embodiments, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

The invention is further described below with reference to the accompanying drawings:

example one

Referring to fig. 1-3, an anti-creeping high thermal conductive printed PCB comprises a PCB circuit plug-in board 1, a PCB circuit welding board 2, a thermal conductive silicone sheet 3, a heat dissipation hole 4, a first groove 5, a second groove 6, an air hole 7, an isolation groove 8, a jack 9 and a positioning hole 10, wherein: the two sides below the PCB circuit plug-in board 1 are connected with the two sides above the PCB circuit welding board 2, a heat-conducting silica gel sheet 3 is nested between the PCB circuit plug-in board 1 and the PCB circuit welding board 2, and heat dissipation holes 4 are formed in the surface of the heat-conducting silica gel sheet 3 in a penetrating mode; the upper surface of the PCB circuit plug-in board 1 is respectively provided with a first groove 5, a second groove 6, an air hole 7, an isolation groove 8, an insertion hole 9 and positioning holes 10, and the positioning holes 10 are uniformly distributed at four corners of the surface of the PCB circuit plug-in board 1; the PCB circuit welding plate 2 comprises a PCB body 21, a groove three 22, a groove four 23, an air hole one 24, a rectangular frame 25, a welding hole 26 and a positioning column 27.

It should be noted that the insertion hole 9 and the soldering hole 26 are matched with the printed circuit, and the air vent 7 and the air vent-24 bypass the printed circuit.

Further, the first grooves 5 and the second grooves 6 are arranged in a vertical cross mode, the air holes 7 are uniformly distributed in the first grooves 5 and the second grooves 6, the isolation grooves 8 are uniformly distributed between the first grooves 5 and the second grooves 6, and the jacks 9 are uniformly distributed in the isolation grooves 8; the air hole 7 communicates with the inside of the cavity 32; when the electronic components on the surface of the PCB circuit plug-in board 1 generate heat, the ventilation and heat dissipation effects are good; through the arrangement of the first groove 5, the second groove 6 and the isolation groove 8, when dust is accumulated on the surface of the PCB circuit plug-in board 1, the dust can be cut off, the pins of electronic components inside each jack 9 are prevented from being connected together by the dust, and therefore when the PCB circuit plug-in board is installed in electronic equipment, the phenomena of power connection and electric leakage between the electronic components can be effectively prevented, and the PCB circuit plug-in board is safer and more reliable.

Furthermore, the bottom surface of the PCB body 21 is provided with a third groove 22, a fourth groove 23 and a first air hole 24, the third groove 22 and the fourth groove 23 are arranged in a vertical cross manner, and the first air holes 24 are uniformly distributed in the third groove 22 and the fourth groove 23; the rectangular frames 25 are uniformly distributed between the third grooves 22 and the fourth grooves 23, and welding holes 26 are uniformly distributed in the rectangular frames 25; the positioning columns 27 are arranged at four corners of the bottom surface of the PCB body 21, and the positions of the positioning columns 27 correspond to the positions of the positioning holes 10; the air hole I24 is communicated with the inside of the cavity 32, when the PCB body 21 is installed in the electronic equipment, a certain gap can be formed between the whole PCB body and an installation point due to the luxury of the rectangular frame 25 and the positioning column 27, and when pins of electronic components in the PCB body 21 generate heat, the PCB body can have good ventilation and heat dissipation effects; through the setting of groove three 22, groove four 23 and rectangle frame 25, when the dust is scraped up to PCB plate body 21 surface, can cut off the dust, avoid the dust to link together the inside electronic components's of each welding hole 26 pin to when installing electronic equipment, can effectually prevent to appear between each electronic components and connect the phenomenon of electricity and electric leakage, thereby make its more safe and reliable.

Further, the heat-conducting silica gel sheet 3 comprises a silica gel sheet main body 31, a cavity 32 and inserting columns 33, the cavity 32 is formed in the silica gel sheet main body 31, and a plurality of identical inserting columns 33 are uniformly distributed in the cavity 32; when the heat conducting and radiating device is used, a good heat conducting and radiating effect can be conducted on the PCB circuit plug-in board 1, the PCB circuit welding board 2 and pins of electronic components.

Utilize technical scheme, or technical personnel in the field are in the utility model discloses under technical scheme's the inspiration, design similar technical scheme, and reach above-mentioned technological effect, all fall into the utility model discloses a protection scope.

Claims

1. The utility model provides a high heat conduction printed PCB circuit board of anticreep which characterized in that: including PCB circuit plug-in components board (1), PCB circuit welded plate (2), heat conduction silica gel piece (3), louvre (4), recess one (5), recess two (6), gas pocket (7), isolated groove (8), jack (9) and locating hole (10), wherein: two sides below the PCB circuit plug-in board (1) are connected with two sides above the PCB circuit welding board (2), a heat-conducting silica gel sheet (3) is nested between the PCB circuit plug-in board (1) and the PCB circuit welding board (2), and heat-radiating holes (4) are formed in the surface of the heat-conducting silica gel sheet (3) in a penetrating mode; the PCB circuit plug-in board comprises a PCB circuit plug-in board (1), wherein a first groove (5), a second groove (6), an air hole (7), an isolation groove (8), an insertion hole (9) and positioning holes (10) are formed in the upper surface of the PCB circuit plug-in board (1), and the positioning holes (10) are uniformly distributed at four corners of the surface of the PCB circuit plug-in board (1); the PCB circuit welding plate (2) comprises a PCB body (21), a groove III (22), a groove IV (23), an air hole I (24), a rectangular frame (25), a welding hole (26) and a positioning column (27).

2. The anti-creeping high-thermal-conductivity printed PCB circuit board of claim 1, wherein: recess one (5) and recess two (6) are the vertical cross form setting, and gas pocket (7) equipartition sets up in the inside of each recess one (5) and recess two (6), and isolated groove (8) equipartition sets up between each recess one (5) and recess two (6), and jack (9) equipartition sets up the inside in each isolated groove (8).

3. The anti-creeping high-thermal-conductivity printed PCB circuit board of claim 1, wherein: the bottom surface of the PCB body (21) is provided with a third groove (22), a fourth groove (23) and a first air hole (24), the third groove (22) and the fourth groove (23) are arranged in a vertical crossing manner, and the first air holes (24) are uniformly distributed in the third groove (22) and the fourth groove (23); the rectangular frames (25) are uniformly distributed between the grooves III (22) and the grooves IV (23), and welding holes (26) are uniformly distributed in the rectangular frames (25); the positioning columns (27) are arranged at four corners of the bottom surface of the PCB body (21), and the positions of the positioning columns (27) correspond to the positions of the positioning holes (10).

4. The anti-creeping high-thermal-conductivity printed PCB circuit board of claim 1, wherein: the heat-conducting silica gel sheet (3) comprises a silica gel sheet main body (31), a cavity (32) and inserting columns (33), the cavity (32) is formed in the silica gel sheet main body (31), and a plurality of identical inserting columns (33) are uniformly distributed in the cavity (32).

5. The anti-creeping high-thermal-conductivity printed PCB circuit board of claim 4, wherein: jacks penetrate through the middle of the surfaces of the inserting columns (33), and the jacks on the surfaces of the inserting columns (33) correspond to the jacks (9) and the welding holes (26) respectively; the interior of the cavity (32) corresponds to the interior of the heat dissipation hole (4).