CN218788785U

CN218788785U - Industrial camera

Info

Publication number: CN218788785U
Application number: CN202222615002.4U
Authority: CN
Inventors: 唐钦远; 周斌; 高华
Original assignee: Hangzhou Hikrobot Co Ltd
Current assignee: Hangzhou Hikrobot Co Ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2023-04-04
Anticipated expiration: 2032-09-30

Abstract

The embodiment of the application provides an industrial camera, which comprises a machine shell, a main body module and a heat dissipation plate, wherein the machine shell comprises two first side walls which are oppositely distributed along a first direction; the main body module comprises a control module and a sensor module, and the control module and the sensor module are respectively arranged on the two first side walls; the cooling plate is installed on the shell, a cooling channel for cooling liquid to pass through is formed in the cooling plate, and the position of the cooling plate corresponds to the control module and the sensor module, so that the control module and the sensor module can exchange heat with the cooling liquid passing through the cooling channel. The embodiment of this application corresponds to control module and sensor module through the cooling plate position, utilizes the coolant liquid that passes through in the heat dissipation channel to dispel the heat with control module and sensor module heat exchange, can solve the image sensor vibration that air-cooled heat dissipation technique brought, the problem that the radiating efficiency is low, promotes the imaging quality of industry camera.

Description

Industrial camera

Technical Field

The present application relates to the field of imaging technology, and in particular, to an industrial camera.

Background

The industrial camera with high power consumption adopts a natural heat dissipation technology, and the requirements cannot be met, the existing industrial camera mostly adopts an air cooling heat dissipation technology, a fan is arranged in the industrial camera, and the fan blows air continuously to dissipate heat. However, the fan may vibrate during operation, which may cause the image sensor to vibrate, and the heat dissipation of the fan is slow and the heat dissipation efficiency is low, which may result in poor imaging quality of the industrial camera.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide an industrial camera to solve the problem that image sensor vibration, radiating efficiency are low that forced air cooling heat dissipation technique brought, promote the formation of image quality. The specific technical scheme is as follows:

the embodiment of the application provides an industrial camera which comprises a machine shell, a main body module and a heat dissipation plate, wherein the machine shell comprises two first side walls which are oppositely distributed along a first direction; the main body module comprises a control module and a sensor module which are positioned in the shell and electrically connected with each other, and the control module and the sensor module are respectively arranged on the two first side walls; the cooling plate is installed on the shell, a cooling channel for cooling liquid to pass through is formed in the cooling plate, and the cooling plate corresponds to the control module and the sensor module in position, so that the control module, the sensor module and the cooling liquid passing through the cooling channel can exchange heat.

In some embodiments of the present application, the heat dissipation plate is located in the casing, the heat dissipation plate is distributed in parallel between the control module and the sensor module, an edge of the heat dissipation plate is fixed on a second side wall of the casing, the second side wall is distributed along a second direction, the second direction intersects with the first direction, and the heat dissipation plate is in contact with the control module and the sensor module.

In some embodiments of the present application, the heat dissipation plate is located outside the chassis, and the heat dissipation plate is fixed to a second side wall of the chassis, the second side wall being distributed along a second direction, the second direction intersecting the first direction.

In some embodiments of the present application, the heat dissipation plate includes a first base body and a cover plate disposed on the first base body, the first base body has a heat dissipation groove formed thereon, and the heat dissipation groove and the cover plate enclose the heat dissipation channel.

In some embodiments of the present application, the heat dissipation groove includes a plurality of first groove bodies distributed in parallel along a third direction, and a plurality of second groove bodies distributed in parallel along a fourth direction, and each second groove body is connected between the head and the tail of two adjacent first groove bodies, and the third direction intersects with the fourth direction.

In some embodiments of the present application, the heat dissipation grooves are a plurality of first groove bodies distributed in parallel along a third direction, or a plurality of second groove bodies distributed in parallel along a fourth direction.

In some embodiments of the present application, a plurality of water baffles are disposed at the bottoms of the first tank body and the second tank body, two adjacent micro channels are formed between the water baffles, and each micro channel in the first tank body or the second tank body is distributed in parallel or in series.

In some embodiments of the present application, the industrial camera further comprises a heat conducting structure, the heat conducting structure is located between the heat dissipation plate and the sensor module, a first end of the heat conducting structure is connected to the heat dissipation plate, and a second end of the heat conducting structure is in contact with the image sensor on the sensor module.

In some embodiments of the present application, the industrial camera includes a heat conducting structure located between the control module and the sensor module, an outer peripheral edge of a first end of the heat conducting structure is fixed on the second sidewall of the housing, the first end of the heat conducting structure is in contact with the control module, and a second end of the heat conducting structure is in contact with the image sensor on the sensor module.

In some embodiments of the present application, the heat conducting structure includes a second base as a first end of the heat conducting structure, and a protrusion protruding from a central region of the second base as a second end of the heat conducting structure.

In some embodiments of the present application, a liquid inlet portion and a liquid outlet portion are disposed on the heat dissipation plate, one end of each of the liquid inlet portion and the liquid outlet portion is communicated with the heat dissipation channel, and the other end of each of the liquid inlet portion and the liquid outlet portion is located outside the housing.

In some embodiments of the present application, the control module and the sensor module are filled with a thermally conductive material between the housing and the control module.

The embodiment of the application provides an industrial camera, including casing, main part module and heating panel, the main part module includes control module and sensor module, control module and sensor module distribute and set up on two first lateral walls of the relative distribution of edge first direction of casing, the heating panel is installed in the casing, is formed with the heat dissipation channel that supplies the coolant liquid to pass through in the heating panel, the position of heating panel corresponds to control module and sensor module. When the industrial camera works, the control module and the sensor module generate heat, the cooling liquid continuously passes through the heat dissipation channel, the heat dissipation plate corresponds to the control module and the sensor module, the cooling liquid passing through the heat dissipation channel can exchange heat with the control module and the sensor module, the heat dissipation of heating devices in the control module and the sensor module is realized, in addition, the heat generated by the control module and the sensor module can be conducted to the heat dissipation plate through the machine shell, meanwhile, the heat can be directly dissipated to the outside through the machine shell, the heat dissipation way is increased, and the heat dissipation efficiency is further improved. Compared with the air-cooled heat dissipation technology, the heat dissipation plate in the embodiment of the application corresponds to the control module and the sensor module, heat dissipation is carried out by utilizing heat exchange between the cooling liquid passing through the heat dissipation channel and the control module and the sensor module, the problem of vibration of the image sensor caused by the air-cooled heat dissipation technology can be solved, in addition, the heat generated on the control module and the sensor module can be timely taken away by the cooling liquid, the heat dissipation efficiency is high, and further the imaging quality of the industrial camera is improved. In summary, the embodiment of the application can solve the problems of vibration of the image sensor and low heat dissipation efficiency caused by an air-cooled heat dissipation technology by arranging the heat dissipation plate on the casing and corresponding to the control module and the sensor module, and the imaging quality of the industrial camera is improved.

Of course, it is not necessary for any product to achieve all of the above-described advantages at the same time for practicing the present application.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art according to the drawings.

Fig. 1 is a schematic structural diagram of an industrial camera according to some embodiments of the present disclosure (a heat dissipation plate is located inside a housing);

FIG. 2 is a cross-sectional view of an industrial camera from a first perspective, according to some embodiments of the present disclosure;

FIG. 3 is an exploded view of an industrial camera according to some embodiments of the present disclosure;

fig. 4 is another schematic structural diagram of an industrial camera according to some embodiments of the present disclosure (a heat dissipation plate is located outside a housing);

FIG. 5 is a left side view of FIG. 4;

FIG. 6 is a cross-sectional view of FIG. 4;

fig. 7 is an exploded view of a heat spreader plate according to some embodiments of the present application;

fig. 8 is a first structural view of a heat sink of the heat sink plate according to some embodiments of the present disclosure;

fig. 9 is a second structural diagram of a heat sink of a heat spreader in some embodiments of the present application.

Description of reference numerals:

an industrial camera 100;

a housing 10, a first side wall 10a, a second side wall 10b, a first frame 11, a second cover 12, and a third cover 13;

a first frame member 111, a second frame member 112, an opening 113;

a main body module 20, a control module 21 and a sensor module 22;

an interface adapter board 211, a main control board 212, a control board 221, an image sensor 222, a first opening 223;

a heat dissipation plate 30, a liquid inlet 30a, a liquid outlet 30b, a third side wall 30c, a first substrate 31, a cover plate 32, a heat dissipation groove 33, a liquid inlet portion 34 and a liquid outlet portion 35;

a first tank 331, a second tank 332, a water-stop sheet 333, a micro flow channel 334;

connecting pipe 301, joint 302;

a heat dissipation channel 40;

a heat conducting structure 50, a first end 50a, a second end 50b, a second substrate 51, a protrusion 52;

a first direction X, a second direction Y, a third direction Z, a fourth direction W.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the description herein are intended to be within the scope of the present disclosure.

As shown in fig. 1 to 6, an embodiment of the present application provides an industrial camera 100, including a case 10, a main body module 20, and a heat dissipation plate 30; the casing 10 comprises two first side walls 10a distributed oppositely along the first direction X; the main body module 20 includes a control module 21 and a sensor module 22 located in the casing 10 and electrically connected to each other, the control module 21 and the sensor module 22 are respectively disposed on the two first side walls 10a; the heat dissipation plate 30 is installed on the chassis 10, a heat dissipation channel 40 for passing the cooling liquid is formed in the heat dissipation plate 30, and the position of the heat dissipation plate 30 corresponds to the control module 21 and the sensor module 22, so that the control module 21 and the sensor module 22 exchange heat with the cooling liquid passing through the heat dissipation channel 40.

In the embodiment of the present application, as shown in fig. 2 to 3 and 6, the control module 21 includes an interface adapter board 211 and a main control board 212 electrically connected to each other, the interface adapter board 211 is installed on a first side wall 10a in the enclosure 10, a power circuit is provided on the interface adapter board 211, the power circuit has a heat generating device such as a voltage converter, the main control board 212 is installed on the interface adapter board 211, a plurality of power devices are provided on the main control board 212, the sensor module 22 includes a control board 221 and an image sensor 222 electrically connected to each other, the control board 221 is installed on another first side wall 10a in the enclosure 10, and the image sensor 222 is installed on a side of the control board 221 away from the interface adapter board 211. In the embodiment of the present application, the image sensor 222 may be a general photosensitive sensor, or a photosensitive sensor with high precision and high resolution, and when the image sensor 222 is a photosensitive sensor with high precision and high resolution, the image quality has a larger relationship with temperature, and the higher the temperature is, the more image noise is, and the poorer the imaging quality is.

The industrial camera 100 provided by the embodiment of the application comprises a machine shell 10, a main body module 20 and a heat dissipation plate 30, wherein the main body module 20 comprises a control module 21 and a sensor module 22, the control module 21 and the sensor module 22 are respectively arranged on two first side walls 10a, the heat dissipation plate 30 is installed on the machine shell 10, a heat dissipation channel 40 for cooling liquid to pass through is formed in the heat dissipation plate 30, and the position of the heat dissipation plate 30 corresponds to the control module 21 and the sensor module 22. When the industrial camera 100 works, the control module 21 and the sensor module 22 generate heat, and a cooling liquid continuously passes through the heat dissipation channel 40, because the heat dissipation plate 30 corresponds to the control module 21 and the sensor module 22, the cooling liquid passing through the heat dissipation channel 40 can exchange heat with the control module 21 and the sensor module 22 to dissipate heat of heat generating devices in the control module 21 and the sensor module 22, for example, a voltage converter on the interface adapter plate 211, a power device on the main control plate 212, the image sensor 222, and the like, in addition, the control module 21 and the sensor module 22 are respectively arranged on the two first side walls 10a, heat generated by the control module 21 and the sensor module 22 can be conducted to the heat dissipation plate 30 through the case 10, and can also be directly dissipated to the outside through the case 10, thereby increasing a heat dissipation path and further improving heat dissipation efficiency. Compared with the air-cooling heat dissipation technology, the control module 21 and the sensor module 22 in the embodiment of the application can perform heat exchange with the cooling liquid passing through the heat dissipation channel 40 to dissipate heat, the control module 21 and the sensor module 22 can dissipate heat through the casing 10, the problem of vibration of the image sensor 222 caused by the air-cooling heat dissipation technology can be solved, the cooling liquid can timely take away heat generated on the control module 21 and the sensor module 22, the heat dissipation efficiency is high, and the imaging quality of the industrial camera 100 can be further improved. In summary, in the embodiments of the present application, the heat dissipation plate 30 is installed on the housing 10 and the position of the heat dissipation plate corresponds to the control module 21 and the sensor module 22, so that the problems of vibration and low heat dissipation efficiency of the image sensor 222 caused by the air-cooling heat dissipation technology can be solved, and the imaging quality can be improved. In addition, in some high-demand application scenarios, for example, when the image sensor 222 adopts a high-precision and high-resolution photosensitive sensor, the image quality and the temperature have a larger relationship, the higher the temperature is, the more the image noise is, and the poorer the imaging quality is, and by applying the embodiment provided by the present application, the cooling liquid in the cooling plate 30 can timely take away the heat generated on the control module 21 and the sensor module 22, the heat generated on the control module 21 and the sensor module 22 can be dissipated by the case 10, the heat dissipation efficiency is high, and meanwhile, the problem of poor imaging quality caused by the high temperature is solved, so that the imaging quality is further improved, and it is clear that the application scenario of the present application is very wide.

In some embodiments of the present application, as shown in fig. 1 to 3, the heat dissipation plate 30 is located in the chassis 10, the heat dissipation plate 30 is distributed in parallel between the control module 21 and the sensor module 22, an edge of the heat dissipation plate 30 is fixed to a second side wall 10b of the chassis 10 distributed along the second direction Y, and the heat dissipation plate 30 is in contact with the control module 21 and the sensor module 22. Specifically, the interface adapter board 211 is installed on a first side wall 10a in the chassis 10, the main control board 212 is installed on the interface adapter board 211, the control board 221 is installed on another first side wall 10a in the chassis 10, the image sensor 222 is installed on one side of the control board 221 away from the interface adapter board 211, the heat dissipation plate 30 is distributed in parallel between the main control board 212 and the control board 221, the main control board 212 may contact with the heat dissipation plate 30, and the image sensor 222 may contact with the heat dissipation plate 30. Thus, the main ways of heat exchange between the control module 21 and the heat dissipation plate 30 include: the interface adapter plate 211 → the first side wall 10a → the second side wall 10b → the heat dissipation plate 30 → the cooling liquid take away, and the main control plate 212 → the heat dissipation plate 30 → the cooling liquid take away. The main paths of heat exchange between the sensor module 22 and the heat dissipation plate 30 include: image sensor 222 → heat sink 30 → coolant take away. Compared with the air-cooled heat dissipation technology, the heat dissipation is performed by heat exchange between the cooling liquid passing through the heat dissipation channel 40 of the heat dissipation plate 30 and the control module 21 and the sensor module 22, so that the problem of vibration of the image sensor 222 caused by the air-cooled heat dissipation technology can be solved, the heat of the control module 21 and the heat of the sensor module 22 can be taken away in time by the cooling liquid, the heat dissipation efficiency is high, and the imaging quality of the industrial camera 100 is further improved. In addition, the heat dissipation plate 30 is disposed in the housing 10, so that the overall structure and shape of the housing are not changed, and the requirement of the miniaturized design of the industrial camera 100 can be satisfied.

Of course, the heat dissipation plate 30 is not limited to be disposed inside the housing 10, and may be disposed outside the housing 10.

In some embodiments of the present application, as shown in fig. 4 to 6, the heat dissipation plate 30 is located outside the chassis 10, and the heat dissipation plate 30 is fixed to a second side wall 10b of the chassis 10 distributed along a second direction Y, which intersects the first direction X. Specifically, the interface adapter board 211 is installed on a first side wall 10a in the chassis 10, the main control board 212 is installed on the interface adapter board 211, the control board 221 is installed on another first side wall 10a in the chassis 10, the image sensor 222 is installed on one side of the control board 221, which is away from the interface adapter board 211, a plurality of interfaces are provided on the interface adapter board 211, a plurality of openings are provided on a side wall of the interface adapter board 211 installed on the chassis 10, the interfaces extend out of the chassis 10 through the openings, the sensor module 22 is generally matched with the lens assembly, the lens assembly is generally installed outside the first side wall 10a where the sensor module 22 is located, the heat dissipation plate 30 is fixed on a second side wall 10b of the chassis 10, which is distributed along a second direction Y, and the second direction Y can be perpendicular to the first direction X. The main ways of exchanging heat between the control module 21 and the heat dissipation plate 30 include: the interface adapter plate 211 → the first sidewall 10a where the interface adapter plate 211 is located → the second sidewall 10b → the heat dissipation plate 30 → the coolant is carried away, and the main control plate 212 → the second sidewall 10b → the heat dissipation plate 30 → the coolant is carried away; the main ways of exchanging heat between the sensor module 22 and the heat dissipation plate 30 include: the image sensor 222 → the first side wall 10a where the control board 221 is located → the second side wall 10b → the heat dissipation plate 30 → the cooling liquid is taken away, and the image sensor 222 → the control board 221 → the second side wall 10b → the heat dissipation plate 30-the cooling liquid is taken away, so that heat exchange paths among the heat dissipation plate 30, the control module 21 and the sensor module 22 are increased as much as possible, the problem of vibration of the image sensor 222 caused by an air-cooled heat dissipation technology is solved, the heat dissipation efficiency is improved, and further the imaging quality of the industrial camera 100 is improved. In addition, the heat dissipation plate 30 is disposed outside the housing 10, and thus, the internal structure of the camera does not need to be changed, which facilitates installation.

In some embodiments of the present application, as shown in fig. 7 to 9, the heat dissipation plate 30 includes a first base 31 and a cover plate 32 disposed on the first base 31, a heat dissipation groove 33 is formed on the first base 31, and the heat dissipation groove 33 and the cover plate 32 enclose a heat dissipation channel 40. The cover plate 32 and the first base 31 can be hermetically connected through welding, the cooling liquid can be water, and the cover plate 32 and the first base 31 are hermetically connected, so that the influence of water leakage on the use of the industrial camera 100 can be avoided.

In some embodiments of the present application, as shown in fig. 7, the heat dissipating slot 33 may have a serpentine slot structure, and specifically, the heat dissipating slot 33 includes a plurality of first slots 331 distributed in parallel along the third direction Z, and a plurality of second slots 332 distributed in parallel along the fourth direction W, each second slot 332 being connected between the head and the tail of two adjacent first slots 331, and the third direction Z intersects with the fourth direction W. The heat dissipation plate 30 may have a rectangular structure, the third direction Z may be a length direction of the heat dissipation plate 30, and the fourth direction W may be a width direction of the heat dissipation plate 30. The heat dissipation groove 33 is a serpentine groove structure, which can increase the length and the degree of the meandering of the heat dissipation channel 40, increase the heat dissipation surface, and improve the heat dissipation efficiency.

In some embodiments of the present application, as shown in fig. 8 and 9, the heat dissipation grooves 33 may be a plurality of first grooves 331 distributed in parallel along the third direction Z and extending along the fourth direction W, or a plurality of second grooves 332 distributed in parallel along the fourth direction W and extending along the third direction Z. Specifically, the first and

second chutes

331 and 332 may be linear chutes or arc chutes.

In some embodiments of the present application, the first and

second tanks

331 and 332 have micro fluid channels 334 formed therein. Specifically, a plurality of water-stop plates 333 are arranged at the bottoms of the first tank 331 and the second tank 332, a micro-channel 334 is formed between two adjacent water-stop plates 333, and a plurality of micro-channels 334 in each first tank 331 or the second tank 332 are distributed in parallel or in series. Thus, the heat dissipation surface of the cooling liquid can be increased on the heat dissipation plate 30 with a limited volume, thereby greatly improving the heat dissipation efficiency and facilitating the miniaturization design of the industrial camera 100.

In some embodiments of the present application, as shown in fig. 1, fig. 3, and fig. 5, the heat dissipation plate 30 is provided with a liquid inlet portion 34 and a liquid outlet portion 35, one end of each of the liquid inlet portion 34 and the liquid outlet portion 35 is communicated with the heat dissipation channel 40, and the other end of each of the liquid inlet portion 34 and the liquid outlet portion 35 is located outside the enclosure 10. Specifically, when the heat dissipation plate 30 is located in the casing 10, the other ends of the liquid inlet portion 34 and the liquid outlet portion 35 can extend out of the casing, so that the liquid inlet portion 34 and the liquid outlet portion 35 can be conveniently connected with external pipelines respectively, cooling liquid can be conveniently introduced into the heat dissipation channel 40 through the external pipelines, the cooling liquid after heat exchange is timely discharged, and the heat dissipation efficiency is improved.

In some embodiments, the liquid inlet portion 34 and the liquid outlet portion 35 may be connected to an external pipeline having a circulation pump and a cold drain, the circulation pump drives the cooling liquid to circularly flow in the heat dissipation channel 40 and the external pipeline, the cooling liquid enters the external pipeline after heat exchange in the heat dissipation channel 40, and the cooling liquid enters the heat dissipation channel 40 after being cooled by the cold drain in the external pipeline, so that the cooling liquid can be circularly introduced into the heat dissipation channel 40, thereby improving the heat dissipation efficiency.

In some embodiments of the present application, as shown in fig. 8, a liquid inlet 30a and a liquid outlet 30b are opened on the third side wall 30c of the heat dissipation plate 30 and are communicated with the heat dissipation channel 40, the liquid inlet portion 34 is correspondingly communicated with the liquid inlet 30a, and the liquid outlet portion 35 is correspondingly communicated with the liquid outlet 30 b.

In some embodiments of the present application, as shown in fig. 7, each of the liquid inlet portion 34 and the liquid outlet portion 35 includes a connection pipe 301 disposed on the heat dissipation plate 30 and communicated with the heat dissipation channel 40, and a connector 302 connected to the connection pipe 301, the connection pipe 301 may be welded to a position of the third sidewall 30c corresponding to the liquid inlet 30a or the liquid outlet 30b, the connector 302 may be screwed or snap-fitted to the connection pipe 301, the connector 302 may be located outside the housing 10, and the connector may be a water pipe connector or an air pump connector, which is not limited in this application.

In some embodiments of the present application, the control module 21 and the sensor module 22 are filled with a heat conductive material between the housing 10. Specifically, the thermally conductive material may fill a gap between the interface adapter plate 211 of the control module 21 and the chassis 10, and the thermally conductive material may fill a gap between the control plate 221 of the sensor module 22 and the chassis 10. The heat on the control module 21 and the sensor module 22 can be effectively conducted to the housing 10, and then taken away through the heat dissipation plate 30, and also can be directly dissipated to the outside through the housing 10, so that a heat conduction path is increased, the heat transfer efficiency is improved, and further the heat dissipation efficiency is improved.

In some embodiments of the present application, the heat dissipation plate 30 is located in the chassis 10, and when the heat dissipation plate 30 is distributed in parallel between the control module 21 and the sensor module 22, the control module 21 and the heat dissipation plate 30 may be in direct contact or indirect contact, and the sensor module 22 and the heat dissipation plate 30 may be in direct contact or indirect contact, preferably indirect contact. Specifically, the heat conduction material is filled between the control module 21 and the heat dissipation plate 30, and the heat conduction material is filled between the sensor module 22 and the heat dissipation plate 30, so that the heat on the control module 21 and the sensor module 22 is conducted to the heat dissipation plate 30 through the heat conduction material, the heat transfer efficiency is improved, and the heat dissipation efficiency is further improved.

In some embodiments, a heat conducting material is filled between the main control board 212 of the control module 21 and the heat dissipation plate 30, and a heat conducting material is filled between the image sensor 222 of the sensor module 22 and the heat dissipation plate 30, so that heat on the control module 21 and the sensor module 22 can be conducted to the heat dissipation plate 30 through the heat conducting material, thereby improving heat transfer efficiency and further improving heat dissipation efficiency.

In some embodiments of the present application, as shown in fig. 2 to 3, the industrial camera 100 includes a heat conducting structure 50, the heat conducting structure 50 is located between the heat sink 30 and the sensor module 22, a first end 50a of the heat conducting structure 50 is connected to the heat sink 30, and a second end 50b of the heat conducting structure 50 is in contact with the image sensor 222 on the sensor module 22. Thus, the main ways of exchanging heat between the sensor module 22 and the heat dissipation plate 30 include: the image sensor 222 → the heat conducting structure 50 → the heat dissipating plate 30 → the cooling liquid is taken away, so as to increase the rate of heat conduction of the image sensor 222 to the heat dissipating plate 30, improve the heat dissipating efficiency of the image sensor 222, reduce noise, and improve the imaging quality.

Specifically, as shown in fig. 2 to 3, the heat conducting structure 50 may include a second base 51 and a protrusion 52 protruding from a central region of the second base 51, the second base 51 serves as a first end 50a of the heat conducting structure 50, the protrusion 52 serves as a second end 50b of the heat conducting structure 50, the second base 51 is connected to the heat sink 30, the protrusion 52 is disposed toward the image sensor 222, a heat conducting material is filled between the protrusion 52 and the image sensor 222, a first opening 223 may be formed in the control board 221, and the heat conducting material is filled in the first opening 223, so that heat generated by the image sensor 222 may be conducted to the heat conducting structure 50 through the heat conducting material and then conducted to the heat sink 30 through the heat conducting structure 50, thereby improving heat transfer efficiency and further improving heat dissipation efficiency. In addition, the heat conductive material may prevent hard contact between the heat conductive structure 50 and the image sensor 222, and thus protect the image sensor 222.

In some embodiments of the present application, as shown in fig. 6, when the heat dissipation plate 30 is located outside the casing 10 and fixed to the second side wall 10b of the casing 10, the industrial camera 100 includes a heat conduction structure 50, the heat conduction structure 50 is located between the control module 21 and the sensor module 22, an outer periphery of a first end 50a of the heat conduction structure 50 is fixed to the second side wall 10b of the casing 10, the first end 50a of the heat conduction structure 50 can be in contact with the control module 21, and a second end 50b of the heat conduction structure 50 is in contact with the image sensor 222 on the sensor module 22. Thus, the main ways of heat exchange between the control module 21 and the heat dissipation plate 30 include: the interface adapter plate 211 → the first side wall 10a → the second side wall 10b → the heat sink plate 30 → the coolant liquid carrying away where the interface adapter plate 211 is located, the main control plate 212 → the heat conductive structure 50 → the second side wall 10b → the heat sink plate 30 → the coolant liquid carrying away, the main control plate 212 → the second side wall 10b → the heat sink plate 30 → the coolant liquid carrying away, and the main path of heat exchange between the sensor module 22 and the heat sink plate 30 includes: the image sensor 222 → the heat conducting structure 50 → the second side wall 10b → the heat dissipation plate 30-the cooling liquid is taken away, the image sensor 222 → the first side wall 10a where the control board 221 is located → the second side wall 10b → the heat dissipation plate 30 → the cooling liquid is taken away, and the image sensor 222 → the control board 221 → the second side wall 10b → the heat dissipation plate 30-the cooling liquid is taken away, so that a heat exchange path between the heat dissipation plate 30 and the control module 21 and between the heat dissipation plate and the sensor module 22 is increased, the heat dissipation efficiency is improved, and the imaging quality is improved.

Specifically, the heat conducting structure 50 may include a second base 51 and a protrusion 52 protruding from a central region of the second base 51, the second base 51 serves as a first end 50a of the heat conducting structure 50, an outer periphery of the second base 51 is fixed on the second sidewall 10b of the chassis 10, the second base 51 may contact the control module 21, the protrusion 52 serves as a second end 50b of the heat conducting structure 50, the protrusion 52 is disposed toward the image sensor 222, a first opening 223 may be opened on the control board 221, and the protrusion 52 may contact the image sensor 222 through the first opening 223.

In some embodiments, the second base 51 and the main control board 212 of the control module 21 may be filled with a heat conductive material, the protrusion 52 and the image sensor 222 of the sensor module 22 are filled with a heat conductive material, and the control board 221 may have a first opening 223 formed thereon, and the heat conductive material is filled in the first opening 223. In this way, the heat generated on the main control board 212 can be quickly conducted to the heat conducting structure 50 through the heat conducting material, and then conducted to the heat dissipation plate 30 through the heat conducting structure 50 and the second side wall 10b, and the heat generated on the image sensor 222 can be quickly conducted to the heat conducting structure 50 through the heat conducting material, and then conducted to the heat dissipation plate 30 through the heat conducting structure 50 and the second side wall 10b, so that the heat transfer efficiency is improved, and further the heat dissipation efficiency is improved. In addition, the heat conductive material may prevent hard contact between the heat conductive structure 50 and the image sensor 222, and thus protect the image sensor 222.

In some embodiments, the thermally conductive material may be a thermally conductive interface material, such as a thermally conductive silicone gel or a thermally conductive gel, and the like, without limitation.

In some embodiments, the heat conducting structure 50 may be made of a metal material, such as aluminum, or a copper material. When the heat conducting structure 50 is connected to the heat dissipating plate 30, the heat conducting structure 50 and the heat dissipating plate 30 may be disposed separately or integrally, which is not limited in this application.

In some embodiments of the present application, as shown in fig. 1 to 6, the casing 10 is of a split structure, specifically, the casing 10 includes a first frame 11, a second cover 12 and a third cover 13, the second cover 12 and the third cover 13 are distributed on two sides of the first frame 11 along the first direction X, an edge of the second cover 12 is connected to the first frame 11 through a fastener, an edge of the third cover 13 is connected to the first frame 11 through a fastener, the control module 21 is located in the second cover 12 and is disposed on a side wall of the second cover 12 in the first direction X, the sensor module 22 is located in the third cover 13, and the sensor module 22 is disposed on a side wall of the third cover 13 in the first direction X. When the heat dissipation plate 30 is located in the chassis 10, the heat dissipation plate 30 is located in the first frame 11, the heat dissipation plate 30 is distributed in parallel between the control module 21 and the sensor module 22, an edge of the heat dissipation plate 30 is fixed on a side wall of the first frame 11, and when the heat dissipation plate 30 is located outside the chassis 10, the heat dissipation plate 30 is attached to the side wall of the first frame 11 and fixed on the side wall of the first frame 11. In the embodiment of the present application, the housing 10 is a split structure, which facilitates the assembly of the industrial camera 100.

In some embodiments, the edge of the second cover 12 may be connected to the first frame 11 by a bolt, and the edge of the third cover 13 may be connected to the first frame 11 by a bolt, so that the first frame 11, the second cover 12 and the third cover 13 are detachably connected, which facilitates the assembly of the industrial camera 100.

In some embodiments of the present application, as shown in fig. 3, the first frame 11 includes a first frame 111 and a second frame 112 that are butted with each other, and the second frame 112 is provided with an opening 113 for passing the liquid inlet portion 34 and the liquid outlet portion 35, so that the heat dissipation plate 30 with the liquid inlet portion 34 and the liquid outlet portion 35 can be conveniently installed in the first frame 11, and the assembly efficiency is improved.

The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. An industrial camera, comprising:

a casing (10), said casing (10) comprising two first side walls (10 a) distributed oppositely along a first direction (X);

the main body module (20) comprises a control module (21) and a sensor module (22) which are positioned in the machine shell (10) and electrically connected with each other, and the control module (21) and the sensor module (22) are respectively arranged on the two first side walls (10 a);

the cooling plate (30) is installed on the machine shell (10), a cooling channel (40) allowing cooling liquid to pass through is formed in the cooling plate (30), and the position of the cooling plate (30) corresponds to the control module (21) and the sensor module (22) so that the control module (21) and the sensor module (22) can exchange heat with the cooling liquid passing through the cooling channel (40).

2. The industrial camera of claim 1,

the heat dissipation plate (30) is located in the machine shell (10), the heat dissipation plate (30) is distributed in parallel between the control module (21) and the sensor module (22), the edge of the heat dissipation plate (30) is fixed on a second side wall (10 b) of the machine shell (10) distributed along a second direction (Y), the second direction (Y) is intersected with the first direction (X), and the heat dissipation plate (30) is in contact with the control module (21) and the sensor module (22).

3. The industrial camera of claim 1,

the heat dissipation plate (30) is located outside the machine shell (10), the heat dissipation plate (30) is fixed on a second side wall (10 b) of the machine shell (10) distributed along a second direction (Y), and the second direction (Y) is intersected with the first direction (X).

4. The industrial camera according to any one of claims 1 to 3,

the heat dissipation plate (30) comprises a first base body (31) and a cover plate (32) arranged on the first base body (31), a heat dissipation groove (33) is formed in the first base body (31), and the heat dissipation groove (33) and the cover plate (32) enclose a heat dissipation channel (40).

5. The industrial camera of claim 4,

the radiating groove (33) comprises a plurality of first groove bodies (331) which are distributed in parallel along a third direction (Z) and a plurality of second groove bodies (332) which are distributed in parallel along a fourth direction (W), each second groove body (332) is connected between the heads and the tails of two adjacent first groove bodies (331), and the third direction (Z) is intersected with the fourth direction (W).

6. The industrial camera of claim 4,

the heat dissipation grooves (33) are a plurality of first grooves (331) which are distributed in parallel along a third direction (Z), or a plurality of second grooves (332) which are distributed in parallel along a fourth direction (W).

7. The industrial camera as claimed in claim 5 or 6,

the tank bottoms of the first tank body (331) and the second tank body (332) are respectively provided with a plurality of water-stop plates (333), two adjacent water-stop plates (333) form micro channels (334), and each micro channel (334) in the first tank body (331) or the second tank body (332) are distributed in parallel or in series.

8. The industrial camera of claim 2,

the industrial camera further comprises a heat conducting structure (50), the heat conducting structure (50) is located between the heat dissipation plate (30) and the sensor module (22), a first end (50 a) of the heat conducting structure (50) is connected to the heat dissipation plate (30), and a second end (50 b) of the heat conducting structure (50) is in contact with an image sensor (222) on the sensor module (22).

9. The industrial camera of claim 3,

the industrial camera comprises a heat conducting structure (50), wherein the heat conducting structure (50) is located between the control module (21) and the sensor module (22), the outer periphery of a first end (50 a) of the heat conducting structure (50) is fixed on a second side wall (10 b) of the machine shell (10), the first end (50 a) of the heat conducting structure (50) is in contact with the control module (21), and a second end (50 b) of the heat conducting structure (50) is in contact with an image sensor (222) on the sensor module (22).

10. The industrial camera of claim 8 or 9,

the heat conducting structure (50) comprises a second base body (51) and a protrusion (52) protruding from a central region of the second base body (51), wherein the second base body (51) serves as a first end (50 a) of the heat conducting structure (50), and the protrusion (52) serves as a second end (50 b) of the heat conducting structure (50).

11. The industrial camera of claim 1,

the heat dissipation plate (30) is provided with a liquid inlet portion (34) and a liquid outlet portion (35), one ends of the liquid inlet portion (34) and the liquid outlet portion (35) are communicated with the heat dissipation channel (40), and the other ends of the liquid inlet portion (34) and the liquid outlet portion (35) are located outside the shell (10).

12. The industrial camera of claim 1,

the control module (21), the sensor module (22) and the enclosure (10) are filled with heat conduction materials.