CN218783049U

CN218783049U - LED lamp bead, display module and electronic equipment

Info

Publication number: CN218783049U
Application number: CN202223150471.XU
Authority: CN
Inventors: 周恒�; 冯超
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2022-11-25
Filing date: 2022-11-25
Publication date: 2023-03-31
Anticipated expiration: 2032-11-25

Abstract

The utility model provides a LED lamp pearl, display module assembly and electronic equipment, this LED lamp pearl include base plate and LED wafer, still include first inoxidizing coating, and first inoxidizing coating is attached to on base plate and the LED wafer, and first inoxidizing coating includes the first film of superpose in proper order, second film and third film, first film with substrate connection, first film, second film and the combination of third film form compact layer to make base plate and LED wafer all keep apart with the external world, the base plate facing is equipped with the green membrane of high temperature, and the green membrane of high temperature is located the both sides wall that the base plate is relative with the LED wafer respectively, and the green membrane of high temperature is used for keeping apart first inoxidizing coating. Through the application, the external water vapor or the halogen can be isolated from entering the LED wafer, the water vapor or the halogen existing on the LED wafer is avoided, the metal element of the LED wafer electrode is influenced by the current to cause the metal migration, the bad problem of the LED lamp bead is reduced, and the service life of the LED lamp bead is prolonged.

Description

LED lamp bead, display module and electronic equipment

Technical Field

The utility model relates to a LED encapsulation technology field, in particular to LED lamp pearl, display module assembly and electronic equipment.

Background

With the wide application of display screen technology, the application of key components and parts of the LED display device formed by the display screen becomes more important, and especially in the development direction of the display screen towards high definition, high resolution and high reliability, higher requirements are put forward on the LED display device.

At present, on a typical LED display CHIP device 1010, due to the miniaturization of the size (1.0 x 0.6 mm), the size of a correspondingly used wafer reaches below 200um, and the problem caused by the miniaturization is that the distance between positive and negative electrodes of the wafer is reduced, and due to the fact that no protection mechanism exists on the surface of the LED display device, after external water vapor and halogen invade the LED display device, metal migration occurs due to the continuous influence of current when the wafer electrodes are electrified, so that the LED short circuit dead lamp is caused, the display screen failure is further caused, and the specific expression is that the phenomenon of string lighting of pixels similar to the shape of a caterpillar is caused.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a LED lamp pearl, display module assembly and electronic equipment to not enough among the prior art.

In order to achieve the above object, the utility model provides a LED lamp pearl, include the base plate and locate LED wafer on the base plate still includes first inoxidizing coating, first inoxidizing coating attach to the base plate with on the LED wafer, first inoxidizing coating is including the first film, second film and the third film of superpose in proper order, first film with the substrate connection, first film the second film with the third film combination forms compact layer, so that the base plate with the LED wafer all keeps apart with the external world, the substrate facing is equipped with the high temperature green film, the high temperature green film with the LED wafer is located respectively on the relative both sides wall of base plate, the high temperature green film is used for keeping apart first inoxidizing coating.

The beneficial effects of the utility model are that: through attaching to first inoxidizing coating on base plate and LED wafer to make base plate and LED wafer all keep apart with the external world, can keep apart on external steam or halogen enter into the LED wafer promptly, avoid the metallic element of LED wafer electrode to receive the influence of electric current, take place the problem of metal migration, with the bad problem that reduces LED lamp pearl, prolong LED lamp pearl's life.

Preferably, the first protective layer is attached to the substrate and the LED wafer through an ALD coating method.

Preferably, the first thin film and the third thin film are both made of silicon oxide, and the second thin film is made of aluminum oxide.

Preferably, the thickness of the first protective layer is 30 to 200nm.

Preferably, the thickness of the first film and the thickness of the third film are both smaller than the thickness of the second film.

Preferably, the LED lamp bead further comprises a bonding wire and an epoxy layer, one end of the bonding wire is connected with the LED wafer, the other end of the bonding wire is connected with the substrate, and the epoxy layer wraps the LED wafer and the bonding wire.

Preferably, the LED lamp bead further comprises a second protective layer, and the bonding wire is wrapped by the second protective layer and integrally formed with the first protective layer.

Preferably, the substrate is made of a BT plate.

In order to realize the purpose, the utility model also provides a display module assembly, LED lamp pearl in the above-mentioned.

In order to achieve the above object, the present invention also provides an electronic device including the display module set.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is the utility model discloses the structure schematic diagram of LED lamp pearl that the first embodiment provided.

Description of the main element symbols:

substrate	10	Bonding wire	40
				LED wafer	20	Epoxy resin layer	50
A first protective layer	30	Second protective layer	60

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, an LED lamp bead according to a first embodiment of the present invention includes a substrate 10, an LED chip 20, and a first protective layer 30.

Wherein: the substrate 10 is made of BT plate, the LED chip 20 is mounted at the center of the surface of the substrate 10, and the first protective layer 30 is attached to the outer contours of the substrate 10 and the LED chip 20, so that the substrate 10 and the LED chip 20 are isolated from the external moisture or halogen, and the problem that the metal elements of the electrodes of the LED chip 20 are affected by the current and the metal migration occurs due to the moisture or halogen entering the LED chip 20 is avoided.

In this embodiment, the LED lamp bead further includes a bonding wire 40 and an epoxy layer 50, the bonding wire 40 is used for conducting electricity, one end of the bonding wire 40 is connected to the LED chip 20, the other end of the bonding wire 40 is connected to the substrate 10, the epoxy layer 50 is used for protecting the LED chip 20, the epoxy layer 50 wraps the LED chip 20 and the bonding wire 40, and it should be noted that the epoxy layer 50 is fixed on the surface of the substrate 10 by means of a pressing mold.

In the present embodiment, before the step of forming the epoxy layer 50 on the substrate 10, a second protective layer 60 is required to be wrapped on the bonding wires 40, so as to further reduce the probability of metal migration in the LED chip 20 to affect the quality of the LED chip 20. It should be noted that the first protection layer 30 and the second protection layer 60 have the same structure, and the second protection layer 60 is integrally formed with the first protection layer 30.

Specifically, before the first protective layer 30 and the second protective layer 60 are formed on the substrate 10, the LED chip 20 and the bonding wire 40, respectively, a high temperature green film needs to be attached to the bottom of the substrate 10, and the high temperature green film and the LED chip 20 are located on two opposite sidewalls of the substrate 10, respectively, so that the first protective layer 60 or the second protective layer 60 can be isolated from the bottom of the substrate 10, that is, the bottom of the substrate 10 is prevented from being coated with the first protective layer 30 or the second protective layer 60, which may affect the tin pasting or the tin paste brushing on the bottom of the substrate 10.

It should be noted that, the first protective layer 30 and the second protective layer 60 are respectively formed on the substrate 10, the LED chip 20 and the bonding wires 40 by ALD coating, and the first protective layer 30 formed by ALD coating is different from the earlier spray coating and PVD physical vapor deposition, and has more uniform thickness, thinner thickness, high-density waterproof, antistatic and metal migration resistance, and approximate refractive index to the LED chip 20, and can achieve a good light-emitting angle.

In the present embodiment, the first protection layer 30 includes a first film, a second film and a third film stacked in sequence, specifically, the first film is deposited and attached to the outer contours of the substrate 10 and the LED chip 20 by an ALD coating method in advance, the second film and the third film are deposited on the first film in sequence by an ALD coating method, it can be understood that, in the present embodiment, the first film and the third film are both made of silicon oxide, the second film is made of aluminum oxide, and the first film, the second film and the third film are combined to form a dense layer, so that the substrate 10 and the LED chip 20 are isolated from external moisture or halogen, and the problem that metal elements of the electrode of the LED chip 20 are affected by current and metal migration occurs due to the entry of moisture or halogen into the LED chip 20 is avoided.

It is understood that the first film and the third film can provide good bonding performance based on the non-conductive and good bonding performance of silicon oxide, so as to be connected with the substrate 10 and the epoxy layer 50 respectively; based on the characteristics of high refractive index and strong waterproof property of the alumina, the waterproof property of the first protective layer 30 or the second protective layer 60 is improved.

It will be appreciated that the second protective layer 60 is formed in a manner substantially identical to that of the first protective layer 30 and will not be described in detail herein.

In the embodiment, the thickness of the first protective layer 30 and the second protective layer 60 is 30-200nm, and generally, the thickness of the first protective layer 30 or the second protective layer 60 is more than 30nm to achieve effective water-proofing, it can be understood that the optimal thickness of the first protective layer 30 and the second protective layer 60 is 50nm, and the thicknesses of the corresponding first film, second film and third film are 7nm, 37nm and 6nm, respectively.

When the LED lamp is specifically implemented, the protective layer is attached to the substrate 10 and the LED wafer 20, so that the substrate 10 and the LED wafer 20 are isolated from the outside, namely, external water vapor or halogen can be isolated from entering the LED wafer 20, the problem that metal elements of electrodes of the LED wafer 20 are affected by current and metal migration occurs is avoided, the problem of poor quality of the LED lamp beads is reduced, and the service life of the LED lamp beads is prolonged.

It should be noted that, the implementation process described above is only for illustrating the applicability of the present application, but this does not mean that the LED lamp bead of the present application has only the above-mentioned one implementation process, and on the contrary, as long as the LED lamp bead of the present application can be implemented, all the LED lamp beads can be incorporated into the feasible embodiments of the present application.

The utility model discloses display module assembly in the second embodiment, including the LED lamp pearl in the first embodiment.

It should be noted that, the LED lamp bead provided by the second embodiment of the present invention, the implementation principle and some technical effects generated by the LED lamp bead are the same as those of the first embodiment, and for the sake of brief description, the embodiment does not mention, and reference may be made to corresponding contents in the first embodiment.

The utility model discloses electronic equipment in the third embodiment, including the display module assembly in the second embodiment.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a LED lamp pearl, includes the base plate and locates LED wafer on the base plate, its characterized in that still includes first inoxidizing coating, first inoxidizing coating attach to the base plate with on the LED wafer, first inoxidizing coating is including the first film of superpose in proper order, second film and third film, first film with the substrate connection, first film the second film with the third film combination forms compact layer, so that the base plate with the LED wafer all keeps apart with the external world, the substrate facing is equipped with the green membrane of high temperature, the green membrane of high temperature with the LED wafer is located respectively on the both sides wall that the base plate is relative, the green membrane of high temperature is used for keeping apart first inoxidizing coating.

2. The LED lamp bead of claim 1, wherein the first protective layer is attached to the substrate and the LED chip by ALD coating.

3. The LED lamp bead according to claim 1, wherein the first film and the third film are both made of silicon oxide, and the second film is made of aluminum oxide.

4. The LED lamp bead according to claim 1, wherein the thickness of the first protective layer is 30-200nm.

5. The LED lamp bead of claim 1, wherein the thickness of the first film and the thickness of the third film are both less than the thickness of the second film.

6. The LED lamp bead according to claim 1, wherein the LED lamp bead further comprises a bonding wire and an epoxy layer, one end of the bonding wire is connected with the LED chip, the other end of the bonding wire is connected with the substrate, and the epoxy layer wraps the LED chip and the bonding wire.

7. The LED lamp bead of claim 6, further comprising a second protective layer, wherein the bonding wire is wrapped by the second protective layer, and the second protective layer is integrally formed with the first protective layer.

8. The LED lamp bead according to claim 1, wherein the substrate is made of BT sheet material.

9. A display module, characterized in that, includes the LED lamp pearl of any one of claims 1-8.

10. An electronic device comprising the display module of claim 9.