CN218730938U - Intelligent light-modulation color-display-finger CoB light source - Google Patents
Intelligent light-modulation color-display-finger CoB light source Download PDFInfo
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- CN218730938U CN218730938U CN202222506792.2U CN202222506792U CN218730938U CN 218730938 U CN218730938 U CN 218730938U CN 202222506792 U CN202222506792 U CN 202222506792U CN 218730938 U CN218730938 U CN 218730938U
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Abstract
The application discloses an intelligent light-modulation color-modulation index CoB light source which comprises a circuit substrate, a blue light chip set, a red CSP chip set, a dark red CSP chip set, dam rubber, a fluorescent mixture, a power supply positive electrode pad, a first power supply negative electrode pad, a second power supply negative electrode pad and a third power supply negative electrode pad; the blue light chip set, the red CSP chip set and the deep red CSP chip set are arranged on the circuit substrate in a combined mode; the dam adhesive is arranged on the circuit substrate along the peripheries of the blue light chip set, the red CSP chip set and the deep red CSP chip set; the fluorescent mixture is arranged in gaps among the blue light chip set, the red CSP chip set, the deep red CSP chip set and the dam adhesive; the blue light chip set is electrically connected with the power supply anode bonding pad and the first power supply cathode bonding pad; the red CSP chip set is electrically connected with the power supply positive electrode bonding pad and the second power supply negative electrode bonding pad; the deep red CSP chip group is electrically connected with the power supply positive electrode bonding pad and the third power supply negative electrode bonding pad so as to realize flexible regulation and control of color rendering index and light effect.
Description
Technical Field
The application relates to the technical field of lighting, in particular to an intelligent light-adjusting color-modulation color-display-finger CoB light source.
Background
With the continuous improvement of the technological level, in the application fields of commercial illumination, furniture illumination, film and television illumination and the like, an intelligent dimming and color mixing CoB (Chip On Board) light source is mostly adopted as a light emitting source at present.
In the process of realizing the prior art, the inventor finds that:
the existing intelligent dimming and color mixing CoB light sources are mainly of two types, one type is high in low-color-rendering-index light effect, the other type is low in high-color-rendering-index light effect, the two CoB light sources need to be matched with lamps to realize application in different places, and the situation that one CoB light source is applied to places in different fields cannot be realized. The existing intelligent dimming and toning CoB technology is still to be improved.
Therefore, it is necessary to provide a related technical solution for a CoB light source that can flexibly adjust and control the color rendering index and the luminous efficiency.
SUMMERY OF THE UTILITY MODEL
The application provides a can regulate and control related technical scheme that the intelligent mixing of colors of adjusting luminance that colour rendering index and light efficiency are nimble indicates the CoB light source, can both realize intelligent dimming mixing of colors on same CoB light source, realize again that intelligence changes colour rendering index, still can realize simultaneously that low apparent indicates that the light efficiency is high and high apparent indicates that the light efficiency is low, has solved the technical problem that current CoB light source can't regulate and control colour rendering index and light efficiency in a flexible way.
The application provides an intelligent light modulation color modulation indication CoB light source which comprises a circuit substrate, a blue light chip set, a red CSP chip set, a deep red CSP chip set, dam rubber, a fluorescent mixture, a power supply positive electrode pad, a first power supply negative electrode pad, a second power supply negative electrode pad and a third power supply negative electrode pad;
the blue light chip set, the red CSP chip set and the deep red CSP chip set are arranged on the circuit substrate in a combined mode;
the dam adhesive is arranged on the circuit substrate along the peripheries of the blue light chip group, the red CSP chip group and the deep red CSP chip group;
the fluorescent mixture is arranged in gaps among the blue light chip set, the red CSP chip set, the deep red CSP chip set and the dam adhesive;
the blue light chip set is electrically connected with the power supply anode bonding pad and the first power supply cathode bonding pad;
the red CSP chip set is electrically connected with the power supply anode bonding pad and the second power supply cathode bonding pad;
the deep red CSP chip group is electrically connected with the power supply positive electrode bonding pad and the third power supply negative electrode bonding pad.
Furthermore, the fluorescent mixture is formed by mixing a first silica gel material and fluorescent powder.
Furthermore, the fluorescent powder is formed by mixing green fluorescent powder, yellow fluorescent powder and red fluorescent powder in proportion.
Furthermore, the first silica gel material is a methyl chain material.
Furthermore, the blue light chip group comprises a plurality of first blue light chips which are electrically connected in sequence through gold wires.
Furthermore, the red CSP chip group comprises a plurality of red CSP chips which are electrically connected in sequence through gold wires.
Further, the red CSP chip is composed of a second blue light chip and a first red fluorescent film;
the first red fluorescent film is obtained by mixing first red fluorescent powder and a second silica gel material.
Furthermore, the deep red CSP chip group comprises a plurality of deep red CSP chips which are electrically connected in sequence through gold wires.
Further, the deep red CSP chip is composed of a third blue light chip and a second red fluorescent die;
the second red fluorescent film is obtained by mixing second red fluorescent powder and a third silica gel material.
Further, the wavelength of light waves emitted by the first blue light chip, the second blue light chip and the third blue light chip is 440-460nm;
the wavelength of light waves emitted by the red CSP chip is 625-630nm;
the wavelength of light emitted by the deep red CSP chip is 650-655nm.
The technical scheme provided by the application has the following beneficial effects at least:
through the combined arrangement of the blue light chip set, the red CSP chip set and the deep red CSP chip set, the light emitting of various colors can be realized through one CoB light source; by arranging the dam adhesive at the peripheries of the blue light chip group, the red CSP chip group and the deep red CSP chip group, the influence degree of the overflow of light in the light emitting area on the light emitting effect can be reduced; the fluorescent mixture is arranged in the gaps among the blue light chip group, the red CSP chip group, the deep red CSP chip group and the dam adhesive, so that the luminous effect can be enhanced; through connecting the blue light chipset between positive power pad and first power negative terminal pad, connect red CSP chipset between positive power pad and second power negative terminal pad, connect dark red CSP chipset between positive power pad and third power negative terminal pad, can realize the independent power control to blue light chipset, red CSP chipset, dark red CSP chipset, realize multiple luminous effect.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of an intelligent light-modulation color-modulation-display-finger CoB light source provided in an embodiment of the present application.
11. A circuit substrate; 12. a blue light chip set; 13. a red CSP chipset; 14. a deep red CSP chipset; 15. dam enclosing glue; 16. a fluorescent mixture; 17. a power supply positive electrode pad; 18. a first power supply negative electrode pad; 19. a second power supply negative electrode pad; 20. a third power supply negative electrode pad; 100. intelligent light-modulating, color-modulating, and color-modulating display refers to a CoB light source.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, an intelligent light modulation color modulation index CoB light source 100 provided by the present application includes a circuit substrate 11, a blue light chip set 12, a red CSP chip set 13, a deep red CSP chip set 14, a dam glue 15, a fluorescent mixture 16, a power supply positive electrode pad 17, a first power supply negative electrode pad 18, a second power supply negative electrode pad 19, and a third power supply negative electrode pad 20;
the blue light chip set 12, the red CSP chip set 13 and the deep red CSP chip set 14 are arranged on the circuit substrate 11 in a combined manner;
the dam rubber 15 is arranged on the circuit substrate 11 along the peripheries of the blue light chip set 12, the red CSP chip set 13 and the deep red CSP chip set 14;
the fluorescent mixture 16 is arranged in a gap among the blue light chip set 12, the red CSP chip set 13, the deep red CSP chip set 14 and the dam rubber 15;
the blue light chip set 12 is electrically connected with the power supply positive electrode bonding pad 17 and the first power supply negative electrode bonding pad 18;
the red CSP chip group 13 is electrically connected with the power supply positive electrode pad 17 and the second power supply negative electrode pad 19;
the deep red CSP chip group 14 is electrically connected to the positive power pad 17 and the negative power pad 20.
Here, the circuit board 11 may be made of a material such as superconducting aluminum, copper, or ceramic. In a specific embodiment, the dimensions of the circuit substrate 11 are 15.8mm x 1.0mm, i.e., the surface of the circuit substrate 11 is square, the side length thereof is 15.8mm, and the thickness of the circuit substrate 11 is 1.0mm. The circuit substrate 11 preferably adopts a superconducting aluminum circuit substrate or a copper circuit substrate, the thickness of an insulating layer is generally 50-60 um, the heat conductivity coefficient of the insulating layer is required to be more than 8-12W/m.K, the thickness of a circuit layer copper foil is more than 1oz, the power supply positive electrode bonding pad 17, the first power supply negative electrode bonding pad 18, the second power supply negative electrode bonding pad 19, the third power supply negative electrode bonding pad 20 and other bonding pads adopt a nickel-palladium-gold deposition process, and the thicknesses of nickel, palladium and gold are respectively 180u ', 1u ' and 2u '. The solder mask of the circuit substrate 11 is made of high-temperature-resistant warm white solar ink, and the thickness of the solder mask is 25um. Where u' represents micro-inches, is one of the commonly used units of measure in electroplating processes. The blue light chip group 12, the red CSP chip group 13 and the crimson CSP chip group 14 are fixed on the circuit substrate 11 through a reflow soldering technology, electrical connection is formed between chip bonding pads of the blue light chip group 12, the red CSP chip group 13 and the crimson CSP chip group 14 and bonding pads of the circuit substrate 11 and between internal bonding pads of the circuit substrate 11 through an ultrasonic bonding technology, and then dam glue is dispensed on the circuit substrate 11 to form dam glue 15. A blue light chip set 12 fixed on the wiring substrate 11 may be used to excite the phosphor mixture 16 to obtain white light. The blue light chip set 12, the red CSP chip set 13 and the deep red CSP chip set 14 can perform combination control of different currents through the power supply positive electrode bonding pad 17, the first power supply negative electrode bonding pad 18, the second power supply negative electrode bonding pad 19 and the third power supply negative electrode bonding pad 20 to obtain light rays with different color temperatures. Such as: the current passing through the blue light chip set 12 can be controlled through the power supply positive electrode bonding pad 17 and the first power supply negative electrode bonding pad 18, the current passing through the red CSP chip set 13 can be controlled through the power supply positive electrode bonding pad 17 and the second power supply negative electrode bonding pad 19, the currents passing through the blue light chip set 12 and the red CSP chip set 13 are controlled in a combined mode, and finally emitted light can be kept at the color temperature indicated by 80; the current passing through the blue light chip set 12 can be controlled through the power supply positive electrode bonding pad 17 and the first power supply negative electrode bonding pad 18, the current passing through the deep red CSP chip set 14 can be controlled through the power supply positive electrode bonding pad 17 and the third power supply negative electrode bonding pad 20, the currents passing through the blue light chip set 12 and the deep red CSP chip set 14 are controlled in a combined mode, and finally emitted light can be kept at the color temperature indicated by 95; the current passing through the blue chip set 12 can be controlled through the power supply positive electrode pad 17 and the first power supply negative electrode pad 18, the current passing through the red CSP chip set 13 can be controlled through the power supply positive electrode pad 17 and the second power supply negative electrode pad 19, the current passing through the deep red CSP chip set 14 can be controlled through the power supply positive electrode pad 17 and the third power supply negative electrode pad 20, the currents passing through the blue chip set 12, the red CSP chip set 13 and the deep red CSP chip set 14 are controlled in a combined mode, and finally emitted light can be kept in different color temperature sections indicated by 80-95. The application provides an intelligent dimming tone-modulation index CoB light source which can be independently applied to a plurality of different fields, is wide in coverage range, can realize intelligent change of color temperature from 2700K to 6500K, and can also realize intelligent change of color rendering index from 80 to 100.
Further, the fluorescent mixture 16 is formed by mixing a first silica gel material and fluorescent powder.
It should be noted that the first silicone material is understood as a common silicone commonly used in the electronic technology field. The fluorescent mixture 16 is formed by mixing silica gel and fluorescent powder, and is coated on a blank area surrounded by the dam rubber 15. The blue light chipset 12 emits light to excite the phosphor in the phosphor mixture 16 to emit white light after being powered on.
Furthermore, the fluorescent powder is formed by mixing green fluorescent powder, yellow fluorescent powder and red fluorescent powder in proportion.
The green phosphor is preferably made of LuAG and GaAG materials, and has a wavelength of 500-540nm. The yellow phosphor is preferably a YAG material having a wavelength of about 585 nm. The red phosphor is preferably a nitride or oxynitride material with a wavelength of 625-660nm.
Furthermore, the first silica gel material is a methyl chain material.
It is to be noted that the first silicone material is understood to be a silicone in the general field of electronics. The silica gel is preferably a methyl chain material, and has a refractive index of generally 1.41 and can withstand a high temperature of 260 ℃ or higher.
Further, the blue light chipset 12 includes a plurality of first blue light chips electrically connected in sequence by gold wires.
It should be noted that the gold wire used in the blue-ray chipset 12 may be understood as a gold wire, the gold content is 99.99%, and the wire diameter is required to be 1.0mil. The first blue chip here can be understood as a normal blue chip. The first blue light chips in the blue light chip set 12 can be connected in series by gold wires. The electric connection is realized through gold wires, so that the electric conductivity and the hot pressing performance can be effectively improved.
Further, the red CSP chip set 13 includes a plurality of red CSP chips electrically connected in sequence by gold wires.
The gold wires used in the red CSP chip set 13 can be understood as gold wires, with a gold content of 99.99% and a wire diameter of 1.0mil. The red CSP chips in the red CSP chip group 13 can be connected in series by gold wires. The electric connection is realized through gold wires, so that the electric conductivity and the hot pressing performance can be effectively improved.
Further, the red CSP chip is composed of a second blue light chip and a first red fluorescent film;
the first red fluorescent film is obtained by mixing first red fluorescent powder and a second silica gel material.
It should be noted that the second blue chip is understood as a normal blue chip, and the first red phosphor film is selected from red phosphor films with a wavelength of 625-630 nm. The first red phosphor can be red phosphor with a wavelength of 625-660nm, and is preferably made of nitride or oxynitride. The second silicone material is understood here to be a silicone in the general field of electronics. The second silica gel material is preferably methyl chain material, the refractive index is generally 1.41, and the second silica gel material can resist high temperature of more than 260 ℃. The first red fluorescent powder and the second silica gel material are mixed according to a specific proportion to prepare a first red fluorescent film with a specific wavelength.
Further, the deep red CSP chipset 14 includes a plurality of deep red CSP chips electrically connected in sequence by gold wires.
The gold wires used in the magenta CSP chip set 14 are gold wires, which have a gold content of 99.99% and a wire diameter of 1.0mil. The plurality of deep red CSP chips inside the deep red CSP chipset 14 can be connected in series by gold wires. The electric connection is realized through gold wires, so that the electric conductivity and the hot pressing performance can be effectively improved.
Further, the deep red CSP chip is composed of a third blue light chip and a second red fluorescent die;
the second red fluorescent film is obtained by mixing second red fluorescent powder and a third silica gel material.
It should be noted that the third blue chip is understood as a normal blue chip, and the second red phosphor chip is selected from a red phosphor chip with a wavelength of 650-655nm. The second red phosphor can be red phosphor with a wavelength of 625-660nm, and is preferably made of nitride or oxynitride. The third silicone material is understood to be silicone in the general field of electronics. The third silica gel material is preferably methyl chain material, the refractive index is generally 1.41, and the third silica gel material can resist high temperature of more than 260 ℃. The second red fluorescent powder and the third silica gel material are mixed according to a specific proportion to prepare a second red fluorescent film with a specific wavelength.
Further, the wavelength of light waves emitted by the first blue light chip, the second blue light chip and the third blue light chip is 440-460nm;
the wavelength of light waves emitted by the red CSP chip is 625-630nm;
the wavelength of light emitted by the deep red CSP chip is 650-655nm.
It should be noted that the first blue chip, the second blue chip, and the third blue chip may be understood as a common blue chip with a light wavelength of 440-460 nm. The blue light chip set 12 mainly obtains white light by exciting the fluorescent substance such as phosphor powder in the fluorescent mixture 16 through the inner first blue light chip, and the obtained white light is mixed with the light emitted by the red CSP chip set 13 under a specific current, so as to obtain the light with the color temperature of 80 color. The resulting white light is mixed with light emitted by the deep red CSP chip set 14 at a particular current to produce 95 color temperature light. The obtained white light is mixed with the light emitted by the red CSP chip group 13 under a specific current and the light emitted by the dark red CSP chip group 14 under the specific current, and the light with the color temperature range of 80-95 can be obtained. The blue light chips in the blue light chip group 12 excite the fluorescent powder mixed in the fluorescent mixture 16, and under the matching of the red CSP chip group 13 and the deep red CSP chip group 14, the brightness of different color rendering indexes, different color temperature sections and different lights can be intelligently adjusted.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. An intelligent light-modulation color-modulation indication CoB light source is characterized by comprising a circuit substrate, a blue light chip set, a red CSP chip set, a deep red CSP chip set, dam rubber, a fluorescent mixture, a power supply positive electrode pad, a first power supply negative electrode pad, a second power supply negative electrode pad and a third power supply negative electrode pad;
the blue light chip set, the red CSP chip set and the deep red CSP chip set are arranged on the circuit substrate in a combined mode;
the dam adhesive is arranged on the circuit substrate along the peripheries of the blue light chip group, the red CSP chip group and the deep red CSP chip group;
the fluorescent mixture is arranged in gaps among the blue light chip set, the red CSP chip set, the deep red CSP chip set and the dam adhesive;
the blue light chip set is electrically connected with the power supply anode bonding pad and the first power supply cathode bonding pad;
the red CSP chip set is electrically connected with the power supply anode bonding pad and the second power supply cathode bonding pad;
the deep red CSP chip group is electrically connected with the power supply positive electrode bonding pad and the third power supply negative electrode bonding pad.
2. The intelligent light-modulating color-rendering index CoB light source of claim 1, wherein the phosphor blend is formed by mixing a first silica gel material and a phosphor.
3. The intelligent light-modulation color-modulation indicator CoB light source according to claim 2, wherein the fluorescent powder is prepared by mixing green fluorescent powder, yellow fluorescent powder and red fluorescent powder in proportion.
4. The intelligent light-modulation color-modulation index CoB light source according to claim 2, wherein said silica gel is made of methyl chain material.
5. The intelligent light-modulation color-modulation dominant CoB light source of claim 1, wherein the blue-light chipset comprises a plurality of first blue-light chips electrically connected in sequence by gold wires.
6. The intelligent light-modulation color-modulation dominant CoB light source of claim 5, wherein the red CSP chipset comprises a plurality of red CSP chips electrically connected in sequence by gold wires.
7. The intelligent light-modulating, color-modulating, light-indicating CoB light source of claim 6, wherein the red CSP chip is comprised of a second blue chip and a first red phosphor die;
the first red fluorescent film is obtained by mixing first red fluorescent powder and a second silica gel material.
8. The intelligent light-modulation color-modulation dominant CoB light source of claim 7, wherein the deep red CSP chipset comprises a plurality of deep red CSP chips electrically connected in sequence by gold wires.
9. The intelligent light-modulating, color-modulating, light-indicating CoB light source of claim 8, wherein the deep red CSP chip is comprised of a third blue chip and a second red phosphor die;
the second red fluorescent film is obtained by mixing second red fluorescent powder and a third silica gel material.
10. The intelligent light-modulation color-modulation dominant CoB light source of claim 9, wherein the wavelength of light emitted by the first blue light chip, the second blue light chip and the third blue light chip is 440-460nm;
the wavelength of light waves emitted by the red CSP chip is 625-630nm;
the wavelength of light waves emitted by the deep red CSP chip is 650-655nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222506792.2U CN218730938U (en) | 2022-09-21 | 2022-09-21 | Intelligent light-modulation color-display-finger CoB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222506792.2U CN218730938U (en) | 2022-09-21 | 2022-09-21 | Intelligent light-modulation color-display-finger CoB light source |
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| Publication Number | Publication Date |
|---|---|
| CN218730938U true CN218730938U (en) | 2023-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222506792.2U Active CN218730938U (en) | 2022-09-21 | 2022-09-21 | Intelligent light-modulation color-display-finger CoB light source |
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| CN (1) | CN218730938U (en) |
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- 2022-09-21 CN CN202222506792.2U patent/CN218730938U/en active Active
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