CN218710936U - A device that drips fast for perpendicular plating line of PCB processing procedure - Google Patents
A device that drips fast for perpendicular plating line of PCB processing procedure Download PDFInfo
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- CN218710936U CN218710936U CN202223066497.6U CN202223066497U CN218710936U CN 218710936 U CN218710936 U CN 218710936U CN 202223066497 U CN202223066497 U CN 202223066497U CN 218710936 U CN218710936 U CN 218710936U
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- crane
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Abstract
The utility model provides a device that drips fast for perpendicular electric plate wire of PCB processing procedure belongs to the perpendicular electroplating technology field in the PCB board production process, including vibrating mechanism, lifting by crane mechanism and control system, lifting by crane the mechanism and being used for taking the work piece from the hydraulic cylinder, it installs to vibrate the mechanism lifting by crane mechanism one side, is used for driving lifting by crane the mechanism vibrations, control system with vibrate the mechanism electricity and connect, work as lifting by crane the mechanism and taking the work piece from the hydraulic cylinder when, be used for control it starts to vibrate the mechanism. The utility model discloses the optimal design realizes the PCB plate in the quick function of dripping of perpendicular plating line, can drip workpiece surface adnexed liquid in the short time, also can drip more liquid at equal time to reach the proportion that reduces liquid cross contamination, reduce liquid and consume.
Description
Technical Field
The utility model belongs to the technical field of electroplate perpendicularly in the PCB board production process, specifically a device drips fast for perpendicular plating line of PCB processing procedure.
Background
In the Printed Circuit Board (PCB) industry, in order to ensure that a high-quality plate is provided for a customer and reduce the processing cost, the investment of consumables is reduced as much as possible and the utilization rate of equipment is improved in each production and processing link except strictly according to the production process flow, so that the overall processing cost is optimized. In the vertical electroplating process, the consumption of the liquid medicine brought out and the influence of the cross contamination of the liquid medicine can be reduced. In addition, the time for waiting for dripping water can be reduced, so that the processing period is shortened, and the utilization rate of equipment is improved.
Disclosure of Invention
To the not enough of above-mentioned prior art, the embodiment of the utility model provides a technical problem who solves provides a device drips fast for perpendicular plating line of PCB processing procedure.
In order to solve the technical problem, the utility model provides a following technical scheme:
a fast water dripping device for a vertical electroplating line in a PCB manufacturing process comprises a vibration mechanism, a lifting mechanism and a control system,
the lifting mechanism is used for taking the workpiece away from the hydraulic cylinder,
the vibration mechanism is arranged on one side of the lifting mechanism and is used for driving the lifting mechanism to vibrate,
and the control system is electrically connected with the oscillation mechanism and is used for controlling the oscillation mechanism to start when the hoisting mechanism takes the workpiece away from the hydraulic cylinder.
As a further improvement of the utility model: the hoisting mechanism comprises a suspension arm and a hanging basket arranged at one end of the suspension arm.
As a further improvement of the utility model: the oscillation mechanism is installed on one side of the suspension arm.
As a further improvement of the utility model: the oscillation mechanism is an adjustable oscillation motor.
As the utility model discloses further improvement scheme again: the control system can set the oscillation time of the oscillation mechanism according to requirements.
Compared with the prior art, the beneficial effects of the utility model are that:
1. at the same time, 11.39% more liquid can be dropped by using the device than the traditional device for waiting for dropping water.
2. The liquid drops into the original liquid cylinder, thereby avoiding the waste and cross contamination of the liquid and reducing the consumption.
3. The structure is succinct, and the maintenance cost is low, does not have the loss piece.
The utility model discloses the optimal design realizes the PCB plate in the quick function of dripping of perpendicular plating line, can drip workpiece surface adnexed liquid in the short time, also can drip more liquid at equal time to reach the proportion that reduces liquid cross contamination, reduce liquid and consume. The device has low daily energy consumption and simple and convenient installation, can directly and vertically reduce the useless loss of each liquid cylinder of the electroplating line, and reduces the processing cost of the processing procedure.
Drawings
Fig. 1 is a schematic structural view of a rapid water dropping apparatus for a vertical plating line in a PCB manufacturing process.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
Referring to fig. 1, the embodiment provides a quick water dripping device for a vertical electroplating line in a PCB manufacturing process, which includes an oscillating mechanism 1, a hoisting mechanism and a control system 4, wherein the hoisting mechanism is used for taking a workpiece away from a hydraulic cylinder, the oscillating mechanism 1 is installed on one side of the hoisting mechanism and used for driving the hoisting mechanism to vibrate, and the control system 4 is electrically connected with the oscillating mechanism 1 and used for controlling the oscillating mechanism 1 to start when the hoisting mechanism takes the workpiece away from the hydraulic cylinder.
After the workpiece is electroplated in the hydraulic cylinder, the workpiece is taken away from the hydraulic cylinder through the hoisting mechanism, the control system 4 controls the oscillation mechanism 1 to start, the oscillation mechanism 1 can drive the hoisting mechanism to vibrate when starting, and then drives the workpiece to vibrate, and the electroplating solution attached to the surface of the workpiece can be quickly shaken away and dripped into the hydraulic cylinder again when vibrating.
Referring to fig. 1, in one embodiment, the lifting mechanism includes a boom 2 and a basket 3 disposed at one end of the boom 2, and the oscillation mechanism 1 is mounted on one side of the boom 2.
Vibrate mechanism 1 and can pass through 2 transmissions to hanging flower basket 3 with shaking force after the start-up in to drive the work piece vibrations in the hanging flower basket 3, realize breaking away from fast of workpiece surface plating solution, and because the work piece is located hanging flower basket 3 inside, when making hanging flower basket 3 drive the work piece vibrations, the work piece can not loosen and take off.
In one embodiment, the oscillating mechanism 1 is an adjustable oscillating motor, and the control system 4 can set the oscillating time of the oscillating mechanism 1 according to the requirement, that is, when the control system 4 collects that the workpiece leaves a specific hydraulic cylinder, the oscillating mechanism 1 is started, and the oscillation is stopped after the set time.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (5)
1. A rapid water dripping device for a vertical electroplating line in a PCB manufacturing process is characterized by comprising a vibration mechanism, a hoisting mechanism and a control system,
the lifting mechanism is used for taking the workpiece away from the hydraulic cylinder,
the vibration mechanism is arranged on one side of the lifting mechanism and is used for driving the lifting mechanism to vibrate,
the control system is electrically connected with the oscillating mechanism and is used for controlling the oscillating mechanism to start when the lifting mechanism takes the workpiece away from the hydraulic cylinder.
2. The quick water dripping device for the vertical plating line for the PCB process according to claim 1, wherein the lifting mechanism comprises a suspension arm and a hanging basket arranged at one end of the suspension arm.
3. The fast dripping device for vertical PCB processing line as claimed in claim 2, wherein the oscillating mechanism is installed at one side of the suspension arm.
4. The apparatus as claimed in any one of claims 1 to 3, wherein the oscillating mechanism is an adjustable oscillating motor.
5. The apparatus as claimed in claim 1, wherein the control system is capable of setting the oscillation time of the oscillation mechanism according to a requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223066497.6U CN218710936U (en) | 2022-11-18 | 2022-11-18 | A device that drips fast for perpendicular plating line of PCB processing procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223066497.6U CN218710936U (en) | 2022-11-18 | 2022-11-18 | A device that drips fast for perpendicular plating line of PCB processing procedure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218710936U true CN218710936U (en) | 2023-03-24 |
Family
ID=85621685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223066497.6U Active CN218710936U (en) | 2022-11-18 | 2022-11-18 | A device that drips fast for perpendicular plating line of PCB processing procedure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218710936U (en) |
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2022
- 2022-11-18 CN CN202223066497.6U patent/CN218710936U/en active Active
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