CN218691696U - Wafer sorting machine and wafer sorting production line - Google Patents
Wafer sorting machine and wafer sorting production line Download PDFInfo
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- CN218691696U CN218691696U CN202222690416.3U CN202222690416U CN218691696U CN 218691696 U CN218691696 U CN 218691696U CN 202222690416 U CN202222690416 U CN 202222690416U CN 218691696 U CN218691696 U CN 218691696U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
This application is applicable to wafer sorting technology field, provides a wafer sorter and wafer sorting production line, wafer sorter includes: a base; the feeding and discharging mechanism is arranged on the base; the material box mechanism is arranged on the base and is positioned in the range of the transverse moving length of the feeding and discharging mechanism; a plurality of sorting station devices disposed on the base; the sorting station device comprises: the wafer carrying platform mechanism is arranged on the base and is positioned in the range of the transverse moving length of the feeding and discharging mechanism; and the bin carrying platform mechanism is arranged on the base and is positioned in the range of the transverse moving length. The wafer sorting machine provided by the embodiment of the application can improve the working efficiency.
Description
Technical Field
The application belongs to the technical field of wafer sorting, and more specifically relates to a wafer sorting machine and a wafer sorting production line.
Background
In the manufacturing process of the unpackaged LED (light-emitting diode) chip semi-finished products, a sorting machine is usually used to sort various types of LED chip wafers. The work efficiency of the existing wafer sorting machine is low.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a wafer sorting machine and a wafer sorting production line, and the work efficiency can be improved.
In a first aspect, an embodiment of the present application provides a wafer sorter, including:
a base;
the feeding and discharging mechanism is arranged on the base;
the material box mechanism is arranged on the base and is positioned in the range of the transverse moving length of the feeding and discharging mechanism;
a plurality of sorting station devices disposed on the base;
the sorting station device comprises:
the wafer carrying platform mechanism is arranged on the base and is positioned in the range of the transverse moving length of the feeding and discharging mechanism;
and the bin carrying platform mechanism is arranged on the base and is positioned in the range of the transverse moving length.
In some possible embodiments of the first aspect, the sorting station apparatus further comprises:
the thimble mechanism is arranged on one side of the wafer carrying platform mechanism;
a jacking mechanism disposed on one side of the bin stage mechanism;
and the swing arm mechanism is arranged between the wafer carrier mechanism and the bin carrier mechanism.
In some possible embodiments of the first aspect, the cartridge mechanism comprises:
the wafer material box is arranged on the base and is positioned in the range of the transverse moving length;
and the bin box is arranged on the base and is positioned in the range of the transverse moving length.
In some possible embodiments of the first aspect, each sorting station device is arranged on the base in sequence along the transverse moving direction of the loading and unloading mechanism.
In some possible embodiments of the first aspect, the loading and unloading mechanism includes:
a support member provided to the base;
a cross member provided to the support member;
the grabbing component is movably arranged on the cross beam;
the moving range of the grabbing component along the length direction of the cross beam is the transverse moving length range.
In some possible embodiments of the first aspect, the support member comprises:
a first support member provided to the base;
a second support member provided to the base;
each of the wafer stage mechanisms and each of the bin stage mechanisms are located between the first support member and the second support member along a length direction of the beam.
In some possible embodiments of the first aspect, the support member further comprises:
a third support member provided to the base;
the fourth supporting part is arranged on the base and is staggered with the third supporting part in the width direction of the feeding and discharging mechanism;
a connecting member connecting the cross member, the third support member and the fourth support member.
In some possible embodiments of the first aspect, the wafer sorter further comprises:
a plurality of vision mechanisms, each vision mechanism disposed between one of the wafer stage mechanisms and one of the bin stage mechanisms.
In some possible embodiments of the first aspect, the number of sorting station arrangements is from 3 to 10.
In some possible embodiments of the first aspect, the base is a marble base.
In a second aspect, an embodiment of the present application provides a wafer sorting production line, including the wafer sorter described in any one of the above.
Compared with the prior art, the embodiment of the application has the beneficial effects that:
the material box mechanism is located in the transverse moving length range of the feeding and discharging mechanism, the wafer stage mechanism and the bin stage mechanism of each sorting station device are located in the transverse moving length range of the feeding and discharging mechanism, and the feeding and discharging mechanism can grab material slices in the material box from the material box mechanism to supply materials to the wafer stage mechanism and the bin stage mechanism of the sorting station devices, so that the sorting station devices can work simultaneously, multiple sorting stations can work simultaneously in one sorting machine, and the working efficiency can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a perspective view of a wafer handler according to an embodiment of the present disclosure;
fig. 2 is a front view of a wafer handler according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a magazine mechanism of a wafer handler according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a wafer stage mechanism of a wafer handler according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a bin stage mechanism of a wafer sorter according to an embodiment of the present disclosure;
fig. 6 is a front view of a thimble mechanism of a wafer handler according to an embodiment of the present disclosure;
fig. 7 is a top view of a thimble mechanism of a wafer handler according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a jacking mechanism of a wafer handler according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a swing arm mechanism of a wafer handler according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a vision mechanism of a wafer handler according to an embodiment of the present disclosure.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to fig. 1 to 10 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
It should be understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Embodiments of the present application provide a wafer sorter for sorting wafers (such as LED chip wafers).
Fig. 1 is a perspective view of a wafer handler according to an embodiment of the present disclosure; fig. 2 is a front view of a wafer handler according to an embodiment of the present disclosure. Referring to fig. 1 and 2, a wafer sorter provided in an embodiment of the present application includes a base 1, a loading and unloading mechanism 2, a magazine mechanism 3, and a sorting station apparatus 4.
The susceptor 1 is used to support various components of the wafer handler.
The base 1 may be a marble base. The base 1 uses the marble platform, can make the sorter operation more stable, and the precision is higher.
Of course, the floor may be used as the base 1 of the sorting machine according to actual conditions.
The feeding and discharging mechanism 2 is used for realizing feeding and discharging. The loading and unloading mechanism 2 is arranged on the base 1.
The magazine mechanism 3 is provided on the base 1. The material box mechanism 3 is positioned in the transverse moving length range of the feeding and discharging mechanism 2.
Referring to fig. 1, in the height direction H of the wafer sorting machine, the magazine mechanism 3 may be located below the feeding and discharging mechanism 2, so that the feeding and discharging mechanism 2 can take materials in the vertical direction.
The sorting station device 4 is used for sorting the wafers.
Referring to fig. 1, in some embodiments, the sorting station apparatus 4 is plural in number. Each sorting station device 4 is provided on the base 1.
Each sorting station apparatus 4 is a station, and the plurality of sorting station apparatuses 4 are a plurality of stations.
Referring to fig. 1, in some embodiments, sort station apparatus 4 includes a wafer stage mechanism 41 and a bin stage mechanism 42.
The wafer stage mechanism 41 can supply and recover a wafer sheet (also referred to as wafer) by the loading and unloading mechanism 2.
The wafer stage mechanism 41 is provided on the base 1, and may be mounted on the back surface of the base 1 in parallel with the base 1. The wafer stage mechanism 41 is also located within the range of the lateral movement length of the loading and unloading mechanism 2.
The bin stage mechanism 42 can supply and recover bins by the loading and unloading mechanism 2. Where bin is a chip web sorted from a wafer web (also referred to as wafer) according to a specified condition, such as a voltage value, a band value, or a power value. A wafer slice can sort out a plurality of bins.
Referring to fig. 1, in the height direction H of the wafer sorting machine, a wafer stage mechanism 41 and a bin stage mechanism 42 may be located below the loading and unloading mechanism 2, so that the loading and unloading mechanism 2 can feed and take materials in the vertical direction.
According to the above, the magazine mechanism 3 is located within the range of the lateral movement length of the feeding and discharging mechanism 2, the wafer stage mechanism 41 and the bin stage mechanism 42 of each sorting station device 4 are located within the range of the lateral movement length of the feeding and discharging mechanism 2, and the feeding and discharging mechanism 2 can grab the tablets (such as tablets in the wafer magazine and in the bin magazine) in the magazine from the magazine mechanism 3 to supply the wafer stage mechanism 41 and the bin stage mechanism 42 of the sorting station devices 4, so that the sorting station devices 4 can work simultaneously, and thus, the sorting stations can work simultaneously in one sorting machine, and the work efficiency can be improved.
The wafer sorting machine equipment provided by the embodiment of the application can realize multi-station (such as three stations) simultaneous sorting, and is small in occupied area and high in productivity. In practical application, in order to further reduce the occupied area, a wafer sorting machine can be used for simultaneously sorting in four stations, and even can be expanded to simultaneously sorting in ten stations.
Referring to fig. 1, in some embodiments, each sorting station device 4 is sequentially disposed on the base 1 along the transverse moving direction L of the loading and unloading mechanism 2, so that the loading and unloading mechanism 2 can sequentially load and unload materials along the transverse moving direction L.
Illustratively, the sorting station arrangements 4 are arranged in sequence from left to right (or from right to left) in the transverse direction of movement L.
Fig. 3 is a schematic structural diagram of a magazine mechanism of a wafer handler according to an embodiment of the present disclosure. Referring to fig. 3, in some embodiments, magazine mechanism 3 includes a wafer magazine 31 and a bin magazine 32.
The wafer magazine 31 is disposed on the base 1 within the range of the lateral movement length.
The wafer material box 31 is used for placing wafer material pieces, and can realize the supply, the recovery and the temporary storage of the wafer material pieces through the loading and unloading mechanism 2.
The bin magazine 32 is disposed on the base 1 within the lateral movement length range.
The bin magazine 32 is used for placing bin tablets, and can realize the feeding, the recovery and the temporary storage of the bin tablets through the feeding and discharging mechanism 2.
When the sorting machine works, the loading and unloading mechanism 2 grabs the wafer material box 31 with the wafers placed to the sorting station device 4, so that the wafers are sorted by the sorting station device 4; in addition, the loading and unloading mechanism 2 also grabs the tablets in the empty bin magazine 32 to the sorting station device 4, so as to place the chips sorted from the wafer tablets on the bin tablets.
Referring to fig. 1, in some embodiments, the loading and unloading mechanism 2 includes a support member 21, a cross beam 22, and a gripper assembly 23.
The support member 21 is provided on the base 1. The support member 21 may be a rod or a bracket.
The cross member 22 is provided to the support member 21.
The gripper assembly 23 is movably arranged to the cross beam 22.
The movement range of the gripper assembly 23 in the length direction L of the cross beam 22 is a lateral movement length range.
The grabbing assembly 23 moves along the length direction L of the cross beam 22, and can grab the material sheets in the material boxes from the material box mechanism 3 and place the material sheets to each sorting station device 4.
Referring to fig. 1, in some embodiments, the support member 21 includes a first support member 211 and a second support member 212.
The first supporting member 211 is disposed on the base 1.
The second support member 212 is provided to the base 1.
The first support member 211 and the second support member 212 support the cross beam 22 together. The first and second support members 211 and 212 may be rods.
Each wafer stage mechanism 41 and each bin stage mechanism 42 are located between the first support member 211 and the second support member 212 along the longitudinal direction L of the beam 22. In this manner, the grasping unit 23 moves in the longitudinal direction L of the cross beam 22, and can grasp the tablets in the wafer magazine 31 and place them on each wafer stage mechanism 41, and can grasp the tablets in the bin magazine 32 and place them on each bin stage mechanism 42.
Referring to fig. 1, in some embodiments, the support member 21 further includes a third support member 213, a fourth support member 214, and a connection member 215.
The third support member 213 is provided to the base 1.
The fourth support member 214 is provided to the base 1.
The third support member 213 and the fourth support member 214 are used to support the cross member 22. The third and fourth support members 213 and 214 may be rods.
The fourth support member 214 is provided offset from the third support member 213 in the width direction W of the loading and unloading mechanism 2 to support the loading and unloading mechanism 2 at different positions.
The connecting member 215 connects the cross member 22, the third support member 213, and the fourth support member 214. The connecting member 215 may be a bent structure.
The connecting part 215 is used for connecting the cross beam 22, the third supporting part 213 and the fourth supporting part 214, so that fewer supporting parts can be used for supporting the cross beam 22 at different positions, the cross beam 22 can be reliably supported, the phenomenon that the feeding and discharging of the feeding and discharging mechanism 2 is obstructed can be avoided, and the working efficiency of the sorting machine can be further improved.
Referring to fig. 1, in some embodiments, sorting station apparatus 4 further includes a lift pin mechanism 43, a lift mechanism 44, and a swing arm mechanism 45.
The ejector pin mechanism 43 is provided on one side of the wafer stage mechanism 41. Ejector pin mechanism 43 is used to peel off a wafer sheet positioned on wafer stage mechanism 41 on the side of wafer stage mechanism 41, and thereby place chips sorted from the wafer sheet on a bin sheet.
The thimble mechanism 43 may be horizontally mounted on the base 1, and is parallel to the base 1.
The jacking mechanism 44 is disposed on one side of the bin stage mechanism 42, and may be specifically mounted horizontally on the base 1 and parallel to the base 1. The lift-up mechanism 44 is for lifting up the bin tray located on the blue film of the bin stage mechanism 42 on the side of the bin stage mechanism 42 so as to attach the chip to the bin blue film.
The swing arm mechanism 45 may be mounted horizontally on the base 1 and parallel to the base 1.
Fig. 4 is a schematic structural diagram of a wafer stage mechanism of a wafer handler according to an embodiment of the present application. Referring to fig. 4, in some embodiments, wafer stage mechanism 41 includes an X-axis assembly 411, a Y-axis assembly 412, and a stage assembly 413.
The X-axis assembly 411 can be powered by a servo motor, and the motion position of a Y-axis assembly 412 arranged on the X-axis assembly 411 can be precisely controlled by combining parts such as a linear guide rail, a screw rod and the like.
The Y-axis assembly 412 can be powered by a servo motor, and the movement position of the stage assembly 413 mounted on the Y-axis assembly 412 can be precisely controlled by combining a linear guide, a lead screw and other parts.
The stage assembly 413 may be a fixed structure for loading the wafer sheet supplied by the loading and unloading mechanism 2.
Fig. 5 is a schematic structural diagram of a bin stage mechanism of a wafer sorter according to an embodiment of the present disclosure. Referring to fig. 5, in some embodiments, bin stage mechanism 42 includes an X-shaft assembly 421, a Y-shaft assembly 422, a stage assembly 423, and a T-shaft assembly 424.
The X-axis assembly 421 can be powered by a servo motor, and the moving position of the Y-axis assembly 422 mounted on the X-axis assembly 421 can be precisely controlled by combining with a linear guide rail, a lead screw and other parts.
The Y-axis assembly 422 can be powered by a servo motor, and the movement positions of the carrier assembly 423 and the T-axis assembly 424 which are arranged on the Y-axis assembly 422 can be precisely controlled by combining parts such as a linear guide rail, a screw rod and the like.
T-shaft assembly 424 may be powered by a servo motor and precisely mounted to stage assembly 423 in conjunction with bearings, timing pulleys, and the like.
Fig. 6 is a front view of a thimble mechanism of a wafer handler according to an embodiment of the present disclosure; fig. 7 is a top view of a thimble mechanism of a wafer handler according to an embodiment of the present disclosure. Referring to FIGS. 6 and 7, in some embodiments, spike mechanism 43 includes an X-axis assembly 431, a Z-axis assembly 432, a spike cover assembly 433, and a spike assembly 434.
The X-axis assembly 431 can be powered by an air cylinder and can be combined with a linear guide and other parts to precisely control the movement position of a Z-axis assembly 432 mounted on the X-axis assembly 431.
Z-axis assembly 432 may be powered by a stepper motor and may incorporate linear guides, linkages, etc. to precisely control the movement positions of needle cover assemblies 433, 434 mounted on Z-axis assembly 432.
Top needle cover assembly 433 may be powered by a stepper motor and precisely mounted on Z-axis assembly 432 in conjunction with linear guides, cams, and the like.
The thimble assembly 434 may be powered by a stepper motor and mounted to the Z-axis assembly 432 in combination with linear guides, cams, and the like.
The ejector pin mechanism 43 peels the wafer sheet on each wafer stage mechanism 41 by means of the X-axis assembly 431, the Z-axis assembly 432, the ejector pin cover assembly 433, and the ejector pin assembly 434.
Fig. 8 is a schematic structural diagram of a jacking mechanism of a wafer handler according to an embodiment of the present disclosure. Referring to fig. 8, in some embodiments, jacking mechanism 44 includes an X-axis assembly 441 and a bin island rod assembly 442.
The X-axis assembly 441 may be powered by an air cylinder and incorporate linear guides or the like to precisely control the position of the motion of the bin island rod assembly 442 mounted to the X-axis assembly 441.
bin island rod assembly 442 may be powered by a stepper motor and precisely mounted to X-axis assembly 441 in conjunction with linear guides, cam structures, and the like.
The jack-up mechanism 44 performs plane pasting of the bin through the X-axis assembly 441 and the bin island rod assembly 442.
Fig. 9 is a schematic structural diagram of a swing arm mechanism of a wafer handler according to an embodiment of the present disclosure. Referring to fig. 9, in some embodiments, the swing arm mechanism 45 includes a power assembly 451, a first suction assembly 452, and a second suction assembly 453.
The power assembly 451 may be servo powered. The power assembly 451 may specifically be mounted precisely to the base 1 in a self-locking manner.
The first and second suction assemblies 452, 453 can also be precisely mounted to the power assembly 451 in a self-locking manner.
The swing arm mechanism 45 sucks the bin selected from each wafer stage mechanism 41 by the power unit 451, the first suction unit 452, and the second suction unit 453, and moves the bin close to each bin stage mechanism 42 so that the bin can be attached to the bin pan blue film located at each bin stage mechanism 42.
Referring to fig. 1, in some embodiments, the wafer handler further includes a vision mechanism 5.
The vision mechanism 5 is used to image and position the wafer and bin sheets.
The vision mechanism 5 may specifically be mounted horizontally to the base 1 and parallel to the base 1.
In some embodiments, the number of vision mechanisms 5 is multiple.
Each vision mechanism 5 is provided between one wafer stage mechanism 41 and one bin stage mechanism 42.
Fig. 10 is a schematic structural diagram of a vision mechanism of a wafer handler according to an embodiment of the present disclosure. Referring to fig. 10, in some embodiments, the vision mechanism 5 includes a first vision component 51 and a second vision component 52.
The first visual element 51 and the second visual element 52 can be precisely mounted on the base 1 in a self-locking manner.
The vision mechanism 5 images and positions the wafers and bin sheets via the first vision assembly 51 and the second vision assembly 52 for accurate sorting.
The working principle of the wafer sorting machine provided by the embodiment of the application is as follows:
the loading and unloading mechanism 2 grabs the wafer material sheet in the wafer box 31 with the wafer placed and places the wafer material sheet on the wafer stage mechanism 41, and the loading and unloading mechanism 2 grabs the material sheet in the bin box 32 with the bin disc blue film placed and places the material sheet on the bin stage mechanism 42; wafer stage mechanism 41 moves the wafer sheet through X-axis assembly 411 and Y-axis assembly 412 to the position of first suction assembly 452 of swing arm mechanism 45; ejector pin mechanism 43 sends ejector pin assembly 434 to a position close to the wafer sheet through X-axis assembly 431 and Z-axis assembly 432, ejector mechanism 44 sends bin island rod assembly 442 to be close to bin blue membrane through X-axis assembly 441, ejector pin cover assembly 433 is close to the wafer membrane and the vacuum is opened, ejector pin assembly 434 ejects out, bin is ejected from the wafer sheet and is pushed up to first adsorption assembly 452 of swing arm mechanism 45, and first adsorption assembly 452 adsorbs bin; the power assembly 451 of the swing arm mechanism 45 rotates the first adsorption assembly 452 so that the bin island rod assembly 442 can lift up the bin blue membrane and stick to the bin, the bin island rod assembly 442 retracts the bin disk so that the bin leaves the first adsorption assembly 452, and the sorted chips stick to the bin blue membrane.
The wafer sorting machine provided by the embodiment of the application can realize multi-station sorting, can reduce the frequency of replacing the material box and reduce the waiting time of material sheets in the material box, can improve the productivity, and has a compact internal structure and a small occupied area.
The embodiment of the application further provides a wafer sorting production line which comprises the wafer sorting machine provided by any one of the embodiments.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. A wafer sorter, comprising:
a base;
the feeding and discharging mechanism is arranged on the base;
the material box mechanism is arranged on the base and is positioned in the range of the transverse moving length of the feeding and discharging mechanism;
a plurality of sorting station devices disposed on the base;
the sorting station device comprises:
the wafer carrying platform mechanism is arranged on the base and is positioned in the range of the transverse moving length of the feeding and discharging mechanism;
and the bin carrying platform mechanism is arranged on the base and is positioned in the range of the transverse moving length.
2. The wafer handler of claim 1, wherein the sorting station means further comprises:
the thimble mechanism is arranged on one side of the wafer carrying platform mechanism;
a jacking mechanism disposed on one side of the bin stage mechanism;
and the swing arm mechanism is arranged between the wafer carrier mechanism and the bin carrier mechanism.
3. The wafer handler of claim 1, wherein the magazine mechanism comprises:
the wafer material box is arranged on the base and is positioned in the range of the transverse moving length;
and the bin material box is arranged on the base and is positioned in the range of the transverse moving length.
4. The wafer sorter as claimed in claim 1 wherein each of said sorting station apparatus is disposed in sequence on said base in a direction of lateral movement of said loader and unloader mechanism.
5. The wafer handler of claim 1, wherein the loading and unloading mechanism comprises:
a support member provided to the base;
a cross member provided to the support member;
the grabbing component is movably arranged on the cross beam;
the moving range of the grabbing component along the length direction of the cross beam is the transverse moving length range.
6. The wafer handler of claim 5, wherein the support member comprises:
a first support member provided to the base;
a second support member provided to the base;
each of the wafer stage mechanisms and each of the bin stage mechanisms are located between the first support member and the second support member along a length direction of the beam.
7. The wafer handler of claim 6, wherein the support member further comprises:
a third support member provided to the base;
the fourth supporting part is arranged on the base and is staggered with the third supporting part in the width direction of the feeding and discharging mechanism;
a connecting member connecting the cross member, the third support member and the fourth support member.
8. The wafer handler of claim 1, wherein the wafer handler further comprises:
a plurality of vision mechanisms, each vision mechanism disposed between one of the wafer stage mechanisms and one of the bin stage mechanisms.
9. The wafer sorter of claim 1 wherein the number of sorting station means is 3 to 10.
10. The wafer sorter of any of claims 1 to 9 wherein the base is a marble base.
11. A wafer sorting line comprising the wafer sorter of any of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222690416.3U CN218691696U (en) | 2022-10-13 | 2022-10-13 | Wafer sorting machine and wafer sorting production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222690416.3U CN218691696U (en) | 2022-10-13 | 2022-10-13 | Wafer sorting machine and wafer sorting production line |
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| Publication Number | Publication Date |
|---|---|
| CN218691696U true CN218691696U (en) | 2023-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222690416.3U Active CN218691696U (en) | 2022-10-13 | 2022-10-13 | Wafer sorting machine and wafer sorting production line |
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| CN (1) | CN218691696U (en) |
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- 2022-10-13 CN CN202222690416.3U patent/CN218691696U/en active Active
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