CN218660494U - Semiconductor plastic packaging device - Google Patents
Semiconductor plastic packaging device Download PDFInfo
- Publication number
- CN218660494U CN218660494U CN202222780078.2U CN202222780078U CN218660494U CN 218660494 U CN218660494 U CN 218660494U CN 202222780078 U CN202222780078 U CN 202222780078U CN 218660494 U CN218660494 U CN 218660494U
- Authority
- CN
- China
- Prior art keywords
- plastic packaging
- sealing
- semiconductor
- electromagnet
- partial channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model belongs to the technical field of the semiconductor package. In view of the problem that the prior semiconductor plastic packaging device has a large number of bubbles after packaging, the utility model discloses a semiconductor plastic packaging device, which comprises a lower die; the upper die can move up and down and is arranged above the lower die; the vacuumizing assembly is communicated with an exhaust pipeline of the plastic packaging space and is provided with a vacuum pump; one end of the sealing element is communicated with the plastic packaging space through the sealed exhaust pipeline; a gap is formed between the other end of the sealing element and the exhaust pipeline; and the other end of the sealing element is also provided with a magnet; an electromagnet opposite to the other end of the sealing member; a gap is formed between the electromagnet and the exhaust pipeline; one end of the telescopic rod is connected with the sealing element, and the other end of the telescopic rod is connected with the electromagnet; the spring is sleeved on the telescopic rod. The device can vacuumize the plastic packaging space, and can automatically seal the plastic packaging space after vacuumization, thereby effectively reducing the number of bubbles in the plastic packaging process.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package, concretely relates to plastic envelope mould.
Background
The packaging of the semiconductor refers to that the semiconductor which meets the performance requirements is packaged and protected by a plastic shell according to a certain classification so as to achieve the purpose of protecting the chip and the bonding wire of the semiconductor.
In the traditional semiconductor packaging process, only a semiconductor needing plastic packaging is coated with packaging raw materials and then heated and cured under normal pressure, and the plastic packaging method can cause a large amount of bubbles in the packaged semiconductor to influence the product performance. With the continuous development of semiconductor technology, the performance requirements of customers on semiconductors are higher and higher, so that the plastic packaging process needs to be improved and the plastic packaging quality needs to be improved.
In view of this, it is very important to design a semiconductor plastic package device with good performance.
SUMMERY OF THE UTILITY MODEL
In view of above-mentioned current semiconductor plastic packaging device is behind the plastic envelope, has a large amount of bubbles in the semiconductor, influences the problem of producing the performance, an object of the utility model is to provide a semiconductor plastic packaging device, this plastic packaging device can carry out evacuation before the plastic envelope and handle to effectively reduced the bubble quantity in the semiconductor of introducing in the plastic envelope process.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor plastic package device comprises a base; the lower die is arranged on the base; the upper die can be vertically moved and arranged above the lower die; the upper die and the lower die can form a sealed plastic packaging space; and the vacuumizing assembly is communicated with the plastic packaging space.
And the lower die or the upper die is provided with an exhaust pipeline communicated with the plastic packaging space.
The vacuum-pumping assembly has: a vacuum pump in communication with the exhaust conduit; a seal mounted in the exhaust conduit; one end part of the sealing element is used for sealing the end part of the exhaust pipeline communicated with the plastic packaging space; a gap is formed between the other end of the sealing element and the exhaust duct; and the other end of the sealing element is also provided with a magnet; an electromagnet installed in the exhaust duct to be opposite to the other end of the sealing member; a gap is formed between the electromagnet and the exhaust pipeline; one end of the telescopic rod is connected with the sealing element, and the other end of the telescopic rod is connected with the electromagnet; and the spring is sleeved on the telescopic rod.
In one of the technical solutions of the present invention, the exhaust duct has: one end of the first partial channel is communicated with the plastic packaging space; one end of the second partial channel is communicated with the first partial channel, and the other end of the second partial channel is communicated with the vacuum pump; wherein the diameter of the second partial channel is larger than the diameter of the first partial channel.
In one embodiment of the present disclosure, the sealing member has a first body, and the shape of the first partial channel corresponds to the shape of the first partial channel, so as to seal the first partial channel; a second body connected with the first body; wherein the diameter of the second body is larger than the diameter of the first body and smaller than the diameter of the second partial passage.
The utility model discloses an among the technical scheme, the second body with one side that first body is connected is equipped with ring packing.
In one of the technical solutions disclosed in the present invention, the upper surface of the lower mold is provided with a sealing groove; and the lower surface of the upper die is provided with a sealing strip corresponding to the sealing groove.
The utility model discloses an among one of them technical scheme, the seal groove is the dovetail.
In one of the technical solutions disclosed in the present invention, the sealing strip is made of fluororubber.
The utility model discloses an among one of them technical scheme, the electro-magnet with be provided with a plurality of connecting rods between the exhaust duct, in order to fix the electro-magnet.
The utility model discloses an among one of them technical scheme, still include the pneumatic cylinder, the pneumatic cylinder with go up the mould and connect, in order to drive go up the mould and reciprocate.
In one of the technical solutions disclosed in the present invention, the annular sealing ring is made of fluororubber.
As can be seen from the above description, compared with the prior art, the beneficial effects of the present invention are:
1. the plastic packaging space is vacuumized through the vacuumizing assembly, and then plastic packaging is carried out, so that the number of bubbles in the plastic packaging process can be effectively reduced; meanwhile, the exhaust pipeline is sealed through a sealing piece, and the electromagnet controls the sealing piece to move, so that the exhaust pipeline is opened; after the plastic packaging space is vacuumized, the power supply of the electromagnet is disconnected, and the sealing element is reset under the action of the spring, so that the plastic packaging space is sealed again, the sealing performance of the plastic packaging space is improved, and the number of bubbles in the plastic packaging process is reduced.
2. Be equipped with the seal groove on the bed die, be equipped with the sealing strip that corresponds with the seal groove on the mould, when the compound die, the sealing strip card is gone into in the seal groove, is favorable to improving the leakproofness between bed die and the mould to be favorable to reducing the bubble quantity of plastic envelope process.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or technical descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of the three-dimensional structure of the present invention.
Fig. 2 is a schematic longitudinal sectional structure of the present invention.
Fig. 3 is an enlarged schematic view of a point a in fig. 2.
Reference numerals: 1-a base; 2-lower mould; 21-lower plastic packaging groove; 22-an exhaust channel; 221-a first partial channel; 222-a second portion of channels; 23-a sealing groove; 3, mounting a mold; 31-mounting a plastic packaging groove; 32-injection molding channels; 33-a sealing strip; 4-a vacuum-pumping assembly; 41-a vacuum pump; 42-a seal; 43-electromagnetic Russian iron; 44-scalable dry; 45-spring.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The embodiment of the utility model discloses semiconductor plastic envelope device, its structure is as shown in figure 1 ~ figure 3, including base 1, bed die 2, go up mould 3, evacuation subassembly 4 and pneumatic cylinder 5.
Specifically, the lower mold 2 is mounted on the upper surface of the base 1, and the upper surface thereof is concavely formed with a lower molding groove 21. The side wall of the lower die 2 is provided with an exhaust passage 22 communicated with the lower plastic groove 21.
The exhaust passage 22 has a first partial passage 221 and a second partial passage 222. Wherein, one end of the first partial channel 221 is communicated with the lower plastic packaging groove 21, and the other end is communicated with the second partial channel 222; the diameter of the first partial channel is smaller than the diameter of the second partial channel 222 to form a stepped channel.
The upper die 3 is arranged above the lower die 2, and an upper plastic sealing groove 31 is formed in the lower surface of the upper die in a concave mode. The upper plastic package groove 31 corresponds to the lower plastic package groove 21. The upper die 3 is provided with an injection molding channel 32 communicated with the upper plastic packaging groove 31.
The hydraulic cylinder 5 is connected to the upper mold 3 to drive the upper mold 3 up and down.
The vacuumizing assembly 4 is communicated with the exhaust channel 22, when the upper die 3 and the lower die 2 are closed, a sealed plastic packaging space is formed between the upper plastic packaging groove 31 and the lower plastic packaging groove 21, and the vacuumizing assembly 4 can vacuumize the plastic packaging space through the exhaust channel 22. The evacuation assembly 4 includes a vacuum pump 41, a seal 42, an electromagnet 43, a retractable rod 44, and a spring 45.
Wherein the sealing member 42 is used to seal the first partial channel 221. The sealing member 42 has a first body 421 and a second body 422. Wherein the first body 421 has a size and a shape corresponding to the first sub-channel 221 to seal the first sub-channel 221. Second body 422 is positioned in second partial passage 222 with a diameter that is smaller than the diameter of second partial passage 222.
The electromagnet 43 is fixedly mounted in the second partial channel 222 by means of several connecting rods. Wherein, a magnet is arranged on one side of the second body 422 opposite to the electromagnet 43.
The extendable rod 44 has one end connected to the second body 422 and the other end connected to the electromagnet 43.
The spring 45 is sleeved on the telescopic rod 44.
The vacuum pump 41 communicates with the second partial passage 222.
With the structure, when the upper die 3 and the lower die 2 are closed, a sealed plastic packaging space is formed between the upper plastic packaging groove 31 and the lower plastic packaging groove 21; at this time, the electromagnet 43 is powered on, the electromagnet 43 and the magnet of the second body 422 generate attraction force, so that the sealing element 42 is driven to move towards the side of the second partial channel 222, and the spring 45 is compressed; then, starting the vacuum pump 41, namely pumping out the gas in the plastic packaging space from the exhaust channel 22; after the plastic packaging space is vacuumized, the power supply of the electromagnet 43 is switched off, and at the moment, the sealing element 42 moves to one side of the first partial channel 221 under the action of the spring 45, so that the plastic packaging space is sealed again, namely, the plastic packaging space can be subjected to injection molding through the injection molding channel 32 to realize plastic packaging; the structure can effectively reduce the number of bubbles in the semiconductor plastic packaging process.
More specifically, the diameter of the second body 422 is larger than that between the first bodies 421. An annular sealing ring is arranged on one side where the second body 422 and the first body 421 are connected, so that the sealing performance of the plastic packaging space is improved, and the number of bubbles in the semiconductor plastic packaging process is reduced.
More specifically, the upper surface of the lower mold 2 is provided with a seal groove 23; correspondingly, the lower surface of the upper die 3 is provided with a sealing strip 33. By adopting the structure, when the upper die 3 and the lower die 2 are closed, the sealing strip 33 is clamped into the sealing groove 23, so that the lower die 2 and the upper die 3 are sealed, the sealing property of a plastic packaging space is improved, and the quantity of bubbles in the semiconductor plastic packaging process is reduced.
More specifically, the seal groove 23 is a dovetail groove. By adopting the structure, the sealing performance of the plastic packaging space is facilitated, the condition that the sealing strip falls off when the die is opened can be avoided, and the number of bubbles in the semiconductor plastic packaging process is reduced.
More specifically, the seal ring and the seal strip 33 are made of fluororubber. The fluororubber has high temperature resistance, and can avoid the failure of the sealing ring.
The embodiment of the utility model provides a theory of operation is:
(1) The semiconductor is first placed in the lower plastic encapsulation groove 21.
(2) Subsequently, the upper mold 3 moves downwards and is matched with the lower mold 2, so that the lower plastic packaging groove 21 and the upper plastic packaging groove 31 form a sealed plastic packaging space; the electromagnet 43 is powered to move the second body 422 towards the second partial channel 222, so that the exhaust duct 22 is opened, at which point the spring 45 is compressed.
(3) The vacuum pump 41 is started to pump out the gas in the plastic sealed space from the exhaust duct 22, and the plastic sealed space is evacuated.
(4) Subsequently, the power supply of the electromagnet 43 is turned off, and the sealing member 42 moves toward the first partial passage 221, thereby resealing the plastic-sealed empty space.
(5) Finally, injection molding is performed on the plastic packaging space through an injection molding pipeline 32, so that plastic packaging of the semiconductor is achieved.
As can be seen from the above description, the embodiments of the present invention have the following advantages:
the plastic packaging space is vacuumized through the vacuumizing assembly 4, and then plastic packaging is carried out, so that the number of bubbles in the plastic packaging process can be effectively reduced; further, the exhaust duct 22 is sealed by a sealing member 42, and the movement of the sealing member 42 is controlled by an electromagnet 43, thereby opening the exhaust duct 22; after the plastic packaging space is vacuumized, the power supply of the electromagnet 43 is switched off, and the sealing element 42 is reset under the action of the spring 45, so that the plastic packaging space is sealed again, the sealing property of the plastic packaging space is improved, and the number of bubbles in the plastic packaging process is reduced; finally, be equipped with seal groove 23 on the bed die 2, be equipped with the sealing strip 33 that corresponds with seal groove 23 on the mould 3, when the compound die, sealing strip 33 card is gone into in the seal groove 23, is favorable to improving the leakproofness between bed die 2 and the mould 3 to be favorable to reducing the bubble quantity of plastic envelope process.
The above-mentioned embodiments further describe the objects, technical solutions and advantages of the present invention in detail, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A semiconductor plastic package device, characterized by comprising:
a base;
the lower die is arranged on the base;
the upper die can be vertically moved and arranged above the lower die; the upper die and the lower die can form a sealed plastic packaging space;
the vacuumizing assembly is communicated with the plastic packaging space;
wherein, an exhaust pipeline communicated with the plastic packaging space is arranged on the lower die or the upper die;
the vacuum-pumping assembly has:
a vacuum pump in communication with the exhaust conduit;
a seal mounted in the exhaust duct; one end part of the sealing element is used for sealing the end part of the exhaust pipeline communicated with the plastic packaging space; a gap is formed between the other end of the sealing element and the exhaust duct; and the other end of the sealing element is also provided with a magnet;
an electromagnet installed in the exhaust duct to be opposite to the other end of the sealing member; a gap is formed between the electromagnet and the exhaust pipeline;
one end of the telescopic rod is connected with the sealing element, and the other end of the telescopic rod is connected with the electromagnet;
and the spring is sleeved on the telescopic rod.
2. The semiconductor plastic package device according to claim 1, wherein the exhaust duct has: one end of the first partial channel is communicated with the plastic packaging space;
one end of the second partial channel is communicated with the first partial channel, and the other end of the second partial channel is communicated with the vacuum pump;
wherein the diameter of the second partial channel is larger than the diameter of the first partial channel.
3. The semiconductor package according to claim 2, wherein the sealing member comprises:
a first body corresponding in shape and size to the first partial channel to seal the first partial channel;
a second body connected with the first body;
wherein the diameter of the second body is larger than the diameter of the first body and smaller than the diameter of the second partial passage.
4. A semiconductor package assembly according to claim 3, wherein a ring-shaped sealing ring is disposed on a side of the second body connected to the first body.
5. A semiconductor package assembly according to claim 1, wherein a sealing groove is formed in an upper surface of the lower mold; and the lower surface of the upper die is provided with a sealing strip corresponding to the sealing groove.
6. A semiconductor package assembly according to claim 5, wherein the sealing groove is a dovetail groove.
7. A semiconductor package assembly according to claim 5 or 6, wherein the sealing strip is made of viton.
8. The semiconductor plastic package device according to claim 1, wherein a plurality of connecting rods are disposed between the electromagnet and the exhaust duct to fix the electromagnet.
9. The semiconductor plastic package device according to claim 1, further comprising a hydraulic cylinder connected to the upper mold to drive the upper mold to move up and down.
10. The semiconductor plastic package device according to claim 4, wherein the annular sealing ring is made of fluororubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222780078.2U CN218660494U (en) | 2022-10-21 | 2022-10-21 | Semiconductor plastic packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222780078.2U CN218660494U (en) | 2022-10-21 | 2022-10-21 | Semiconductor plastic packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218660494U true CN218660494U (en) | 2023-03-21 |
Family
ID=85564234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222780078.2U Active CN218660494U (en) | 2022-10-21 | 2022-10-21 | Semiconductor plastic packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218660494U (en) |
-
2022
- 2022-10-21 CN CN202222780078.2U patent/CN218660494U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103682240A (en) | Battery manufacturing equipment, battery no-cavity vacuum liquid-drawing device and battery vacuum-pumping packaging method | |
| CN105599976A (en) | Modified atmosphere packaging machine | |
| CN103433611B (en) | Vacuum percussion welding packaging device for packaging semiconductor device | |
| CN107871878A (en) | A kind of heating, vacuum packaging machine | |
| CN2920620Y (en) | Epoxy mould capable of reducing electronic epoxy product air holes and air bubbles | |
| CN208452118U (en) | A kind of precise injection mould vacuum sucker type insert fixing device | |
| CN102270712A (en) | LED (Light-Emitting Diode) vacuum encapsulating device and method | |
| CN218660494U (en) | Semiconductor plastic packaging device | |
| CN203644871U (en) | Battery manufacturing device and cavity-free vacuum liquid extracting device thereof | |
| CN208979168U (en) | A kind of improvement structure vacuumizing reshaping device | |
| CN207651593U (en) | A kind of heating, vacuum sealing machine | |
| CN204977231U (en) | Vacuum low pressure injection molding machine | |
| CN208683251U (en) | Tea packaging machine | |
| CN208197417U (en) | A kind of novel sealing structure of liquid silica gel injection molding | |
| CN208181562U (en) | A kind of secondary reshaping device | |
| CN207207260U (en) | Non-return air valve sealing device in a kind of bag | |
| CN110880418B (en) | Negative pressure packaging device for energy storage device | |
| CN211105328U (en) | Notebook computer plastic part injection mold with vacuumizing mechanism | |
| CN208854969U (en) | Mold suction mechanism | |
| CN206218297U (en) | Sealing rack device | |
| CN206169237U (en) | Die -casting die structure suitable for die casting technology | |
| CN212010708U (en) | Mould for packaging inductor by adopting hot fluid | |
| CN110822281A (en) | Inflating sealing mechanism of inflator | |
| CN104961092A (en) | Antifreezing solution filling gun | |
| CN220098504U (en) | Vacuumizing gland device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |