CN218631984U - Suction nozzle of chip mounter - Google Patents
Suction nozzle of chip mounter Download PDFInfo
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- CN218631984U CN218631984U CN202223199936.0U CN202223199936U CN218631984U CN 218631984 U CN218631984 U CN 218631984U CN 202223199936 U CN202223199936 U CN 202223199936U CN 218631984 U CN218631984 U CN 218631984U
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- suction nozzle
- chip
- rubber disc
- vacuum suction
- adsorption cavity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a suction nozzle of a chip loader, which relates to the technical field of chip packaging and manufacturing and comprises a suction nozzle rod, a suction nozzle shell and a rubber disc; the suction nozzle rod is connected with the suction nozzle shell; one surface of the suction nozzle shell, which is far away from the suction nozzle rod, is provided with a suction cavity; a plurality of first vacuum suction holes are formed in the adsorption cavity; all the first vacuum suction holes are communicated with the internal passage of the suction nozzle rod; the rubber disc is fixed in the adsorption cavity; the rubber disc is tightly attached to the inner wall of the adsorption cavity; one side of the rubber disc, which is far away from the suction nozzle shell, is a smooth plane; a plurality of second vacuum suction holes are formed in the rubber disc; the second vacuum suction holes are the same in number as the first vacuum suction holes and are communicated with the first vacuum suction holes in a one-to-one correspondence mode. The utility model provides a suction nozzle metal plane that exists among the prior art cause the problem of damage to the chip, greatly reduced the condition of mounting in-process chip damage, can effectively promote the mounting yield.
Description
Technical Field
The utility model relates to a chip package makes technical field, especially relates to a chip bonding machine suction nozzle.
Background
The mounting is used as an important whole link in the chip packaging and manufacturing process, namely, the integrated circuit chip is preliminarily fixed on the bearing seat by using an adhesive or lead-tin solder, so that support is provided for the subsequent process. The chip transfer needs to depend on a special chip loader suction nozzle, for example, a flat suction nozzle disclosed in the invention patent of chinese application No. 200710306122.3, a chip pick-and-place machine and a semiconductor test method thereof provide by a currently common flat suction nozzle, in order to ensure the acting force when the suction nozzle sucks the chip when sucking a large-size chip in operation, the surface of the suction nozzle is a metal plane except for a through hole, and is directly contacted with the surface of the chip, and the metal plane is easy to press particles attached to the surface of the chip into the surface of the chip, so that the chip is damaged by indentation, depression and the like, and the chip yield is influenced.
SUMMERY OF THE UTILITY MODEL
To the problem that exists, the utility model provides a pair of chip bonding machine suction nozzle can solve the problem that the suction nozzle metal plane that exists causes the damage to the chip among the prior art, reaches the chip and does not have the indentation, guarantees the beneficial effect of roughness and mounting yield.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a suction nozzle of a chip loader, which comprises a suction nozzle rod and is characterized by also comprising a suction nozzle shell and a rubber disc; the suction nozzle rod is connected with the suction nozzle shell; an adsorption cavity is formed in one surface of the suction nozzle shell, which is far away from the suction nozzle rod; a plurality of first vacuum suction holes are formed in the adsorption cavity; all the first vacuum suction holes are communicated with the inner passage of the nozzle rod; the rubber disc is fixed in the adsorption cavity; the rubber disc is tightly attached to the inner wall of the adsorption cavity; one surface of the rubber disc, which is far away from the suction nozzle shell, is a smooth plane; a plurality of second vacuum suction holes are formed in the rubber disc; the second vacuum suction holes are the same in number as the first vacuum suction holes and are communicated with the first vacuum suction holes in a one-to-one correspondence manner.
The utility model provides a suction nozzle of chip bonding machine, preferably, the suction nozzle shell includes a plurality of sand grips; all the convex strips are arranged on the inner top surface of the adsorption cavity in parallel; the convex strip and the suction nozzle shell are integrally formed; a plurality of groove strips are formed on one surface of the rubber disc, which is attached to the adsorption cavity; the number of the groove strips is the same as that of the convex strips, and the groove strips and the convex strips are distributed in a one-to-one correspondence manner; the convex strips are embedded into the groove strips and are tightly attached.
The utility model provides a suction nozzle of a chip bonding machine, preferably, the number of the first vacuum suction holes is 3; all the first vacuum suction holes are arranged in the adsorption cavity in a quartering mode.
The suction nozzle of the chip bonding machine provided by the utility model preferably also comprises four angle limiting blocks; all the angle limiting blocks are respectively arranged on four corners of the suction nozzle shell, which deviate from the suction nozzle rod.
The technical scheme has the following advantages or beneficial effects:
the utility model provides a suction nozzle of a chip mounter, which comprises a suction nozzle rod, and is characterized by also comprising a suction nozzle shell and a rubber disc; the suction nozzle rod is connected with the suction nozzle shell; an adsorption cavity is formed in one surface of the suction nozzle shell, which is far away from the suction nozzle rod; a plurality of first vacuum suction holes are formed in the adsorption cavity; all the first vacuum suction holes are communicated with the internal passage of the suction nozzle rod; the rubber disc is fixed in the adsorption cavity; the rubber disc is tightly attached to the inner wall of the adsorption cavity; one surface of the rubber disc, which is far away from the suction nozzle shell, is a smooth plane; a plurality of second vacuum suction holes are formed in the rubber disc; the second vacuum suction holes are the same in number as the first vacuum suction holes and are communicated with the first vacuum suction holes in a one-to-one correspondence mode. The utility model provides a pair of suction nozzle metal plane that chip bonding machine suction nozzle exists has been solved among the prior art and has caused the problem of damage to the chip, can reduce the damage of new piece attached particle to the chip, reaches the beneficial effect of effectively promoting the mounting yield.
Drawings
The invention and its features, aspects and advantages will become more apparent from a reading of the following detailed description of non-limiting embodiments with reference to the attached drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not intended to be drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic view of a suction nozzle of a die bonder provided in embodiment 1 of the present invention;
fig. 2 is a schematic view of the inside of an adsorption cavity of a suction nozzle of a chip mounter provided in embodiment 1 of the present invention;
fig. 3 is a schematic working diagram of a suction nozzle of a die bonder provided in embodiment 1 of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which should not be construed as limiting the invention.
Example 1:
as shown in fig. 1-2, the utility model provides a suction nozzle of a chip loader, which comprises a suction nozzle rod 1, a suction nozzle shell 2 and a rubber disc 3; the suction nozzle rod 1 is connected with the suction nozzle shell 2; one side of the suction nozzle shell 2, which is far away from the suction nozzle rod 1, is provided with a suction cavity 22; a plurality of first vacuum suction holes 21 are formed in the adsorption cavity 22; all the first vacuum suction holes 21 communicate with the internal passage of the nozzle lever 1; the rubber disc 3 is fixed in the adsorption cavity 22; the rubber disc 3 is tightly attached to the inner wall of the adsorption cavity 22; one side of the rubber disc 3 departing from the suction nozzle shell 2 is a smooth plane; a plurality of second vacuum suction holes 31 are formed in the rubber disc 3; the second vacuum suction holes 31 are the same in number as the first vacuum suction holes 21 and are in one-to-one correspondence communication. When this embodiment 1 during operation, suction nozzle rod 1 drives suction nozzle casing 2 and falls directly over chip 5, press rubber disc 3 on chip 5, passageway and first vacuum in suction nozzle rod 1 inhale the hole 21 and second vacuum and inhale the interior vacuum negative pressure state of hole 31, make chip 5 firmly adsorbed on rubber disc 3, because rubber disc 3 self material is rubber, compare the metal and have stronger elasticity, can have better protection to chip 5, even there is not the tiny particle of discovery to adhere to on chip 5, more can imbed in the rubber disc 3, thereby make the damage greatly reduced of granule to chip 5 ignore even, after chip 5 shifts to the assigned position, fix chip 5 on bearing seat 6, then close the vacuum of passageway in suction nozzle rod 1, remove the suction nozzle, carry out follow-up process flow. In the embodiment 1 of the utility model, the metal of the suction nozzle is isolated from the chip 5 by the rubber disc 3, so that the damage of the negative pressure formed by the direct contact between the metal of the suction nozzle and the surface of the chip 5 to the chip 5 is avoided, and the integrity of the surface of the chip 5 in the chip mounting process is ensured; the stress point of the chip 5 can be increased by arranging a plurality of vacuum suction holes, so that the suction process of the chip 5 is smoother and more stable, and the chip mounting yield is effectively improved.
The embodiment of the utility model provides a pair of die bonder suction nozzle, the metal covering of effectively having solved among the prior art suction nozzle and 5 chip 5 damage scheduling problems that the direct contact of chip 5 surface probably leads to are showing the die bonder yield that has improved chip 5.
In order to improve the sealing performance between the rubber disc 3 and the nozzle housing 2 and facilitate the subsequent detachment and replacement of the rubber disc 3, in the embodiment, the nozzle housing 2 includes a plurality of protruding strips 23; all the convex strips 23 are arranged on the inner top surface of the adsorption cavity 22 in parallel; the convex strip 23 and the suction nozzle shell 2 are integrally formed; a plurality of groove strips 33 are arranged on one surface of the rubber disc 3, which is attached to the adsorption cavity 22; the groove strips 33 and the convex strips 23 are the same in quantity and are distributed in a one-to-one corresponding mode; the convex strips 23 are embedded in the groove strips 33 to be tightly attached. The workman only needs to correspond recess strip 33 on the rubber dish 3 with 23 directions of sand grip in the absorption chamber 22 when installing rubber dish 3, hard press the rubber dish 3 to in the absorption chamber 22, make sand grip 23 all tightly embed respectively corresponding in the recess strip 33 can, when needing to dismantle and change rubber dish 3, rubber dish 3 also can conveniently pull down fast.
In order to ensure that the acting force transmitted to the chip 5 by the suction nozzle of the chip loader is more uniform, in the embodiment, the number of the first vacuum suction holes 21 is 3; all the first vacuum suction holes 21 are arranged in the adsorption chamber 22 in four equal parts.
As shown in fig. 3, the thickness of the adhesive is also important in fixing the chip 5, and in order to better control the thickness of the adhesive between the chip 5 and the bearing seat 6, in this embodiment, four corner stoppers 4 are further included; all angle limiting blocks 4 are respectively arranged on four corners of the suction nozzle shell 2 deviating from the suction nozzle rod 1, the lower end face of each angle limiting block 4 is lower than the bottom face of the chip 5, after the chip 5 is transferred to the bearing seat 6 by the suction nozzle of the chip loader at a designated position, the suction nozzle is supported on the bearing seat 6, at the moment, a gap exists between the chip 5 and the bearing seat 6, at the moment, the gap is filled by the glue dispenser through the accessible, and the height of each angle limiting block 4 is adjusted so as to conveniently control the thickness of the adhesive between the chip 5 and the bearing seat 6.
To sum up, the utility model provides a pair of chip bonding machine suction nozzle has effectively solved among the prior art metal suction nozzle and has caused the problem of damage such as indentation is sunken to the chip, can reach and reduce the damage of new piece attached particle to the chip, and then effectively promotes the mounting yield, and makes things convenient for the operation on chip bonding layer on bearing the seat.
Those skilled in the art will appreciate that variations may be implemented by those skilled in the art in combination with the prior art and the above-described embodiments, and will not be described in detail herein. Such variations do not affect the essence of the present invention, and are not described herein.
The above description is directed to the preferred embodiment of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that equipment and structures not described in detail are understood to be practiced in a manner that is conventional in the art; the person skilled in the art, without affecting the essence of the invention, may make numerous possible variations and modifications, or may modify the equivalent embodiments, without departing from the technical solution of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments by the technical entity of the present invention all still fall within the protection scope of the technical solution of the present invention, where the technical entity does not depart from the content of the technical solution of the present invention.
Claims (4)
1. A suction nozzle of a chip loader comprises a suction nozzle rod and is characterized by further comprising a suction nozzle shell and a rubber disc;
the suction nozzle rod is connected with the suction nozzle shell; an adsorption cavity is formed in one surface of the suction nozzle shell, which is far away from the suction nozzle rod;
a plurality of first vacuum suction holes are formed in the adsorption cavity; all the first vacuum suction holes are communicated with the inner passage of the nozzle rod;
the rubber disc is fixed in the adsorption cavity; the rubber disc is tightly attached to the inner wall of the adsorption cavity; one surface of the rubber disc, which is far away from the suction nozzle shell, is a smooth plane; a plurality of second vacuum suction holes are formed in the rubber disc; the second vacuum suction holes are the same in number as the first vacuum suction holes and are communicated with the first vacuum suction holes in a one-to-one correspondence mode.
2. The suction nozzle of a die bonder as set forth in claim 1,
the suction nozzle shell comprises a plurality of convex strips; all the convex strips are arranged on the inner top surface of the adsorption cavity in parallel; the convex strip and the suction nozzle shell are integrally formed;
a plurality of groove strips are arranged on one surface of the rubber disc, which is attached to the adsorption cavity; the number of the groove strips is the same as that of the convex strips, and the groove strips and the convex strips are distributed in a one-to-one correspondence manner; the convex strips are embedded into the groove strips and are tightly attached.
3. The suction nozzle of a die bonder as claimed in claim 1, wherein the number of said first vacuum suction holes is 3; all the first vacuum suction holes are arranged in the adsorption cavity in a quartering mode.
4. The suction nozzle of a die bonder as claimed in claim 1, further comprising four corner stoppers; all the angle limiting blocks are respectively arranged on four corners of the suction nozzle shell, which deviate from the suction nozzle rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223199936.0U CN218631984U (en) | 2022-11-30 | 2022-11-30 | Suction nozzle of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223199936.0U CN218631984U (en) | 2022-11-30 | 2022-11-30 | Suction nozzle of chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218631984U true CN218631984U (en) | 2023-03-14 |
Family
ID=85452615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223199936.0U Active CN218631984U (en) | 2022-11-30 | 2022-11-30 | Suction nozzle of chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218631984U (en) |
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2022
- 2022-11-30 CN CN202223199936.0U patent/CN218631984U/en active Active
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