CN218631689U

CN218631689U - High sheet resistance metallized polymer film capacitor

Info

Publication number: CN218631689U
Application number: CN202222298437.0U
Authority: CN
Inventors: 冯建勋
Original assignee: Nantong Jiangsen Electronic Technology Co ltd
Current assignee: Nantong Jiangsen Electronic Technology Co ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2023-03-14
Anticipated expiration: 2032-08-30

Abstract

The utility model discloses a high square resistance metallization polymer film capacitor, including capacitor case, capacitor case surface evenly is equipped with first sand grip, and is a plurality of first sand grip surface evenly is equipped with the second sand grip, the second sand grip with first sand grip sets up perpendicularly relatively, the inside dielectric layer that is equipped with of capacitor case, the dielectric layer outside is equipped with first film cladding material and second film cladding material, second film cladding material set up in the first film cladding material outside. The utility model discloses a be equipped with buffer layer and dielectric layer, will attach the space buffer layer that can cushion in first film coating structure in the dielectric layer outside, make its electrostatic energy or short-circuit current that bring at the condenser during operation through the time, cause to dissolve and resume insulating in-process with the evaporation and provide certain buffering, guarantee that it can not lead to the condition emergence that extrusion deformation influences life because of expend with heat and contract with cold under the condition that the inside temperature of condenser during operation increases.

Description

High sheet resistance metallized polymer film capacitor

Technical Field

The utility model relates to a condenser technical field, more specifically say, the utility model relates to a high square resistance metallization polymer film capacitor.

Background

The capacitor is very diverse depending on the dielectric, for example: electrolyte capacitors, paper capacitors, thin film capacitors, ceramic capacitors, mica capacitors, air capacitors, and the like. But are most frequently used in audio equipment, as are electrolytic capacitors and Film (Film) capacitors. Electrolytic capacitors are often used in places where a large capacitance is required, such as filter capacitors in the main power supply section, which also serve to store electric energy in addition to filtering. The thin film capacitor is widely used in the place of the cross connection of analog signals, the bypass of power supply noise (reverse cross connection), and the like.

A film capacitor has many excellent characteristics, and thus is a capacitor having excellent performance. Its main equivalence is as follows: no polarity, high insulation resistance, excellent frequency characteristics (wide frequency response), and low dielectric loss. Due to the above advantages, the thin film capacitor is used in a large number of analog circuits. Particularly, in the signal connection portion, a capacitor with good frequency characteristics and extremely low dielectric loss must be used to ensure that the signal is transmitted without causing too large distortion, wherein the capacitor in the form of metallized film has a so-called self-recovery function, that is, if a short circuit is caused by weak electric interface in a tiny portion of the electrode, the electrode metal around the short circuit portion is caused, and the insulation is recovered by melting and evaporation of a larger area due to the electrostatic energy or short circuit current carried by the capacitor at that time, so that the capacitor recovers the function of the capacitor again. That is to say, the device can be self-healed instantly.

However, when the current flows through the interior of the existing metallized polymer during working, the internal temperature is gradually increased, the metal film is easy to deform after being heated, the self-healing performance and the service life of the capacitor are reduced after deformation and extrusion, and the square resistance of many existing capacitors is low, the voltage resistance is poor, and the film is easy to break down, so that the invention of the metallized polymer film capacitor with high square resistance is necessary.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned deficiencies of the prior art, embodiments of the present invention provide a high sheet resistance metallized polymer film capacitor.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a high square hinders metallized polymer film capacitor, includes capacitor case, capacitor case evenly is equipped with first sand grip on the surface, and is a plurality of first sand grip surface evenly is equipped with the second sand grip, the second sand grip with first sand grip sets up perpendicularly relatively, the inside dielectric layer that is equipped with of capacitor case, the dielectric layer outside is equipped with first thin film coating and second thin film coating, the second thin film coating set up in the first thin film coating outside, first sand grip set up in the first thin film coating outside.

In a preferred embodiment, the dielectric layer is made of a polyethylene material.

In a preferred embodiment, the first film plating layer and the first ribs are provided as a zinc plating layer, and the second film plating layer and the second ribs are provided as an aluminum plating layer.

In a preferred embodiment, the buffer layer is a hollow structure, the first thin film plating layer is movably disposed inside the buffer layer, and a protruding layer is disposed on a surface of the first thin film plating layer, and the protruding layer is respectively connected to the dielectric layer and the second thin film plating layer.

In a preferred embodiment, the first protruding strip and the second protruding strip have the same thickness and are both protruding.

In one preferred embodiment, the first rib extends through the capacitor case to communicate with the first film plating layer, and the second rib extends through the capacitor case to communicate with the second film plating layer.

In a preferred embodiment, the contact portions of the first protruding strip and the second protruding strip with the capacitor case are welded.

In a preferred embodiment, pin lines are connected to the outside of the capacitor case.

The utility model discloses a technological effect and advantage:

1. the utility model discloses a be equipped with buffer layer and dielectric layer, will attach the space buffer layer that can cushion of first film coating structure outside the dielectric layer, make it when the capacitor during operation brought electrostatic energy or short circuit current through, cause to dissolve and evaporate and resume insulating process and provide certain buffering, guarantee it can not cause because of expend with heat and contract with cold extrusion deformation to influence the condition emergence of life under the condition that the internal temperature of capacitor during operation increases;

2. through being equipped with first film cladding material, second film cladding material, first sand grip and second sand grip, first film cladding material and first sand grip all set up to the galvanizing coat, second film cladding material and second sand grip all set up to the aluminized layer, and set up in the dielectric layer both sides, set gradually the galvanizing coat respectively and aluminized the layer, make the resistant heavy current of condenser pass through the performance reinforcing, whole volume can not have great change, and the aluminized layer in the outside can play better heat conductivility, improve heat dispersion, in addition, the first sand grip and the second sand grip that the protrusion set up arrange highly in proper order and change, its holistic square resistance has been improved greatly, reduce surface metal conductivity, improve the performance of whole withstand voltage.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is an overall sectional view of the present invention.

The reference signs are: 1 capacitor shell, 11 pin lines, 2 first convex strips, 3 second convex strips, 4 dielectric layers, 5 buffer layers, 6 first thin film plating layers and 7 second thin film plating layers.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The high sheet resistance metallized polymer film capacitor shown in fig. 1-2 comprises a capacitor shell 1, wherein first convex strips 2 are uniformly arranged on the surface of the capacitor shell 1, a plurality of second convex strips 3 are uniformly arranged on the surface of the first convex strips 2, the second convex strips 3 are perpendicular to the first convex strips 2, a dielectric layer 4 is arranged inside the capacitor shell 1, a first film plating layer 6 and a second film plating layer 7 are arranged on the outer side of the dielectric layer 4, the second film plating layer 7 is arranged on the outer side of the first film plating layer 6, and the first convex strips 2 are arranged on the outer side of the first film plating layer 6.

The dielectric layer 4 is made of a polyethylene material.

The first film coating 6 and the first convex strip 2 are both arranged to be a galvanized layer, the second film coating 7 and the second convex strip 3 are both arranged to be an aluminum coating layer, and the galvanized layer and the aluminum coating layer are respectively and sequentially arranged, so that the high-current-resistant performance of the capacitor is enhanced, and the whole volume cannot be greatly changed.

The buffer layer 5 is arranged in a hollow manner, the first film plating layer 6 is movably arranged in the buffer layer 5, a protruding layer is arranged on the surface of the first film plating layer, the protruding layer is respectively connected with the dielectric layer 4 and the second film plating layer 7, and the first film plating layer 6 attached to the outer side of the dielectric layer 4 forms a buffer space buffer layer 5, so that when electrostatic energy or short-circuit current caused by the working of the capacitor flows, the buffer space buffer layer is caused to melt and evaporate to provide certain buffer in the process of recovering insulation.

First sand grip 2 with 3 thickness of second sand grip are the same and are the protrusion setting, and the first sand grip 2 and the second sand grip 3 that the protrusion set up arrange highly in proper order and change in proper order, have improved its holistic side greatly and have hindered, reduce surperficial metal conductivity.

The first convex strips 2 penetrate through the capacitor shell 1 and are communicated with the first film coating 6, the second convex strips 3 penetrate through the capacitor shell 1 and are communicated with the second film coating 7, and the aluminum coating on the outer side can play a good role in heat conduction, so that the heat dissipation performance is improved.

The contact parts of the first convex strip 2 and the second convex strip 3 with the capacitor shell 1 are welded, so that the stability of the whole structure is ensured.

The outside of the capacitor case 1 is connected with a pin wire 11.

The utility model discloses theory of operation:

referring to the description of the drawings, figure 2: the first film plating layer 6 attached to the outer side of the dielectric layer 4 is constructed into a spatial buffer layer 5 which can buffer, so that certain buffer is provided in the process of causing melting and evaporation to recover insulation when electrostatic energy or short-circuit current caused by the working of the capacitor passes through, and the condition that the service life is influenced by extrusion deformation caused by expansion with heat and contraction with cold is avoided when the internal temperature of the capacitor is increased in the working process;

referring to the description figures 1 and 2: first film coating 6 and first sand grip 2 all set up to the galvanizing coat, second film coating 7 and second sand grip 3 all set up to the aluminized layer, and set up in 4 both sides of dielectric layer, the galvanizing coat and the aluminized layer set gradually respectively, make the resistant heavy current of condenser pass through the performance reinforcing, whole volume can not have great change, and the aluminized layer in the outside can play better heat conductivility, improve heat dispersion, in addition, highly change in proper order is arranged in proper order to first sand grip 2 and second sand grip 3 that the protrusion set up, its holistic square resistance has been improved greatly, reduce surface metal conductivity, improve the performance of whole withstand voltage.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to common designs, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high sheet resistance metallized polymer film capacitor comprising a capacitor case (1), characterized by: the capacitor case body (1) surface evenly is equipped with first sand grip (2), and is a plurality of first sand grip (2) surface evenly is equipped with second sand grip (3), second sand grip (3) with first sand grip (2) sets up perpendicularly relatively, inside dielectric layer (4) that is equipped with of capacitor case body (1), the dielectric layer (4) outside is equipped with first film cladding layer (6) and second film cladding layer (7), second film cladding layer (7) set up in first film cladding layer (6) outside, first sand grip (2) set up in first film cladding layer (6) outside.

2. A high sheet resistance metallized polymer film capacitor according to claim 1, wherein: the dielectric layer (4) is made of a polyethylene material.

3. A high sheet resistance metallized polymer film capacitor according to claim 1, wherein: the first film plating layer (6) and the first raised lines (2) are both arranged to be zinc plating layers, and the second film plating layer (7) and the second raised lines (3) are both arranged to be aluminum plating layers.

4. A high sheet resistance metallized polymer film capacitor according to claim 1, wherein: the buffer layer (5) is arranged in a hollow mode, the first film coating (6) is movably arranged inside the buffer layer (5), a protruding layer is arranged on the surface of the first film coating, and the protruding layer is connected with the dielectric layer (4) and the second film coating (7) respectively.

5. A high sheet resistance metallized polymer film capacitor according to claim 1, wherein: the first convex strip (2) and the second convex strip (3) are the same in thickness and are arranged in a protruding mode.

6. A high sheet resistance metallized polymer film capacitor according to claim 1, wherein: the first protruding strips (2) penetrate through the capacitor shell (1) and are communicated with the first film plating layer (6), and the second protruding strips (3) penetrate through the capacitor shell (1) and are communicated with the second film plating layer (7).

7. A high sheet resistance metallized polymer film capacitor according to claim 6, wherein: the contact parts of the first convex strip (2) and the second convex strip (3) and the capacitor shell (1) are welded.

8. A high sheet resistance metallized polymer film capacitor according to claim 1, wherein: the outer side of the capacitor shell (1) is connected with a pin wire (11).