CN218548395U - Wafer aligning device - Google Patents

Abstract

The utility model provides a wafer aligning device, the device includes at least: the device comprises a base component, a first motion system, a second motion system, an alignment detection system and an in-place detection system. The utility model combines the adjustment precision grading of the motion platform and the matching application of the optical lens of the detection system, feeds back the alignment state in real time, and improves the alignment precision between the wafers and the in-place precision of the motion platform; meanwhile, the driving systems with different dimensions of the detection system are tiled and separated, so that the mutual influence of the driving systems with different dimensions in adjustment is reduced, the adjustment precision is improved, and the height in the third direction is reduced; in addition, the air floatation guide connection design is utilized, the central rotation motion on a two-dimensional plane is realized, the alignment precision is favorably improved, the resistance in the motion process is reduced, the driving weight is reduced, and the operation efficiency of the device is improved; and finally, the step type base station design and the arrangement design of the driving device are matched, so that the height of the device is reduced, and the space utilization is optimized.

Description

Wafer aligning device

Technical Field

The utility model belongs to the technical field of semiconductor integrated circuit manufacture equipment, especially, relate to a wafer aligning device.

Background

With the advent of the big data era and the 5G era, the magnitude of data processing is growing exponentially, which also demands higher and higher integration of chips. In order to meet the requirement, the current three-dimensional design of semiconductor integrated design is used more and more frequently, and the realization of high-precision alignment and positioning of wafers in the process of manufacturing devices with high density and three-dimensional design (such as bonding, photoetching and other processing processes) becomes a key technical problem, and the yield of finished products and the working stability and reliability of devices can be directly influenced due to insufficient precision.

The alignment device in the prior art is mostly driven by a mechanical mode, and a moving table is subjected to large friction force, so that the alignment precision is reduced, and meanwhile, the driving weight is large, and the reaction is insensitive. The stack type is mostly adopted in the existing design adopting air floatation driving, so that the device has large volume and complex structure, and is difficult to realize free rotary motion on a two-dimensional plane. In addition, most detection modules in the current alignment device adopt traditional electromagnetic position sensors, and the sensing speed is limited, so that the real-time feedback and accurate alignment are difficult to realize.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer alignment apparatus for solving the problem of high precision alignment and positioning of wafers in the prior art.

To achieve the above and other related objects, the present invention provides the following technical solutions:

the utility model provides a wafer aligning device, wafer aligning device includes: the system comprises a base component, a first motion system, a second motion system, an alignment detection system and an in-place detection system;

the first motion system comprises a lower motion carrying platform, a lower motion platform, a lower air floating assembly and a first wafer; the lower moving carrying platform is fixedly arranged on the base component; the lower moving platform is arranged on the lower moving platform deck and movably connected with the lower moving platform deck so as to bear and move the first wafer arranged on the lower moving platform; the lower air floatation assemblies are symmetrically arranged on two sides of the bottom surface of the lower motion platform along a first direction;

the second motion system comprises an upper motion platform, an upper two-dimensional motion system, an upper fine adjustment platform and a second wafer; the upper motion platform is connected with the base assembly in an air floating manner and is arranged above the lower motion platform deck; the upper moving table and the lower moving table are separated by a preset distance in a third direction; the upper two-dimensional motion system is arranged on the upper motion platform; the upper fine adjustment table is movably arranged on the upper moving table, and the second wafer is arranged on the upper fine adjustment table;

the alignment detection system comprises a detection assembly, a C-shaped support beam and a three-way motion table; the detection assembly is fixedly arranged on the C-shaped support beam; the C-shaped supporting beam is arranged on the three-way moving table; the three-way motion table is arranged on the base component;

the in-place detection system comprises a base, an in-place driving module and an in-place detection assembly, wherein the in-place detection assembly comprises an optical detection lens which is driven by the in-place driving module to linearly move along a third direction, and the optical detection lens is movably connected with the in-place driving module;

the in-place driving module and the in-place detection module are respectively provided with two groups; the two in-place driving modules are symmetrically arranged on two sides of the base along a second direction; each in-place driving module is correspondingly connected with one in-place detection assembly; the base is fixedly arranged on the base component; the in-place detection system is arranged below the lower motion table; at least two in-place marks are preset on the lower surface of the lower motion table;

the first direction, the second direction and the third direction are mutually perpendicular in pairs.

Optionally, the base assembly further comprises a bottom base, a first guide base, a second guide base, an upper first-direction motor stator, and an upper first-direction in-place sensor; the first guide base and the second guide base are symmetrically fixed on the bottom base along the first direction; the outer side surfaces of the first guide base and the second guide base are respectively provided with a secondary step comprising a primary step and a secondary step, the primary step is provided with the stator of the motor in the upper first direction, and the secondary step is provided with the sensor in the upper first direction.

Optionally, the first motion system further comprises 3 or more than 3 sets of third downward driving components arranged in a non-coplanar manner; the third downward driving component is arranged on the bottom surface of the base component and movably connected with the lower moving carrying platform by penetrating through the base component.

Optionally, the first motion system further comprises a lower first direction motor stator, a lower position sensor; two sides of the lower moving carrying platform symmetrical along the first direction are both provided with a second-level step comprising a first-level step and a second-level step, the first-level step is provided with the lower first-direction motor stator, and the second-level step is provided with the lower in-place sensor; the lower air floatation assembly comprises a lower first-direction motor rotor, a lower plane air floatation module and a lower side surface air floatation module; the first-direction motor rotor is arranged on the side surface of the lower motion table, and the lower plane air floatation module is arranged at the bottom of the lower motion table; the bottom surface of the lower plane air floatation module and the top surface of the lower motion carrying platform form an air floatation area; the lower moving carrying platform is arranged in a shape of a Chinese character 'hui', the center of the surface of the lower moving carrying platform is sunk or overhead to form four inner side surfaces, and two inner side surfaces symmetrical along the first direction are a first inner side surface and a second inner side surface respectively; the downside air supporting module set up in first medial surface with the second medial surface, first medial surface with downside air supporting module a side forms first air supporting district, the second medial surface with downside air supporting module another side forms second air supporting district.

Optionally, the first air bearing is disposed in the first air bearing region, and the second air bearing is disposed in the second air bearing region; the lower first air bearing is a spherical air bearing, and the lower second air bearing is a planar air bearing with a piston; or the lower first air bearing is a planar air bearing with a piston, and the lower second air bearing is a spherical air bearing; the first and second air bearings cooperate to limit movement of the lower motion stage in the first direction.

Optionally, the upper two-dimensional motion system further comprises an upper first-direction motion module; the upper first direction movement module comprises a plurality of upper first direction guide block groups, an upper second direction air floatation first plate, an upper second direction air floatation second plate and an upper first direction motor rotor; the upper second-direction air floatation first plate and the upper second-direction air floatation second plate are symmetrically arranged on the upper moving table along the second direction; each upper first direction guide block group comprises two upper first direction guide blocks, two upper first direction guide blocks in each upper first direction guide block group are symmetrically fixed at the bottom of the upper second direction air floatation first plate or/and the bottom of the upper second direction air floatation second plate along the first direction, and are erected on the first guide base and the second guide base respectively so as to limit the upper moving table to move along the first direction.

Optionally, the upper two-dimensional motion system further comprises an upper second direction motion module; the upper second direction movement module comprises an upper second direction driving piece, a bearing, a wedge-shaped seat and an elastic piece; the upper second direction driving piece, the bearing, the wedge seat and the elastic piece are arranged in two groups, and the two groups are symmetrically arranged on the upper moving table along the second direction; the two groups of upper second-direction driving pieces are respectively fixed on the upper second-direction air floatation first plate and the upper second-direction air floatation second plate; the upper second direction driving piece is connected with the upper moving table through the wedge-shaped seat and the bearing which are clamped with each other as a movable connecting piece so as to limit the upper moving table to do central rotation movement on the first plane; the elastic piece is connected with the wedge-shaped seat and the bearing.

Optionally, the second motion system further comprises a first fine adjustment driver, a second fine adjustment driver; at least one group of first fine adjustment drivers are respectively arranged on two symmetrical sides of the upper fine adjustment table along the second direction so as to drive the upper fine adjustment table to linearly move along the first direction; and two sides of the upper fine adjustment platform symmetrical along the first direction are respectively provided with a group of second fine adjustment drivers so as to drive the upper fine adjustment platform to linearly move along the second direction or to do central rotation movement on the first plane.

Optionally, the detection assembly of the alignment detection system includes a set of first detection assemblies and a set of second detection assemblies, and each set of the first detection assemblies and the second detection assemblies is provided with at least two detection pieces respectively; the first detection assembly is arranged on the lower arm of the C-shaped support beam, and the second detection assembly is arranged on the upper arm of the C-shaped support beam; the lower surface of the first wafer is provided with first detection points, the upper surface of the second wafer is provided with second detection points, the first detection assembly is used for detecting the first detection points, and the second detection assembly is used for detecting the second detection points.

Optionally, the three-way motion stage comprises an air floatation detection base, a first motion detection assembly, a second motion detection assembly and a third motion detection assembly; an air floatation area is formed between the detection air floatation base and the bottom base; the first detection movement assembly is connected with the air floatation detection base and drives the air floatation detection base to move along the first direction; the second detection movement assembly is connected with the air floatation detection base and drives the air floatation detection base to move along the second direction; the third detection assembly is connected with the detection assembly and drives the detection assembly to move along the third direction.

As described above, the utility model discloses a wafer aligning device has following beneficial effect:

the utility model combines the adjustment precision grading of the motion platform and the matching application of the optical lens of the detection system, feeds back the alignment state in real time, and improves the alignment precision between the wafers and the in-place precision of the motion platform;

the utility model discloses a detection system different dimension's the drive system tiling is separated, has reduced the mutual influence when the drive system of different dimensions adjusts, improves the adjustment accuracy, and reduces the third direction height;

the utility model realizes the central rotation movement on the two-dimensional plane by utilizing the air floatation guiding connection design, is beneficial to improving the alignment precision, reduces the resistance in the movement process, reduces the driving weight and improves the operation efficiency of the device;

the utility model discloses the design of arranging is spread to cascaded base station design of cooperation and drive arrangement, has reduced the height of device, has optimized space utilization.

Drawings

Fig. 1 is a schematic perspective view of a wafer alignment apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic front view of a wafer alignment apparatus according to an embodiment of the present invention.

Fig. 3 is a perspective view of the base assembly according to an embodiment of the present invention.

Fig. 4 is a schematic front view of a base assembly according to an embodiment of the present invention.

Fig. 5 is a perspective view of the first motion system on the base assembly according to an embodiment of the present invention.

Fig. 6 is a schematic front view of a first motion system on a base assembly according to an embodiment of the invention.

Fig. 7 is a schematic left side view of the first motion system on the base assembly according to an embodiment of the present invention.

Fig. 8 is a perspective view of a second motion system on the base assembly according to an embodiment of the present invention.

Fig. 9 is a perspective detailed view of the first motion system in the embodiment of the present invention.

Fig. 10 is a rear perspective detail view of the upper motion stage according to an embodiment of the present invention.

Fig. 11 is a schematic perspective view of an alignment detection system according to an embodiment of the present invention.

Fig. 12 is a schematic left side view of an alignment detection system according to an embodiment of the present invention.

Fig. 13 is a schematic top view of an alignment detection system according to an embodiment of the present invention.

Fig. 14 is a schematic perspective view of an in-place detection system according to an embodiment of the present invention.

Fig. 15 is a schematic left side view of an in-place detection system on a base assembly according to an embodiment of the present invention.

Description of the element reference numerals

100. A base assembly; 101. a bottom base; 102. a first guide base; 103. a second guide base; 104. a primary step; 105. a secondary step;

200. a first motion system; 201. a lower motion stage; 202. a lower motion stage; 2031. a lower first direction motor stator; 2032. a lower first-direction motor mover; 2033. a lower in-place sensor; 204. a first wafer; 205. driving the component downwards by a third party;

300. a second motion system; 301. an upper motion table; 3021. floating a plate in the second direction; 3022. floating the second plate in the second direction; 3023. an upper first direction guide block; 303. a fine adjustment table is arranged; 3041. a first fine adjustment driver; 3042. a second fine adjustment driver; 305. a flexible hinge; 306. a second wafer;

400. an alignment detection system; 401. a C-shaped support beam; 402. a first detection assembly; 403. a second detection assembly; 404. detecting a first moving component; 405. detecting a second moving component; 406. detecting a third moving component;

500. an in-place detection system; 501. an in-place driving module; 502. an in-place detection component; 503. and an optical detection lens.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

As in the detailed description of the embodiments of the present invention, the schematic drawings showing the structure of the device are not enlarged partially according to the general scale for the convenience of illustration, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures.

In the context of this application, a structure described as having a first feature "over" a second feature may encompass embodiments in which the first and second features are formed in direct contact, and may also encompass embodiments in which additional features are formed between the first and second features such that the first and second features may not be in direct contact.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention in a schematic manner, and the drawings only show the components related to the present invention, rather than drawing the shapes, the shapes and the dimensions of the components according to the actual implementation, the shapes, the amounts and the proportions of the components may be changed at will, and the layout of the components may be more complicated.

As shown in fig. 1-15, the utility model provides a wafer aligning device, the wafer aligning device includes: a base assembly 100, a first motion system 200, a second motion system 300, an alignment detection system 400, an in-position detection system 500;

the first motion system 200 comprises a lower motion stage 201, a lower motion stage 202, a lower air-bearing assembly, and a first wafer 204; the lower motion stage 201 is fixedly arranged on the base assembly 100; the lower motion table 202 is arranged on the lower motion stage 201 and movably connected with the lower motion stage 201 so as to bear and move the first wafer 204 arranged on the lower motion table 202; the lower air floating assemblies are symmetrically arranged on two sides of the bottom surface of the lower motion platform 202 along a first direction so as to drive and limit the lower motion platform 202 to move on the lower motion platform 201 along the first direction;

the second motion system 300 comprises an upper motion platform 301, an upper two-dimensional motion system, an upper fine adjustment platform 303 and a second wafer 306; the upper motion table 301 is connected to the base assembly 100 in an air floating manner and is arranged above the lower motion stage 201; the upper moving table 301 and the lower moving table 202 are spaced by a preset distance in the third direction; the upper two-dimensional motion system is arranged on the upper motion table 301 and used for driving the upper motion table 301 to do two-dimensional motion on a first plane on the base component 100; the upper fine adjustment table 303 is movably arranged on the upper moving table 301, and the second wafer 306 is arranged on the upper fine adjustment table 303;

alignment detection system 400 includes a detection assembly, a C-shaped support beam 401, a three-way motion stage; the detection component is fixedly arranged on the C-shaped support beam 401 and is used for detecting the alignment state of the first wafer 204 and the second wafer 306 in the third direction; the C-shaped supporting beam 401 is arranged on the three-way moving platform; the three-way motion stage is arranged on the base component 100; the three-way motion stage is used for moving the C-shaped support beam 401 so that the detection component on the C-shaped support beam 401 follows the first wafer 204 or the second wafer 306;

the in-place detection system 500 comprises a base, an in-place driving module 501 and an in-place detection assembly 502, wherein the in-place detection assembly 502 comprises an optical detection lens 503 which is driven by the in-place driving module 501 to linearly move along a third direction, and the optical detection lens 503 is movably connected with the in-place driving module 501;

the in-place driving module 501 and the in-place detection module 502 are respectively provided with two groups; the two in-place driving modules 501 are symmetrically arranged on two sides of the base along the second direction; each in-place driving module 501 is correspondingly connected with a set of in-place detection components 502; the base is fixedly arranged on the base component 100; the in-place detection system 500 is disposed below the lower motion stage 202; at least two in-place marks are preset on the lower surface of the lower motion table 202;

the first direction, the second direction and the third direction are mutually vertical pairwise. The first direction and the second direction are both parallel to the first plane, and the third direction is perpendicular to the first plane. In this embodiment, the first direction is a Y direction, the second direction is an X direction, and the third direction is a Z direction.

The utility model improves the motion accuracy of the first motion system 200 by the air-floating connection between the lower motion carrier 201 and the lower motion platform 202; the movement in-place precision of the first movement system 200 is improved through the matching use of the upper two-dimensional movement system of the second movement system 300 and the upper fine adjustment platform 303; the alignment detection system 400 is used in cooperation with the in-place detection system 500 which uses the optical detection lens 503 to perform detection, so that the detection precision of the wafer alignment device is improved; the motion in-place precision and the detection precision are improved simultaneously, and the alignment in-place precision of the wafer alignment device is obviously improved; meanwhile, the design of the double-wafer motion platform capable of moving in multiple dimensions improves the control flexibility of the wafer alignment device.

Specifically, the bottom surface of the upper moving stage 301 is spaced apart from the top surface of the lower moving stage 202 by a predetermined distance in the third direction to prevent the first moving system 200 and the second moving system 300 from interfering.

As an example, as shown in fig. 3-4, the base assembly 100 further includes a bottom base 101, a first guide base 102, a second guide base 103, an upper first direction motor stator, an upper first direction position sensor; the first guide base 102 and the second guide base 103 are symmetrically fixed on the bottom base 101 along a first direction; the outer side surfaces of the first guide base 102 and the second guide base 103 are respectively provided with a two-stage step comprising a primary step 104 and a secondary step 105, the primary step 104 is provided with a first-direction motor stator, and the secondary step 105 is provided with a first-direction in-place sensor. The utility model discloses a base subassembly 100's second grade ladder design and inside built on stilts design have reduced wafer aligning device's vertical height, make its structure compacter, have improved wafer aligning device's usage space flexibility.

In another example, the upper first direction motor stator is provided at the secondary stage 105, and the upper first direction position sensor is provided at the primary stage 104.

As an example, as shown in fig. 6, the first motion system 200 further includes 3 sets or more than 3 sets of third downward driving components 205 arranged non-coplanar; the third downward driving component 205 is arranged on the bottom surface of the base component 100, and is movably connected with the lower moving carrier 201 through the base component 100; the third downward driving assembly 205 is used to drive the lower moving stage 201 to move in a third direction and keep the lower moving stage 201 parallel to the first plane. The utility model discloses a not coplaner third party of multiunit drives the design of subassembly 205 downwards, makes first moving system 200 not only can be in the third direction motion, can also guarantee that lower motion platform 202 is on a parallel with first plane in the motion process to guaranteed the stationary motion of lower motion platform in the third direction, avoided because the small slope influence of lower motion platform 202 aims at the detection precision that targets in place.

As an example, as shown in fig. 5-7, the first motion system 200 further includes a lower first-direction motor stator 2031, a lower reach sensor 2033; two sides of the lower moving carrier 201 symmetrical along the first direction are both provided with a second-level step comprising a first-level step and a second-level step, the first-level step is provided with a motor stator 2031 in the next first direction, and the second-level step is provided with a lower-in-place sensor 2033; the lower air floatation assembly comprises a lower first direction motor rotor 2032, a lower plane air floatation module and a lower side surface air floatation module; the first-direction motor mover 2032 is disposed on a side surface of the lower motion stage 202, and the lower planar air flotation module is disposed at the bottom of the lower motion stage 202; the bottom surface of the lower plane air floatation module and the top surface of the lower motion carrier 201 form an air floatation area; the lower motion carrying platform 201 is arranged in a shape of a Chinese character 'hui', the center of the surface of the lower motion carrying platform is sunk or overhead to form four inner side surfaces, and two inner side surfaces symmetrical along the first direction are respectively a first inner side surface and a second inner side surface; the downside air supporting module set up in first medial surface and second medial surface, first medial surface and downside air supporting module one side form first air supporting district, and second medial surface and downside air supporting module another side form the second air supporting district.

Alternatively, only the lower plane air floating module and the top surface of the lower moving stage 201 may be arranged to form an air floating area, and the lower side air floating module is not arranged, so that the first air floating area and the second air floating area are omitted; or only the lower side surface air floatation module is arranged to form a first air floatation area and a second air floatation area, and the lower plane air floatation module is not arranged, so that the lower plane air floatation module and the air floatation area formed on the top surface of the lower motion carrying platform 201 are omitted. Specifically, the practitioner can adjust the specific air bearing surface position setting according to the air bearing adsorption tightness degree requirement of the actual application and the device space condition.

Specifically, the lower moving stage 201 further includes two outer side surfaces, which are a first outer side surface and a second outer side surface.

Preferably, the first inner side surface and one side surface of the lower side surface air floatation module form an air floatation area, the second inner side surface and the other side surface of the lower side surface air floatation module form another air floatation area, and the two air floatation bearing sets are respectively arranged in the two air floatation areas and are in air floatation connection with the corresponding side surfaces. The design of the air floating area can enable air floating connection to play a guiding role, and meanwhile, enough space can be reserved on the outer side surface of the lower movement carrier 201 for installing other devices such as a sensor, a grating ruler and the like, so that the size of the whole device is further reduced, and flattening is achieved.

In another example, the first outer side surface and one side surface of the lower side surface air floatation module form an air floatation area, the second outer side surface and the other side surface of the lower side surface air floatation module form another air floatation area, and the two air floatation bearing sets are respectively arranged in the two air floatation areas and form air floatation connection with the corresponding side surfaces.

In another example, the first inner side surface and one side surface of the lower side surface air floatation module form an air floatation area, the second inner side surface and the other side surface of the lower side surface air floatation module form an air floatation area, the first outer side surface and one side surface of the lower side surface air floatation module form an air floatation area, the second outer side surface and the other side surface of the lower side surface air floatation module form another air floatation area, and the four air floatation bearing sets are respectively arranged in the four air floatation areas and are in air floatation connection with the corresponding side surfaces.

Alternatively, lower motion stage 202 may be moved linearly in a first direction, linearly in a second direction, or in a micro-rotation in a first plane.

Specifically, as shown in fig. 5, one stage air-bearing surface is formed on each of the two ends of the top surface of lower motion stage 201 that is symmetrical in the second direction, and when lower motion stage 202 moves on lower motion stage 201 in the second direction, the movement stroke of the lower motion stage is half the length of one stage air-bearing surface in the second direction, so that a practitioner needs to determine the size of lower motion stage 201 according to the required movement stroke of lower motion stage 202 in the second direction when designing lower motion stage 201. Alternatively, the stage air bearing surface may be narrow, where lower motion stage 202 moves linearly in only the first direction.

Specifically, when the first motion system 200 is configured to be able to rotate slightly on the first plane, the shape of the stage air-bearing surface is designed according to the angle of rotation required, so that the stage air-bearing surface can maintain air-bearing connection with the air-bearing surface of the lower motion stage 202 in the rotation range.

Specifically, when the lower motion stage 202 is in a driving state in the first direction, both the first air floating area and the second air floating area between the lower side air floating module and the lower motion stage 201 are communicated with positive pressure, and the air floating area between the lower plane air floating module and the lower motion stage 201 is communicated with negative pressure and positive pressure, so that the lower motion stage 202 is limited to move in the first direction, and the second direction is not deviated; when the lower motion stage 202 is in a driving state in the second direction, a set of positive pressure and a set of negative pressure are applied to the first air floating area and the second air floating area between the lower side air floating module and the lower motion stage 201, and a set of positive pressure is applied to the air floating area between the lower plane air floating module and the lower motion stage 201, so that the lower motion stage 202 can move in the second direction; when the lower motion stage 202 is in a non-driving state, the first air floating area and the second air floating area between the lower side air floating module and the lower motion stage 201 are not ventilated, and the air floating area between the lower plane air floating module and the lower motion stage 201 is ventilated with negative pressure, so that the lower motion stage 202 is adsorbed on the lower motion stage 201 and cannot be interfered to generate sliding or deviation.

The utility model discloses a design is connected in the air supporting between lower first direction motor active cell 2032 and the lower first direction motor stator 2031, lower plane air supporting module and the air supporting between the lower motion microscope carrier 201, has improved the speed and the stability of motion, has avoided lower motion platform 202 to slide for lower motion microscope carrier 201 under non-driven state simultaneously, has improved the position accuracy after the wafer targets in place.

As an example, the first air bearing zone is provided with a lower first air bearing, and the second air bearing zone is provided with a lower second air bearing; the lower first air bearing is a spherical air bearing, and the lower second air bearing is a planar air bearing with a piston; or the lower first air bearing is a planar air bearing with a piston, and the lower second air bearing is a spherical air bearing; the lower first air bearing and the lower second air bearing cooperate to limit movement of lower motion stage 202 in a first direction. The utility model discloses a spherical surface formula air bearing uses with the cooperation of taking piston plane air bearing, can avoid the drive direction deviation or receive the interference to lead to the drive track skew to improve the motion stability of first moving system 200.

Optionally, a lower suction plate is disposed on the lower motion stage 202 to suck the first wafer 204, so as to prevent the first wafer 204 from shifting relative to the lower motion stage 202 during the motion process, and improve the accuracy of the first motion system 200 in adjusting the position of the first wafer 204.

As an example, as shown in fig. 8 and 10, the upper two-dimensional movement system further includes an upper first-direction movement module; the upper first direction movement module comprises an upper first direction guide block group, an upper second direction air floatation first plate 3021 and an upper second direction air floatation second plate 3022; an upper second direction air floating first plate 3021 and an upper second direction air floating second plate 3022 are symmetrically arranged on the upper moving stage 301 along the second direction; each upper first direction guide block group includes two upper first direction guide blocks 3023, and the two upper first direction guide blocks 3023 of each upper first direction guide block group are symmetrically fixed to the bottom of the upper second direction air floating first plate 3021 or/and the bottom of the upper second direction air floating second plate 3022 in the first direction and are respectively erected on the first guide base 102 and the second guide base 103 to restrict the upper moving stage 301 from moving in the first direction. Specifically, the upper two-dimensional motion system is disposed on the upper motion stage 301, and is used for driving the upper motion stage 301 to perform a linear motion or a central rotation motion on the base assembly 100 in a first plane.

Specifically, when the upper motion stage 301 is driven in the first direction, positive pressure is applied to the air-bearing areas formed between the plurality of upper first direction air-bearing block sets and the first and second guide bases 102 and 103, and negative pressure is applied to the air-bearing areas between the upper first direction air-bearing first plate and the upper second direction air-bearing second plate 3022 and the upper motion stage 301, so that the upper motion stage 301 is restricted from moving in the first direction, and the second direction does not shift; when the upper motion table 301 is in a driving state in the second direction, negative pressure is communicated to the air floating areas formed between the plurality of upper first direction air floating block groups and the first guide bases 102 and the second guide bases 103, and positive pressure is communicated to the air floating areas between the upper first direction air floating first plate and the upper second direction air floating second plate 3022 and the upper motion table 301, so that the upper motion table 301 is limited to move in the second direction, and the first direction does not deviate; when the upper moving stage 301 is in a non-driving state, the air floating areas between the upper first-direction air floating first plate and the upper second-direction air floating second plate 3022 and the upper moving stage 301 and the air floating areas between the plurality of upper first-direction guide block sets and the first guide base 102 and the second guide base 103 are all communicated with negative pressure, so that the first-direction air floating first plate and the upper second-direction air floating second plate 3022 are adsorbed on the upper moving stage 301, and the plurality of upper first-direction guide block sets are adsorbed on the first guide base 102 and the second guide base 103 without being interfered to slide or shift.

Specifically, as shown in fig. 10, two third air-floating regions are formed by the plurality of upper first direction block sets and the inner side surfaces of the first guide bases 102 and the second guide bases 103, and two fourth air-floating regions are formed by the plurality of upper first direction block sets and the outer side surfaces of the first guide bases 102 and the second guide bases 103. The utility model discloses an go up first direction air supporting one board and go up second direction air supporting two board 3022 respectively with go up the air supporting between motion platform 301 and be connected the design, a plurality of air supporting design of going up between first direction block group and the first direction base 102 and a plurality of air supporting design of going up between first direction block group and the second direction base 103, avoid under the non-drive state the skew of motion platform 301, realize the accurate control of two-dimensional air supporting motion of motion platform 301.

Alternatively, the upper first-direction motor stator on the first guide base 102 has a third inner side and a third outer side, and the upper first-direction motor stator on the second guide base 103 has a fourth inner side and a fourth outer side. Two upper first direction guide blocks 3023 of each upper first direction guide block group are respectively disposed to form an air floating connection with the third inner side surface and the fourth inner side surface. In another example, the two upper first direction guide blocks 3023 in each upper first direction guide block group may be respectively disposed to form an air-floating connection with the third outer side surface and the fourth outer side surface, or the two upper first direction guide blocks 3023 in each upper first direction guide block group may be respectively disposed to form an air-floating connection with the third inner side surface and the third outer side surface, or the two upper first direction guide blocks 3023 in each upper first direction guide block group may be respectively disposed to form an air-floating connection with the fourth inner side surface and the fourth outer side surface.

Alternatively, the plurality of upper first direction guide block groups may be replaced with a bearing structure resembling the first and second air bearing zones. Specifically, a first air bearing is arranged on the third air floating area, and a second air bearing is arranged on the fourth air floating area; the upper first air bearing is a spherical air bearing, and the upper second air bearing is a planar air bearing with a piston; or the upper first air bearing is a plane air bearing with a piston, and the upper second air bearing is a spherical air bearing; the upper first air bearing and the upper second air bearing cooperate to limit movement of the upper motion stage 301 in a first direction. The utility model discloses a spherical surface formula air bearing uses with the cooperation of taking piston plane air bearing, can avoid the drive direction deviation or receive the interference to lead to the drive track skew to improve second moving system 300's motion stability.

As an example, as shown in fig. 9, the upper two-dimensional movement system further includes an upper second-direction movement module; the upper second direction movement module comprises an upper second direction driving piece, a bearing, a wedge-shaped seat and an elastic piece; the upper second direction driving piece, the bearing, the wedge seat and the elastic piece are arranged in two groups, and the two groups are symmetrically arranged on the upper moving table 301 along the second direction; the two groups of upper second direction driving pieces are respectively fixed on an upper second direction air floatation first plate 3021 and an upper second direction air floatation second plate 3022; the upper second direction driving piece is connected with the upper moving table 301 by taking the wedge-shaped seat and the bearing which are mutually clamped as movable connecting pieces so as to limit the upper moving table 301 to do central rotation movement on a first plane; the elastic piece is connected with the wedge-shaped seat and the bearing.

The utility model discloses a drive direction design of going up second direction driving piece makes the top motion platform 301 can be at first plane and be central rotary motion, and cooperates the connection setting of wedge seat and bearing, avoids top motion platform 301 free slip to lead to rotary motion to lose control to realize steady top motion center rotary motion.

In another example, any one or more of the above air bearing connection designs may be replaced by a mechanical connection design according to the actual application requirements.

As an example, the second motion system 300 further includes a first fine actuator 3041, a second fine actuator 3042; at least one group of first fine adjustment drivers 3041 are respectively arranged on two symmetrical sides of the upper fine adjustment table 303 along the second direction to drive the upper fine adjustment table 303 to linearly move along the first direction; a set of second fine adjustment drivers 3042 is respectively disposed on two sides of the upper fine adjustment stage 303 symmetrical along the first direction to drive the upper fine adjustment stage 303 to move linearly along the second direction or to rotate around the first plane. Specifically, a first fine adjustment driver 3041 and a second fine adjustment driver 3042 are respectively connected to the upper moving stage 301 and the upper fine adjustment stage 303; the first fine adjustment driver 3041 and the second fine adjustment driver 3042 are small in size, light and thin, and have high position adjustment accuracy, and can achieve quick response to driving of the upper fine adjustment stage 303 for linear motion in the first direction, linear motion in the second direction, and rotational motion about the third direction, and improve the motion accuracy of the upper fine adjustment stage 303 for linear motion in the first direction, linear motion in the second direction, and rotational motion about the third direction. The first fine actuator 3041 and the second fine actuator 3042 have the same structure, and the structure of the first fine actuator 3041 is described as an example: the first fine actuator 3041 includes: the piezoelectric actuator comprises a piezoelectric actuator, a flexible sheet and a pre-tightening spring, wherein the fixed end of the piezoelectric actuator is connected with the upper motion platform 301, the movable end of the piezoelectric actuator is connected with the flexible sheet, and the flexible sheet is respectively connected with the upper fine adjustment platform 303 and the pre-tightening spring. The pre-tensioned springs are connected to the upper motion stage 301.

The utility model discloses an go up accurate adjustment platform 303 and carry out accurate adjustment once more on the basis of last motion stage 301 position, the position precision of the second wafer 306 that bears on the messenger goes up accurate adjustment platform 303 further improves. Specifically, the upper fine adjustment stage 303 is movably disposed on the upper moving stage 301 to finely adjust the position of the second wafer 306 disposed on the upper fine adjustment stage 303, and the upper fine adjustment stage 303 is disposed with a positioning sensor for detecting whether the upper fine adjustment stage 303 is driven to a predetermined position.

Specifically, as shown in fig. 9, the upper fine adjustment stage 303 is flexibly connected to the upper moving stage 301 by a flexible hinge 305 so that the upper fine adjustment stage 303 can perform a fine movement with respect to the upper moving stage 301. The utility model discloses a flexible hinge 305's connection design utilizes the high characteristics of its motion sensitivity to have improved the motion precision of last fine tuning platform 303, and its no mechanical friction, gapless characteristics are favorable to improving the technological precision that wafer aligning device made, make wafer aligning device compact structure, simultaneously because flexible hinge 305 structure can full page shaping, make wafer aligning device manufacturing efficiency higher.

Optionally, the flexible hinge 305 is a straight beam type flexible hinge 305 or a circular arc type flexible hinge 305. Specifically, the straight beam type flexible hinge 305 has higher motion precision but can only realize small amplitude rotation, the arc type flexible hinge 305 has larger rotation range but poorer precision, and a practitioner can select the type of the flexible hinge 305 according to specific precision requirements. Preferably, a straight beam type flexible hinge 305 is used.

Optionally, an upper suction cup is disposed on the upper fine adjustment stage 303 to suck the second wafer 306, so as to prevent the second wafer 306 from shifting relative to the upper fine adjustment stage 303 during the movement process, improve the accuracy of the second movement system 300 in adjusting the position of the second wafer 306, and improve the alignment accuracy of the first wafer 204 and the second wafer 306.

In another example, a fine adjustment stage may also be disposed on the lower motion stage 202, and the specific arrangement is similar to the upper fine adjustment stage 303, so as to further improve the positioning accuracy of the lower motion stage 202.

As an example, as shown in fig. 11-13, the inspection assembly of the alignment inspection system 400 includes a set of first inspection assemblies 402 and a set of second inspection assemblies 403, each set of the first inspection assemblies 402 and the second inspection assemblies 403 having at least two inspection pieces; the first detection component 402 is arranged at the lower arm of the C-shaped support beam 401, and the second detection component 403 is arranged at the upper arm of the C-shaped support beam 401; the lower surface of the first wafer 204 is provided with a first detecting point, the upper surface of the second wafer 306 is provided with a second detecting point, the first detecting element 402 is used for detecting the first detecting point, and the second detecting element 403 is used for detecting the second detecting point. Specifically, the detecting component is fixedly disposed on the C-shaped support beam 401 for detecting the alignment state of the first wafer 204 and the second wafer 306 in the third direction.

Preferably, each of the first detection assembly 402 and the second detection assembly 403 is provided with at least two detection elements, a connection line between two detection elements in each of the first detection assembly 402 passes through the first wafer 204, and a connection line between two detection elements in each of the second detection assembly 403 passes through the second wafer 306, so as to improve the alignment accuracy of the first wafer 204 and the second wafer 306 in the third direction.

Specifically, the second inspection assembly 403 and the first inspection assembly 402 have a confocal plane, and the lower surface of the second wafer 306 is in the same plane as the confocal plane; the plane where the two detecting elements of the first detecting element 402 are located is a first detecting surface, the plane where the two detecting elements of the second detecting element 403 are located is a second detecting surface, and the plane between the first detecting surface and the second detecting surface and having the same distance with the first detecting surface and the second detecting surface is a confocal surface. Since the detection assembly is imaged most clearly on the confocal plane, the lower surface of the second wafer 306 and the confocal plane can be aligned with the first wafer 204 and the second wafer 306 with the maximum accuracy of the detection assembly when the lower surface and the confocal plane are in the same plane.

The utility model discloses an aim at the mode that detecting system 400 detected the alignment from top to bottom respectively, improved the alignment accuracy of first wafer 204 and second wafer 306 in the third direction, the alignment accuracy of aiming at detecting system 400 has further been improved in the setting of confocal face to second wafer 306 lower surface.

As an example, as shown in fig. 12, the three-way motion stage includes a detect air bearing base, a detect first motion assembly 404, a detect second motion assembly 405, a detect third motion assembly 406; detecting that an air floating area is formed between the air floating base and the bottom base 101; the detection first moving assembly 404 is connected with the detection air floatation base and drives the detection air floatation base to move along a first direction; the second detection moving assembly 405 is connected with the detection air floatation base and drives the detection air floatation base to move along a second direction; the third detection assembly is connected with the detection assembly and drives the detection assembly to move along the third direction. Specifically, a three-way motion stage is used to move the C-beam 401 such that the detection assembly on the C-beam 401 follows the first wafer 204 or the second wafer 306.

The utility model discloses a detect first motion subassembly 404, detect second motion subassembly 405, detect arranging of third motion subassembly 406 tiled formula, reduced the height of wafer aligning device in the third direction, improved wafer aligning device's space utilization and reduced the mutual restriction between the motion subassembly of different dimensions simultaneously.

As an example, as shown in fig. 14-15, the optical detection lens 503 of the in-place detection system 500 is used to detect an in-place mark disposed on the lower surface of the lower motion stage 202 to detect the alignment state of the first wafer 204 with a preset first plane position; the in-place driving module 501 is used for driving the optical detection lens 503 to move to a position where the in-place mark can be detected or a clearest position where the in-place mark is detected, so as to ensure the accuracy of in-place detection. Specifically, at least two in-place marks are provided, and whether the position of the first wafer 204 on the first plane coincides with the preset position can be determined through the two in-place marks. Preferably, four in-place marks are provided to minimize the data processing amount of the optical detection lens 503 while ensuring the in-place accuracy, so as to improve the detection efficiency.

Specifically, the optical detection lens 503 may select one of a visible light imaging lens, a short wave infrared imaging lens, or an ultraviolet imaging lens. The visible light imaging lens is low in cost and lens requirement, the short wave infrared imaging lens is high in image recognition definition, simple and convenient in installation structure, the ultraviolet imaging lens is high in response sensitivity and imaging intuitionistic and simple, and the ultraviolet imaging lens is not influenced by external environment or illumination. A practitioner can select an appropriate optical detection lens 503 according to specific application requirements (e.g., cost, space, accuracy, sensitivity, interference immunity, etc.). Different optical detection lenses 503 need to match the in-place marks with different optical properties to obtain high-precision in-place detection results.

Preferably, at least one of the sets of sensors for detecting the position of the corresponding component in the first motion system 200, the second motion system 300, the alignment detection system 400, and the in-position detection system 500 employs a capacitive sensor. The capacitance sensor has simple structure, convenient installation and good dynamic response.

In another example, a grating scale can be used in part of each group of sensors, and the grating scale has high measurement accuracy but a complex installation structure.

Specifically, when the wafer alignment apparatus is located at the alignment station, the in-place detection assembly 502 of the in-place detection system 500 detects the positions of the in-place marks, and the in-place driving module 501 drives the optical detection lens 503 to move until the optical detection lens 503 can detect all the in-place marks when the optical detection lens 503 cannot detect all the in-place marks at the same time; when the optical detection lens 503 detects that the in-place mark does not coincide with the preset position, the first motion system 200 adjusts the position of the first wafer 204 by moving the lower motion platform until the in-place mark coincides with the preset position; the three-way motion stage of alignment inspection system 400 adjusts the position of the inspection assembly until the confocal plane between first inspection assembly 402 and second inspection assembly 403 is coplanar with the lower surface of second wafer 306; the first detection assembly 402 detects a first detection point, the second detection assembly 403 detects a second detection point, and when the detection assembly detects that the first detection point or/and the second detection point do not coincide with the preset position, the second motion system 300 adjusts the position of the second wafer 306 by moving the upper motion stage 301 and the upper fine tuning stage 303 until the first detection point and the second detection point both coincide with their respective preset positions; in the process of aligning the first and second inspection points, the in-place inspection system 500 detects the in-place state of the first wafer 204 in real time, and feeds back and adjusts the position of the first wafer 204 in real time until the alignment inspection system 400 detects that the first wafer 204 and the second wafer 306 are aligned, and the in-place inspection system 500 detects that the first wafer 204 is overlapped with the preset first plane position.

Specifically, when the wafer alignment device is located at the transfer station, the first motion system 200 moves the lower motion table 202, and the second motion system 300 moves the upper motion table 301, so that the positions of the lower motion table 202 and the upper motion table 301 in the third direction do not have an overlapping region, thereby avoiding interference between the upper motion table 301 and the lower motion table 202 during the transfer process.

To sum up, the wafer aligning device of the utility model combines the adjustment precision grading of the motion table and the matching application of the optical lens of the detection system to feed back the alignment state in real time, thereby improving the alignment precision between the wafers and the in-place precision of the motion platform; meanwhile, the driving systems with different dimensions of the detection system are tiled and separated, so that the mutual influence of the driving systems with different dimensions in adjustment is reduced, the adjustment precision is improved, and the height in the third direction is reduced; in addition, the air floatation guide connection design is utilized, so that the rotation movement at the center of a two-dimensional plane is realized, the alignment precision is favorably improved, the resistance in the movement process is reduced, the driving weight is reduced, and the operation efficiency of the device is improved; and finally, the step type base station design and the arrangement design of the driving device are matched, so that the height of the device is reduced, and the space utilization is optimized.

Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. It will be apparent to those skilled in the art that modifications and variations can be made to the above-described embodiments without departing from the spirit and scope of the invention, and it is intended that all equivalent modifications and variations be covered by the appended claims without departing from the spirit and scope of the invention.

Claims (10)

1. A wafer aligning device, comprising: a base assembly (100), a first motion system (200), a second motion system (300), an alignment detection system (400), and an in-position detection system (500);

the first motion system (200) comprises a lower motion stage (201), a lower motion table (202), a lower air floating assembly and a first wafer (204); the lower motion carrier (201) is fixedly arranged on the base assembly (100); the lower moving table (202) is arranged on the lower moving stage (201) and movably connected with the lower moving stage (201) so as to bear and move the first wafer (204) arranged on the lower moving table (202); the lower air floating assemblies are symmetrically arranged on two sides of the bottom surface of the lower motion table (202) along a first direction;

the second motion system (300) comprises an upper motion platform (301), an upper two-dimensional motion system, an upper fine adjustment platform (303) and a second wafer (306); the upper moving platform (301) is connected with the base assembly (100) in an air floating manner and is arranged above the lower moving carrying platform (201); the upper moving table (301) and the lower moving table (202) are separated by a preset distance in a third direction; the upper two-dimensional motion system is arranged on the upper motion table (301); the upper fine adjustment table (303) is movably arranged on the upper moving table (301), and the second wafer (306) is arranged on the upper fine adjustment table (303);

the alignment detection system (400) comprises a detection assembly, a C-shaped support beam (401) and a three-way motion table; the detection assembly is fixedly arranged on the C-shaped support beam (401); the C-shaped supporting beam (401) is arranged on the three-way moving table; the three-way motion table is arranged on the base component (100);

the in-place detection system (500) comprises a base, an in-place driving module (501) and an in-place detection assembly (502), wherein the in-place detection assembly (502) comprises an optical detection lens (503) which is driven by the in-place driving module (501) to move linearly along a third direction, and the optical detection lens (503) is movably connected with the in-place driving module (501);

the in-place driving module (501) and the in-place detection module (502) are respectively provided with two groups; the two in-place driving modules (501) are symmetrically arranged on two sides of the base along a second direction; each in-place driving module is correspondingly connected with one in-place detection assembly (502); the base is fixedly arranged on the base component (100); the in-place detection system (500) is arranged below the lower motion table (202); at least two in-place marks are preset on the lower surface of the lower motion table (202);

the first direction, the second direction and the third direction are mutually perpendicular in pairs.

2. The wafer alignment device of claim 1, wherein the base assembly (100) further comprises a bottom base (101), a first guide base (102), a second guide base (103), an upper first direction motor stator, an upper first direction in-place sensor; the first guide base (102) and the second guide base (103) are fixed on the bottom base (101) symmetrically along the first direction; the outer side surfaces of the first guide base (102) and the second guide base (103) are respectively provided with a two-stage step comprising a primary step (104) and a secondary step (105), the primary step (104) is provided with the upper first-direction motor stator, and the secondary step (105) is provided with the upper first-direction in-place sensor.

3. The wafer alignment apparatus of claim 1, wherein the first motion system (200) further comprises 3 or more than 3 third downward driving components (205) disposed non-coplanar; the third downward driving component (205) is arranged on the bottom surface of the base component (100) and movably connected with the lower moving carrier (201) through the base component (100).

4. The wafer alignment apparatus of claim 1, wherein the first motion system (200) further comprises a lower first direction motor stator (2031), a lower reach sensor (2033); two sides of the lower moving carrier (201) symmetrical along the first direction are both provided with a second-level step comprising a first-level step and a second-level step, the first-level step is provided with the lower first-direction motor stator (2031), and the second-level step is provided with the lower in-place sensor (2033);

the lower air floatation assembly comprises a lower first-direction motor rotor (2032), a lower plane air floatation module and a lower side surface air floatation module; the first-direction motor rotor (2032) is arranged on the side surface of the lower motion table (202), and the lower plane air floatation module is arranged at the bottom of the lower motion table (202); the bottom surface of the lower plane air floatation module and the top surface of the lower motion carrying platform (201) form an air floatation area; the lower movement carrying platform (201) is arranged in a shape of a Chinese character 'hui', the center of the surface of the lower movement carrying platform is sunk or overhead to form four inner side surfaces, and two inner side surfaces symmetrical along the first direction are respectively a first inner side surface and a second inner side surface; the downside air supporting module set up in first medial surface with the second medial surface, first medial surface with downside air supporting module a side forms first air supporting district, the second medial surface with downside air supporting module another side forms second air supporting district.

5. The wafer aligning device of claim 4, wherein the first air bearing is disposed in the first air floating zone, and the second air bearing is disposed in the second air floating zone;

the lower first air bearing is a spherical air bearing, and the lower second air bearing is a planar air bearing with a piston;

or the lower first air bearing is a planar air bearing with a piston, and the lower second air bearing is a spherical air bearing;

the first and second air bearings cooperate to limit movement of the lower motion stage (202) in the first direction.

6. The wafer alignment device of claim 2, wherein the upper two-dimensional motion system further comprises an upper first-direction motion module;

the upper first direction movement module comprises a plurality of upper first direction guide block groups, an upper second direction air floatation first plate (3021) and an upper second direction air floatation second plate (3022);

the upper second direction air-floating first plate (3021) and the upper second direction air-floating second plate (3022) are symmetrically arranged on the upper moving stage (301) along the second direction; each of the upper first direction guide block groups includes two upper first direction guide blocks (3023), two upper first direction guide blocks (3023) of each of the upper first direction guide block groups are symmetrically fixed to the bottom of the upper second direction air floating first plate (3021) or/and the bottom of the upper second direction air floating second plate (3022) in the first direction, and are respectively erected on the first guide base (102) and the second guide base (103) to restrict the upper moving table (301) from moving in the first direction.

7. The wafer alignment device of claim 6, wherein the upper two-dimensional motion system further comprises an upper second direction motion module; the upper second direction movement module comprises an upper second direction driving piece, a bearing, a wedge-shaped seat and an elastic piece;

the upper second direction driving piece, the bearing, the wedge-shaped seat and the elastic piece are arranged in two groups, and the two groups are symmetrically arranged on the upper moving table (301) along the second direction; the two groups of upper second direction driving pieces are respectively fixed on the upper second direction air floatation first plate (3021) and the upper second direction air floatation second plate (3022);

the upper second direction driving piece is connected with the upper motion table (301) through the wedge-shaped seat and the bearing which are mutually clamped as movable connecting pieces; the elastic piece is connected with the wedge-shaped seat and the bearing.

8. The wafer alignment apparatus as claimed in claim 1, wherein the second motion system (300) further comprises a first fine adjustment driver (3041), a second fine adjustment driver (3042); at least one group of first fine adjustment drivers (3041) are respectively arranged on two symmetrical sides of the upper fine adjustment table (303) along the second direction so as to drive the upper fine adjustment table (303) to linearly move along the first direction; and two sides of the upper fine adjustment platform (303) symmetrical along the first direction are respectively provided with a group of second fine adjustment drivers (3042).

9. The wafer aligning apparatus according to claim 1, wherein the detecting elements of the alignment detecting system (400) comprise a set of first detecting elements (402) and a set of second detecting elements (403), each set of the first detecting elements (402) and the second detecting elements (403) having at least two detecting elements; the first detection assembly (402) is arranged at the lower arm of the C-shaped support beam (401), and the second detection assembly (403) is arranged at the upper arm of the C-shaped support beam (401);

the lower surface of the first wafer (204) is provided with a first detection point, the upper surface of the second wafer (306) is provided with a second detection point, the first detection component (402) is used for detecting the first detection point, and the second detection component (403) is used for detecting the second detection point.

10. The wafer alignment device of claim 2, wherein the three-way motion stage comprises an air floating detection base, a first motion detection assembly (404), a second motion detection assembly (405), and a third motion detection assembly (406); an air floatation area is formed between the detection air floatation base and the bottom base (101); the first detection movement assembly (404) is connected with the air floating detection base and drives the air floating detection base to move along the first direction; the second detection movement assembly (405) is connected with the air floating detection base and drives the air floating detection base to move along the second direction; the third motion detection assembly (406) is connected with the detection assembly and drives the detection assembly to move along the third direction.

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