CN218548376U - Wafer detection device with circumference location structure - Google Patents
Wafer detection device with circumference location structure Download PDFInfo
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- CN218548376U CN218548376U CN202222654774.9U CN202222654774U CN218548376U CN 218548376 U CN218548376 U CN 218548376U CN 202222654774 U CN202222654774 U CN 202222654774U CN 218548376 U CN218548376 U CN 218548376U
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- 238000013519 translation Methods 0.000 claims abstract description 91
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- 238000007689 inspection Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 238000001259 photo etching Methods 0.000 abstract description 5
- 238000012360 testing method Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 104
- 238000012876 topography Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
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- 230000003044 adaptive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002153 concerted effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
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- 230000005484 gravity Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
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Abstract
The utility model provides a wafer detection device with circumference location structure, place subassembly and wafer sensing subassembly including supporting assembly subassembly, wafer, the wafer is placed the subassembly and is passed through motion and install on supporting assembly subassembly, and motion includes horizontal translation subassembly and circumference rotation subassembly, and the wafer is placed the unit mount on the circumference rotation subassembly, and portability wafer together carries out lateral shifting and rotation in a circumferential direction along with the circumference rotation subassembly. This wafer detection device's place the microscope carrier and open and establish and keep away a port, form circumference location structure, make the wafer edge can arrange in and place on the microscope carrier, drive the wafer and carry out lateral shifting and carry out the rotation in a circumferential direction simultaneously, form the helical scan route, reduce the deformation that the wafer formed because of the edge hangs down in the scanning process, promote the stability and the precision of testing process, the unqualified wafer is rejected to the accuracy, reduce the influence of unqualified wafer to the photoetching process, promote integrated circuit chip's yield.
Description
Technical Field
The utility model relates to an integrated circuit production facility especially relates to a wafer detection device with circumference location structure.
Background
The wafer is a basic material for processing the integrated circuit chip, the influence of the difference of the warpage, the flatness and the surface topography on the integrated circuit photoetching process is very obvious, along with the progress of the manufacturing process, an adopted photoetching optical system has smaller focal depth, the tolerance requirements on the flatness and the topography change of the wafer are very strict, and the fine difference of the wafer flatness can consume higher energy consumption, so that detection equipment is required to be used for detecting the wafer to obtain the warpage, the flatness and the topography distribution information of the wafer so as to remove unqualified wafers.
CN 20212069677.6 discloses a wafer inspection platform, which includes a supporting assembly component, a horizontal moving component, a vertical moving component, an adsorbing and rotating component, and a distance inspection component, and calculates a flatness index of a wafer by converting a distance of the wafer into indexes such as a thickness and a height through a capacitive distance sensor. This testing platform adopts the bearing frame that plate and stand are constituteed, its structural accuracy is not good, take place easily after long-time operation and warp, and simultaneously, this testing platform's wafer bearing member adopts unipolar sucking disc bearing structure, because the support area is less, the wafer edge can hang down under the action of gravity, cause wafer surface flatness and angularity different, influence the stability and the detection precision of testing process, can't accurately reject unqualified wafer, and then influence the energy consumption of follow-up photoetching process and integrated circuit chip's yield. Therefore, it is necessary to optimize the structure of the wafer inspection apparatus to overcome the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wafer detection device with circumference location structure to promote the stability and the precision that the wafer detected.
The utility model discloses a solve the technical scheme that its technical problem adopted and be:
a wafer detection device with a circumferential positioning structure comprises:
a bearing assembly having an installation space thereon;
the wafer placing assembly is arranged on the supporting assembly through the moving mechanism and can move on the supporting assembly through the moving mechanism, a wafer accommodating space is formed in the wafer placing assembly, and the wafer placing assembly positions a wafer to be detected and carries the wafer to move together;
the wafer sensing assembly is arranged on the supporting assembly and corresponds to the wafer placing assembly in position, and the wafer sensing assembly detects the wafer on the wafer placing assembly;
wherein, motion includes:
a lateral translation assembly mounted on the support assembly and movable laterally thereon;
the wafer placing component is arranged on the circumferential rotating component and can carry out transverse movement and circumferential rotation together with the circumferential rotating component, so that the wafer sensing component forms a spiral scanning path on the wafer.
Specifically, the lateral translation assembly comprises:
the translation bottom plate is fixedly installed on the support assembly component in a translation mode, two ends of the translation bottom plate are respectively provided with limiting convex edges, the limiting convex edges are parallel to each other and protrude towards the upper portion of the translation bottom plate, and limiting notches are formed among the limiting convex edges;
the translation top plate is positioned above the translation bottom plate, the middle part of the translation top plate is provided with a limiting boss, the limiting boss protrudes towards the lower part of the translation top plate, and the width of the limiting boss is smaller than the distance between the limiting convex ridges, so that the limiting boss can extend into the limiting groove;
the cross guide rails are provided with a pair of cross guide rails, and each cross guide rail is respectively arranged between the lug bosses of the limiting convex edges so that the translation top plate can move on the translation bottom plate through the cross guide rails;
the translation linear motor is a U-shaped groove type linear motor, a stator component of the translation linear motor is fixedly arranged on the bearing assembly component, a rotor component of the translation linear motor is fixedly arranged on the translation top plate, and the stator component drives the rotor component and the transverse translation component to move when being electrified.
The U-shaped groove type linear motor is provided with two parallel magnetic tracks which are arranged between metal plates and are opposite to a coil rotor, and the rotor is supported between the two magnetic tracks by a guide rail system.
The circumferential direction rotation assembly includes:
the rotary linear motor is an arc linear motor, a stator part of the rotary linear motor is fixedly arranged on the transverse translation assembly, a rotor part of the rotary linear motor is arranged on the transverse translation assembly through a crossed roller collar, and the stator part drives the rotor part to rotate on the transverse translation assembly when being electrified.
The wafer placing component comprises:
the wafer sensing assembly corresponds to the position of the avoiding through hole and can sense the wafer.
The wafer sensing assembly comprises:
and the sensing probes are provided with a pair of sensing probes, each sensing probe is respectively arranged on the supporting assembly component and is respectively arranged on the upper side and the lower side of the wafer placing component, and the sensing probes sense the wafers on the wafer placing component.
The support assembly includes:
the wafer placing assembly is arranged above the supporting platform, a pair of supporting upright columns are arranged at the top of the supporting platform, the supporting upright columns respectively protrude above the supporting platform, the tops of the supporting upright columns are connected through a supporting cross beam, the supporting cross beam is arranged above the wafer placing assembly, and the wafer sensing assembly is arranged at the top of the supporting platform and the bottom of the supporting cross beam.
The utility model has the advantages of:
the placing platform of the wafer detection device is provided with a avoiding opening to form a circumferential positioning structure, so that the edge of a wafer can be placed on the placing platform, the middle part of the wafer is exposed out of the avoiding opening, a wafer sensing assembly corresponds to the avoiding opening in position and can sense the wafer, a avoiding opening is formed in the edge of the avoiding opening, so that the detection starting point part of the edge of the wafer is exposed out of the avoiding opening, for adapting to the structure of the placing platform, a circumferential rotating assembly is formed by adopting a rotating linear motor and drives the placing platform to rotate, an installation space is reserved for a sensing probe, and the wafer is driven to move transversely and simultaneously and circumferentially rotate by combining a transverse translation assembly formed by a translation bottom plate, a translation top plate, a cross guide rail and a translation linear motor to form a spiral scanning path, so that the deformation of the wafer due to edge plumpness in the scanning process is reduced, the stability and the precision of the detection process are improved, unqualified wafers are accurately removed, the influence of the wafer on the photoetching process is reduced, and the yield of integrated circuit chips is improved.
Drawings
Fig. 1 is a schematic structural diagram of a wafer inspection apparatus provided in the present invention;
FIG. 2 is a schematic structural view of the support assembly;
FIG. 3 is a schematic structural view of a lateral translation assembly;
FIG. 4 is a schematic view of a circumferential rotation assembly;
FIG. 5 is a schematic view of a spiral scan path of a wafer.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention will be combined below to clearly and completely describe the technical solution in the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
As shown in fig. 1-4, the utility model provides a wafer detection device with circumference location structure includes supporting assembly component, subassembly and wafer sensing subassembly are place to the wafer, the last installation space that has of supporting assembly component, the subassembly is placed to the wafer and is installed on supporting assembly component through the motion mechanism, accessible motion mechanism moves on supporting assembly component, wafer accommodation space has in the subassembly is placed to the wafer, place the subassembly by the wafer and treat that detect the wafer and fix a position, and carry its concerted movement, wafer sensing subassembly is installed on supporting assembly component, and place the subassembly position with the wafer and correspond, place the wafer on the subassembly by the wafer sensing subassembly to the wafer and detect; the movement mechanism comprises a transverse translation assembly and a circumferential rotation assembly, the transverse translation assembly is arranged on the supporting assembly and can move transversely on the supporting assembly, the circumferential rotation assembly is arranged on the transverse translation assembly and can move transversely along with the transverse translation assembly and can rotate circumferentially on the transverse translation assembly, and the wafer placing assembly is arranged on the circumferential rotation assembly and can carry out transverse movement and circumferential rotation along with the circumferential rotation assembly, so that the wafer sensing assembly forms a spiral scanning path on the wafer as shown in figure 5.
In embodiment 1, the supporting assembly includes a supporting platform 110, the supporting platform is disposed along a transverse direction, the wafer placing assembly is located above the supporting platform, a pair of supporting columns 120 is disposed on the top of the supporting platform, each supporting column protrudes above the supporting platform, the top of the supporting column is connected through a supporting beam, the supporting beam is located above the wafer placing assembly, and the wafer sensing assemblies are mounted on the top of the supporting platform and the bottom of the supporting beam. The wafer placing component comprises a placing carrier 200 which is fixedly arranged on the circumferential rotating component, wherein a avoiding port is formed in the middle of the placing carrier, the edge of the wafer is arranged on the placing carrier, and the middle of the wafer is exposed out of the avoiding port. The wafer sensing assembly comprises a pair of sensing probes 300, each sensing probe is respectively mounted on the supporting assembly and is respectively arranged at the upper side and the lower side of the wafer placing assembly, and the sensing probes sense the wafer on the wafer placing assembly.
The horizontal translation assembly comprises a translation bottom plate 410, a translation top plate 420, cross guide rails 430 and a translation linear motor 440, translation is fixedly installed on the bearing assembly, two ends of the translation are respectively provided with limiting convex ribs 411 which are parallel to each other and protrude above the translation bottom plate, limiting notches are formed between the limiting convex ribs, the translation top plate is located above the translation bottom plate, the middle of the translation is provided with a limiting boss 421 which protrudes below the translation top plate, the width of the limiting boss is smaller than the distance between the limiting convex ribs, the limiting bosses can be inserted into the limiting notches, the cross guide rails are provided with a pair, the cross guide rails are respectively installed between the limiting convex rib bosses, the translation top plate can move on the translation bottom plate through the cross guide rails, a stator part of the translation top plate is fixedly installed on the bearing assembly, a rotor part of the translation top plate is fixedly installed on the translation top plate, and the stator part can drive the rotor part and the horizontal translation assembly to move when the stator part is electrified. The circumferential rotating assembly comprises a rotating linear motor 500 which is an arc linear motor, a stator part of the rotating linear motor is fixedly arranged on the transverse translation assembly, a rotor part of the rotating linear motor is arranged on the transverse translation assembly through a crossed roller collar, and the stator part drives the rotor part to rotate on the transverse translation assembly when being electrified.
In example 2, the support assembly includes a support platform 110, which is arranged along a transverse direction, and a wafer placing assembly is located above the support platform, and a pair of support columns 120 are provided on the top of the support platform, each of which protrudes above the support platform, and the tops of which are connected by a support beam 130. The supporting platform, the supporting upright post and the supporting cross beam are all made of marble, the Shore hardness is more than HS70, the wear resistance is strong, and the compressive strength is 245-254 kg/mm 2 The elastic modulus is 1.27-1.47N-mm 2 Has less deformation, stable precision and linear expansion coefficient of 4.6 x 10 -6 The temperature per DEG C is less influenced by the temperature change of the use environment, is not influenced by moisture, and has the advantages of no rustiness, corrosion resistance, friction resistance, high stability and the like.
The transverse translation assembly comprises a translation bottom plate 410, a translation top plate 420, cross guide rails 430 and a translation linear motor 440, wherein the translation bottom plate is fixedly installed at the top of a supporting platform, two ends of the translation bottom plate are respectively provided with limiting convex edges 411 which are parallel to each other and protrude towards the upper side of the translation bottom plate, limiting notches are formed between the limiting convex edges, the translation top plate is located above the translation bottom plate, the middle part of the translation bottom plate is provided with limiting bosses 421 which protrude towards the lower side of the translation top plate, the width of the limiting bosses is smaller than the distance between the limiting convex edges, the limiting bosses can be inserted into the limiting notches, the cross guide rails are provided with a pair, each cross guide rail is respectively installed between the limiting convex edge bosses, the translation top plate can move on the translation bottom plate through the cross guide rails, the translation linear motor is a U-shaped groove linear motor, a stator part of the translation linear motor is fixedly installed at the top of the supporting platform, a stator part is fixedly installed on the translation top plate, the stator part and the translation top plate can drive the stator part and the translation top plate to move when the stator part is powered on, the U-shaped groove linear motor is provided with two parallel magnetic rails, the two magnetic rails which are opposite to the coil rotors, and the rotors are supported by a guide rail system.
The circumferential rotating assembly comprises a rotating linear motor 500 which is an arc linear motor, a stator component of the rotating linear motor is fixedly arranged on the translation top plate, a rotor component of the rotating linear motor is arranged on the translation top plate through a crossed roller collar, and the stator component drives the rotor component to rotate on the translation top plate when being electrified.
The wafer placing assembly comprises a placing carrier 200, the placing carrier is fixedly installed on a rotor component of the rotary linear motor, a avoiding position through hole 210 is formed in the middle of the placing carrier, the avoiding position through hole penetrates through the upper end and the lower end of the placing carrier, the edge of a wafer is arranged at the top of the placing carrier, and the middle of the wafer is exposed out of the avoiding position through hole.
The wafer sensing assembly comprises a pair of sensing probes 300, each sensing probe is respectively installed at the top of the supporting platform and the bottom of the supporting beam and respectively arranged at the upper side and the lower side of the clearance opening of the placing platform deck, the sensing probes sense wafers on the placing platform deck oppositely, and the structure and the working principle of the sensing probes are the prior art and are not detailed.
The edge of the avoiding port is further provided with a avoiding notch 220, the detection starting point position of the edge of the wafer can be exposed out of the avoiding notch, and the sensing probe starts to scan and detect the wafer from the detection starting point position to form a spiral scanning path.
Place the microscope carrier top and seted up and put the notch, should get the notch and extend to keeping away position logical mouth department from placing the microscope carrier outer wall, when the manipulator was placed the wafer on placing the microscope carrier, can pass through in getting the notch, avoid taking place to interfere with placing the microscope carrier.
During detection, a wafer is placed on the placing platform by the manipulator, 4-6 air holes are formed in the placing platform, the wafer is adsorbed and positioned, an overlapping part of about 4mm is formed between the edge of the wafer and the placing platform, the specific quantity and size can be changed according to requirements, at the moment, the translation linear motor operates to drive the translation top plate and the placing platform to move to the position of the sensing probe, the sensing probe points to the detection starting point of the edge of the wafer, the rotation linear motor operates to drive the placing platform and the wafer to rotate, meanwhile, the translation linear motor drives the placing platform and the wafer to transversely translate, the distance between the sensing probe and the center of the wafer is gradually reduced, and a spiral scanning path as shown in fig. 5 is formed.
The placing platform of the wafer detection device is provided with a avoiding opening to form a circumferential positioning structure, so that the edge of a wafer can be placed on the placing platform, the middle of the wafer is exposed from the avoiding opening, the wafer sensing assembly corresponds to the avoiding opening in position and can sense the wafer, the edge of the avoiding opening is provided with a avoiding opening, so that the detection starting point of the edge of the wafer is exposed from the avoiding opening, and the wafer detection device is adaptive to the structure of the placing platform.
In the description of the present invention, it should be noted that when the terms of the directions or the positional relationships indicated by "upper", "lower", "inner", "outer", "left", "right", etc. appear, it should be understood that the directions or the positional relationships shown in the drawings, or the directions or the positional relationships that the products of the present invention are usually placed when used, or the directions or the positional relationships that the skilled person usually understand are only for the convenience of describing the present invention and simplifying the description, but not for indicating or suggesting that the indicated devices or elements must have a specific direction, be constructed and operated in a specific direction, and therefore, should not be construed as limiting the present invention. Furthermore, the appearances of the terms first, second, etc. are only used for distinguishing between the descriptions and not necessarily for indicating or implying relative importance. In the description of the present invention, it should be further noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Claims (6)
1. A wafer detection device with a circumferential positioning structure comprises:
a bearing assembly having an installation space thereon;
the wafer placing assembly is arranged on the supporting assembly through the moving mechanism, and a wafer accommodating space is formed in the wafer placing assembly;
the wafer sensing assembly is arranged on the supporting assembly and corresponds to the wafer placing assembly in position;
the motion mechanism includes:
a lateral translation assembly mounted on the support assembly;
the circumferential rotating assembly is arranged on the transverse translation assembly, and the wafer placing assembly is arranged on the circumferential rotating assembly;
the wafer placing assembly is characterized by comprising:
the placing carrying platform is fixedly arranged on the circumferential rotating assembly, a avoiding opening is formed in the middle of the placing carrying platform, and the wafer sensing assembly corresponds to the avoiding opening in position.
2. The apparatus of claim 1, wherein the lateral translation assembly comprises:
the translation bottom plate is fixedly arranged on the support assembly component in a translation manner, two ends of the translation bottom plate are respectively provided with limiting convex edges which are parallel to each other and protrude towards the upper part of the translation bottom plate, and limiting notches are formed among the limiting convex edges;
the translation top plate is positioned above the translation bottom plate, the middle part of the translation top plate is provided with a limiting boss, the limiting boss protrudes towards the lower part of the translation top plate, and the width of the limiting boss is smaller than the distance between the limiting convex edges;
the cross guide rails are provided with a pair of cross guide rails, and each cross guide rail is respectively arranged between the limit convex rib bosses;
and a stator component of the translation linear motor is fixedly arranged on the bearing assembly component, and a rotor component of the translation linear motor is fixedly arranged on the translation top plate.
3. The wafer inspection apparatus with circumferential positioning structure as claimed in claim 1, wherein the circumferential rotation assembly comprises:
the rotary linear motor is an arc linear motor, a stator component of the rotary linear motor is fixedly arranged on the transverse translation assembly, and a rotor component of the rotary linear motor is arranged on the transverse translation assembly through a crossed roller shaft collar.
4. The apparatus as claimed in claim 1, wherein the wafer sensing assembly comprises:
and the sensing probes are provided with a pair of sensing probes, and each sensing probe is respectively arranged on the supporting assembly component and is respectively arranged at the upper side and the lower side of the wafer placing component.
5. The wafer inspection device with circumferential positioning structure as claimed in claim 1, wherein the support assembly comprises:
the wafer placing assembly is arranged above the supporting platform, a pair of supporting upright columns are arranged at the top of the supporting platform, the supporting upright columns respectively protrude above the supporting platform, the tops of the supporting upright columns are connected through a supporting cross beam, the supporting cross beam is arranged above the wafer placing assembly, and the wafer sensing assembly is arranged at the top of the supporting platform and the bottom of the supporting cross beam.
6. The wafer inspection apparatus with circumferential positioning structure as recited in claim 1, wherein:
and a avoiding notch is also formed in the edge of the avoiding through hole, and the detection starting point part of the edge of the wafer can be exposed from the avoiding notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222654774.9U CN218548376U (en) | 2022-10-09 | 2022-10-09 | Wafer detection device with circumference location structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222654774.9U CN218548376U (en) | 2022-10-09 | 2022-10-09 | Wafer detection device with circumference location structure |
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| CN218548376U true CN218548376U (en) | 2023-02-28 |
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| CN202222654774.9U Active CN218548376U (en) | 2022-10-09 | 2022-10-09 | Wafer detection device with circumference location structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913797A (en) * | 2023-07-14 | 2023-10-20 | 无锡九霄科技有限公司 | Wafer bonding quality detection device |
-
2022
- 2022-10-09 CN CN202222654774.9U patent/CN218548376U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913797A (en) * | 2023-07-14 | 2023-10-20 | 无锡九霄科技有限公司 | Wafer bonding quality detection device |
| CN116913797B (en) * | 2023-07-14 | 2024-02-13 | 无锡九霄科技有限公司 | Wafer bonding quality detection device |
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Denomination of utility model: A wafer detection device with circumferential positioning structure Effective date of registration: 20231012 Granted publication date: 20230228 Pledgee: Zhejiang Jiashan rural commercial bank Limited by Share Ltd. science and technology sub branch Pledgor: Jiaxing Weituo Electronic Technology Co.,Ltd. Registration number: Y2023980060718 |