CN218547883U

CN218547883U - LED display module and LED display screen

Info

Publication number: CN218547883U
Application number: CN202222782519.2U
Authority: CN
Inventors: 孙天鹏; 张金刚
Original assignee: Shenzhen Zhouming Technology Co Ltd
Current assignee: Shenzhen Zhouming Technology Co Ltd
Priority date: 2022-10-21
Filing date: 2022-10-21
Publication date: 2023-02-28
Anticipated expiration: 2032-10-21

Abstract

The utility model discloses a LED display module assembly and LED display screen belongs to display screen technical field. The LED display module comprises a PCB, an LED light-emitting chip fixed through a bonding pad is assembled on the upper surface of the PCB, the upper surface of the PCB is covered with a first glue layer, a first ink layer is arranged on the first glue layer, a second glue layer is arranged on the first ink layer, a second ink layer is arranged on the second glue layer, the first ink layer and the second ink layer cover the region except the LED light-emitting chip, the first glue layer covers the bonding pad and is parallel and level to the lower end face of the LED light-emitting chip, and the upper end face of the first ink layer is parallel and level to the upper end face of the LED light-emitting chip. Through the setting on two-layer printing ink layer first printing ink layer and second printing ink layer, effectively improve LED display module's contrast, the up end on first printing ink layer and the up end parallel and level of LED luminescence chip prevent the cluster light between the adjacent LED luminescence chip and make PCB board black color be the uniformity, solve the LED luminescence chip of LED display module's the colour difference between the chip to realize the angle uniformity.

Description

LED display module and LED display screen

Technical Field

The utility model relates to a display screen technical field, more specifically say, it relates to a LED display module assembly and LED display screen.

Background

With the continuous development of the LED display technology, the display effect of the LED display screen is rapidly improved, and the pixel pitch and the display effect are greatly improved. With the coming of the 5G era, the popularization of the Internet of things and artificial intelligence is taken as an interactive important information display window, and the LED display screen is further widely applied due to the technical advantages of seamless splicing and large-screen display. In the field of indoor small-pitch, LED displays are moving toward higher definition and more perfect image quality. At present, the small-distance display in the LED room starts from the original product with the distance of more than P1.0, and develops into the product with the distance of less than P1.0, and the display definition is greatly improved. The product with the distance below P1.0 mainly adopts Mini-LED display technology. The technology in the field is divided into surface mounting technology SMD products and Mini-LED COB display products integrally packaged by PCB.

The Mini-LED COB display screen is characterized in that a flip LED chip is adopted as a chip, the size of the chip is smaller than 300 micrometers on two sides of the chip, and a PCB substrate is adopted as a display product for integrally packaging display carrier plates. Along with the reduction of the distance, the Mini-LED COB display product has better advantages in the aspects of reliability, manufacturing cost and display effect, and becomes the most explosive technology in the industry at the present stage.

Because of the difference of the ink color of the PCB substrate and the tin white color of the pad after windowing and welding, the consistency difference of the ink color finally appears in the display module, and the contrast ratio is greatly reduced. In order to solve the problem, the problem is solved by coating ink with a certain thickness on the bottom of a chip and a PCB in the prior industry, and although the problem of PCB ink color consistency can be well solved, climbing at different heights is formed on the side wall of the chip due to the liquid tension problem of black coating, and finally the consistency of the light emitting angle of a display module is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a LED display module assembly and LED display screen can ensure the uniformity and the high contrast effect of china ink color, improves the uniformity and the piece bright color line problem at visual angle simultaneously.

The above technical purpose of the present invention can be achieved by the following technical solutions:

according to an aspect of the utility model, a LED display module assembly is provided, including the PCB board, the upper surface of PCB is equipped with the LED luminescence chip of fixing through the pad, the upper surface of PCB board covers there is first glue film, be equipped with first printing ink layer on the first glue film, be equipped with the second glue film on the first printing ink layer, be equipped with second printing ink layer on the second glue film, first printing ink layer with second printing ink layer covers except that the region outside the LED luminescence chip, first glue film covers the pad and with the lower terminal surface parallel and level of LED luminescence chip, the up end on first printing ink layer with the up end parallel and level of LED luminescence chip.

Preferably, the central position of the coverage area of the second ink layer is vertically aligned with the central position of the coverage area of the first ink layer, and the coverage area of the second ink layer is smaller than the coverage area of the first ink layer.

Preferably, an included angle between a connecting line between the edge of the second ink layer located between the adjacent LED light emitting chips and the edge of the first ink layer located between the adjacent LED light emitting chips and the vertical direction is greater than or equal to 30 ° and less than or equal to 90 °.

Preferably, the first ink layer and/or the second ink layer is/are formed by using epoxy ink or acrylic ink; and/or the first ink layer and/or the second ink layer are ink layers formed by ink with OD value larger than 1.

Preferably, a third glue layer is arranged on the second ink layer.

Preferably, a third ink layer is arranged on the third adhesive layer.

Preferably, a fourth glue layer is arranged on the third ink layer.

As further optimization, the coverage center position of the third ink layer is vertically aligned with the coverage center position of the second ink layer, the coverage of the third ink layer is smaller than that of the second ink layer, the third ink layer is located adjacent to the edge of the part between the LED light-emitting chips, and the second ink layer is located adjacent to the connecting line of the edge of the part between the LED light-emitting chips and the included angle of the vertical direction are in the range of more than or equal to 30 degrees and less than or equal to 90 degrees.

As a further optimization, the thickness of the first glue layer and/or the second glue layer is 10 microns to 150 microns; and/or the first adhesive layer and/or the second adhesive layer are adhesive layers formed by epoxy resin or silica gel; and/or the first adhesive layer and/or the second adhesive layer are transparent adhesive layers or semitransparent adhesive layers.

According to another aspect of the present invention, a LED display screen is provided, which includes the LED display module as described above.

To sum up, the utility model discloses following beneficial effect has: through the setting on two-layer printing ink layer first printing ink layer and second printing ink layer, effectively improve LED display module's contrast, the up end on first printing ink layer and the up end parallel and level of the luminous chip of LED prevent the cluster light between the luminous chip of adjacent LED and make PCB board china ink be the uniformity, solve the colour difference between the luminous chip of LED display module's LED to realize the angle uniformity, and the implementation is simple, and the preparation is efficient.

Drawings

Fig. 1 is a schematic cross-sectional view of an LED display module according to a first embodiment;

fig. 2 is a schematic cross-sectional view of an LED display module according to a second embodiment.

In the figure: 1. a PCB board; 2. a driver IC; 3. an LED light emitting chip; 4. a bonding pad; 5. a first adhesive layer; 6. a first ink layer; 7. a second adhesive layer; 8. a second ink layer; 80. a second ink layer; 90. a third adhesive layer; 100. a third ink layer; 200. and a fourth adhesive layer.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects of the present invention to be solved clearer and more obvious, the present invention is further explained in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. The description of the orientations such as "left", "right", "upper", "lower", "X-axis", "Y-axis" in the claims, the specification and the drawings is only the orientation with reference to the drawings, the orientation has relativity, the difference of the reference objects can lead to the difference of the orientations, and the orientation description in the present application is only for the understanding of the scheme, and is not taken as the limitation of the actual orientation and the scheme.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example one

As shown in fig. 1, the present embodiment discloses an LED display module, which includes a PCB board 1, a driving IC2 mounted on a lower surface of the PCB board 1, an LED light emitting chip 3 mounted on an upper surface of the PCB board 1, and the LED light emitting chip 3 fixed by a bonding pad 4. The number of the LED light emitting chips 3 is multiple, and adjacent LED light emitting chips 3 are arranged at intervals. The upper surface of the PCB board 1 is covered with a first adhesive layer 5, the first adhesive layer 5 is provided with a first ink layer 6, the first ink layer 6 is provided with a second adhesive layer 7, and the second adhesive layer 7 is provided with a second ink layer 8. First glue film 5 covers pad 4 and with the lower terminal surface parallel and level of LED luminescence chip 3, the up end of first printing ink layer 6 and the up end parallel and level of LED luminescence chip 3. The first ink layer 6 and the second ink layer 8 both cover the other areas outside the LED light-emitting chip 3. Through the setting of two-layer printing ink layer 6 and second printing ink layer 8 promptly, effectively improve LED display module's contrast, the up end of first printing ink layer 6 and the up end parallel and level of LED luminescence chip 3, prevent the light string between the adjacent LED luminescence chip 3 and make PCB board 1 black color be the uniformity, the LED luminescence chip 3 of solving LED display module is between the colour difference, and realize the angle uniformity, and the realization mode is simple, and the efficiency of manufacture is high.

As shown in fig. 1, the first glue layer 5 may be a glue layer formed of epoxy or glue or other conventional encapsulation glue. The thickness of the first glue layer 5 is preferably in the range of greater than or equal to 10 micrometers and less than or equal to 150 micrometers. The first ink layer 6 can be realized by spray printing, and is close to the edge of the LED light-emitting chip 3 as much as possible. The first ink layer 6 may be an ink layer formed of epoxy ink or acrylic ink or other ink material. First ink layer 6 is preferably an ink layer formed using an ink having an OD (optical density) value of more than 1. The second glue layer 7 may be a glue layer formed by epoxy or glue layer or other conventional encapsulation glue. The thickness of the second glue layer 7 is preferably in the range of greater than or equal to 10 micrometers and less than or equal to 150 micrometers.

As shown in fig. 1, the center of the coverage area of the second ink layer 8 is vertically aligned with the center of the coverage area of the first ink layer 6, and the coverage area of the second ink layer 8 is smaller than the coverage area of the first ink layer 6. The center of coverage in this application may be exemplified by the second ink layer 8 and/or the first ink layer 6 in the portion between the adjacent LED light emitting chips 3. In a preferred embodiment, an included angle between a line connecting an edge of the second ink layer 8 between the adjacent LED light emitting chips 3 and an edge of the first ink layer 6 between the adjacent LED light emitting chips 3 and a vertical direction is in a range of 30 ° or more and 90 ° or less. The second ink layer 8 may be an ink layer formed of epoxy ink or acrylic ink or other ink material. Second ink layer 8 is preferably an ink layer formed using an ink having an OD (optical density) value of more than 1. The second ink layer 8 may be realized by inkjet printing.

Example two

The difference between this embodiment and the first embodiment is: as shown in fig. 2, a third adhesive layer 90 is disposed on the second ink layer 80, and the third adhesive layer 90 may be an adhesive layer formed by epoxy resin, an adhesive layer, or other conventional encapsulation adhesives. The thickness of the third glue layer 90 is preferably in the range of greater than or equal to 10 micrometers and less than or equal to 150 micrometers.

As shown in fig. 2, a third ink layer 100 is disposed on the third adhesive layer 90, a central position of a coverage area of the third ink layer 100 is vertically aligned with a central position of a coverage area of the second ink layer 80 and a central position of a coverage area of the first ink layer 60, and a coverage area of the third ink layer 100 is smaller than a coverage area of the second ink layer 80. In a preferred embodiment, an included angle between a line connecting an edge of the third ink layer 100 between the LED light emitting chips and an edge of the second ink layer 80 between the adjacent LED light emitting chips and a vertical direction is greater than or equal to 30 ° and less than or equal to 90 °. The third ink layer 100 may be an ink layer formed of epoxy ink or acrylic ink or other ink materials. Third ink layer 100 is preferably an ink layer formed using an ink having an OD (optical density) value greater than 1. The third ink layer 100 may be realized by inkjet printing.

As shown in fig. 2, a fourth glue layer 200 is disposed on the third ink layer 100, and the ink layer has a window, and a glue layer is disposed thereon to ensure the appearance of the finished product. The fourth glue layer 200 may be a glue layer formed of epoxy or glue or other conventional encapsulation glue. The thickness of the fourth glue layer 200 is preferably in the range of greater than or equal to 10 micrometers and less than or equal to 150 micrometers.

EXAMPLE III

The embodiment discloses an LED display screen, which can be an LED display module in the first embodiment, as shown in FIG. 1, the LED display module comprises a PCB (printed Circuit Board) 1, a driving IC2 is assembled on the lower surface of the PCB 1, an LED light-emitting chip 3 is assembled on the upper surface of the PCB 1, and the LED light-emitting chip 3 is fixed through a bonding pad 4. The number of the LED light emitting chips 3 is plural, and the plurality of LED light emitting chips 3 are arranged at intervals. The upper surface of the PCB board 1 is covered with a first adhesive layer 5, the first adhesive layer 5 is provided with a first ink layer 6, the first ink layer 6 is provided with a second adhesive layer 7, and the second adhesive layer 7 is provided with a second ink layer 8. First glue film 5 covers pad 4 and with the lower terminal surface parallel and level of LED luminescence chip 3, first printing ink layer 6 and the up end parallel and level of LED luminescence chip 3. The first ink layer 6 and the second ink layer 8 both cover the other areas outside the LED light-emitting chip 3. Through the setting on two-layer printing ink layer first printing ink layer 6 and second printing ink layer 8 promptly, effectively improve LED display module's contrast, first printing ink layer 6 and the up end parallel and level of LED luminescence chip 3 prevent the cluster light between the LED luminescence chip 3 and make 1 china ink of PCB board be the uniformity, solve the LED of LED display module and send out the colour difference between the chip 3 to realize the angle uniformity, and the realization is simple, and the preparation efficiency is high.

The LED display screen may also include the LED display module in the second embodiment, as shown in fig. 2, a third glue layer 90 is disposed on the second ink layer 80, a third glue layer 100 is disposed on the third glue layer 90, a fourth glue layer 200 is disposed on the third glue layer 100, the ink layers have windows, and the glue layers are disposed thereon to ensure the appearance of the finished product.

The above embodiments are to be considered illustrative, and not restrictive, and all changes, equivalents, and modifications that come within the spirit and scope of the invention are desired to be protected by the following claims.

Claims

1. The utility model provides a LED display module assembly which characterized in that: including the PCB board, PCB's upper surface is equipped with the LED luminescence chip fixed through the pad, PCB's upper surface covers has first glue film, be equipped with first printing ink layer on the first glue film, be equipped with the second glue film on the first printing ink layer, be equipped with second printing ink layer on the second glue film, first printing ink layer with second printing ink layer covers except that LED luminescence chip's region, first glue film covers the pad and with LED luminescence chip's lower terminal surface parallel and level, the up end on first printing ink layer with LED luminescence chip's up end parallel and level.

2. The LED display module of claim 1, wherein: the central position of the coverage area of the second ink layer is vertically aligned with the central position of the coverage area of the first ink layer, and the coverage area of the second ink layer is smaller than that of the first ink layer.

3. The LED display module of claim 2, wherein: and the included angle between the connecting line of the edge of the part of the second ink layer between the adjacent LED light-emitting chips and the edge of the part of the first ink layer between the adjacent LED light-emitting chips and the vertical direction is more than or equal to 30 degrees and less than or equal to 90 degrees.

4. The LED display module of claim 1, wherein: the first ink layer and/or the second ink layer are formed by epoxy ink or acrylic ink; and/or the first ink layer and/or the second ink layer are ink layers formed by ink with OD value larger than 1.

5. The LED display module of claim 1, wherein: and a third adhesive layer is arranged on the second ink layer.

6. The LED display module of claim 5, wherein: and a third ink layer is arranged on the third adhesive layer.

7. The LED display module of claim 6, wherein: and a fourth adhesive layer is arranged on the third ink layer.

8. The LED display module of claim 6, wherein: the coverage area center position of the third ink layer is vertically aligned with the coverage area center position of the second ink layer, the coverage area of the third ink layer is smaller than the coverage area of the second ink layer, the edge of the part, which is positioned between the adjacent LED light-emitting chips, of the third ink layer and the connecting line of the edge of the part, which is positioned between the adjacent LED light-emitting chips, of the second ink layer are in an included angle of more than or equal to 30 degrees and less than or equal to 90 degrees with the vertical direction.

9. The LED display module of any of claims 1-8, wherein: the thickness of the first adhesive layer and/or the second adhesive layer is 10-150 micrometers; and/or the first adhesive layer and/or the second adhesive layer are adhesive layers formed by epoxy resin or silica gel; and/or the first adhesive layer and/or the second adhesive layer are transparent adhesive layers or semitransparent adhesive layers.

10. An LED display screen which characterized in that: comprising an LED display module according to any one of claims 1-9.