CN218544881U - Semiconductor refrigerating device, equipment and cooling clothes - Google Patents

Abstract

The invention relates to the technical field of semiconductor refrigeration, and provides a semiconductor refrigeration device, equipment and cooling clothes, wherein the semiconductor refrigeration device comprises a refrigeration device, a heat exchange piece, a cold exchange piece, a controller and a sensor; the refrigerating device is provided with a conductive lead, a heat release end and a refrigerating end; the heat exchange piece is connected with the heat release end; the cold exchange assembly comprises a cold exchange piece and a refrigeration cavity, the refrigeration cavity is in heat conduction connection with the refrigeration end through the cold exchange piece, and the refrigeration cavity is provided with an input interface and an output interface for transmitting a refrigeration medium; the controller is used for regulating the current of the refrigerating device; the sensor is electrically connected with the controller and used for monitoring the temperature value of the refrigeration device. Compared with the prior art, the refrigeration module can supply cold for a long time, namely, the refrigeration module can be used for cooling immediately, has the advantage of being capable of supplying cold for a long time, and can monitor the working temperature of a refrigeration part in real time. The occupied space of the whole structure of the refrigeration module is small, and the whole portable performance is strong.

Description

Semiconductor refrigerating device, equipment and cooling clothes

Technical Field

The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration device, equipment and cooling clothes.

Background

High temperature is a working environment which workers often need to face at present, if the high temperature exceeds the tolerance of a human body, the working efficiency is reduced slightly, judgment is influenced, sunstroke can be caused seriously, sudden death can be caused seriously, and the cooling clothes are taken along to solve the problems.

Most phase change cooling clothes on the market all regard as the cold source through cold gel or phase change material, inject this kind of material into or insert the protective clothing, can keep the cold volume of a certain duration after freezing the cooling clothes, but the shortcoming that exists is exactly that the gel can harden after freezing, does not laminate wearer's health, seriously influences the action flexibility of wearer, and all cooling clothes all need to freeze the energy storage in advance simultaneously, can not emergency use to it is shorter to use duration. Therefore, a refrigeration module capable of supplying cold for a long time is needed, i.e. the module can be cooled immediately, so as to improve the working efficiency of the wearer.

Disclosure of Invention

Therefore, a semiconductor refrigerating device, equipment and a cooling garment are needed, the problem that in the prior art, the cold source is short in use time is solved, the semiconductor refrigerating device has the advantage of being capable of supplying cold for a long time, and the working temperature of a refrigerating part can be monitored in real time.

A semiconductor refrigeration device comprising:

a refrigeration device having a conductive lead, a heat emitting end, and a refrigeration end;

the heat exchange piece is connected with the heat release end;

the cold exchange assembly comprises a cold exchange piece and a refrigeration cavity, the cold exchange piece is connected with the refrigeration end, the refrigeration cavity is in heat conduction connection with the refrigeration end through the cold exchange piece, and the refrigeration cavity is provided with an input interface and an output interface for transmitting refrigeration media;

the controller is electrically connected with the conductive lead and is used for adjusting the current of the refrigerating device;

and

the sensor is arranged on the refrigeration device and electrically connected with the controller to monitor the temperature value of the refrigeration device.

Compared with the prior art, the normal during operation of refrigeration module, the electric current is through electrically conductive lead wire, and to the circular telegram of refrigerating device, the end of sending out heat begins the heat production this moment, and the refrigeration end begins to refrigerate, and the heat of the end of sending out heat will be conducted on the heat exchange piece, and heat exchange piece will dispel the heat gradually afterwards, and the cold volume on the cold exchange piece will cool down to the inside refrigerating medium of refrigeration cavity. The refrigerating medium is communicated with the equipment and the object which need to be cooled through the input interface and the output interface, so that the effects of heat exchange and circulating refrigeration are realized. The refrigeration module can supply cold for a long time, namely, the refrigeration module can be used for cooling immediately, has the advantage of being capable of supplying cold for a long time, and can monitor the working temperature of a refrigeration component in real time. The occupied space of the whole structure of the refrigeration module is small, and the whole portable performance is strong.

In one embodiment, the sensor and the conductive leads are both disposed at the refrigeration side of the refrigeration device.

In one embodiment, the sensor and the conductive leads are both disposed at the heat emitting end of the refrigeration device.

In one embodiment, the sensor is arranged at the heat release end of the refrigeration device; the conductive lead is arranged at the refrigerating end of the refrigerating device.

In one embodiment, the heat exchange element comprises a first fin and a first mounting plate; the first fin and the first mounting plate are integrally formed or connected in a welding mode.

In one embodiment, the first fin is an open linear fin, a serrated linear fin, or a pin fin.

In one embodiment, the semiconductor refrigeration device further comprises a heat dissipation fan;

the air outlet of the cooling fan is arranged towards the heat exchange piece.

In one embodiment, the controller has a power interface for connecting to a power supply device.

In one embodiment, the semiconductor refrigeration device further comprises a battery, and the battery is in power supply connection with the controller.

The application also provides semiconductor refrigeration equipment which comprises the semiconductor refrigeration device.

In one embodiment, the semiconductor refrigeration equipment further comprises an assembly box, wherein the semiconductor refrigeration device is arranged in the assembly box;

the assembly box comprises a wearing surface, and the assembly box is provided with heat dissipation holes on the adjacent surface or the opposite surface of the wearing surface.

The application also provides a cooling garment, which comprises the semiconductor refrigerating device in the scheme;

the cooling suit further comprises a suit body, wherein a flow channel is arranged on the suit body, and the flow channel is connected with the input interface and the output interface to form a circulating channel.

Compared with the prior art, this cooling clothes can carry out the cooling for a long time, and is cold promptly, has the advantage that can carry out the cooling for a long time, and overall structure's occupation volume is less, and holistic portability, portable nature are stronger.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a refrigeration module according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a refrigeration device according to an embodiment of the present invention;

FIG. 3 is an exploded view of a portion of the structure corresponding to FIG. 2;

fig. 4 is a schematic structural diagram of a refrigeration device according to another embodiment of the present invention;

FIG. 5 is an exploded view of a portion of the structure corresponding to FIG. 4;

fig. 6 is a schematic structural diagram of a refrigeration device according to another embodiment of the present invention;

FIG. 7 is an exploded view of a portion of the structure corresponding to FIG. 6;

fig. 8 is a schematic view of a specific structure of a refrigeration apparatus according to an embodiment of the present invention;

fig. 9 is a schematic view of a specific structure of the cooling suit according to an embodiment of the present invention.

Description of the reference numerals:

10. a refrigeration device; 101. a heat releasing end; 1011. a binding face; 1012. a mounting surface; 102. a refrigerating end; 103. a conductive lead;

20. a heat exchange member; 201. a first fin; 202. a first mounting plate;

30. a cold exchange assembly; 301. cold exchanging the piece; 302. a refrigeration cavity; 303. a box body;

40. a sensor; 50. a heat radiation fan; 60. an internal battery; 70. assembling a box; 80. heat dissipation holes; 90. a garment body.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In order to cool down in being in the staff that non-air conditioner room carried out work, this application provides a semiconductor refrigerating plant, equipment and cooling clothes, can carry out the refrigeration module of cooling for a long time, and the instant cold of using to promote wearer's work efficiency, have the advantage that can carry out the cooling for a long time, and can monitor the operating temperature of refrigeration part in real time, concrete scheme is as follows:

referring to fig. 1 and 2, the present application provides a semiconductor cooling device including a cooling device 10, a heat exchange member 20, a cold exchange assembly 30, a controller (not shown), and a sensor 40. The refrigeration device 10 has, among other things, conductive leads 103, a heat sink 101, and a refrigeration end 102. The heat exchange member is connected to the heat releasing end 101. The cold exchange assembly 30 includes a cold exchange member 301 and a refrigeration cavity 302, the cold exchange member 301 is connected to the refrigeration end 102, the refrigeration cavity 302 is connected to the refrigeration end 102 through the cold exchange member 301 in a heat conduction manner, and the refrigeration cavity 302 has an input interface and an output interface for transmitting a refrigeration medium. A controller is electrically connected to the conductive leads 103, the controller being configured to regulate the current to the refrigeration device 10. The sensor 40 is integrally and fixedly mounted on the refrigeration device 10, and when the refrigeration module works, the sensor 40 is used for monitoring the real-time temperature of the refrigeration device 10.

In this embodiment, the sensor 40 is used to monitor the real-time temperature of the refrigeration device 10, and before the refrigeration device is operated, a first temperature threshold may be set by the controller, where the first temperature threshold is set according to the normal operation temperature range of the refrigeration device 10, and the first temperature threshold is outside the normal operation temperature range. When the refrigerating device works, the sensor 40 monitors the working temperature of the refrigerating device 10 in real time, the monitored temperature value is fed back to the controller, if the refrigerating device 10 is abnormal, the temperature value will change abnormally, when the temperature value changes continuously and enters a first temperature threshold value, the controller cuts off the electric connection of the refrigerating device 10 to force the refrigerating device 10 to stop working, so that the refrigerating device 10 is protected, and the overall operation stability of the refrigerating module is improved.

Note that, in this embodiment, the refrigeration device 10 is a semiconductor refrigerator as a whole, and the semiconductor refrigerator (Thermo Electric Cooler) is made using the peltier effect of a semiconductor material. The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. The refrigerating device 10 comprises a hot end substrate, a cold end substrate and a plurality of P-type and N-type electric couple pairs (groups), wherein the P-type and N-type electric couple pairs (groups) are connected together through electrodes and are clamped between the hot end substrate and the cold end substrate; the refrigeration device 10 further includes a conductive lead 103 connected to the couple pair, the conductive lead 103 is divided into a first conductive lead and a second conductive lead, when current flows in from the first conductive lead and flows out from the second conductive lead of the TEC, the P-type and N-type couple pairs (group) will generate a "hot" side and a "cold" side on the TEC based on the effect of the current, which is the heating and cooling principle of the TEC, specifically, in this embodiment, the heat emitting end 101 is the side generating heat on the refrigeration device 10, and the cooling end 102 is the side generating cold.

Illustratively, when the refrigeration device works normally, the controller is connected based on the conductive lead 103 of the refrigeration device 10, and current is applied to the refrigeration device 10 through the controller, so that the heat releasing end 101 starts to generate heat and the refrigeration end 102 starts to refrigerate.

As the heat release end 101 generates heat, the heat exchange element 20 is connected with the heat release end 101, and a heat conduction connection exists between the heat exchange element 20 and the heat release end 101, so that the heat of the heat release end 101 is conducted to the heat exchange element 20, and then the heat exchange element 20 gradually dissipates heat; because the cold exchanger 301 is connected with the refrigerating end 102 and the refrigerating end is in heat conduction connection, the cold energy of the refrigerating end 102 is conducted to the cold exchanger 301, and because the cold exchanger 301 is in heat conduction connection with the refrigerating cavity 302, the cold energy on the cold exchanger 301 can cool the refrigerating medium in the refrigerating cavity 302. The refrigerating medium is communicated with the equipment and the pipeline of the object which need to be cooled through the input interface and the output interface, thereby realizing the effects of heat exchange and circulating refrigeration. The refrigerating device can supply cold for a long time, namely, the cold is supplied immediately after use, so that the refrigerating device has the advantage of being capable of supplying cold for a long time and monitoring the working temperature of a refrigerating part in real time.

When the refrigerating device works, the input interface and the output interface are connected with a pipeline which needs to be refrigerated and cooled, in the embodiment, the refrigerating module is integrally applied to the cooling suit, the body of the cooling suit is provided with a flow passage, and the flow passage is connected with the input interface and the output interface to form a circulating channel. In addition, in this embodiment, the refrigeration medium for implementing cold conduction is water, and when the refrigeration device performs refrigeration, water enters the refrigeration cavity 302 through the input interface. Refrigerating plant during operation, cold exchange 301 lasts to flowing into the inside water of refrigeration cavity 302 and refrigerates the cooling to the realization is to the cooling of the lasting nature circulation refrigeration of cooling clothes, in addition, in refrigerated, this refrigerating plant can carry out the cooling for a long time, and overall structure's occupy-place volume is less, and holistic portability, portability are stronger.

In this embodiment, the installation positions of the sensor 40 and the conductive lead 103 are further refined, the sensor 40 and the conductive lead 103 are integrally installed on the refrigeration device 10, and the installation positions can be selected as a heat release end 101 or a refrigeration end 102. Specifically, in this embodiment, the sensor 40 and the conductive leads 103 are both mounted on the heat radiating end 101, and the heat radiating end 101 has an attachment surface 1011 connected to the heat exchange member 20 and a mounting surface 1012 connected to the cooling end 102, wherein the sensor 40 and the conductive leads 103 are both mounted on the mounting surface 1012. To facilitate mounting of the sensor 40 and the conductive leads 103, the TEC hot side substrate area at the heat emitting side is set to be larger than the TEC cold side substrate area at the cooling side. By arranging the sensor 40 and the conductive lead 103 on the mounting surface of the heat radiation end, the loss of cooling capacity caused by the connection line between the conductive lead 103 and the sensor 40 and the adverse effect caused by condensation on the surfaces of the conductive lead and the connection line can be reduced.

It should be noted that the sensor 40 is installed at the cooling end 102 and can monitor the temperature of the heat releasing end 101 in real time, but the sensor 40 must contact with the cooling end 102 and form a heat conduction connection with the cooling end 102, and when the cooling end 102 performs normal cooling, part of the cooling capacity is conducted to the sensor 40, which will cause the cooling capacity loss of the cooling device 10, so in this embodiment, the sensor 40 is fixedly installed at the heat releasing end 101 to optimize the cooling efficiency of the cooling device 10.

In another embodiment, the sensor 40 and the conductive leads 103 are both mounted on the refrigeration end 102, the refrigeration end 102 having a mounting surface connected to the cold exchanger 301 and a mounting surface connected to the heat sink 101, wherein the sensor 40 and the conductive leads 103 are both mounted on the mounting surface. In order to facilitate the installation of the sensor 40 and the conductive lead 103, the area of the cold-end substrate of the TEC at the refrigerating end is set to be larger than that of the hot-end substrate of the TEC at the heat releasing end, the sensor 40 and the conductive lead 103 are arranged on the installation surface of the refrigerating end, and the installation holes or the installation positions are arranged at the peripheral parts of the cold-end substrates corresponding to the areas of the multiple hot-end substrates, so that the cold-end substrate and the liquid box body are connected in a mechanical connection mode to form a closed refrigerating cavity.

In another embodiment, the sensor 40 is mounted on the heat radiating end 101 and the conductive lead 103 is mounted on the cooling end 102, the heat radiating end 101 has a bonding surface connected to the heat exchanging member 20 and a mounting surface connected to the cooling end 102, the cooling end 102 has a bonding surface connected to the cold exchanging member 301 and a mounting surface connected to the heat radiating end 101, wherein the sensor 40 and the conductive lead 103 are respectively mounted on the corresponding mounting surfaces. The area of the TEC cold end substrate of the refrigerating end is set to be equal to the area of the TEC hot end substrate of the refrigerating end, the conductive lead 103 is arranged on the mounting surface of the refrigerating end, the cold end substrate can be connected with the cold connecting piece in a welding or gluing mode, and the cold connecting piece is connected with the box body in a sealing mode to form a closed refrigerating cavity. By arranging the sensor 40 on the mounting surface of the heat release end, the loss of cooling capacity caused by the connecting line of the sensor 40 and the adverse effect caused by condensation on the surfaces of the conductive lead and the connecting line can be reduced.

In an embodiment, the heat exchange element 20 is further refined, the heat exchange element 20 includes a first fin 201 and a first mounting plate 202, the first fin 201 is connected with the heat dissipation end 101 through the first mounting plate 202 in a heat conduction manner, heat generated by the heat dissipation end 101 can be conducted to the heat exchange element, and is dissipated through the first fin 201, and finally, a heat dissipation effect is achieved.

It should be noted that, in this embodiment, the first fin 201 may be an open linear fin, a sawtooth linear fin, or a pin-structured fin, and specifically, in this embodiment, the first toothed disc is an open linear fin.

Preferably, in this embodiment, the semiconductor refrigeration device further includes a heat dissipation fan 50, wherein the fan may be an axial fan, a centrifugal fan or a butterfly fan, and specifically, in this embodiment, the fan is a centrifugal fan, an air outlet of the fan is disposed toward the heat exchange member, when the refrigeration module normally works, heat generated by the heat dissipation end 101 can be continuously conducted to the heat exchange member, and meanwhile, the fan also performs heat dissipation and cooling processing on the heat exchange member. The structure arrangement can improve the heat dissipation speed of the heat exchange element, and further optimize the refrigeration effect of the refrigeration device 10.

Further, in this embodiment, the cold exchange assembly 30 is further refined, the cold exchange assembly 30 further includes a box 303, the box 303 is in an open configuration, and the cold exchange member 301 seals the box 303 to form the refrigeration cavity 302. Wherein, one side of cold exchange piece 301 is connected with refrigeration end 102, and the opposite side inserts inside refrigeration cavity 302, and refrigeration cavity 302 is whole to be used for carrying out the refrigeration cooling to rivers.

In this embodiment, the semiconductor thermoelectric refrigeration technology of the refrigeration device 10 replaces a mechanical compressor with a small and miniature thermoelectric device, and has the advantages of no vibration in work, compact core refrigeration structure, light weight, convenience in movement and miniaturization, and adopts a direct current power supply mode, thereby being very suitable for battery power supply, and having the characteristics of portability and portability.

In this embodiment, the controller has a power input interface.

It should be noted that the power supply mode of the refrigeration module can be internal power supply or external power supply, the selection of the specific power supply mode can be determined according to the actual working scene, when the worker needs to frequently walk, the power supply mode can be selected as internal power supply, the power input interface of the controller is connected with the internal battery 60, and the refrigeration module has an independent working function as a whole.

If the staff only need carry out the during operation in the fixed point position, the power supply mode can select for external power supply, connects external power supply unit's power supply line on the power input interface of controller, wholly for external power supply, does not need to install internal battery 60 on the refrigeration module and supplies power, and this power supply mode can alleviate the holistic weight load of refrigeration module. For example, the external power supply device may be, but is not limited to, a portable power source such as a power bank, a vehicle-mounted power source, and the like.

In order to understand the features and technical content of the embodiments of the present disclosure more thoroughly, a specific application example is provided below for illustration, and it is understood that the following application example is only used as a reference and does not limit the specific implementation process.

Referring to fig. 3, the present application further provides a semiconductor refrigeration device including the semiconductor refrigeration device according to the above aspect. The semiconductor refrigeration equipment further comprises an assembly box 70, and the semiconductor refrigeration device is arranged in the assembly box 70.

When the refrigeration module works, the input interface and the output interface are connected with a pipeline which needs to be refrigerated and cooled, in the embodiment, the refrigeration module is integrally applied to the cooling suit, a flow passage is arranged on the body of the cooling suit, and the flow passage is connected with the input interface and the output interface to form a circulating channel. In addition, in this embodiment, the refrigeration medium for implementing cold conduction is water, and when the refrigeration module performs refrigeration, the water enters the refrigeration cavity 302 through the input interface. Refrigeration module during operation, cold exchange 301 lasts to flowing into the inside water of refrigeration cavity 302 and refrigerates the cooling to the realization is to the cooling of the lasting nature circulation refrigeration of cooling suit, and in addition, in refrigerated, this refrigeration module can carry out the cooling for a long time, and overall structure's occupy-place volume is less, and holistic portability, portability are stronger.

Preferably, in this embodiment, the assembly box 70 includes a wearing surface, the assembly box 70 is provided with heat dissipation holes 80, and the heat dissipation holes 80 correspond to the air outlet direction of the heat dissipation fan 50, so that the hot air flowing through the heat exchange element can flow out of the refrigeration apparatus through the heat dissipation holes 80. The heat dissipation holes 80 may be formed on the adjacent surface or the opposite surface of the wearing surface, and specifically, in this embodiment, the heat dissipation holes 80 are formed on the opposite surface of the wearing surface.

It should be noted that, the heat dissipation function of the assembly box 70 can be optimized by the structural arrangement, and the heat dissipation holes 80 face away from the wearing face, so that when the device works normally, the heat exchange piece 20 is cooled by hot air, so that the human body can be avoided from flowing out of the assembly box 70, and the use experience of the wearing person is improved.

Referring to fig. 4, the present application further provides a cooling garment including the semiconductor refrigeration device according to the above-mentioned aspect.

The cooling suit further comprises a suit body 90, wherein a flow channel is arranged on the suit body 90, and the flow channel is connected with the input interface and the output interface to form a circulating channel.

Illustratively, when the refrigeration module is operating normally, the current is applied to the refrigeration device 10, and the heat-releasing end 101 starts to generate heat and the refrigeration end 102 starts to generate refrigeration. Because the heat exchange piece is connected with the heat release end 101, and heat conduction connection exists between the heat exchange piece and the heat release end 101, the heat of the heat release end 101 is conducted to the heat exchange piece, and the heat dissipation assembly continuously dissipates heat to the heat exchange piece when working, so that the heat of the heat release end 101 is continuously conducted to the heat exchange piece when the refrigeration module works, and the heat dissipation assembly can continuously dissipate heat to the heat exchange piece;

along with the refrigeration of the refrigeration end 102, the cold exchange piece 301 is connected with the refrigeration end 102, and the cold quantity of the refrigeration end 102 is transmitted to the cold exchange piece 301 due to the heat conduction connection between the cold exchange piece 301 and the refrigeration cavity 302, and meanwhile, the cold quantity on the cold exchange piece 301 can cool the refrigeration medium in the refrigeration cavity 302. The refrigerating medium is communicated with the flow channel of the clothes body 90 through the input interface and the output interface, so that the effects of heat exchange and circulating refrigeration are realized. This system can carry out the cooling for a long time, and is cold promptly, has the advantage that can carry out the cooling for a long time, and overall structure's occupation volume is less, and holistic portability, portability are stronger.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Claims (10)

1. A semiconductor refrigeration device, comprising:

a refrigeration device (10), the refrigeration device (10) having an electrically conductive lead (103), a heat sink end (101), and a refrigeration end (102);

a heat exchange member (20), the heat exchange member (20) being connected to the heat release end (101);

the cold exchange assembly (30), the cold exchange assembly (30) comprises a cold exchange piece (301) and a refrigeration cavity (302), the cold exchange piece (301) is connected with the refrigeration end (102), the refrigeration cavity (302) is in heat conduction connection with the refrigeration end (102) through the cold exchange piece (301), and the refrigeration cavity (302) is provided with an input interface and an output interface for transmission of refrigeration media;

a controller in electrical connection with the electrically conductive lead (103), the controller for regulating the current of the refrigeration device (10);

and

a sensor (40), the sensor (40) is disposed on the refrigeration device (10), the sensor (40) is electrically connected with the controller for monitoring a temperature value of the refrigeration device (10).

2. A semiconductor cooling device according to claim 1, characterized in that the sensor (40) and the electrically conductive lead (103) are both arranged at a cooling end (102) of the cooling device.

3. A semiconductor cooling device according to claim 1, characterized in that the sensor (40) and the electrically conductive lead (103) are both arranged at the heat emitting end (101) of the cooling device.

4. A semiconductor cooling device according to claim 1, wherein the sensor (40) is arranged at a heat emitting end (101) of the cooling means; the conductive lead (103) is disposed at a cooling end (102) of the cooling device.

5. A semiconductor cooling device according to any one of claims 2-4, characterized in that the heat exchange element (20) comprises a first fin (201) and a first mounting plate (202); the first fin (201) and the first mounting plate (202) are integrally formed or connected in a welding mode.

6. The semiconductor cooling device according to claim 1, wherein the controller has a power interface for connecting a power supply.

7. The semiconductor refrigeration device of claim 1, further comprising a battery, the battery being in electrical communication with the controller.

8. A semiconductor refrigeration device characterized by comprising the semiconductor refrigeration device according to any one of claims 1 to 7.

9. The semiconductor refrigeration device according to claim 8, further comprising an assembly box (70), wherein the semiconductor refrigeration device is disposed within the assembly box (70);

the assembly box (70) comprises a wearing surface, and heat dissipation holes (80) are formed in the adjacent surface or the opposite surface of the wearing surface of the assembly box (70).

10. A cooling garment comprising the semiconductor cooling device of any one of claims 1-7;

the cooling suit further comprises a suit body (90), wherein a runner is arranged on the suit body (90), and the runner is connected with the input interface and the output interface to form a circulating channel.

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