CN218526640U - Heat sink device - Google Patents

Abstract

The utility model provides a heat dissipation device. The heat dissipation device is used for a heat source on a circuit element. The heat dissipation device includes a first heat-conducting element and a housing. The first heat-conducting element includes a lower portion, a middle portion, and an upper portion, the middle portion connecting the lower portion and the upper portion. The housing accommodates a first heat-conducting element. The upper portion includes a toggle structure.

Description

Heat sink device

Technical Field

The utility model relates to a heat dissipation device.

Background

With the development of technology, the demand for electronic devices is increasing. For example, it is desirable that the display image of the electronic device has a higher resolution, or that the electronic device can achieve a networking function. These requirements may place a computational burden on the chip and may generate a large amount of heat. Common chips include a System on a Chip (SOC), a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and the like. It should be noted that the heat generation source is not limited to the chip. In this specification, these elements that are likely to generate a large amount of heat energy are referred to as "heat generation sources". In order to avoid overheating the entire electronic device or the heat source itself and to avoid the thermal energy affecting the user experience, the thermal energy needs to be dissipated from the electronic device.

One common heat dissipation device includes an upper cover, a lower cover, and heat dissipation fins (fins). The heat dissipation fins are arranged on the heat source and are provided with a plurality of outward fin-shaped structures, and the fin-shaped structures increase convection to achieve heat dissipation. However, since there are heat dissipation fins and waterproof members (e.g., O-rings) need to be provided between different members (e.g., between the upper cover and the lower cover, between the upper cover and the heat dissipation fins), such a heat dissipation device includes a relatively large number of members, for example, in which as many as four or more waterproof members may be required. Not only increases the assembly cost, but also is not favorable for the assembly convenience.

Therefore, it is important to effectively achieve heat dissipation of electronic equipment and to achieve the convenience of assembling the heat dissipation device.

SUMMERY OF THE UTILITY MODEL

Some embodiments of the present invention provide a heat dissipation device. The heat dissipation device is used for a heat source on a circuit element. The heat dissipation device includes a first heat-conducting element and a housing. The first heat-conducting element includes a lower portion, a middle portion, and an upper portion, the middle portion connecting the lower portion and the upper portion. The housing accommodates a first heat-conducting element. The upper portion includes a toggle mechanism.

In some embodiments, the upper portion further comprises a snap-fit structure. In some embodiments, the toggle structure is a protrusion, and the engaging structure is a hook, and during the assembling process of the heat sink device, the engaging structure can temporarily engage with the circuit element, and the engaging structure can be disengaged from the circuit element by applying a force to the toggle structure. In some embodiments, the housing is a hollow cuboid, and heat generated by the heat source is transferred to the housing through the lower portion, the middle portion and the upper portion in sequence. In some embodiments, the housing is made of a material having a thermal conductivity greater than 100W/mK.

In some embodiments, opposite sides of the interior of the housing each include a rail, and the circuit elements are disposed between the rails. In some embodiments, the heat dissipation device further includes a second heat conducting element. The second heat conducting element is arranged between the shell and the upper part and between the lower part and the heating source. In some embodiments, the second thermally conductive element is compressible.

In some embodiments, the heat dissipation device further comprises a front cover, a front connecting element, a back cover, and a back connecting element, wherein the front cover is connected to the housing, the front connecting element is connected to the front cover, the back cover is connected to the housing, the back connecting element is connected to the back cover, the front cover is integrally formed with the front connecting element, and the back cover is integrally formed with the back connecting element. In some embodiments, the heat dissipation device further comprises a waterproof element. The waterproof element is arranged between the front cover and the shell and between the rear cover and the shell.

Drawings

In order to make the features and advantages of the present disclosure more comprehensible, several embodiments accompanied with figures are described in detail below. It should be noted that the various features are not necessarily drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced and may be illustrated schematically.

Fig. 1 is a perspective view of a heat dissipation device.

Fig. 2 is an exploded view of the heat sink.

Fig. 3A, 3B, 4A, 4B, 4C, 5A, 5B, 6A, and 6B are schematic diagrams for illustrating how to assemble the heat dissipation device.

FIG. 7 is a cross-sectional view of the assembled heat sink.

Description of the reference numerals

10 heating source

20 circuit element

21 fixed part of circuit component

22 accommodating part of circuit component

100 heat sink

110 first heat conducting element

111 lower part

1111 a lower body

1112 fixing holes at lower part

112 middle part

113 upper part

1131, toggle structure

1132 engaging structure

120 second heat conducting element

130 casing

131: guide rail

140 front cover

141 fixing holes of front cover

150 front connecting element

151 inserting portion of front side connecting element

160 rear cover

161 fixing hole of back cover

170 rear side connecting element

171 mating portion of rear connector

180 waterproof element

190 fastening element of lower part

200 fixing element of front cover

210 fixing element of back cover

Detailed Description

The following disclosure provides many different embodiments, or examples, and may describe specific examples of components and arrangements of parts using relative spatial terms to implement various features of the disclosure. For example, if the specification states a first feature formed "on" or "over" a second feature, that embodiment may include the first feature in direct contact with the second feature, or that embodiment may include additional features formed between the first and second features, such that the first and second features are not in direct contact. Spatially relative terms are used to facilitate describing the relationship between elements or features in the drawings and other elements or features. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be oriented in different orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Furthermore, ordinal numbers such as "first" and "second" in the specification and claims are not used to distinguish one element from another, but rather are used to identify a different element having the same name. Moreover, the term "about" means within 10%, within 5%, within 3%, within 2%, within 1%, within 0.5% of a given value. The term "between" means that the range includes the first value, the second value and other values in between.

Please refer to fig. 1 and fig. 2. Fig. 1 is a perspective view of a heat dissipation device 100. Fig. 2 is an exploded view of the heat dissipation device 100, and illustrates a heat source 10 and a circuit element 20. The heat sink 100 may be used for the heat generating source 10. The heat generating source 10 may be disposed on the circuit component 20. In some embodiments, the heat generating source 10 is a chip, such as, but not limited to, a system-on-chip, a central processing unit, a graphics processor, and the like. In some embodiments, the circuit element 20 is a circuit board, such as, but not limited to, a hard board, a flexible board (flex board), a rigid-flex board (RIGID-Flex board), and the like. The circuit element 20 may have two fixing portions 21 and a receiving portion 22.

The heat dissipation device 100 includes a first heat conducting element 110, two second heat conducting elements 120, a housing 130, a front cover 140, a front connecting element 150, a rear cover 160, a rear connecting element 170, two waterproof elements 180, one or more fixing elements 190, one or more fixing elements 200, and one or more fixing elements 210. It should be understood that elements may be added or subtracted as desired.

The first heat conducting element 110 is disposed inside the housing 130. The first heat conducting element 110 includes a lower portion 111, a middle portion 112, and an upper portion 113. The lower portion 111 is disposed on the circuit element 20. The lower portion 111 may include a body 1111 and two fixing holes 1112 disposed at opposite sides of the body 1111. In some embodiments, the central region of the body 1111 is a recess, but not limited thereto. The lower portion 111 can be fixed to the circuit element 20 by a fixing element 190 such as a screw or a bolt passing through the fixing hole 1112 and being disposed in the fixing portion 21. In some embodiments, the fixing element 190 and the fixing portion 21 are formed with mutually corresponding shapes (e.g., screw threads) therebetween to reinforce the connection between the lower portion 111 and the circuit element 20.

The middle portion 112 connects the lower portion 111 and the upper portion 113. In some embodiments, an angle between the lower portion 111 and the middle portion 112 and an angle between the middle portion 112 and the upper portion 113 are both greater than 90 degrees. That is, the lower portion 111 and the upper portion 113 are located on opposite sides of the middle portion 112. The upper portion 113 may include a toggle structure 1131 and one or more engaging structures 1132 (the toggle structure 1131 and the engaging structures 1132 may refer to fig. 3A and 3B first). In some embodiments, the toggle structure 1131 is a protrusion. In some embodiments, the engaging structure 1132 is a hook.

In some embodiments, the first heat conducting element 110 is made of an elastic material, but is not limited thereto. In some embodiments, the first heat conducting element 110 is made of a metal or metal alloy, such as, but not limited to, stainless steel. Because the first heat conducting element 110 can have elasticity, the middle portion 112 and the upper portion 113 can be changed in position relative to the circuit element 20 during the assembly process of the heat dissipating device 100, so as to increase the assembly convenience.

The two second heat conducting elements 120 may be disposed between the lower portion 111 and the heat generating source 10 and between the housing 130 and the upper portion 113, respectively. In some embodiments, the second thermally conductive element 120 is compressible. In some embodiments, the second heat-conducting element 120 is polygonal, e.g., rectangular or square, when viewed from above. In some embodiments, the shape of the second heat conducting element 120 may match the shape of the heat generating source 10. In some embodiments, the shape of the second heat conducting element 120 may match the shape of the upper portion 113. In some embodiments, the second heat conducting element 120 may be a heat conducting sheet (thermal pad). The heat conductive sheet may include materials such as silicon, a heat conductive material, an interface treatment agent, and the like, but is not limited thereto. In some embodiments, the thermally conductive material may include, but is not limited to, aluminum oxide, zinc oxide, titanium oxide, boron nitride, aluminum nitride, combinations of the foregoing, and the like.

The case 130 may contain and protect the heat generating source 10, the circuit component 20, the first heat conductive member 110, the second heat conductive member 120, and the like. In some embodiments, the housing 130 is a hollow cuboid. Since the housing 130 is a hollow rectangular parallelepiped, rather than being formed by combining an upper cover and a lower cover, a waterproof element between the upper cover and the lower cover can be omitted, so as to reduce the cost and improve the overall waterproof and dustproof effects of the heat dissipation device 100.

In some embodiments, the housing 130 is made of a material having a thermal conductivity greater than 100W/mK, for example, the thermal conductivity of the housing 130 may be about 400W/mK, about 350W/mK, about 300W/mK, about 250W/mK, about 200W/mK, about 150W/mK, about 100W/mK, but is not limited thereto. In some embodiments, the housing 130 is made of a metal or metal alloy, such as, but not limited to, copper, chromium, aluminum, combinations thereof, and the like. In some embodiments, the thermal conductivity of the housing 130 is greater than the thermal conductivity of the first thermal conductive element 110 and the thermal conductivity of the second thermal conductive element 120, so as to reduce the possibility that the heat generated by the heat generating source 10 is accumulated inside the housing 130. Since the case 130 has a relatively high thermal conductivity, the heat generated by the heat generating source 10 can be rapidly transferred to the case 130. Therefore, the heat dissipation device 100 can have a fast and good heat dissipation effect.

In some embodiments, opposing sides of the interior of the housing 130 may each include a guide rail 131. In some embodiments, the dimensions of the rail 131 are matched to the dimensions of the circuit element 20. The guide rail 131 may have a guiding function to facilitate the sliding installation of the circuit component 20 into the housing 130 when assembling the heat dissipation device 100, so as to increase the assembly convenience. In some embodiments, the guiding rail 131 may be provided with a positioning structure to ensure the positioning of the circuit element 20.

The front cover 140 is coupled to the housing 130. The front cover 140 may include one or more fixing holes 141. The front cover 140 may be fixed to the housing 130 by fixing members 200, such as screws and bolts, passing through the fixing holes 141. In some embodiments, the front cover 140 is integrally formed with the front connection member 150. For example, the front connecting element 150 can be integrally formed through the front cover 140 by insert molding.

The back cover 160 and the front cover 140 may have similar shapes, structures, materials, etc. The rear cover 160 is connected to the housing 130. The rear cover 160 may include one or more fixing holes 161. The rear cover 160 may be fixed to the housing 130 through fixing elements 210, such as screws and bolts, passing through the fixing holes 161. In some embodiments, the rear cover 160 is integrally formed with the rear connection member 170. For example, the rear connecting element 170 can be formed integrally by insert-molding through the rear cover 160.

Since the front cover 140 is integrally formed with the front connecting element 150 and the rear cover 160 is integrally formed with the rear connecting element 170, waterproof elements between the front cover 140 and the front connecting element 150 and between the rear cover 160 and the rear connecting element 170 can be omitted, so that the cost can be reduced and the overall waterproof and dustproof effects of the heat sink 100 can be improved.

In some embodiments, the front connection element 150 and the rear connection element 170 are transmission lines, such as, but not limited to, HDMI transmission line, USB transmission line, type C transmission line. In some embodiments, the front side connection element 150 and the back side connection element 170 are different types of transmission lines, but are not limited thereto. The front and rear connecting members 150 and 170 may include a receiving portion 151 and a receiving portion 171, respectively.

The two waterproof elements 180 can be disposed between the front cover 140 and the housing 130 and between the rear cover 160 and the housing 130, respectively. In some embodiments, waterproofing member 180 may be an O-ring. The waterproof element 180 can enhance the overall waterproof and dustproof effects of the heat dissipation device 100.

Next, how to assemble the heat sink 100 will be described in conjunction with fig. 3A, 3B, 4A, 4B, 4C, 5A, 5B, 6A, and 6B.

Fig. 3A and 3B are schematic diagrams illustrating how the first heat conducting element 110 is disposed on the circuit element 20. First, two second heat conducting elements 120 may be attached to the bottom surface of the lower portion 111 of the first heat conducting element 110 and the top surface of the upper portion 113 of the first heat conducting element 110, respectively. Next, the lower portion 111 may be fixed to the circuit element 20 by the fixing element 190 penetrating the fixing hole 1112 and disposed in the fixing portion 21 to tightly compress the second heat conducting element 120 between the lower portion 111 and the heat generating source 10.

At this time, the upper portion 113 may be floating without contacting the circuit element 20. If the subsequent assembly is performed in such a state, the upper portion 113 may move relative to the circuit element 20, and unwanted shaking, vibration, or the like may occur. Therefore, it is necessary to temporarily fix the upper portion 113 during the assembly of the heat sink 100.

Fig. 4A, 4B, and 4C are diagrams for illustrating how the upper portion 113 is temporarily fixed during the assembly of the heat sink 100. The upper portion 113 may be forced such that the engagement structure 1132 is in contact with the circuit element 20. For example, the engaging structure 1132 may engage with an edge of the circuit component 20, and the toggle structure 1131 may be located in the receiving portion 22 of the circuit component 20. By the engaging structure 1132, during the assembling process of the heat sink device 100, the engaging structure 1132 can temporarily engage with the circuit element 20 to suppress the relative movement between the upper portion 113 and the circuit element 20 during the assembling process of the heat sink device 100, and unwanted vibration, etc., so as to further increase the assembling convenience.

Next, the heat generating source 10, the circuit component 20, the first heat conducting component 110, and the second heat conducting component 120 may be mounted into the housing 130. In detail, the circuit component 20 may be slidably mounted in the housing 130 by the guide rail 131. At this time, because the engaging structure 1132 and the circuit element 20 are still in the engaging state, the second heat conducting element 120 between the housing 130 and the upper portion 113 is not collided or pressed by the housing 130, and the possibility of deformation or displacement of the second heat conducting element 120 between the housing 130 and the upper portion 113 can be reduced.

Next, the waterproof member 180 between the housing 130 and the front cover 140, the front side connection member 150 may be mounted to the housing 130, and the insertion portion 151 of the front side connection member 150 may be disposed on the circuit member 20. Furthermore, the front cover 140 can be fixed to the housing 130 by the fixing member 200 passing through the fixing hole 141 of the front cover 140.

Before the waterproof member 180, the rear cover 160, and the rear connecting member 170 between the housing 130 and the rear cover 160 are mounted to the housing 130, the toggle structure 1131 may be forced to disengage the engaging structure 1132 from the circuit component 20. Fig. 5A and 5B are schematic diagrams illustrating how the toggle structure 1131 is forced. The toggle structure 1131 can be mechanically or manually forced in the direction of the arrow shown in fig. 5A and 5B, so that the engaging structure 1132 is disengaged from the circuit element 20. For example, the operator may apply a force to the toggle structure 1131 by using a jig.

At this time, since the first heat conducting element 110 has elasticity, the middle portion 112 and the upper portion 113 change positions relative to the circuit element 20 except for being fixed to the lower portion 111 of the circuit element 20 by the fixing element 190. Fig. 6A and 6B are schematic views showing the intermediate portion 112 and the upper portion 113 after the position is changed. As shown in fig. 6A and 6B, the middle portion 112 after being displaced is inclined more than that in fig. 5A and 5B, so that the middle portion 112 can provide a resilience force to force the upper portion 113 to be tightly compressed in the second heat conducting element 120 between the housing 130 and the upper portion 113.

Next, the waterproof member 180 between the housing 130 and the rear cover 160, the rear side connecting member 170 may be mounted to the housing 130, and the insertion portion 171 of the rear side connecting member 170 may be disposed on the circuit member 20. Furthermore, the rear cover 160 can be fixed to the housing 130 by the fixing member 210 passing through the fixing hole 161 of the rear cover 160.

It is noted that the assembly sequence is not limited thereto. In some embodiments, the toggle structure 1131 may be applied with a force after the circuit component 20 is mounted to the housing 130, so that the engaging structure 1132 is separated from the circuit component 20, and then the front cover 140 is mounted to the housing 130.

Please refer to fig. 7. Fig. 7 is a cross-sectional view of the assembled heat dissipation device 100. As shown in fig. 7, the heat dissipation device 100 does not include heat dissipation fins, and only two waterproof members 180 are required. Also, the lower portion 111 of the first heat conducting element 110 may tightly compress the second heat conducting element 120 between the lower portion 111 and the heat generating source 10. The upper portion 113 of the first heat-conducting element 110 may tightly compress the second heat-conducting element 120 between the housing 130 and the upper portion 113.

The heat generated by the heat generating source 10 can be transferred to the housing 130 sequentially through the paths shown by the arrows in fig. 7. That is, the heat generated by the heat generating source 10 can be transferred to the housing 130 through the second heat conducting element 120 between the lower portion 111 and the heat generating source 10, the lower portion 111 of the first heat conducting element 110, the middle portion 112 of the first heat conducting element 110, the upper portion 113 of the first heat conducting element 110, and the second heat conducting element 120 between the housing 130 and the upper portion 113 in sequence. Also, since the housing 130 has a relatively high thermal conductivity, the heat dissipation device 100 can have a fast and good heat dissipation effect. Therefore, the cost can be reduced. Also, since the number of components is reduced, the convenience of assembly can be increased.

It is noted that although the first heat conducting element 110 is illustrated as having only a single middle portion 112 and a single upper portion 113 near the rear cover 160, in some embodiments, the first heat conducting element 110 may have two middle portions 112 and two upper portions 113, wherein one of the middle portions 112 and one of the upper portions 113 are near the front cover 140, and the other of the middle portions 112 and the other of the upper portions 113 are near the rear cover 160, so as to increase the heat conduction path and accelerate the heat dissipation.

In summary, the present disclosure provides a heat dissipation device without heat dissipation fins. Since the heat sink does not include the heat dissipating fins, the heat dissipating device can further omit a waterproof member between the heat dissipating fins and other members, and thus can include a relatively small number of members. In some embodiments, the connecting element may be integrally formed with the front cover or the rear cover, which may further reduce the number of waterproof elements, for example, where only two waterproof elements may be required. Therefore, the heat dissipation device of the present disclosure can reduce the cost, increase the assembly convenience, and improve the overall waterproof and dustproof effects of the heat dissipation device.

In addition, the heat dissipation device of the present disclosure may include a locking structure and a moving structure, wherein the locking structure may be temporarily locked with the circuit device during the assembly process of the heat dissipation device, so as to reduce the possibility of deformation or displacement caused by the collision or pressing of the housing against the device, and to suppress the relative movement between the devices during the assembly process of the heat dissipation device, thereby further increasing the assembly convenience.

Furthermore, the heat sink may include a resilient thermally conductive element and a compressible thermally conductive element, the resilient thermally conductive element may tightly compress the compressible thermally conductive element. Therefore, the heat generated by the heat source can be quickly transferred to the shell with relatively high heat conductivity coefficient through the elastic heat-conducting element and the compressible heat-conducting element, so that the heat dissipation device has quick and good heat dissipation effect.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and apparatus for carrying out the same purposes or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent arrangements do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

Claims (10)

1. A heat dissipation device for a heat generating source on a circuit device, comprising:

a first heat conducting element including a lower portion, a middle portion, and an upper portion, the middle portion connecting the lower portion and the upper portion; and

a housing accommodating the first heat-conducting element;

wherein the upper portion includes a toggle structure.

2. The heat dissipating device of claim 1, wherein said upper portion further comprises a snap-fit structure.

3. The heat dissipating device of claim 2, wherein the toggle structure is a protrusion and the engaging structure is a hook, and during the assembly process of the heat dissipating device, the engaging structure can temporarily engage with the circuit component and force the toggle structure to disengage the engaging structure from the circuit component.

4. The heat dissipating device as claimed in claim 1, wherein the casing is a hollow rectangular parallelepiped, and the heat generated by the heat source is transferred to the casing sequentially via the lower portion, the middle portion and the upper portion.

5. The heat dissipating device of claim 1, wherein said housing is made of a material having a thermal conductivity greater than 100W/mK.

6. The heat dissipating device of claim 1, wherein opposite sides of the interior of the housing each include a rail, and the circuit component is disposed between the rails.

7. The heat dissipating device of claim 1, further comprising a second heat conducting element disposed on at least one of:

between the housing and the upper portion; and

between the lower part and the heat source.

8. The heat dissipating device of claim 7, wherein said second thermally conductive element is compressible.

9. The heat dissipating device of claim 1, further comprising a front cover, a front connecting member, a rear cover, a rear connecting member, wherein the front cover is connected to the housing, the front connecting member is connected to the front cover, the rear cover is connected to the housing, the rear connecting member is connected to the rear cover, the front cover is integrally formed with the front connecting member, and the rear cover is integrally formed with the rear connecting member.

10. The heat dissipating device of claim 9, further comprising a waterproof element disposed on at least one of:

between the front cover and the shell; and

the rear cover and the shell.

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