CN218496166U - Novel temperature and pressure sensor - Google Patents
Novel temperature and pressure sensor Download PDFInfo
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- CN218496166U CN218496166U CN202222877947.3U CN202222877947U CN218496166U CN 218496166 U CN218496166 U CN 218496166U CN 202222877947 U CN202222877947 U CN 202222877947U CN 218496166 U CN218496166 U CN 218496166U
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Abstract
The utility model relates to a novel temperature and pressure sensor belongs to sensor manufacturing technical field. Including having cylindrical inner chamber metal shell body, cylindrical inner chamber embeds there is the temperature sensing support of moulding plastics, the last surface detachable of the temperature sensing support of moulding plastics installs the plug, and the bottom central line of the temperature sensing support of moulding plastics is provided with the temperature sensing and moulds the shell, the inside thermistor that moulds plastics of temperature sensing and moulds the shell, the bottom of metal shell body has the bearing terminal surface of the cylindrical inner chamber lower part of shutoff, and the lower surface of bearing terminal surface is connected with hollow stud. The utility model discloses following beneficial effect has: the material cost can be reduced, and the temperature signal and the pressure signal can be transmitted at the same time. Two inner sealing pieces with different sizes are used for respectively sealing the thermosensitive injection molding bracket and the square sensitive element, so that the medium is prevented from leaking.
Description
Technical Field
The utility model relates to a novel temperature and pressure sensor belongs to sensor manufacturing technical field.
Background
A temperature sensor (temperature transducer) refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The measurement method can be divided into a contact type and a non-contact type, and the measurement method can be divided into a thermal resistor and a thermocouple according to the characteristics of sensor materials and electronic elements.
A Pressure Transducer is a device or apparatus that senses a Pressure signal and converts the Pressure signal into a usable output electrical signal according to a certain rule. A pressure sensor is usually composed of a pressure sensitive element and a signal processing unit.
The temperature sensor structures used at present are as follows:
patent No. 202221445505.5 discloses a high precision temperature sensor probe comprising: the outer shield assembly comprises an outer shield and a mounting plate assembly coaxially arranged at the top of the outer shield, the outer shield comprises an outer shield body and a scraper coaxially arranged at the bottom of the outer shield body, and a cutting edge is formed at the bottom of the scraper; the telescoping device, the symmetrical installation of telescoping device is in the bottom edge of installation plate subassembly, the top of telescoping device is run through the top of installation plate subassembly, the utility model discloses a telescoping device drives sensor probe and removes at the inner chamber of outer guard shield, strikes off the impurity of the water alkali on the metal casing surface and other adhesions on sensor probe through the scraper tangent with the metal casing on the sensor probe, improves sensor probe's precision.
The pressure sensor currently used has the following structure:
the patent number is 201810915879.0, discloses a capacitanc pressure sensor, including metal casing, outer seal ring pad, interior seal ring pad, pottery sensing element, signal processing circuit device, connector, sealed chamber, spacing chamber, plug-in components inner chamber and contact pin, one side of metal casing is equipped with the outer seal ring pad, the opposite side of metal casing is equipped with interior seal ring pad, one side of interior seal ring pad is equipped with pottery sensing element, be equipped with on the pottery sensing element signal processing circuit device.
The following defects can be seen in the use of the existing temperature sensor and pressure sensor:
1. most preparation solitary temperature sensor and pressure sensor of present domestic sensor enterprise can't satisfy the requirement that the customer integrated, and the signal is mostly analog signal, can't satisfy the demand of the multiple signal acquisition of customer.
2. The sealing property is poor.
According to the current situation of the domestic sensor, a novel temperature and pressure sensor is researched and manufactured so as to meet the diversified and integrated requirements of the market.
SUMMERY OF THE UTILITY MODEL
According to the not enough among the above prior art, the utility model discloses the technical problem who solves is: in order to solve one of the above problems, a novel temperature and pressure sensor is provided, which can reduce material cost and transmit temperature signals and pressure signals at the same time. And the thermosensitive injection molding bracket and the square sensitive element can be respectively sealed by using two inner sealing pieces with different sizes, so that the medium is prevented from leaking.
Novel temperature and pressure sensor, its characterized in that: including having cylindrical inner chamber metal casing body, the cylindrical inner chamber embeds there is the temperature sensing support of moulding plastics, the upper surface detachable of the temperature sensing support of moulding plastics installs the plug, and the bottom central line of the temperature sensing support of moulding plastics is provided with the temperature sensing and moulds the shell, the temperature sensing moulds the inside thermistor of moulding plastics of shell, the bottom of metal casing body has the bearing terminal surface of the cylindrical inner chamber lower part of shutoff, and the lower surface of bearing terminal surface is connected with hollow stud, the double-screw bolt hole that the shell passed is moulded for the temperature sensing of heat supply at hollow stud center, and has the intercommunicating pore of intercommunication cylindrical inner chamber and double-screw bolt hole on the bearing terminal surface, the temperature sensing is moulded the shell and is run through intercommunicating pore, double-screw bolt hole in proper order and is extended to the hollow stud outside, and it seals to have inner seal spare A between the lower surface of the temperature sensing support of moulding plastics and the upper surface of bearing terminal surface.
Meanwhile, temperature signals are transmitted to the circuit board through the heat-sensitive welding pins, pressure signals are converted into capacitance signals through the square sensitive elements, the circuit board and the square sensitive elements are welded together through the clamp, the capacitance signals are transmitted to the circuit board, the capacitance signals and the temperature signals are transmitted to the ECU through the lead of the plug, material cost can be reduced, the temperature signals and the pressure signals are transmitted simultaneously, two inner sealing pieces with different sizes are used for sealing the heat-sensitive injection molding support and the square sensitive elements respectively, and medium leakage is avoided.
Furthermore, a square sensitive element cavity for installing a square sensitive element is formed in the middle of the upper surface of the thermosensitive injection molding support, a circular sealing cavity for installing an inner sealing element B is formed in the center of the bottom of the square sensitive element cavity, the upper surface of the square sensitive element is connected with a circuit board through a clamp, two ends of the clamp are electrically connected with the square sensitive element and the circuit board respectively, a pressure signal is converted into a capacitance signal through the square sensitive element, the circuit board and the square sensitive element are brazed together through the clamp, the capacitance signal is transmitted to the circuit board, two groups of thermosensitive welding pins are further installed on the upper surface of the thermosensitive injection molding support and symmetrically arranged on two sides of the square sensitive element cavity, the lower portions of the thermosensitive welding pins are injected into the thermosensitive injection molding support and extend into a thermosensitive plastic shell, the thermosensitive welding pins are connected with the thermosensitive injection molding shell in a welding mode, the upper portions of the thermosensitive welding pins are connected with the circuit board in a brazing mode, and temperature signals of the thermosensitive welding pins are transmitted to the circuit board.
Further, the bottom of plug inserts in cylindrical inner chamber and installs on the support is moulded plastics to the temperature sensing through buckle detachable, the gap between plug and the metal casing body is sealed by sealed glue.
Furthermore, a plug special-shaped cavity is formed in the bottom end of the plug, a lead is arranged in the plug special-shaped cavity, the circuit board and the lead are subjected to brazing welding, the circuit board and the lead in the plug are subjected to brazing welding, and a temperature signal of the thermistor and a pressure signal of the square sensitive element are transmitted to the ECU together.
Furthermore, the hollow stud is screwed on a component to be measured, an external sealing ring mounting groove is formed in the joint of the hollow stud and the metal shell, and an external sealing ring is mounted in the external sealing ring mounting groove.
Furthermore, the conditioning chip of the circuit board is a SENT ASIC chip, after the capacitance signal is transmitted to the circuit board, the capacitance signal is converted into the SENT signal through the conditioning chip, and the SENT signal and the temperature signal are transmitted to the ECU through a lead of the plug, so that the material cost can be reduced, the temperature signal and the pressure signal can be transmitted, and the temperature and pressure sensor which can output the SENT signal required by a customer can be provided.
Compared with the prior art, the utility model discloses following beneficial effect has:
novel temperature pressure sensor, on former pressure sensor basis, increase a temperature sensing support of moulding plastics, mould plastics thermistor in the temperature sensing moulds the shell, during the use, direct submergence of temperature sensing plastics shell is in the medium, can accurate measurement temperature, temperature signal passes through the heat-sensitive welding needle simultaneously and transmits to the circuit board, pressure signal converts the electric capacity signal into through square sensitive first, the rethread clamp is in the same place circuit board and square sensitive first welding, transmit the electric capacity signal on the circuit board, together with temperature signal through the lead wire transmission of plug for ECU, can reduce material cost, transmit temperature signal and pressure signal simultaneously.
Novel temperature pressure sensor uses the inner seal piece of two not unidimensional to seal respectively to the support and the square sensitive unit of moulding plastics of temperature sensing, guarantees that the medium does not leak.
Novel temperature pressure sensor, the regulation chip of circuit board is the SENT ASIC chip, and back on electric capacity signal transmission reaches the circuit board, converts electric capacity signal into the SENT signal through the regulation chip, transmits ECU for through the lead wire of plug together with temperature signal, can reduce material cost, transmits temperature signal and pressure signal simultaneously, can provide the temperature pressure sensor of the SENT signal output of customer's demand again.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a schematic view illustrating the overall structure of the present invention;
FIG. 2 is an exploded view of the internal components of the present invention for purposes of illustration;
fig. 3 is a schematic view of the metal shell of the present invention;
fig. 4 is a schematic diagram of a plug for illustrating the present invention;
fig. 5 is a schematic view illustrating a thermosensitive injection-molded bracket according to the present invention.
In the figure: 1. the device comprises a metal outer shell 2, a plug 3, a heat-sensitive injection molding support 4, an inner sealing element A5, an inner sealing element B6, a square sensitive element 7, a circuit board 8, a clamp 9, a sealant 10, an external sealing ring 11, a plug special-shaped cavity 12, a cylindrical inner cavity 13, a lead 14, a square sensitive element cavity 15, a circular sealing cavity 16, a heat-sensitive welding needle 17 and a heat-sensitive plastic shell.
Detailed Description
The invention will be further described with reference to the accompanying drawings:
the present invention is further described with reference to the following specific embodiments, which are not intended to limit the scope of the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Examples
As shown in fig. 1-5, novel temperature and pressure sensor, including having cylindrical inner chamber 12 metal shell body 1, cylindrical inner chamber 12 embeds there is the temperature sensing support 3 of moulding plastics, the upper surface detachable of temperature sensing support 3 of moulding plastics installs plug 2, and the bottom central line of temperature sensing support 3 of moulding plastics is provided with temperature sensing plastic shell 17, the inside thermistor that moulds plastics of temperature sensing plastic shell 17, the bottom of metal shell body 1 has the bearing terminal surface of the cylindrical inner chamber 12 lower part of shutoff, and the lower surface of bearing terminal surface is connected with hollow stud, the stud hole that hollow stud center for the temperature sensing plastic shell 17 of heat supply passed, and has the intercommunicating pore of the cylindrical inner chamber 12 of intercommunication and stud hole on the bearing terminal surface, temperature sensing plastic shell 17 runs through the intercommunicating pore in proper order, and the stud hole extends to the hollow stud outside, has interior sealing member A4 to seal between the upper surface of temperature sensing plastic support 3's lower surface and bearing terminal surface.
Preferably, a square sensitive element cavity 14 for mounting the square sensitive element 6 is formed in the middle of the upper surface of the heat-sensitive injection molding support 3, a circular sealing cavity 15 for mounting the inner sealing element B5 is formed in the center of the bottom of the square sensitive element cavity 14, the upper surface of the square sensitive element 6 is connected with a circuit board 7 through a clamp 8, two ends of the clamp 8 are electrically connected with the square sensitive element 6 and the circuit board 7 respectively, a pressure signal is converted into a capacitance signal through the square sensitive element 6, the circuit board and the square sensitive element are brazed together through the clamp, the capacitance signal is transmitted to the circuit board, two groups of heat-sensitive welding pins 16 are further mounted on the upper surface of the heat-sensitive injection molding support 3 and symmetrically arranged on two sides of the square sensitive element cavity 14, the lower portions of the heat-sensitive welding pins 16 are injected into the heat-sensitive injection molding support 3 and extend into the heat-sensitive plastic shell 17, the heat-sensitive resistors are connected with the lower portions of the heat-sensitive welding pins 16 through welding, the upper portions of the heat-sensitive welding pins 16 are brazed with the circuit board 7, and the temperature signals of the heat-sensitive resistors are transmitted to the circuit board 7.
Preferably, the bottom of the plug 2 is inserted into the cylindrical inner cavity 12 and detachably mounted on the thermosensitive injection molding bracket 3 through a buckle, and a gap between the plug 2 and the metal outer shell 1 is sealed by the sealant 9.
Preferably, the bottom end of the plug 2 is provided with a plug special-shaped cavity 11, a lead 13 is arranged in the plug special-shaped cavity 11, the circuit board 7 is soldered with the lead 13 in the plug 2, and a temperature signal of the thermistor and a pressure signal of the square sensitive element are transmitted to the ECU together.
Preferably, the hollow stud is screwed on a component to be measured, an external sealing ring installation groove is formed at the joint of the hollow stud and the metal outer shell 1, and an external sealing ring 10 is installed in the external sealing ring installation groove.
Preferably, the conditioning chip of the circuit board is a SENT ASIC chip, after the capacitance signal is transmitted to the circuit board, the capacitance signal is converted into the SENT signal through the conditioning chip, and the SENT signal and the temperature signal are transmitted to the ECU through a lead of a plug, so that the material cost can be reduced, the temperature signal and the pressure signal can be transmitted, and the temperature and pressure sensor capable of outputting the SENT signal required by a customer can be provided.
The working principle is as follows:
the metal outer shell 1 in fig. 2 is provided with a cylindrical cavity 12, the thermosensitive injection molding support 3 is arranged in the cylindrical cavity 12 in the metal outer shell 1, the thermosensitive plastic shell 17 sequentially penetrates through the communication hole and the stud inner hole to extend to the outer side of the hollow stud, and an inner sealing element A4 is arranged between the lower surface of the thermosensitive injection molding support 3 and the upper surface of the bearing end face for sealing, so that the first sealing is realized.
And an inner sealing piece B5 and a square sensitive element 6 are assembled in a round sealing cavity 15 of the heat-sensitive injection molding bracket 3 to realize second sealing.
The circuit board 7 in fig. 2 is soldered to the square sensor element 6 by means of a clip 8. A thermistor and a thermosensitive welding pin 16 are injected in a thermosensitive plastic shell 17 of the thermosensitive injection molding support 3, the thermistor is connected with the lower portion of the thermosensitive welding pin 16 in a welding mode, the upper portion of the thermosensitive welding pin 16 is connected with the circuit board 7 in a welding mode, temperature signals of the thermistor are transmitted to the circuit board 7, and then transmitted to the ECU through a lead 13. The pins of the lead 13 of the plug 2 are defined as power supply, ground, send signal output and temperature signal output respectively.
The utility model discloses the inside inner chamber of cylindrical in the metal casing body 1 is equipped with inner seal spare A4, and the compression is sealed for the axial after the assembly of inner seal spare A4, and the material is FKM.
The thermosensitive welding pins 16 in the thermosensitive injection molding support 3 are made of copper alloy materials, the number of the thermosensitive welding pins is two, the bottoms of the thermosensitive welding pins are respectively connected with two pins of a thermistor with a negative temperature coefficient, the connecting mode is resistance welding, and then PPS (polyphenylene sulfide) plastic is used for injection molding in the thermosensitive plastic shell.
The upper part of the heat-sensitive welding pin 16 is exposed out of the heat-sensitive plastic shell 17 and is soldered with the circuit board 7.
As shown in fig. 2, the heat-sensitive plastic case 17 passes through the inner seal A4 and is pressed above the inner seal A4, and the heat-sensitive plastic case continues to pass through the through hole inside the screw thread of the metal outer case 1, covers the thermistor and is exposed to the external medium. The metal outer shell 1 is internally provided with an annular step which is used for controlling the axial compression ratio of the inner sealing element A4, and the compression ratio is about 30 percent.
As shown in fig. 2 and 5, the inner sealing member B5 is installed in a circular sealing chamber 15 in the thermistor support 3, and a circular through hole is formed in the bottom of the circular sealing chamber 15 for the medium to enter and transmit the pressure of the medium. The square sensing element 6 is a ceramic capacitor part, is placed in the square sensing element cavity 14 of the heat-sensitive injection molding bracket 3 and is pressed above the inner sealing element B5 for axial sealing. The material of the inner sealing element B5 is FKM, and the compression rate after assembly is controlled to be about 30%.
The square sensor cell 6 is internally printed with electrodes extending to the external surface, which is printed with pads. The surface of the circuit board 7 is also printed with a pad, as shown in fig. 2, a hoop 8 is arranged to weld the square sensitive element 6 and the circuit board 7, solder is embedded in the hoop 8, and the three components are welded together in a reflow soldering manner.
The square sensitive element 7 senses the pressure of a medium, converts a pressure signal into a capacitance signal through a C-P conversion relation, processes the capacitance signal through a conditioning chip on a circuit board, converts the capacitance signal into an SENT signal, performs brazing welding on the circuit board 7 and a lead 13 in the plug 2, and transmits the signal to the ECU through a vehicle-mounted wiring harness.
The utility model discloses on former pressure sensor basis, increase a temperature sensing support of moulding plastics, mould plastics thermistor in the shell is moulded to the temperature sensing, during the use, the direct submergence of the shell is moulded to the temperature sensing in the medium, can accurate measurement temperature, and temperature signal passes through the heat-sensitive welding needle simultaneously and transmits to the circuit board. Pressure signal converts capacitance signal into through square sensitive unit, and the rethread clamp is in the same place circuit board and square sensitive unit welding, with capacitance signal transmission to the circuit board on, convert the SENT signal into through the chip of taking care of on the circuit board, give ECU with temperature signal together through the lead wire transmission of plug, can reduce material cost, transmit temperature signal and pressure signal simultaneously, can provide the temperature pressure sensor of the SENT signal output of customer's demand again.
The utility model discloses use the ASIC chip, this chip is a signal conditioning who satisfies AEC-Q100 standard's high integration and uses the chip for capacitanc sensor.
Interpretation of related terms:
the ASIC collects the capacitance value of the ceramic capacitor through a C/V converter and converts the capacitance value into a voltage signal, a 24-bit ADC forms a pressure measurement signal measurement channel after C/V conversion, the voltage signal is subjected to analog-to-digital conversion, the ASIC also has an auxiliary temperature measurement channel formed by the 24-bit ADC, the signal of an external temperature sensor is collected and digitally converted, then the digitized temperature signal and pressure signal are transmitted to a built-in MCU, the built-in MCU supports zero point of the sensor, second-order temperature drift calibration of sensitivity and nonlinear calibration of the highest third order, the calibration precision can reach within 0.1%, and a calibration coefficient is stored in a group of EEPROM which can be programmed for many times. The calibrated data is transmitted to the send controller and the send driver, and the frame of the send protocol and the specific send frame are output to the ECU, so that the send also supports the functions of overvoltage and back pressure protection, and various diagnoses
SENT is a single-wire unidirectional transmission protocol, and encoding transmission is carried out by taking a nibble (nibble) as a basic unit. The utility model discloses what the SENT interface fast channel of frame bore is the transmission of main signal pressure data and temperature data. Specifically, the nibbles 1-3 form a fast channel 1, which transmits pressure signals, which are composed of 12 bits, the measured value is from minimum 0 to 4095, the output number 0 indicates that the chip is initializing, 1 indicates output low clamp, 2-4087 indicates normal pressure output, 4088 indicates high clamp, 4089-4095 indicates diagnostic code, and the pressure range can be adapted to various pressure ranges according to different characteristic curves, such as intake pressure measurement of 0-1bar, engine oil pressure measurement of 0-10bar, and high pressure common rail pressure measurement of up to 2500 bar. Nibbel 4-Nibbel 6 form a fast channel 2, transmit temperature signals, similar to the fast channel 1, and are also composed of 12 bits, and the measured temperature range can cover-73.025-437.85 ℃.
The transmission sequence of the send interface channel data stream is generated according to the Serial Message circulation schedule. A complete cycle schedule is composed of no more than 64 Serial messages, and can be used for transmitting information including auxiliary measurement channel information and other parameter information about each fast and slow channel. And the ASIC completes the generation of the circular scheduling table through the built-in MCU. The MCU program is pre-stored in a chip ROM and generated based on Enhanced Serial Message Format coding, wherein the data content corresponding to the Message ID comprises temperature channel data, diagnostic error codes, pressure calibration coefficients related to a fast channel and the like. The 36 Serial messages are sequentially combined into the fast channel pressure data according to the existing coding format for transmission.
The basic principles, main features and advantages of the present invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
The parts of the present invention not described in detail are known to those skilled in the art.
Claims (6)
1. A novel temperature and pressure sensor is characterized in that: including having cylindrical inner chamber metal casing body, the cylindrical inner chamber embeds there is the temperature sensing support of moulding plastics, the upper surface detachable of the temperature sensing support of moulding plastics installs the plug, and the bottom central line of the temperature sensing support of moulding plastics is provided with the temperature sensing and moulds the shell, the temperature sensing moulds the inside thermistor of moulding plastics of shell, the bottom of metal casing body has the bearing terminal surface of the cylindrical inner chamber lower part of shutoff, and the lower surface of bearing terminal surface is connected with hollow stud, the double-screw bolt hole that the shell passed is moulded for the temperature sensing of heat supply at hollow stud center, and has the intercommunicating pore of intercommunication cylindrical inner chamber and double-screw bolt hole on the bearing terminal surface, the temperature sensing is moulded the shell and is run through intercommunicating pore, double-screw bolt hole in proper order and is extended to the hollow stud outside, and it seals to have inner seal spare A between the lower surface of the temperature sensing support of moulding plastics and the upper surface of bearing terminal surface.
2. The novel temperature and pressure sensor as claimed in claim 1, wherein a square sensing element cavity for mounting a square sensing element is formed in the middle of the upper surface of the heat-sensitive injection molding support, a circular sealing cavity for mounting an inner sealing element B is formed in the center of the bottom of the square sensing element cavity, the upper surface of the square sensing element is connected with a circuit board through a clamp, two ends of the clamp are electrically connected with the square sensing element and the circuit board respectively, a pressure signal is converted into a capacitance signal through the square sensing element, the circuit board and the square sensing element are brazed together through the clamp, the capacitance signal is transmitted to the circuit board, two groups of heat-sensitive welding pins are further mounted on the upper surface of the heat-sensitive injection molding support and symmetrically arranged on two sides of the square sensing element cavity, the lower portions of the heat-sensitive welding pins are injected into the heat-sensitive injection molding support and extend into the heat-sensitive plastic shell, the upper portions of the heat-sensitive welding pins are connected with the circuit board through welding, the upper portions of the heat-sensitive welding pins are brazed with the circuit board, the upper portions of the heat-sensitive welding pins are connected with the circuit board through welding, and the temperature signal of the heat-sensitive welding pins is transmitted to the circuit board.
3. The novel temperature and pressure sensor as claimed in claim 2, wherein the bottom of the plug is inserted into the cylindrical inner cavity and detachably mounted on the heat-sensitive injection-molded bracket through a buckle, and the gap between the plug and the metal outer shell is sealed by a sealant.
4. The novel temperature and pressure sensor according to claim 3, characterized in that the bottom end of the plug is provided with a plug special-shaped cavity, a lead is arranged in the plug special-shaped cavity, the circuit board and the lead are soldered, the circuit board and the lead inside the plug are soldered, and temperature signals of the thermistor and pressure signals of the square sensing element are transmitted to the ECU together.
5. The novel temperature and pressure sensor according to claim 1, wherein the hollow stud is screwed on a component to be measured, an external sealing ring installation groove is formed at the joint of the hollow stud and the metal outer shell, and an external sealing ring is installed in the external sealing ring installation groove.
6. The novel temperature and pressure sensor according to claim 4, wherein the conditioning chip of the circuit board is a SENT ASIC chip.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222877947.3U CN218496166U (en) | 2022-10-31 | 2022-10-31 | Novel temperature and pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222877947.3U CN218496166U (en) | 2022-10-31 | 2022-10-31 | Novel temperature and pressure sensor |
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| CN218496166U true CN218496166U (en) | 2023-02-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116972915A (en) * | 2023-09-25 | 2023-10-31 | 广东润宇传感器股份有限公司 | Integral pressure and temperature transmitter |
| CN117168546A (en) * | 2023-11-02 | 2023-12-05 | 苏州敏芯微电子技术股份有限公司 | Temperature and pressure combined sensor, preparation method thereof and packaging structure |
-
2022
- 2022-10-31 CN CN202222877947.3U patent/CN218496166U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116972915A (en) * | 2023-09-25 | 2023-10-31 | 广东润宇传感器股份有限公司 | Integral pressure and temperature transmitter |
| CN116972915B (en) * | 2023-09-25 | 2023-12-19 | 广东润宇传感器股份有限公司 | Integral pressure and temperature transmitter |
| CN117168546A (en) * | 2023-11-02 | 2023-12-05 | 苏州敏芯微电子技术股份有限公司 | Temperature and pressure combined sensor, preparation method thereof and packaging structure |
| CN117168546B (en) * | 2023-11-02 | 2024-01-23 | 苏州敏芯微电子技术股份有限公司 | Temperature and pressure combined sensor, preparation method thereof and packaging structure |
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