CN218483120U - Waterproof heat dissipation type microcrystalline glass electric heating baking tray - Google Patents
Waterproof heat dissipation type microcrystalline glass electric heating baking tray Download PDFInfo
- Publication number
- CN218483120U CN218483120U CN202221553820.XU CN202221553820U CN218483120U CN 218483120 U CN218483120 U CN 218483120U CN 202221553820 U CN202221553820 U CN 202221553820U CN 218483120 U CN218483120 U CN 218483120U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- radiator
- heat
- microcrystalline glass
- electric heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000011521 glass Substances 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 17
- 238000005485 electric heating Methods 0.000 title claims description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 3
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 4
- 238000010411 cooking Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a waterproof heat dissipation type microcrystalline glass electric heat overware relates to the overware field, including the overware body, this internal circuit board cavity that is used for installing the circuit board that is provided with of overware, the outside radiator hole of intercommunication is seted up to the circuit board cavity, and the downthehole sealed mounting of radiator has and is used for the radiator with the outside transmission of heat in the circuit board cavity. The utility model discloses a heat in the form of radiator is with the circuit board cavity outwards transmits to guarantee that the components and parts on circuit board and the circuit board in the circuit board cavity normally work, and do not have the hole between circuit board cavity and the outside, also do not have the space, water can not get into the circuit board cavity during washing, and waterproof nature is good, can prevent to cause the circuit short circuit because of intaking, and the security is good.
Description
Technical Field
The utility model relates to an overware field, in particular to waterproof heat dissipation type microcrystalline glass electric heat overware.
Background
The continuous innovation of modern cooking appliances brings great convenience to the family life of residents, and the microcrystalline glass electric heating baking tray is a novel baking tray, has the advantages of health, sanitation, environmental protection, fast temperature rise, high heat efficiency and the like, and is popular with consumers.
The microcrystalline glass electric heat overware during operation temperature is than higher, and the below of microcrystalline glass and electric heat membrane that the circuit board is located microcrystalline glass electric heat overware, it is nearer, so the temperature is than higher, components and parts on circuit board and the circuit board are easy because the high temperature and unable normal work, for components and parts normal work on circuit board and the circuit board, need dispel the heat, current radiating mode, mainly be radiator fan cooperation louvre, but this kind of radiating mode waterproof performance is poor, and microcrystalline glass electric heat overware belongs to cooking utensil, need wash after the use, and at abluent in-process, water easily gets into inside circuit board through the louvre, arouse the circuit short circuit, burn out equipment, cause the incident.
SUMMERY OF THE UTILITY MODEL
The utility model provides a waterproof heat dissipation type microcrystalline glass electric heat overware has solved the heat radiation structure of current microcrystalline glass electric heat overware, and waterproof performance is poor, and during the washing, inside water gets into easily, arouses the circuit short circuit, causes equipment to burn out, causes defects such as incident.
The technical scheme of the utility model is realized like this:
the utility model provides a waterproof heat dissipation type microcrystalline glass electric heat overware, includes the overware body, this internal circuit board cavity that is used for installing the circuit board that is provided with of overware, and the outside radiator hole of intercommunication is seted up to the circuit board cavity, and the downthehole sealing installation of radiator is used for the radiator with the outside transmission of the heat in the circuit board cavity.
As a further technical scheme, the heat radiator is a finned heat radiator.
As a further technical scheme, the finned radiator comprises a radiating seat and a plurality of outer radiating fins fixed on the outer side surface of the radiating seat.
As a further technical scheme, a plurality of inner heat absorption sheets are fixed on the inner side surface of the heat dissipation seat.
As a further technical scheme, a circuit board is installed in the circuit board cavity, and components needing cooling on the circuit board are in contact with the inner surface of the radiator.
As a further technical scheme, the baking tray body comprises a shell, microcrystalline glass is fixedly mounted on the upper surface of the shell, an electric heating film is fixed on the lower surface of the microcrystalline glass, a circuit board cavity is arranged in the shell, the circuit board is electrically connected with the electric heating film, a control board cavity is further arranged in the shell, a control board is mounted in the control board cavity, and the control board is electrically connected with the circuit board.
The utility model has the advantages that: the utility model discloses a heat in the form of radiator is with the circuit board cavity outwards transmits to guarantee that the components and parts on circuit board and the circuit board in the circuit board cavity normally work, and do not have the hole between circuit board cavity and the outside, also do not have the space, water can not get into the circuit board cavity during the washing, and waterproof nature is good, can prevent to cause the circuit short circuit because of intaking, and the security is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of example 1;
FIG. 2 is a schematic view of another angle structure of embodiment 1;
FIG. 3 is a schematic view of the internal structure of embodiment 1;
FIG. 4 is a schematic sectional view showing the structure of example 1;
fig. 5 is a schematic structural view of a heat sink in embodiment 1;
fig. 6 is a connection diagram of the heat sink and a component requiring temperature reduction on the circuit board in embodiment 2;
fig. 7 is a schematic structural view of a heat sink in embodiment 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-4, a waterproof heat dissipation type microcrystalline glass electric heating baking tray comprises a baking tray body 1, wherein a circuit board cavity 11 used for installing a circuit board 3 is arranged in the baking tray body 1, a heat sink hole 12 communicated with the outside is formed in the circuit board cavity 11, and a heat sink 2 used for transferring heat in the circuit board cavity 11 outwards is installed in the heat sink hole 12 in a sealing mode.
As a further technical solution, the heat sink 2 is a finned heat sink. Radiator 2 can choose for use copper or aluminum alloy's radiator, radiator 2 is fixed in radiator hole 12 through sealed glue.
Referring to fig. 5, as a further technical solution, the finned radiator 2 includes a radiator seat 21 and a plurality of outer radiating fins 22 fixed on an outer side surface of the radiator seat, and the outer radiating fins 22 can better radiate heat to the outside.
As a further technical scheme, the baking tray body 1 comprises a casing 13, wherein the upper surface of the casing 13 is fixedly provided with microcrystalline glass 4, the lower surface of the microcrystalline glass 4 is fixedly provided with an electrothermal film 5, a circuit board cavity 11 is arranged in the casing 13, the circuit board 3 is electrically connected with the electrothermal film 5, a control board cavity 14 is further arranged in the casing 13, a control board 6 is arranged in the control board cavity 14, and the control board 6 is electrically connected with the circuit board 3.
The utility model discloses a heat in the circuit board cavity 11 of the form of radiator 2 outwards transmits to guarantee that the circuit board in the circuit board cavity 11 and the components and parts on the circuit board 11 normally work, and do not have the hole between circuit board cavity 11 and the outside, also do not have the space, water can not get into circuit board cavity 11 during the washing, and waterproof nature is good, can prevent to cause the circuit short circuit because of intaking, and the security is good.
Example 2
Referring to fig. 6, the present embodiment is different from embodiment 1 in that: install circuit board 3 in the circuit board cavity, the last part 31 that needs the cooling of circuit board 3 with the internal surface contact of radiator 2 can directly carry out the radiating temperature to the part 31 that needs the cooling, and is more direct, and the effect is better.
Example 3
Referring to fig. 7, the present embodiment is different from embodiment 1 in that: the inner side surface of the heat dissipation seat 21 is fixed with a plurality of inner heat absorption sheets 23, and the inner heat absorption sheets 23 are added to absorb heat in the circuit board cavity 11 more quickly, and then the heat is dissipated outwards through the outer heat dissipation sheets 22.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a waterproof heat dissipation type microcrystalline glass electric heat overware which characterized in that: including the overware body, this internal circuit board cavity that is used for installing the circuit board that is provided with of overware, the outside radiator hole of intercommunication is seted up to the circuit board cavity, and the downthehole sealing installation of radiator is used for the radiator with the outside transmission of heat in the circuit board cavity.
2. The waterproof heat-dissipation type microcrystalline glass electric heating baking tray as claimed in claim 1, wherein: the radiator is a fin type radiator.
3. The waterproof heat-dissipation type microcrystalline glass electric heating baking tray as claimed in claim 2, wherein: the finned radiator comprises a radiating seat and a plurality of outer radiating fins fixed on the outer side surface of the radiating seat.
4. The waterproof heat-dissipation type microcrystalline glass electric heating baking tray as claimed in claim 3, wherein: and a plurality of inner heat absorption sheets are fixed on the inner side surface of the heat dissipation seat.
5. The waterproof heat-dissipation type microcrystalline glass electric heating bakeware of any one of claims 1-3, wherein: and a circuit board is arranged in the circuit board cavity, and a part needing cooling on the circuit board is in contact with the inner surface of the radiator.
6. The waterproof heat-dissipation type microcrystalline glass electric heating baking tray as claimed in claim 1, wherein: the baking tray body comprises a shell, microcrystalline glass is fixedly mounted on the upper surface of the shell, an electric heating film is fixed on the lower surface of the microcrystalline glass, a circuit board cavity is arranged in the shell, the circuit board is electrically connected with the electric heating film, a control board cavity is further arranged in the shell, a control board is mounted in the control board cavity, and the control board is electrically connected with the circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221553820.XU CN218483120U (en) | 2022-06-21 | 2022-06-21 | Waterproof heat dissipation type microcrystalline glass electric heating baking tray |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221553820.XU CN218483120U (en) | 2022-06-21 | 2022-06-21 | Waterproof heat dissipation type microcrystalline glass electric heating baking tray |
Publications (1)
Publication Number | Publication Date |
---|---|
CN218483120U true CN218483120U (en) | 2023-02-14 |
Family
ID=85163948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221553820.XU Expired - Fee Related CN218483120U (en) | 2022-06-21 | 2022-06-21 | Waterproof heat dissipation type microcrystalline glass electric heating baking tray |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN218483120U (en) |
-
2022
- 2022-06-21 CN CN202221553820.XU patent/CN218483120U/en not_active Expired - Fee Related
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230214 |
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CF01 | Termination of patent right due to non-payment of annual fee |