CN218417093U - Low resistance testing arrangement - Google Patents

Low resistance testing arrangement Download PDF

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Publication number
CN218417093U
CN218417093U CN202222304390.4U CN202222304390U CN218417093U CN 218417093 U CN218417093 U CN 218417093U CN 202222304390 U CN202222304390 U CN 202222304390U CN 218417093 U CN218417093 U CN 218417093U
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Prior art keywords
heat
heat dissipation
circulating pump
plate
main body
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CN202222304390.4U
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Chinese (zh)
Inventor
邓京宁
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Wuxi Betteri Electronic Technology Co ltd
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Wuxi Betteri Electronic Technology Co ltd
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Abstract

The utility model relates to the technical field of testing instruments, in particular to a low-resistance testing device, which comprises a testing box main body, wherein the back of a circuit board inside the testing box main body is sequentially provided with a heat conducting plate and a heat radiating plate, the heat radiating plate is provided with a coiled pipe, one end of the coiled pipe is connected with the output end of a micro circulating pump, the other end of the coiled pipe is communicated with a cooling liquid box, the top of the cooling liquid box is provided with the micro circulating pump, so that the input end of the micro circulating pump is communicated with the cooling liquid box; and a plurality of air inlet fans and exhaust fans are respectively and linearly embedded in the left side wall and the right side wall of the test box main body. In order to solve above-mentioned current heat radiation structure and adopt the installation heat dissipation fan to carry out radiating mode to test instrument incasement portion, can cause the inside circuit board temperature of test instrument to rise, shortened electronic components's on the circuit board problem of life.

Description

Low resistance testing arrangement
Technical Field
The utility model relates to a test instrument technical field, in particular to low resistance testing arrangement.
Background
The resistance tester is widely applied to the occasions of electrical safety inspection, ground connection engineering completion inspection and the like, and has various types, wherein the direct current low resistance tester adopts a four-terminal measurement method to be specially used for measuring the low direct current resistance. However, the existing heat dissipation structure adopts a mode of installing a heat dissipation fan to dissipate heat inside the test instrument box, so that the temperature of a circuit board inside the test instrument box is increased, and the service life of electronic components on the circuit board is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model provides a low resistance testing arrangement to solve above-mentioned current heat radiation structure and adopt the installation heat dissipation fan to carry out radiating mode to the test instrument incasement portion, can cause the inside circuit board temperature of test instrument to rise, shortened electronic components's on the circuit board problem of life.
The utility model discloses a following technical scheme realizes:
a low-resistance testing device comprises a testing box main body, wherein a heat conducting plate and a heat radiating plate are sequentially arranged on the back of a circuit board in the testing box main body, a coiled pipe is distributed on the heat radiating plate, one end of the coiled pipe is connected with the output end of a micro circulating pump, the other end of the coiled pipe is communicated with a cooling liquid box, and the micro circulating pump is mounted at the top of the cooling liquid box, so that the input end of the micro circulating pump is communicated with the cooling liquid box; and a plurality of air inlet fans and exhaust fans are respectively and linearly embedded in the left side wall and the right side wall of the test box main body.
Preferably, the heat conducting plate is made of a heat conducting silicone grease plate material, and the heat dissipation plate is made of a copper alloy plate material.
Preferably, the serpentine pipe is in a multi-pass U-shaped pipe structure, and is made of brass radiating pipes.
Preferably, the heat dissipation plate comprises a heat dissipation substrate and heat dissipation fins, and the back of the heat dissipation substrate is linearly provided with a plurality of the heat dissipation fins, so that the serpentine tubes are respectively arranged along the heat dissipation fins.
Preferably, the air conditioner further comprises a PLC controller arranged outside, and the PLC controller is electrically connected with the micro circulating pump, the air inlet fan and the exhaust fan respectively.
Compared with the prior art, the utility model, its beneficial effect does:
through the work of the air inlet fan and the exhaust fan that set up, can drive outside air and flow through the inside back that gets into the test box main part of air inlet fan, take away the inside heat of test box main part, discharge through the exhaust fan can, the radiating purpose of forced air cooling has been realized, combine the miniature circulating pump of the aforesaid setting, control miniature circulating pump work, the coolant liquid that drives the inside storage of coolant liquid incasement portion flows and circulation reflux to the coolant liquid incasement along the coiled pipe is inside, after the heat exchange is carried out to the heat on coolant liquid and the heating panel in the coiled pipe, can reach the purpose of cooling down to the heat on the heating panel, and then through the radiating dual mode of above-mentioned forced air cooling heat dissipation and coolant liquid heat exchange, the radiating effect has greatly been improved, make the temperature on the circuit board can cool down rapidly, avoid the life-span of electronic components on the circuit board to shorten.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a left side view of the present invention;
fig. 2 is a right side view of the present invention;
FIG. 3 is a front view of the heat-conducting plate and the heat-dissipating plate of the present invention;
fig. 4 is a back view of the structure of the heat conducting plate and the heat dissipating plate of the present invention.
In the figure: 1-test box main body, 2-heat conducting plate, 3-heat radiating plate, 31-heat radiating base plate, 32-heat radiating fins, 4-serpentine tube, 5-micro circulating pump, 6-cooling liquid box, 7-air inlet fan and 8-exhaust fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present embodiment provides a technical solution of a low resistance testing apparatus, including a testing box main body 1, a heat conducting plate 2 and a heat dissipating plate 3 are sequentially disposed on the back of a circuit board inside the testing box main body 1, a coiled pipe 4 is disposed on the heat dissipating plate 3, one end of the coiled pipe 4 is connected to an output end of a micro-circulation pump 5, and the other end is communicated with a cooling liquid tank 6, and the top of the cooling liquid tank 6 is mounted with the micro-circulation pump 5, so that an input end of the micro-circulation pump 5 is communicated with the cooling liquid tank 6; a plurality of air inlet fans 7 and a plurality of exhaust fans 8 are respectively embedded in the left side wall and the right side wall of the test box main body 1 in a linear mode. The air inlet fan 7 and the exhaust fan 8 work through the above setting, can drive outside air and flow through the air inlet fan 7 and get into the inside back of test box main part 1, take away the heat of the inside of test box main part 1, discharge through the exhaust fan 8 can, the radiating purpose of forced air cooling has been realized, combine the miniature circulating pump 5 of the above-mentioned setting, control miniature circulating pump 5 work, the coolant liquid that drives the inside storage of coolant liquid case 6 flows and circulation backward flow to the coolant liquid case 6 along the inside of 4 coiled pipes, after the heat exchange is carried out to the coolant liquid on 4 coiled pipes and the heating panel 3, can reach the purpose of cooling down the heat on the heating panel 3, and then through the radiating two kinds of modes of above-mentioned forced air cooling heat dissipation and coolant liquid heat exchange, the radiating effect has greatly been improved, make the temperature on the circuit board can cool down rapidly, avoid the life-span of the electronic components on the circuit board to shorten.
In this embodiment, the heat conducting plate 2 is made of a heat conducting silicone plate, and the heat dissipating plate 3 is made of a copper alloy plate.
The serpentine pipe 4 is a multi-pass U-shaped pipe structure, and the serpentine pipe 4 is made of brass radiating pipes, so that the radiating contact area between the serpentine pipe 4 and the radiating plate 3 is further increased.
The heat dissipation plate 3 includes a heat dissipation substrate 31 and heat dissipation fins 32, the back of the heat dissipation substrate 31 is linearly provided with a plurality of heat dissipation fins 32, so that the serpentine tubes 4 are respectively arranged along the heat dissipation fins 32, and the heat dissipation effect of the heat dissipation plate 3 is improved.
Still include the PLC controller of outside setting, the PLC controller links to each other with micro-circulating pump 5, air inlet fan 7 and 8 electrical property of exhaust fan respectively, is convenient for control micro-circulating pump 5, air inlet fan 7 and exhaust fan 8.
The control mode of electrical components that above-mentioned relate to is controlled through the PLC controller rather than supporting control terminal, and control circuit can realize through the simple programming of technical staff in this field, belongs to the common general knowledge in this field, only uses it, does not improve it, and the utility model discloses mainly be used for protecting mechanical device, so the utility model discloses no longer detail control mode and circuit connection are repeated.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (2)

1. A low-resistance testing device comprises a testing box main body (1), and is characterized in that a heat conducting plate (2) and a heat radiating plate (3) are sequentially arranged on the back of a circuit board in the testing box main body (1), a coiled pipe (4) is distributed on the heat radiating plate (3), one end of the coiled pipe (4) is connected with the output end of a micro circulating pump (5), the other end of the coiled pipe is communicated with a cooling liquid tank (6), the micro circulating pump (5) is installed at the top of the cooling liquid tank (6), and the input end of the micro circulating pump (5) is communicated with the cooling liquid tank (6); a plurality of air inlet fans (7) and a plurality of exhaust fans (8) are linearly embedded in the left side wall and the right side wall of the test box main body (1) respectively;
the heat conducting plate (2) is made of a heat conducting silicone plate material, and the heat radiating plate (3) is made of a copper alloy plate material;
the serpentine pipe (4) is arranged in a multi-pass U-shaped pipe structure, and the serpentine pipe (4) is made of brass radiating pipes;
the heat dissipation plate (3) comprises a heat dissipation substrate (31) and a plurality of heat dissipation fins (32), wherein the heat dissipation fins (32) are linearly arranged on the back of the heat dissipation substrate (31), so that the serpentine tubes (4) are respectively arranged along the heat dissipation fins (32).
2. The low resistance testing device according to claim 1, further comprising an externally disposed PLC controller, wherein the PLC controller is electrically connected to the micro circulation pump (5), the air intake fan (7) and the exhaust fan (8), respectively.
CN202222304390.4U 2022-08-30 2022-08-30 Low resistance testing arrangement Active CN218417093U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222304390.4U CN218417093U (en) 2022-08-30 2022-08-30 Low resistance testing arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222304390.4U CN218417093U (en) 2022-08-30 2022-08-30 Low resistance testing arrangement

Publications (1)

Publication Number Publication Date
CN218417093U true CN218417093U (en) 2023-01-31

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ID=85030976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222304390.4U Active CN218417093U (en) 2022-08-30 2022-08-30 Low resistance testing arrangement

Country Status (1)

Country Link
CN (1) CN218417093U (en)

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