CN218417055U

CN218417055U - Auxiliary heat dissipation device of electromechanical equipment

Info

Publication number: CN218417055U
Application number: CN202221404250.8U
Authority: CN
Inventors: 吴鹏
Original assignee: Dalian Rongsheng Electromechanical Engineering Co ltd
Current assignee: Dalian Rongsheng Electromechanical Engineering Co ltd
Priority date: 2022-06-07
Filing date: 2022-06-07
Publication date: 2023-01-31
Anticipated expiration: 2032-06-07

Abstract

The utility model provides an electromechanical device's supplementary heat abstractor, relate to supplementary heat abstractor technical field, including the electromechanical case body, the outside cover of electromechanical case body is equipped with the heat dissipation case, the inboard fixed mounting of heat dissipation case has the heat-conducting plate, the one end and the electromechanical case body of heat-conducting plate offset, one side fixed mounting of heat-conducting plate has a plurality of heat radiation fins, heat radiation fins's one end all runs through the heat dissipation case and extends to inside, the heat dissipation incasement portion inlays between a plurality of heat radiation fins and establishes and install the cooling tube, the top fixed mounting of electromechanical case body has the water tank, the top of water tank is equipped with the refrigeration case, the top of refrigeration case is inlayed and is installed a pair of heat dissipation fan, the bottom of refrigeration case inlays to establish and installs the semiconductor refrigeration piece, the bottom fixed mounting of semiconductor piece has a plurality of copper bars, the top of water tank is all run through to the bottom of copper bar, and extend to inside. The utility model discloses a, can effectively improve electromechanical device's radiating effect, have higher practical value.

Description

Auxiliary heat dissipation device of electromechanical equipment

Technical Field

The utility model belongs to the technical field of supplementary heat abstractor, more specifically says, in particular to electromechanical device's supplementary heat abstractor.

Background

With the continuous improvement of the living standard of people, people have more and more demands on electromechanical equipment in daily life, and the electromechanical equipment from vehicles to various household appliances, computers, printers and the like becomes indispensable electromechanical products in people's life.

Based on the above, the present inventors found that the following problems exist: along with the increase of the power of electronic elements and semiconductor assemblies, the heat productivity of the electronic elements and the semiconductor assemblies on the electromechanical equipment is greatly increased, the heat dissipation function of the existing electromechanical equipment is only limited by the rotation of the fan to circulate air inside, so that the heat dissipation efficiency is low, and the long-time stable operation of the electronic elements inside the electromechanical equipment cannot be ensured.

Therefore, in view of the above, research and improvement are made on the existing structure and defects, and an auxiliary heat dissipation device for an electromechanical device is provided to achieve the purpose of higher practical value.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides an electromechanical device's supplementary heat abstractor to solve the current poor problem of electromechanical device thermal diffusivity.

The utility model discloses electromechanical device's supplementary heat abstractor's purpose and efficiency are reached by following concrete technological means:

the utility model provides an electromechanical device's supplementary heat abstractor, includes electromechanical case body, the outside cover of electromechanical case body is equipped with the heat dissipation case, the inboard fixed mounting of heat dissipation case has the heat-conducting plate, the one end and the electromechanical case body of heat-conducting plate offset, one side fixed mounting of heat-conducting plate has a plurality of heat radiation fins, heat radiation fins's one end all runs through the heat dissipation case and extends to inside, the inside inlays to establish between a plurality of heat radiation fins of heat dissipation case and installs the cooling tube, the top fixed mounting of electromechanical case body has the water tank, the top of water tank is equipped with the refrigeration case, the top of refrigeration case inlays to establish and installs a pair of heat dissipation fan.

Furthermore, the bottom of refrigeration case inlays to establish and installs the semiconductor refrigeration piece, the bottom fixed mounting of semiconductor refrigeration piece has a plurality of bar copper.

Furthermore, the bottom of bar copper all runs through the top of water tank to inside extends.

Further, the one end cover of cooling tube is equipped with the outlet pipe, the other end cover of cooling tube is equipped with the inlet tube, the outlet pipe all runs through the heat dissipation case with the one end of inlet tube and extends to the outside.

Furthermore, a miniature water pump is fixedly mounted on one side inside the water tank, an input end on one side of the miniature water pump is communicated with the water outlet pipe through a pipeline, and one end of the water inlet pipe is communicated with the water tank through a pipeline.

Further, the inside bottom of heat dissipation fan is equal fixed mounting has the support, just the center department of support all inlays to establish and installs the motor.

Furthermore, the top output end of the motor is sleeved with fan blades.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. according to the auxiliary heat dissipation device of the electromechanical device, the heat dissipated by the electromechanical box body can be better absorbed and transferred by installing the heat conduction plate, so that the temperature in the electromechanical box body is reduced, the heat dissipation fins are installed at one end of the heat conduction plate, the heat dissipation pipes are embedded and installed between the heat conduction plate and the heat dissipation fins, the heat transferred by the heat dissipation fins is taken away by using a medium flowing in the heat dissipation pipes, the heat transfer efficiency of the heat conduction plate and the heat dissipation fins is improved, and the heat dissipation effect of the electromechanical box body is further improved;

2. according to the auxiliary heat dissipation device of the electromechanical equipment, the semiconductor refrigeration sheet is conveniently cooled by installing the heat dissipation fan, so that the refrigeration efficiency of the auxiliary heat dissipation device is improved, one end of the copper bar extends to the vertical interior, so that the temperature of a medium in the water tank can be reduced when the semiconductor refrigeration sheet works, the heat dissipation pipe can better transmit and dissipate heat, and the medium in the water tank and the medium in the heat dissipation pipe can be circularly replaced by installing the micro water pump when the auxiliary heat dissipation device works, so that the heat conduction and heat dissipation effects of the heat dissipation pipe are improved; the utility model has the advantages of simple and reasonable structure, the modern design, easy operation is convenient, can effectively improve electromechanical device's radiating effect, has higher practical value.

Drawings

Fig. 1 is a perspective view of the present invention.

Fig. 2 is a perspective view of the heat dissipation pipe of the present invention.

Fig. 3 is a schematic side sectional view of the water tank of the present invention.

Fig. 4 is a schematic view of a depression section according to the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. an electromechanical case body; 2. a heat dissipation box; 3. a water tank; 4. a heat dissipation fan; 5. a radiating pipe; 6. a water inlet pipe; 7. a water outlet pipe; 8. a micro water pump; 9. a semiconductor refrigeration sheet; 10. a copper bar; 11. a heat dissipating fin; 12. a heat conducting plate; 13. a motor; 14. a fan blade; 15. a refrigeration case.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, rather than to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

The embodiment is as follows:

as shown in figures 1 to 4:

the utility model provides an electromechanical device's supplementary heat abstractor, including electromechanical case body 1, the outside cover of electromechanical case body 1 is equipped with heat dissipation case 2, the inboard fixed mounting of heat dissipation case 2 has heat-conducting plate 12, through installation heat-conducting plate 12, can be better adsorb the transmission with the heat that electromechanical case body 1 gived off to reduce the inside temperature of electromechanical case body 1, the one end of heat-conducting plate 12 offsets with electromechanical case body 1, one side fixed mounting of heat-conducting plate 12 has a plurality of heat radiation fins 11, heat radiation fins 11's one end all runs through heat dissipation case 2 and extends to inside, heat dissipation case 2 is inside inlays to establish between a plurality of heat radiation fins 11 and installs cooling tube 5, through the one end installation heat radiation fins 11 at heat-conducting plate 12 to inlay between it and establish installation cooling tube 5, utilize the medium of the inside flow of cooling tube 5, take away the heat of heat radiation fins 11 transmission, improve heat conduction efficiency of heat-conducting plate 12 and heat radiation fins 11, further improve the radiating effect of electromechanical case body 1, the top fixed mounting of electromechanical case body 1 has water tank 3, through installing water tank 5, the heat radiation fins 4 is equipped with the heat dissipation medium and is equipped with the refrigeration fan top that makes things convenient for the refrigeration case that cools down, thereby it improves the cooling fin 15.

Wherein, the bottom of refrigeration case 15 is inlayed and is established and install semiconductor refrigeration piece 9, the bottom fixed mounting of semiconductor refrigeration piece 9 has a plurality of bar copper 10, through the bottom installation bar copper 10 at semiconductor refrigeration piece 9, improves the refrigeration effect of semiconductor refrigeration piece 9.

Wherein, the top of water tank 3 is all run through to the bottom of bar copper 10 to inside extends to, through extending to vertical 3 inside with 10 one end of bar copper, makes 9 during operation of semiconductor refrigeration piece can reduce 3 inside medium temperature of water tank, thereby makes the transmission that cooling tube 5 can be better give off the heat.

Wherein, the one end cover of cooling tube 5 is equipped with outlet pipe 7, the other end cover of cooling tube 5 is equipped with inlet tube 6, outlet pipe 7 all runs through heat dissipation case 2 with the one end of inlet tube 6 and extends to the outside, through setting up outlet pipe 7 and inlet tube 6, the inside medium of the cooling tube 5 of being convenient for carries out circulation flow.

Wherein, inside one side fixed mounting of water tank 3 has miniature pump 8, one side input of miniature pump 8 communicates with each other through pipeline and outlet pipe 7, the one end of inlet tube 6 communicates with each other through pipeline and water tank 3, through installing miniature pump 8, can carry out the change of circulated with the medium of the inside of water tank 3 and cooling tube 5 when making its work, and then improve the heat conduction radiating effect of cooling tube 5.

Wherein, the equal fixed mounting in inside bottom of heat dissipation fan 4 has the support, just the center department of support all inlays to establish and installs motor 13, through installing motor 13, makes its during operation can drive flabellum 14 and rotate.

The fan blades 14 are sleeved at the top end output end of the motor 13, and the fan blades 14 are installed to rotate to generate cold air so as to cooperate with the semiconductor refrigeration sheet 9 to cool the water tank 3.

The specific use mode and function of the embodiment are as follows:

when the product is used, whether each mechanism in the auxiliary heat dissipation device of the electromechanical device is complete is firstly checked, then the heat dissipation box 2 is sleeved outside the electromechanical box body 1, the inlet pipe 6 and the outlet pipe 7 of the heat dissipation pipe 5 arranged inside the heat dissipation box 2 are respectively connected with the water tank 3 through pipelines, when the internal electrical elements of the electromechanical box body 1 start to operate, the generated high temperature is transmitted to the heat dissipation pipe 5 through the heat dissipation fins 11 by the heat conduction plate 12, at the moment, the micro water pump 8 inside the water tank 3 starts to operate, so that the medium inside the water tank 3 and the heat dissipation pipe 5 starts to circulate and replace, thereby the heat on the heat dissipation fins 11 is transmitted to the inside of the water tank 3 by the heat dissipation pipe 5, meanwhile, the motor 13 drives the fan blades 14 to rotate, the semiconductor refrigeration sheet 9 starts to operate, the semiconductor refrigeration sheet 9 generates low temperature when operating, the low temperature is transmitted to the inside of the water tank 3 through the copper rod 10, the medium inside the water tank 3 is cooled, thereby the heat dissipation pipe 5 can transmit and dissipate the heat on the heat dissipation fins 11 continuously, and further improve the efficiency of the heat conduction plate 12, and the cooling effect inside the electromechanical box body 1 is improved.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. The utility model provides an electromechanical device's supplementary heat abstractor, includes electromechanical case body (1), its characterized in that: the outside cover of electromechanical case body (1) is equipped with heat dissipation case (2), the inboard fixed mounting of heat dissipation case (2) has heat-conducting plate (12), the one end and electromechanical case body (1) of heat-conducting plate (12) offset, one side fixed mounting of heat-conducting plate (12) has a plurality of heat radiation fins (11), the one end of heat radiation fins (11) all runs through heat dissipation case (2) and extends to inside, heat dissipation case (2) are inside to inlay between a plurality of heat radiation fins (11) and establish and install cooling tube (5), the top fixed mounting of electromechanical case body (1) has water tank (3), the top of water tank (3) is equipped with refrigeration case (15), the top of refrigeration case (15) is inlayed and is established and install a pair of heat dissipation fan (4).

2. An auxiliary heat sink for an electromechanical device according to claim 1, wherein: the bottom of refrigeration case (15) is inlayed and is established and install semiconductor refrigeration piece (9), the bottom fixed mounting of semiconductor refrigeration piece (9) has a plurality of bar copper (10).

3. An auxiliary heat sink for an electromechanical device according to claim 2, wherein: the bottom ends of the copper rods (10) penetrate through the top end of the water tank (3) and extend to the inside.

4. An auxiliary heat sink for an electromechanical device according to claim 1, wherein: the one end cover of cooling tube (5) is equipped with outlet pipe (7), the other end cover of cooling tube (5) is equipped with inlet tube (6), the one end of outlet pipe (7) and inlet tube (6) all runs through heat dissipation case (2) and extends to the outside.

5. An auxiliary heat sink for an electromechanical device according to claim 4, wherein: the water tank is characterized in that a micro water pump (8) is fixedly mounted on one side inside the water tank (3), an input end on one side of the micro water pump (8) is communicated with a water outlet pipe (7) through a pipeline, and one end of a water inlet pipe (6) is communicated with the water tank (3) through a pipeline.

6. An auxiliary heat sink for an electromechanical device according to claim 1, wherein: the inner bottom of the heat dissipation fan (4) is fixedly provided with a support, and the center of the support is embedded with a motor (13).

7. An auxiliary heat sink for an electromechanical device according to claim 6, wherein: the top end output ends of the motors (13) are sleeved with fan blades (14).