CN218410826U - Heat exchanger - Google Patents

Abstract

The utility model discloses a heat exchanger, including casing and heat transfer module, the heat transfer module includes at least one heat transfer monomer. Any one of the at least one heat exchange monomer comprises a first heat exchange plate, a semiconductor layer and a second heat exchange plate which are sequentially stacked along the thickness direction of the heat exchanger. Each heat exchange plate in first heat exchange plate and the second heat exchange plate all includes first heat exchanger fin and the second heat exchanger fin that sets gradually along the thickness direction of heat exchanger, and first heat exchanger fin week side is provided with first turn-ups, and second heat exchanger fin week side is provided with the second turn-ups, and one side that the second heat exchanger fin was kept away from to one side that first heat exchanger fin was kept away from to first turn-ups and second turn-ups is fixed and sealing connection, makes to form medium passageway between first heat exchanger fin and the second heat exchanger fin. Because the first turn-ups of first heat exchanger fin and the second turn-ups of second heat exchanger fin can increase the intensity of first heat exchanger fin and second heat exchanger fin on the heat exchanger thickness direction respectively, so the lightweight can be compromise to the heat exchanger plate of this heat exchanger in non-deformable simultaneously.

Description

Heat exchanger

Technical Field

The utility model relates to a heat exchange equipment field especially relates to a heat exchanger.

Background

The heat exchanger is a device capable of realizing temperature conversion of high and low temperature difference media so as to meet the requirements of medium temperature reduction or medium temperature rise and meet the requirements of production or life. Heat exchangers can be generally classified as plate, tube, fin, positive displacement, and the like. Wherein, the heat transfer board of plate heat exchanger produces the deformation easily at the spot welding in-process, for avoiding it to produce the deformation, the thick 1.0-2.0mm that needs of the board of the heat transfer board of heat exchanger among the prior art, and thicker heat transfer board can make the weight of heat exchanger heavier. In addition, in order to ensure the sealing performance of the heat exchanger, the structure of the sealing element of the heat exchanger in the prior art is complex, and the number of sub-parts of the sealing element is large.

Therefore, the heat exchanger in the prior art has the problems that the light weight cannot be realized while the deformation is ensured, and the number of the sealing element sub-parts is large.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the heat exchanger among the prior art and have the problem that can't compromise the lightweight when guaranteeing non-deformable to and sealing member sub-part large in quantity.

In order to solve the above problem, an embodiment of the present invention provides a heat exchanger, which includes a housing and a heat exchange module disposed in the housing, wherein the heat exchange module includes at least one heat exchange unit. Any one of the at least one heat exchange monomer comprises a first heat exchange plate, a semiconductor layer and a second heat exchange plate which are sequentially stacked along the thickness direction of the heat exchanger. Each heat exchanger plate all includes first heat exchanger fin and the second heat exchanger fin that sets gradually along the thickness direction of heat exchanger in first heat exchanger plate and the second heat exchanger plate to, the week side of first heat exchanger fin is provided with first turn-ups, and week side of second heat exchanger fin is provided with the second turn-ups, makes first heat exchanger fin and second heat exchanger fin all be the bowl form. The first heat exchange plate is matched with the second heat exchange plate, one side of the first flanging, which is far away from the first heat exchange plate, and one side of the second flanging, which is far away from the second heat exchange plate, are fixedly and hermetically connected, so that a medium channel is formed between the first heat exchange plate and the second heat exchange plate. The two side faces of the semiconductor layer are respectively attached to the second heat exchange sheet of the first heat exchange plate and the outer side face of the first heat exchange sheet of the second heat exchange plate, so that the heat transfer state of a medium between the medium channel of the first heat exchange plate and the medium channel of the second heat exchange plate is adjusted through the electrifying state of the semiconductor layer.

By adopting the technical scheme, the first flanging of the first heat exchange sheet and the second flanging of the second heat exchange sheet can respectively increase the strength of the first heat exchange sheet and the second heat exchange sheet in the thickness direction of the heat exchanger. For being platelike heat exchanger fin, the thickness that is bowl-shaped structure's first heat exchanger fin and second heat exchanger fin can set up is thinner, and then when guaranteeing heat exchanger plate intensity requirement for the heat exchanger plate lightweight more. Meanwhile, when the medium flows in the heat exchange plate, the thinner heat exchange plate can effectively reduce the heat required by the heat exchange plate to reduce the thermal resistance and the heat loss during the heat exchange between the heat exchange plate and the semiconductor layer, and improve the heat exchange performance of the heat exchanger.

In addition, the first heat exchange sheet and the second heat exchange sheet are fixedly and hermetically connected through the first flanging and the second flanging, namely, the first heat exchange sheet and the second heat exchange sheet can be connected and sealed only through proper matching, so that other sealing parts are prevented from being arranged between the first heat exchange sheet and the second heat exchange sheet, and the number of sub-parts of the sealing parts of the heat exchanger is reduced.

The utility model discloses a another kind of embodiment provides a heat exchanger, in each heat transfer board, is provided with the baffle that extends along the length direction of heat transfer board in the medium channel, and the one end butt of baffle is formed with the clearance between the inside wall of the other end and heat transfer board on the inside wall of the one end of heat transfer board. And along the thickness direction of the heat exchanger, two sides of the baffle are respectively abutted against the inner wall surfaces of the first heat exchange sheet and the second heat exchange sheet, so that the medium channel is divided into a first flow channel and a second flow channel, and the first flow channel is communicated with the second flow channel through a gap.

One end of each heat exchange plate is provided with two communicating pipelines which are respectively communicated with the first flow passage and the second flow passage, so that a medium from one of the two communicating pipelines flows through the first flow passage, the gap and the second flow passage in sequence and then flows out from the other communicating pipeline.

By adopting the technical scheme, the baffle can divide the medium channel into the first flow channel and the second flow channel, so that a medium needing heat exchange enters the heat exchange plate through one of the two communicating pipelines, flows through the first flow channel, the gap and the second flow channel and then flows out of the other communicating pipeline, and the flowing heat exchange of the medium needing heat exchange is completed.

The utility model discloses a heat exchanger is provided to another kind of embodiment, at least one heat transfer monomer includes two heat transfer monomers, two heat transfer monomers are first heat transfer monomer and second heat transfer monomer respectively, first heat transfer monomer sets up with second heat transfer monomer relative interval in the thickness direction of heat exchanger, and in the first heat transfer monomer second heat transfer board in with the second heat transfer monomer is close to the setting in opposite directions, first heat transfer board in first heat transfer monomer and the second heat transfer monomer is kept away from the setting dorsad to first heat transfer board

Two communicating pipes on each single first heat exchange plate in the first heat exchange monomer and the second heat exchange monomer are located at one end of the heat exchanger, and two flow guide pipes which are communicated with the two communicating pipes of the single first heat exchange plates in the second heat exchange monomer and are in sealing connection with the two communicating pipes of the single first heat exchange plates in the second heat exchange monomer are arranged on the second heat exchange plates of the first heat exchange monomer. The two flow guide pipelines are respectively communicated with the first flow channel and the second flow channel of the first heat exchange plate in the first heat exchange monomer, so that a medium from one of the two communicating pipelines of the first heat exchange plate in the first heat exchange monomer can also flow through one of the two flow guide pipelines, sequentially flows through the first flow channel, the gap and the second flow channel of the first heat exchange plate of the second heat exchange monomer, then flows through the other flow guide pipeline, and flows out from the other one of the two communicating pipelines of the first heat exchange plate of the first heat exchange monomer.

Two communicating pipelines of each heat exchange single second heat exchange plate in the first heat exchange single body and the second heat exchange single body are located at the other end of the heat exchanger, and two first bosses communicated with the two communicating pipelines of the second heat exchange plates in the second heat exchange single body and connected in a sealing mode are arranged on the second heat exchange plates of the second heat exchange plates in the first heat exchange single body. The inner cavities of the two first bosses are respectively communicated with the first flow channel and the second flow channel of the second heat exchange plate in the first heat exchange monomer, so that a medium from one of the two communicating pipelines of the second heat exchange plate in the first heat exchange monomer can also flow through the inner cavity of one of the two first bosses, sequentially flows through the first flow channel, the gap and the second flow channel of the second heat exchange plate in the second heat exchange monomer, then flows through the inner cavity of the other first boss, and flows out from the other communicating pipeline of the two communicating pipelines of the second heat exchange plate in the first heat exchange monomer.

By adopting the technical scheme, the two communicating pipelines on the first heat exchange plate of each heat exchange monomer in the first heat exchange monomer and the second heat exchange monomer are respectively communicated through the two flow guide pipelines, so that the first heat exchange plate of each heat exchange monomer in the first heat exchange monomer and the second heat exchange monomer commonly uses the same medium inlet channel and the same medium outlet channel. Two communicating pipelines on the second heat exchange plate of each heat exchange monomer in the first heat exchange monomer and the second heat exchange monomer are communicated through two first bosses respectively, so that the second heat exchange plate of each heat exchange monomer in the first heat exchange monomer and the second heat exchange monomer commonly uses the same medium inlet channel and the same medium outlet channel. Compare and equally divide on every heat transfer board and set up two intercommunication pipelines that are used for medium entering and medium outflow respectively, this kind of mode of setting can make the structure of this heat exchanger simpler, simultaneously, also can avoid the medium to get into or flow out the calorific loss who produces from a plurality of pipelines.

In addition, compare the mode that sets up that the intercommunication pipeline on every heat transfer board all is located the one end of heat exchanger, two intercommunication pipelines on every free first heat transfer board of heat transfer all are located the one end of heat exchanger in first heat transfer monomer and the second heat transfer monomer, the mode that sets up that two intercommunication pipelines of every free second heat transfer board of heat transfer all are located the other end of heat exchanger in first heat transfer monomer and the second heat transfer monomer can reduce the occupation space of this heat exchanger for between the structure in this heat exchanger compacter, the volume of this heat exchanger is littleer.

The utility model discloses a another kind of embodiment provides a heat exchanger, and two intercommunication pipelines of second heat transfer board set up respectively into two second bosss in the second heat transfer monomer, two second bosss respectively with two first bosss intercommunication and sealing connection to, the axis of two intercommunication pipelines of second heat transfer board is located same straight line with the axis of two first bosss, two second bosss respectively in the first heat transfer monomer.

The axes of the two communicating pipelines of the first heat exchange plate in the first heat exchange unit are respectively positioned on the same straight line with the axes of the two flow guide pipelines and the two communicating pipelines of the first heat exchange plate in the second heat exchange unit.

By adopting the technical scheme, after the heat exchange module is assembled, the first boss and the second boss are naturally compressed, and other sealing structures are omitted, so that the number of sub-parts of the sealing element of the heat exchanger is further reduced. The axes of the two communicating pipelines of the first heat exchange plate in the first heat exchange monomer are respectively positioned on the same straight line with the axes of the two flow guide pipelines and the two communicating pipelines of the first heat exchange plate in the second heat exchange monomer, so that a medium can rapidly and uniformly flow into or out of each first heat exchange plate of each heat exchange monomer in the first heat exchange monomer and the second heat exchange monomer through the two communicating pipelines of the first heat exchange plate in the first heat exchange monomer. The axes of the two communicating pipelines of the second heat exchange plate in the first heat exchange monomer are respectively positioned on the same straight line with the axes of the two first bosses and the two second bosses, so that a medium can rapidly and uniformly flow into or out of each second heat exchange plate of each heat exchange monomer in the first heat exchange monomer and the second heat exchange monomer through the two communicating pipelines of the second heat exchange plate in the first heat exchange monomer.

The utility model discloses a another embodiment provides a heat exchanger, and the casing includes last casing and the lower casing that sets gradually along the thickness direction of heat exchanger, goes up the casing and forms the accommodation space down between the casing, and the heat transfer module sets up in the accommodation space to, go up the casing and can dismantle the connection down between the casing.

Two first openings are arranged at positions, corresponding to the two communicating pipelines of the first heat exchange plate in the first heat exchange monomer, on the upper shell, and the two communicating pipelines of the first heat exchange plate in the first heat exchange monomer respectively penetrate through the two first openings to extend to the outside of the heat exchanger. The outer diameter of the flow guide pipeline is smaller than the inner diameter of the communicating pipeline of the first heat exchange plate in the second heat exchange unit, so that the flow guide pipeline is inserted into the communicating pipeline of the first heat exchange plate in the second heat exchange unit.

Two second openings are arranged at positions, corresponding to the two communicating pipelines of the second heat exchange plate in the first heat exchange unit, on the upper shell, and the two communicating pipelines of the second heat exchange plate in the first heat exchange unit respectively penetrate through the two second openings to extend to the outside of the heat exchanger.

By adopting the technical scheme, the upper shell and the lower shell are detachably connected, so that the internal structure of the heat exchanger can be maintained and replaced conveniently. The diversion pipeline is inserted in the communicating pipeline of the first heat exchange plate in the second heat exchange monomer, so that a sealing element can be prevented from being arranged between the diversion pipeline and the communicating pipeline of the first heat exchange plate in the second heat exchange monomer, and the number of sub-parts of the sealing element of the heat exchanger is further reduced.

The utility model discloses a another kind of embodiment provides a heat exchanger, still sets up the backup pad between the second heat exchanger fin of second heat transfer board in two heat transfer monomers, and the backup pad sets up to the elasticity material, and the backup pad is corrugate along the ascending cross-section of length direction of heat exchanger to, the compression capacity of backup pad is the same with first boss and the value of second boss at the ascending size sum of thickness direction of heat exchanger.

By adopting the technical scheme, the supporting plate can support the second heat exchange fins of the second heat exchange plate in the two heat exchange units, so that the deformation of the heat exchange plate is avoided. Compare in the rigid material, the backup pad sets up to the elastic material and can produce certain deformation when the backup pad receives certain extrusion when playing the supporting role to play better supporting role between the second heat exchanger fin of second heat exchanger plate in two heat transfer monomers. Because the interval that exists between two heat transfer monomers is that first boss and second boss form in the thickness direction of heat exchanger, so the magnitude of compression of backup pad and first boss and second boss are the same with the value of the size sum in the thickness direction of heat exchanger. Compare in the backup pad that the cross-section on the length direction along the heat exchanger is the rectangle, the backup pad is the corrugate along the cross-section on the length direction of heat exchanger can be when guaranteeing the support performance of backup pad for the weight of backup pad is lighter.

The utility model discloses a heat exchanger, heat exchanger still include the sealing washer, are provided with along the first seal groove of its circumference extension on the side of casing under the last casing laminating, are provided with along the second seal groove of its circumference extension on the side of casing under the casing laminating to, the sealing washer respectively with first seal groove and second seal groove looks adaptation.

By adopting the technical scheme, the sealing ring, the first sealing groove and the second sealing groove are in interference fit, and the sealing reliability between the upper shell and the lower shell can be ensured by the arrangement of the sealing ring, the first sealing groove and the second sealing groove.

Another embodiment of the present invention provides a heat exchanger, further comprising a sealing pad; one of the side surface of the upper shell, which is attached to the lower shell, and the side surface of the lower shell, which is attached to the upper shell, is also provided with a protrusion, the other side surface is also provided with a groove, the sealing gasket is arranged in the groove, and the protrusion is matched with the groove; moreover, the protrusion is wedge-shaped, and the sealing gasket is made of flexible materials.

By adopting the technical scheme, the arrangement of the bulge and the groove further increases the sealing performance between the upper shell and the lower shell. And the protrusion is wedge-shaped, and the sealing gasket is arranged in the groove, so that the sealing performance between the protrusion and the groove can be improved. Meanwhile, the sealing gasket can deform, so that the sealing gasket can absorb tolerance generated when the upper shell and the lower shell are connected and matched, and the sealing performance between the upper shell and the lower shell is further improved.

The utility model discloses a another embodiment provides a heat exchanger, is provided with a plurality of reinforcements between casing and the heat transfer module, and there is the spaced circumference of heat transfer module to have the one end of a plurality of reinforcements evenly to set up on the lateral wall of heat transfer module, and there is the spaced circumference of casing to have the other end to evenly set up on the inside wall of casing along the circumference of casing.

By adopting the technical scheme, the plurality of reinforcing parts are arranged between the shell and the heat exchange module and can play a role in supporting and reinforcing the shell and the heat exchange module so as to avoid deformation of the shell after stress.

Another embodiment of the utility model provides a heat exchanger, the size range of the first flanging and the second flanging in the thickness direction of the heat exchanger is set between 3mm-5 mm; the included angle between the first flanging and the first heat exchange sheet and the included angle between the second flanging and the second heat exchange sheet are set between 75 degrees and 85 degrees.

The semiconductor layer comprises a plurality of semiconductor blocks which are arranged in a matrix, two side surfaces of each semiconductor block in the plurality of semiconductor blocks are respectively provided with a heat conduction pad, and the heat conduction pads are made of flexible materials.

By adopting the technical scheme, the heat conducting pad is made of flexible materials and can absorb the flatness tolerance between the semiconductor block and the matching surface of the heat exchange plate so as to ensure the attachment of the heat exchange surface and ensure the effective transmission of heat.

The utility model has the advantages that:

the utility model provides a heat exchanger includes the casing and sets up the heat transfer module in the casing, and the heat transfer module includes at least one heat transfer monomer. Any one of the at least one heat exchange monomer comprises a first heat exchange plate, a semiconductor layer and a second heat exchange plate which are sequentially stacked along the thickness direction of the heat exchanger. Each heat exchanger plate all includes first heat exchanger fin and the second heat exchanger fin that sets gradually along the thickness direction of heat exchanger in first heat exchanger plate and the second heat exchanger plate to, the week side of first heat exchanger fin is provided with first turn-ups, and week side of second heat exchanger fin is provided with the second turn-ups, makes first heat exchanger fin and second heat exchanger fin all be the bowl form. Two side surfaces of the semiconductor layer are respectively attached to the second heat exchange sheet of the first heat exchange plate and the outer side surface of the first heat exchange sheet of the second heat exchange plate, so that the heat transfer state of a medium between the medium channel of the first heat exchange plate and the medium channel of the second heat exchange plate is adjusted through the electrifying state of the semiconductor layer. The first flanging of the first heat exchange sheet and the second flanging of the second heat exchange sheet can respectively increase the strength of the first heat exchange sheet and the second heat exchange sheet in the thickness direction of the heat exchanger. For being platelike heat exchanger fin, the thickness that is bowl-shaped structure's first heat exchanger fin and second heat exchanger fin can set up is thinner, and then when guaranteeing heat exchanger plate intensity requirement for the heat exchanger plate is lighter-weighted more. Meanwhile, when the medium flows in the heat exchange plate, the thinner heat exchange plate can effectively reduce the heat required by the heat exchange plate to reduce the thermal resistance and the heat loss during the heat exchange between the heat exchange plate and the semiconductor layer, and improve the heat exchange performance of the heat exchanger. In addition, the first heat exchange sheet and the second heat exchange sheet are fixedly and hermetically connected through the first flanging and the second flanging, namely, the first heat exchange sheet and the second heat exchange sheet can be connected and sealed only through proper matching, so that other sealing parts are prevented from being arranged between the first heat exchange sheet and the second heat exchange sheet, and the number of sub-parts of the sealing parts of the heat exchanger is reduced.

Other features and corresponding advantages of the invention are set forth in the following part of the specification, and it is to be understood that at least some of the advantages become apparent from the description of the invention.

Drawings

Fig. 1 is a schematic cross-sectional structural diagram of a heat exchanger provided in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the inside of a heat exchange fin of a heat exchanger according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a heat exchange module of a heat exchanger according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a second boss of the heat exchanger according to an embodiment of the present invention;

fig. 5 is a schematic external structural diagram of a heat exchanger according to an embodiment of the present invention;

fig. 6 is a schematic partial structural view of a heat exchange module of a heat exchanger according to an embodiment of the present invention;

fig. 7 is an exploded view of a housing of a heat exchanger according to an embodiment of the present invention;

fig. 8 is a schematic partial structural view of a shell of a heat exchanger according to an embodiment of the present invention;

fig. 9 is a schematic partial structural view of a heat exchanger fin of a heat exchanger according to an embodiment of the present invention.

Description of reference numerals:

10: a housing;

110: an upper housing; 111: a first opening; 112: a second opening; 113: a first seal groove;

120: a lower housing; 121: a second seal groove;

130: a protrusion;

140: a groove;

20: a heat exchange module;

211: a first heat exchange monomer;

212: a second heat exchange monomer;

221: a first heat exchange plate;

222: a semiconductor layer; 2221: a thermally conductive pad;

223: a second heat exchange plate;

231: a first heat exchanger fin; 2311: a first flanging;

232: a second heat exchanger fin; 2321: second flanging;

241: a media channel; 2411: a first flow passage; 2412: a second flow passage; 2413: a gap;

242: a baffle plate;

251: a communicating pipe; 2511: a second boss;

252: a diversion pipeline;

253: a first boss;

261: a support plate;

30: a seal ring;

40: a gasket;

50: a reinforcement.

Detailed Description

The following description is provided for illustrative embodiments of the present invention, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. While the invention will be described in conjunction with the preferred embodiments, it is not intended that features of the invention be limited to only those embodiments. On the contrary, the intention of implementing the novel features described in connection with the embodiments is to cover other alternatives or modifications which may be extended based on the claims of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be practiced without these particulars. Furthermore, some of the specific details are omitted from the description so as not to obscure or obscure the present invention. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

It should be noted that in this specification, like reference numerals and letters refer to like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

In the description of the present embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or the element to which the present invention is directed must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present embodiment, it should be further noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be interpreted broadly, e.g., as a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present embodiment can be understood in specific cases by those of ordinary skill in the art.

To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiment provides a heat exchanger, as shown in fig. 1, including a housing 10 and a heat exchange module 20 disposed in the housing 10, where the heat exchange module 20 includes at least one heat exchange unit. Any one of the at least one heat exchange unit comprises a first heat exchange plate 221, a semiconductor layer 222 and a second heat exchange plate 223 which are sequentially stacked along the thickness direction of the heat exchanger. Each heat exchanger plate all includes first heat exchanger fin 231 and the second heat exchanger fin 232 that set gradually along the thickness direction of heat exchanger in first heat exchanger plate 221 and the second heat exchanger plate 223 to, the week side of first heat exchanger fin 231 is provided with first turn-ups 2311, and week side of second heat exchanger fin 232 is provided with second turn-ups 2321, makes first heat exchanger fin 231 and second heat exchanger fin 232 all be the bowl form. The first plate 231 and the second plate 232 are fitted, and the side of the first flange 2311 away from the first plate 231 and the side of the second flange 2321 away from the second plate 232 are fixedly and hermetically connected, so that a medium channel 241 is formed between the first plate 231 and the second plate 232. Two side surfaces of the semiconductor layer 222 are respectively attached to the outer side surfaces of the second heat exchange fins 232 of the first heat exchange plate 221 and the first heat exchange fins 231 of the second heat exchange plate 223, so that the heat transfer state of the medium between the medium channel 241 of the first heat exchange plate 221 and the medium channel 241 of the second heat exchange plate 223 is adjusted through the power-on state of the semiconductor layer 222.

Specifically, the number of the heat exchange monomers of the heat exchange module 20 can be set to 1, 2, 3, 4, etc., and the heat exchange monomers can be specifically set according to actual design and use requirements, which is not specifically limited in this embodiment.

Specifically, the peripheral side of the first heat exchanging fin 231 and the first flange 2311, and the peripheral side of the second heat exchanging fin 232 and the second flange 2321 may be connected by welding, or may be integrally formed. Preferably, in order to ensure the sealing performance between the first plate 231 and the first flange 2311 and between the second plate 232 and the second flange 2321, in this embodiment, the periphery of the first plate 231 and the first flange 2311 and the periphery of the second plate 232 and the second flange 2321 are integrally formed.

Specifically, the first flanging 2311 and the second flanging 2321 are connected in a brazing mode, so that the sealing effect is achieved while the first flanging 2311 and the second flanging 2321 are connected.

More specifically, each heat exchange unit is adjusted by the energization state of the semiconductor layer 222 to achieve a heat transfer state of the medium between the medium channel 241 of the first heat exchange plate 221 and the medium channel 241 of the second heat exchange plate 223, that is, after the semiconductor layer 222 is energized, the P-type units and the N-type units inside the semiconductor layer 222 are arranged in a staggered manner, so that the surfaces of the two sides of the semiconductor layer 222 form a cold end and a hot end respectively, and then the heat exchange units transfer heat with the heat exchange plates on the two sides of the semiconductor layer 222, thereby finally achieving a cooling/heating effect. Moreover, the heat exchanger can perform bidirectional heat exchange, that is, the surfaces on the two sides of the semiconductor layer 222 are controlled to form a cold end or a hot end respectively by controlling the power-on state of the semiconductor layer 222, so that the semiconductor layer 222 can refrigerate or heat any heat exchange plate on the two sides of the semiconductor layer 222.

It should be noted that the first flanges 2311 of the first plate 231 and the second flanges 2321 of the second plate 232 can respectively increase the strength of the first plate 231 and the second plate 232 in the thickness direction of the heat exchanger. For being platelike heat exchanger fin, the thickness that is bowl-shaped structure's first heat exchanger fin 231 and second heat exchanger fin 232 can set up is thinner, and then when guaranteeing heat exchanger plate intensity requirement for the heat exchanger plate is lighter-weighted more. Meanwhile, when the medium flows in the heat exchange plate, the thinner heat exchange plate can effectively reduce the heat required by the heat exchange plate to reduce the thermal resistance and the heat loss during the heat exchange between the heat exchange plate and the semiconductor layer 222, and the heat exchange performance of the heat exchanger is improved.

In addition, the first heat exchanging fin 231 and the second heat exchanging fin 232 are fixed and hermetically connected through the first flanging 2311 and the second flanging 2321, that is, the first heat exchanging fin 231 and the second heat exchanging fin 232 can be connected and sealed only through proper matching, so that other sealing parts are prevented from being arranged between the first heat exchanging fin 231 and the second heat exchanging fin 232, and the number of sub-parts of the sealing parts of the heat exchanger is reduced.

Another embodiment of the present embodiment provides a heat exchanger, as shown in fig. 2, in each heat exchange plate, a baffle 242 extending along the length direction of the heat exchange plate is arranged in the medium channel 241, one end of the baffle 242 abuts against the inner side wall of one end of the heat exchange plate, and a gap 2413 is formed between the other end and the inner side wall of the other end of the heat exchange plate. In the thickness direction of the heat exchanger, two sides of the baffle 242 abut against the inner wall surfaces of the first heat exchange plate 231 and the second heat exchange plate 232, so that the medium channel 241 is divided into a first channel 2411 and a second channel 2412, and the first channel 2411 and the second channel 2412 are communicated through a gap 2413.

One end of each heat exchange plate is provided with two communication pipes 251, and the two communication pipes 251 are respectively communicated with the first flow passage 2411 and the second flow passage 2412, so that the medium from one 251 of the two communication pipes 251 flows out from the other communication pipe 251 after sequentially flowing through the first flow passage 2411, the gap 2413 and the second flow passage 2412.

Specifically, between the one end of baffle 242 and the inside wall of the one end of heat transfer board, all can accomplish the butt through interference fit between the both sides of baffle 242 and the internal wall face of first heat exchanger fin 231 and second heat exchanger fin 232, also can connect through the welded mode, and it specifically can be set for according to actual design and user demand, and this embodiment does not specifically limit this.

More specifically, the two communication pipes 251 of each heat exchange plate may be connected to the heat exchange plate by welding, or by screwing, riveting, or the like. Because when connecting through modes such as spiro union, riveting, need set up the sealing member between intercommunication pipeline 251 and the heat transfer board to guarantee the sealing performance between intercommunication pipeline 251 and the heat transfer board, so for reducing the sub-part quantity of the sealing member of this heat exchanger, preferably connect through the welded mode between two intercommunication pipelines 251 in this embodiment and the heat transfer board. In addition, one of the two communicating pipes 251 is a pipe through which the medium enters the heat exchange plate, and the other is a pipe through which the medium flows out of the heat exchange plate, which may be specifically set according to actual design and use requirements, and this embodiment does not specifically limit this.

More specifically, an inner fin is laid in the medium channel 241 of each heat exchange plate to increase the heat exchange area of the heat exchange plate, and further improve the heat exchange efficiency of the heat exchanger.

It should be noted that the baffle 242 may divide the medium channel 241 into a first flow passage 2411 and a second flow passage 2412, so that the medium requiring heat exchange enters the heat exchange plate through one of the two communication pipes 251, and flows out from the other communication pipe 251 after flowing through the first flow passage 2411, the gap 2413 and the second flow passage 2412, so as to complete the flowing heat exchange of the medium requiring heat exchange.

Another embodiment of this embodiment provides a heat exchanger, as shown in fig. 1 and fig. 3, at least one heat exchange unit includes two heat exchange units, the two heat exchange units are a first heat exchange unit 211 and a second heat exchange unit 212, the first heat exchange unit 211 and the second heat exchange unit 212 are arranged in the thickness direction of the heat exchanger at intervals, a second heat exchange plate 223 in the first heat exchange unit 211 and a second heat exchange plate 223 in the second heat exchange unit 212 are arranged close to each other, and a first heat exchange plate 221 in the first heat exchange unit 211 and a first heat exchange plate 221 in the second heat exchange unit 212 are arranged away from each other.

Two communicating pipelines 251 on the first heat exchange plate 221 of each of the first heat exchange unit 211 and the second heat exchange unit 212 are located at one end of the heat exchanger, and two flow guide pipelines 252 communicated with and hermetically connected with the two communicating pipelines 251 of the first heat exchange plate 221 of the second heat exchange unit 212 are arranged on the second heat exchange fin 232 of the first heat exchange plate 221 in the first heat exchange unit 211. The two flow guide pipes 252 are respectively communicated with the first flow passage 2411 and the second flow passage 2412 of the first heat exchange plate 221 in the first heat exchange unit 211, so that a medium from one of the two communication pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211 can also flow through one of the two flow guide pipes 252, sequentially flow through the first flow passage 2411, the gap 2413 and the second flow passage 2412 of the first heat exchange plate 221 in the second heat exchange unit 212, then flow through the other flow guide pipe 252, and flow out from the other communication pipe 251 of the two communication pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211.

Two communicating pipes 251 of each of the second heat exchange plates 223 of the first heat exchange unit 211 and the second heat exchange unit 212 are located at the other end of the heat exchanger, and two first bosses 253 communicated with and hermetically connected with the two communicating pipes 251 of the second heat exchange plates 223 of the second heat exchange unit 212 are arranged on the second heat exchange fins 232 of the second heat exchange plates 223 of the first heat exchange unit 211. The inner cavities of the two first bosses 253 are respectively communicated with the first flow passage 2411 and the second flow passage 2412 of the second heat exchange plate 223 in the first heat exchange single body 211, so that a medium from one of the two communication pipes 251 of the second heat exchange plate 223 in the first heat exchange single body 211 can also flow through the inner cavity of one of the two first bosses 253, and sequentially flow through the first flow passage 2411, the gap 2413 and the second flow passage 2412 of the second heat exchange plate 223 in the second heat exchange single body 212, then flow through the inner cavity of the other first boss 253, and flow out from the other communication pipe 251 of the two communication pipes 251 of the second heat exchange plate 223 in the first heat exchange single body 211.

Specifically, the two flow guide pipes 252 and the second heat exchange fins 232 of the first heat exchange plate 221 in the first heat exchange unit 211 may be connected by welding, or may be connected by screwing, riveting, or the like. When the heat exchanger plates are connected in the first heat exchange unit 211 in a screwed or riveted manner, a sealing member needs to be disposed between the guide pipe 252 and the second heat exchange plate 232 of the first heat exchange plate 221 in the first heat exchange unit 211, so as to ensure the sealing performance between the guide pipe 252 and the second heat exchange plate 232 of the first heat exchange plate 221 in the first heat exchange unit 211. Therefore, in order to reduce the number of sub-components of the sealing member of the heat exchanger, the two flow guide pipes 252 in this embodiment are preferably connected to the second heat exchange fins 232 of the first heat exchange plates 221 in the first heat exchange unit 211 by welding.

Specifically, the two diversion pipes 252 and the two communication pipes 251 of the first heat exchange plate 221 in the second heat exchange unit 212 may be connected by means of plugging, screwing, or the like. When the two diversion pipelines 252 and the two communicating pipelines 251 of the first heat exchange plate 221 in the second heat exchange unit 212 are connected in a threaded connection manner, a sealing member needs to be arranged between the two diversion pipelines 252 and the two communicating pipelines 251 of the first heat exchange plate 221 in the second heat exchange unit 212, so that the sealing performance between the two diversion pipelines 252 and the two communicating pipelines 251 of the first heat exchange plate 221 in the second heat exchange unit 212 is ensured. Therefore, in order to reduce the number of sub-components of the sealing member of the heat exchanger, the two flow guide pipes 252 in the present embodiment are preferably connected with the two communication pipes 251 of the first heat exchange plate 221 in the second heat exchange unit 212 in an insertion manner, which will be described later.

More specifically, the first boss 253 is integrally formed with the second heat exchanger plate 232 of the second heat exchanger plate 223 in the first heat exchange unit 211, so as to ensure the sealing performance between the second heat exchanger plate 232 of the second heat exchanger plate 223 in the first heat exchange unit 211 and the first boss 253.

More specifically, the connection manner between the two first bosses 253 and the two communication pipes 251 of the second heat exchange plate 223 in the second heat exchange unit 212 may be described later.

It should be noted that the two communicating pipes 251 on the first heat exchange plate 221 of each of the first heat exchange unit 211 and the second heat exchange unit 212 are respectively communicated through two flow guide pipes 252, so that the first heat exchange plate 221 of each of the first heat exchange unit 211 and the second heat exchange unit 212 commonly uses the same medium inlet channel and medium outlet channel. The two communicating pipes 251 on the second heat exchange plate 223 of each of the first heat exchange unit 211 and the second heat exchange unit 212 are respectively communicated through the two first bosses 253, so that the second heat exchange plates 223 of each of the first heat exchange unit 211 and the second heat exchange unit 212 share the same medium inlet channel and the same medium outlet channel. Compare and equally set up respectively in every heat transfer board and be used for two intercommunication pipeline 251 that the medium got into and the medium flows out, this kind of arrangement can make the structure of this heat exchanger simpler, simultaneously, also can avoid the medium to get into or flow out the calorific loss who produces from a plurality of pipelines.

In addition, compare in the communicating pipe 251 on every heat transfer plate all be located the mode that sets up of the one end of heat exchanger, two communicating pipe 251 on every free first heat transfer plate 221 of heat transfer all are located the one end of heat exchanger in first heat transfer monomer 211 and the second heat transfer monomer 212, the mode that sets up that two communicating pipe 251 of every free second heat transfer plate 223 of heat transfer all are located the other end of heat exchanger in first heat transfer monomer 211 and the second heat transfer monomer 212 can reduce the occupation space of this heat exchanger, make between the structure in this heat exchanger compacter, the volume of this heat exchanger is littleer.

Another embodiment of the present embodiment provides a heat exchanger, as shown in fig. 1 and 4, two communication pipes 251 of the second heat exchange plate 223 in the second heat exchange unit 212 are respectively provided as two second bosses 2511, the two second bosses 2511 are respectively communicated and hermetically connected with the two first bosses 253, and the axes of the two communication pipes 251 of the second heat exchange plate 223 in the first heat exchange unit 211 are respectively located on the same straight line with the axes of the two first bosses 253 and the two second bosses 2511.

The axes of the two communicating pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211 and the axes of the two communicating pipes 251 of the two flow guide pipes 252 and the first heat exchange plate 221 in the second heat exchange unit 212 are located on the same straight line.

Specifically, the second boss 2511 is integrally formed with the second heat exchanger plate 232 of the second heat exchanger plate 223 in the second heat exchanger unit 212, so as to ensure the sealing performance between the second boss 2511 and the second heat exchanger plate 232 of the second heat exchanger plate 223 in the second heat exchanger unit 212. Moreover, since the distance between the second heat exchange plate 223 in the first heat exchange unit 211 and the second heat exchange plate 223 in the second heat exchange unit 212 is relatively small, the second heat exchange plate 223 in the first heat exchange unit 211 and the second heat exchange plate 223 in the second heat exchange unit 212 can be communicated through the first boss 253 and the second boss 2511.

It should be noted that, after the heat exchange module 20 is assembled, the first boss 253 and the second boss 2511 are naturally compressed, and other sealing structures are omitted, so that the number of sub-parts of the sealing member of the heat exchanger is further reduced. The axes of the two communicating pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211 are respectively located on the same straight line with the axes of the two flow guide pipes 252 and the two communicating pipes 251 of the first heat exchange plate 221 in the second heat exchange unit 212, so that a medium can rapidly and uniformly flow into or out of the first heat exchange plate 221 of each of the first heat exchange unit 211 and the second heat exchange unit 212 through the two communicating pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211. The axes of the two communicating pipes 251 of the second heat exchange plate 223 in the first heat exchange unit 211 are respectively located on the same straight line with the axes of the two first bosses 253 and the two second bosses 2511, so that the medium can rapidly and uniformly flow into or out of the second heat exchange plate 223 of each of the first heat exchange unit 211 and the second heat exchange unit 212 through the two communicating pipes 251 of the second heat exchange plate 223 in the first heat exchange unit 211.

Another embodiment of the present embodiment provides a heat exchanger, as shown in fig. 1, 5 and 7, the housing 10 includes an upper housing 110 and a lower housing 120 sequentially arranged in a thickness direction of the heat exchanger, an accommodating space is formed between the upper housing 110 and the lower housing 120, the heat exchange module 20 is arranged in the accommodating space, and the upper housing 110 and the lower housing 120 are detachably connected.

As shown in fig. 1 and 7, two first openings 111 are provided on the upper shell 110 at positions corresponding to the two communication pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211, and the two communication pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211 respectively pass through the two first openings 111 and extend to the outside of the heat exchanger. The outer diameter of the flow guide pipe 252 is smaller than the inner diameter of the communication pipe 251 of the first heat exchange plate 221 in the second heat exchange unit 212, so that the flow guide pipe 252 is inserted into the communication pipe 251 of the first heat exchange plate 221 in the second heat exchange unit 212.

Two second openings 112 are arranged on the upper shell 110 at positions corresponding to the two communicating pipes 251 of the second heat exchange plate 223 in the first heat exchange unit 211, and the two communicating pipes 251 of the second heat exchange plate 223 in the first heat exchange unit 211 respectively pass through the two second openings 112 and extend to the outside of the heat exchanger.

Specifically, the upper housing 110 and the lower housing 120 may be connected by a screw joint, a snap joint, or the like, which may be specifically set according to actual design and use requirements, and this embodiment does not specifically limit this.

More specifically, two first openings 111 are hermetically connected with two communication pipes 251 of the first heat exchange plate 221 in the first heat exchange single body 211, and two second openings 112 are hermetically connected with two communication pipes 251 of the second heat exchange plate 223 in the first heat exchange single body 211, so as to reduce heat loss.

More specifically, the heat exchanger in the present embodiment can be used for heating or cooling of an automobile battery and a motor. Moreover, the two communicating pipes 251 of the first heat exchange plate 221 in the first heat exchange unit 211 respectively penetrate through the two first openings 111 and extend to one end outside the heat exchanger to be communicated with the heat exchange medium channel 241 of the battery, the two communicating pipes 251 of the second heat exchange plate 223 in the first heat exchange unit 211 respectively penetrate through the two second openings 112 and extend to one end outside the heat exchanger to be communicated with the heat exchange medium channel 241 of the motor, and the heat exchange between the heat exchanger and the automobile battery and the motor is performed to complete the cooling or heating of the automobile battery and the motor.

It should be noted that the detachable connection between the upper shell 110 and the lower shell 120 can facilitate the maintenance and replacement of the internal structure of the heat exchanger. The flow guide pipeline 252 is inserted into the communicating pipeline 251 of the first heat exchange plate 221 in the second heat exchange unit 212, so that a sealing member is prevented from being arranged between the flow guide pipeline 252 and the communicating pipeline 251 of the first heat exchange plate 221 in the second heat exchange unit 212, and the number of sub-parts of the sealing member of the heat exchanger is further reduced.

Another embodiment of this embodiment provides a heat exchanger, as shown in fig. 1 and fig. 6, a support plate 261 is further disposed between the second heat exchange fins 232 of the second heat exchange plate 223 in the two heat exchange units, the support plate 261 is made of an elastic material, a cross section of the support plate 261 in the length direction of the heat exchanger is corrugated, and a compression amount of the support plate 261 is the same as a sum of sizes of the first boss 253 and the second boss 2511 in the thickness direction of the heat exchanger.

Specifically, the material of the supporting plate 261 can be set to be rubber material, elastic steel material or other elastic material, which can be set according to actual design and use requirement, and this embodiment does not specifically limit this.

It should be noted that, the supporting plate 261 is arranged to support the second heat exchanging fins 232 of the second heat exchanging plate 223 in the two heat exchanging units, so as to prevent the heat exchanging plate from deforming. Compared with a rigid material, the support plate 261 is made of an elastic material, so that the support plate 261 can deform to a certain extent when being extruded to better support the second heat exchange plate 232 of the second heat exchange plate 223 in the two heat exchange units. Since there is a space between the two heat exchange cells, that is, the first boss 253 and the second boss 2511 are formed in the thickness direction of the heat exchanger, the compression amount of the support plate 261 is the same as the sum of the sizes of the first boss 253 and the second boss 2511 in the thickness direction of the heat exchanger. Compared with the supporting plate 261 having a rectangular cross section in the length direction of the heat exchanger, the corrugated cross section of the supporting plate 261 in the length direction of the heat exchanger enables the supporting plate 261 to be lighter in weight while ensuring the supporting performance of the supporting plate 261.

Another embodiment of the present embodiment provides a heat exchanger, as shown in fig. 7, the heat exchanger further includes a sealing ring 30, a first sealing groove 113 extending along a circumferential direction of the upper casing 110 is disposed on a side surface of the upper casing 110, which is attached to the lower casing 120, a second sealing groove 121 extending along the circumferential direction of the lower casing 120 is disposed on a side surface of the lower casing 120, which is attached to the upper casing 110, and the sealing ring 30 is respectively fitted with the first sealing groove 113 and the second sealing groove 121.

It should be noted that, the seal ring 30, the first seal groove 113 and the second seal groove 121 are in interference fit, and the arrangement of the seal ring 30, the first seal groove 113 and the second seal groove 121 can ensure the reliability of the seal between the upper casing 110 and the lower casing 120.

Another embodiment of this embodiment provides a heat exchanger, as shown in fig. 1 and 8, further comprising a gasket 40; one of the side of the upper shell 110 attached to the lower shell 120 and the side of the lower shell 120 attached to the upper shell 110 is further provided with a protrusion 130, the other is further provided with a groove 140, the sealing gasket 40 is arranged in the groove 140, and the protrusion 130 is matched with the groove 140; also, the protrusion 130 has a wedge shape, and the sealing gasket 40 is made of a flexible material.

Specifically, the number of the protrusions 130 may be set to 1, 2, 3, 4, etc., and the number of the grooves 140 and the gaskets 40 may be set to a number corresponding to the number of the protrusions 130. The specific configuration may be set according to actual design and use requirements, and this embodiment does not specifically limit this. Also, since the protrusion 130 has a wedge shape, the groove 140 is also provided as a wedge-shaped groove adapted to the protrusion 130.

More specifically, the material of the sealing pad 40 may be a rubber material, a plastic material or other flexible materials, which may be set according to actual design and use requirements, and this embodiment does not specifically limit this.

It should be noted that the arrangement of the protrusion 130 and the groove 140 further increases the sealing performance between the upper case 110 and the lower case 120. The wedge-shaped protrusion 130 and the sealing gasket 40 disposed in the groove 140 can improve the sealing performance between the protrusion 130 and the groove 140. Meanwhile, since the gasket 40 may be deformed, the gasket 40 may absorb a tolerance generated when the upper case 110 and the lower case 120 are coupled and engaged, thereby further increasing a sealing performance between the upper case 110 and the lower case 120.

Another embodiment of the present embodiment provides a heat exchanger, as shown in fig. 2, a plurality of reinforcing members 50 are disposed between the casing 10 and the heat exchange module 20, one end of each of the plurality of reinforcing members 50 is uniformly disposed on the outer side wall of the heat exchange module 20 at intervals along the circumferential direction of the heat exchange module 20, and the other end of each of the plurality of reinforcing members 50 is uniformly disposed on the inner side wall of the casing 10 at intervals along the circumferential direction of the casing 10.

Specifically, the number of the reinforcing members 50 may be set to 2, 3, 4, 5, etc., which may be specifically set according to actual design and use requirements, and this embodiment does not specifically limit this.

More specifically, two ends of the stiffener 50 may abut against the shell 10 and the heat exchange module 20, or may be fixedly connected to the shell 10 and the heat exchange module 20. Moreover, two ends of the stiffener 50 can be connected to the shell 10 and the heat exchange module 20 by clamping, riveting, or the like. The specific configuration may be set according to actual design and use requirements, and this embodiment does not specifically limit this.

It should be noted that, the plurality of reinforcing members 50 are disposed between the shell 10 and the heat exchange module 20, and can support and reinforce the shell 10 and the heat exchange module 20, so as to prevent the shell 10 from deforming after being stressed.

Another embodiment of the present embodiment provides a heat exchanger, as shown in fig. 1 and 9, a size range of the first and second flanges 2311 and 2321 in a thickness direction of the heat exchanger is set between 3mm and 5 mm; the included angle between the first flanging 2311 and the first heat exchanging plate 231 and the included angle between the second flanging 2321 and the second heat exchanging plate 232 are set to be 75-85 degrees.

The semiconductor layer 222 includes a plurality of semiconductor blocks arranged in a matrix, a thermal pad 2221 is provided on each of both side surfaces of each of the plurality of semiconductor blocks, and the thermal pad 2221 is made of a flexible material.

Specifically, the first and second burring 2311 and 2321 may be set to have a size of 3mm, 4mm, 4.5mm, 5mm, etc., respectively, in the thickness direction of the heat exchanger. The specific configuration may be set according to actual design and use requirements, and this embodiment does not specifically limit this.

Specifically, the included angle between the first flange 2311 and the first heat exchanging plate 231, and the included angle between the second flange 2321 and the second heat exchanging plate 232 may be respectively set to 75 °, 78 °, 81.5 °, 84 °, 85 °, and the like. The specific configuration may be set according to actual design and use requirements, and this embodiment does not specifically limit this.

More specifically, the material of the thermal pad 2221 may be a heat conductive flexible material such as silicone rubber or foam rubber, which may be set according to actual design and usage requirements, and this embodiment does not specifically limit this.

It should be noted that the thermal pad 2221 is made of a flexible material, and can absorb the flatness tolerance between the mating surfaces of the semiconductor block and the heat exchange plate, so as to ensure the attachment of the heat exchange surface and ensure the effective transfer of heat.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing is a more detailed description of the invention, and the specific embodiments thereof are not to be considered as limiting. Various changes in form and detail, including simple deductions or substitutions, may be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims (10)

1. A heat exchanger comprises a shell and a heat exchange module arranged in the shell, and is characterized in that the heat exchange module comprises at least one heat exchange monomer; any one of the at least one heat exchange monomer comprises a first heat exchange plate, a semiconductor layer and a second heat exchange plate which are sequentially stacked along the thickness direction of the heat exchanger;

each of the first heat exchange plate and the second heat exchange plate comprises a first heat exchange sheet and a second heat exchange sheet which are sequentially arranged along the thickness direction of the heat exchanger, a first flanging is arranged on the peripheral side of the first heat exchange sheet, and a second flanging is arranged on the peripheral side of the second heat exchange sheet, so that the first heat exchange sheet and the second heat exchange sheet are both in a bowl shape; the first heat exchange plate is matched with the second heat exchange plate, and one side of the first flanging far away from the first heat exchange plate and one side of the second flanging far away from the second heat exchange plate are fixed and hermetically connected, so that a medium channel is formed between the first heat exchange plate and the second heat exchange plate;

two side surfaces of the semiconductor layer are respectively attached to the second heat exchange sheet of the first heat exchange plate and the outer side surface of the first heat exchange sheet of the second heat exchange plate, so that the heat transfer state of a medium between the medium channel of the first heat exchange plate and the medium channel of the second heat exchange plate is adjusted through the electrifying state of the semiconductor layer.

2. The heat exchanger as claimed in claim 1, wherein in each of the heat exchange plates, a baffle plate extending along a length direction of the heat exchange plate is provided in the medium passage, one end of the baffle plate abuts against an inner side wall of one end of the heat exchange plate, a gap is formed between the other end of the baffle plate and the inner side wall of the other end of the heat exchange plate, and, in a thickness direction of the heat exchanger, both sides of the baffle plate abut against inner wall surfaces of the first heat exchanger plate and the second heat exchanger plate, respectively, so that the medium passage is divided into a first flow passage and a second flow passage, and the first flow passage and the second flow passage are communicated through the gap;

and one end of each heat exchange plate is provided with two communicating pipelines which are respectively communicated with the first flow passage and the second flow passage, so that a medium from one of the two communicating pipelines sequentially flows through the first flow passage, the gap and the second flow passage and then flows out from the other communicating pipeline.

3. The heat exchanger according to claim 2, wherein the at least one heat exchange unit comprises two heat exchange units, the two heat exchange units are a first heat exchange unit and a second heat exchange unit respectively, the first heat exchange unit and the second heat exchange unit are arranged at an interval in the thickness direction of the heat exchanger, the second heat exchange plate in the first heat exchange unit is arranged close to the second heat exchange plate in the second heat exchange unit, and the first heat exchange plate in the first heat exchange unit is arranged away from the first heat exchange plate in the second heat exchange unit; wherein,

the two communicating pipelines on the first heat exchange plate of each of the first heat exchange monomer and the second heat exchange monomer are both positioned at one end of the heat exchanger, and the second heat exchange plate of the first heat exchange monomer is provided with two flow guide pipelines which are communicated with and hermetically connected with the two communicating pipelines of the first heat exchange plate of the second heat exchange monomer; the two flow guide pipelines are respectively communicated with the first flow channel and the second flow channel of the first heat exchange plate in the first heat exchange unit, so that a medium from one of the two communication pipelines of the first heat exchange plate in the first heat exchange unit can also flow through one of the two flow guide pipelines, sequentially flow through the first flow channel, the gap and the second flow channel of the first heat exchange plate in the second heat exchange unit, then flow through the other flow guide pipeline, and flow out from the other communication pipeline of the two communication pipelines of the first heat exchange plate in the first heat exchange unit;

the two communicating pipelines of the second heat exchange plate of each of the first heat exchange monomer and the second heat exchange monomer are both positioned at the other end of the heat exchanger, and two first bosses which are communicated with and hermetically connected with the two communicating pipelines of the second heat exchange plate in the second heat exchange monomer are arranged on the second heat exchange plate of the second heat exchange plate in the first heat exchange monomer; the inner cavities of the two first bosses are respectively communicated with the first flow channel and the second flow channel of the second heat exchange plate in the first heat exchange monomer, so that a medium from one of the two communication pipelines of the second heat exchange plate in the first heat exchange monomer can also flow through the inner cavity of one of the two first bosses, sequentially flow through the first flow channel, the gap and the second flow channel of the second heat exchange plate in the second heat exchange monomer, then flow through the inner cavity of the other first boss, and flow out from the other communication pipeline of the two communication pipelines of the second heat exchange plate in the first heat exchange monomer.

4. The heat exchanger according to claim 3, wherein the two communication pipes of the second heat exchange plate in the second heat exchange unit are respectively provided as two second bosses which are respectively communicated and hermetically connected with the two first bosses, and the axes of the two communication pipes of the second heat exchange plate in the first heat exchange unit are respectively located on the same straight line with the axes of the two first bosses and the two second bosses;

the axes of the two communicating pipelines of the first heat exchange plate in the first heat exchange unit are respectively positioned on the same straight line with the axes of the two flow guide pipelines and the two communicating pipelines of the first heat exchange plate in the second heat exchange unit.

5. The heat exchanger according to claim 4, wherein the shell comprises an upper shell and a lower shell which are sequentially arranged along the thickness direction of the heat exchanger, an accommodating space is formed between the upper shell and the lower shell, the heat exchange module is arranged in the accommodating space, and the upper shell and the lower shell are detachably connected;

two first openings are formed in the upper shell at positions corresponding to the two communicating pipelines of the first heat exchange plate in the first heat exchange unit, and the two communicating pipelines of the first heat exchange plate in the first heat exchange unit respectively penetrate through the two first openings and extend to the outside of the heat exchanger; the outer diameter of the flow guide pipeline is smaller than the inner diameter of the communicating pipeline of the first heat exchange plate in the second heat exchange unit, so that the flow guide pipeline is inserted into the communicating pipeline of the first heat exchange plate in the second heat exchange unit;

two second openings are formed in the positions, corresponding to the two communicating pipelines of the second heat exchange plate in the first heat exchange unit, of the upper shell, and the two communicating pipelines of the second heat exchange plate in the first heat exchange unit respectively penetrate through the two second openings to extend to the outside of the heat exchanger.

6. The heat exchanger of claim 5, wherein a support plate is further arranged between the second heat exchange fins of the second heat exchange plate in the two heat exchange units, the support plate is made of an elastic material, the cross section of the support plate in the length direction of the heat exchanger is corrugated, and the compression amount of the support plate is the same as the sum of the sizes of the first boss and the second boss in the thickness direction of the heat exchanger.

7. The heat exchanger as claimed in claim 5, wherein the heat exchanger further comprises a sealing ring, a first sealing groove extending along a circumferential direction of the side surface of the upper shell, which is attached to the lower shell, is formed on the side surface of the lower shell, which is attached to the upper shell, is formed on the side surface of the upper shell, which is attached to the lower shell, is formed on the side surface of the upper shell, which is attached to the upper shell, is formed on the side surface of the upper shell, and the sealing ring is respectively matched with the first sealing groove and the second sealing groove.

8. The heat exchanger of claim 7, further comprising a gasket; one of the side surface of the upper shell, which is attached to the lower shell, and the side surface of the lower shell, which is attached to the upper shell, is also provided with a protrusion, the other side surface is also provided with a groove, the sealing gasket is arranged in the groove, and the protrusion is matched with the groove; and, the arch is the wedge, sealed pad is made by flexible material.

9. The heat exchanger of claim 1, wherein a plurality of reinforcing members are arranged between the shell and the heat exchange module, one end of the plurality of reinforcing members is uniformly arranged on the outer side wall of the heat exchange module at intervals along the circumferential direction of the heat exchange module, and the other end of the plurality of reinforcing members is uniformly arranged on the inner side wall of the shell at intervals along the circumferential direction of the shell.

10. The heat exchanger according to any one of claims 1 to 9, wherein the first flange and the second flange are provided in a size range of 3mm to 5mm in a thickness direction of the heat exchanger; the included angle between the first flanging and the first heat exchange sheet and the included angle between the second flanging and the second heat exchange sheet are set to be 75-85 degrees;

the semiconductor layer comprises a plurality of semiconductor blocks which are arranged in a matrix mode, two side faces of each semiconductor block in the plurality of semiconductor blocks are respectively provided with a heat conduction pad, and the heat conduction pads are made of flexible materials.

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