CN218401291U - Material distributing device - Google Patents
Material distributing device Download PDFInfo
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- CN218401291U CN218401291U CN202222854128.7U CN202222854128U CN218401291U CN 218401291 U CN218401291 U CN 218401291U CN 202222854128 U CN202222854128 U CN 202222854128U CN 218401291 U CN218401291 U CN 218401291U
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Abstract
The utility model relates to a material distribution device, which comprises an operation panel, two material conveying grooves, two material separation mechanisms, a separation positioning mechanism and a distribution mechanism; the two ends of the sorting positioning mechanism are respectively provided with a material separating mechanism; the material separation mechanism comprises a material separation rod and a material separation cylinder; the sorting positioning mechanism comprises a plurality of positioning devices and a fixing plate; the sub-packaging mechanism comprises a plurality of material collecting pipes, a plurality of material collecting frames, a movable frame, a sliding rail, a sliding block, a partition plate and a partition plate lifting cylinder. The utility model has the advantages that: (1) The semiconductor devices can be intercepted one by one through the material separation mechanism, and the pins of the semiconductor devices are intercepted through the positioning grids, so that the semiconductor devices can be quickly and accurately positioned at the detection positions, and the operation cost is low; (2) Through setting up a plurality of collecting tubes and collecting frame, the semiconductor device that will detect carries out categorised collection according to the test result, and the collection of the yields of being convenient for also is convenient for put together different substandard products according to the different classifications of flaw kind, makes things convenient for subsequent processing.
Description
Technical Field
The utility model relates to a chip sorting facilities technical field, especially a distributing device.
Background
When marking and packaging are carried out on a semiconductor device, quality detection needs to be carried out on a product, and a commonly used detection method at present is to extract a plurality of points at different positions on a wafer to carry out parameter testing. After the semiconductor devices are detected in a centralized mode, the semiconductor devices need to be classified and collected, detected qualified products and detected defective products are collected separately, the size of the semiconductor devices is small, the number of the semiconductor devices in the same batch is large, the semiconductor devices cannot be conveyed to a detection station one by one rapidly and accurately, detection is affected due to inaccurate positioning of the semiconductor devices, and the material distribution work efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a divide material device can fix a position semiconductor device fast, is convenient for divide the point to detect and categorised collection.
In order to achieve the purpose of the utility model, a material separating device is provided, which comprises an operation panel, two material conveying grooves, two material separating mechanisms, a separating and positioning mechanism and a sub-packaging mechanism;
the operation panel is an inclined plane, the material conveying groove is vertically fixed on the operation panel, and the top, the bottom and one side of the material conveying groove are provided with openings;
the operation panel is provided with a bottom plate and a top plate; the two ends of the sorting and positioning mechanism are respectively provided with the material separating mechanism;
the material separating mechanism comprises a material separating rod and a material separating cylinder, the material separating rod is U-shaped, the material separating cylinder is fixed on the bottom plate, the top plate is provided with a through hole, the through hole is positioned on one side of the material conveying groove, one end of the material separating rod penetrates through the through hole and is fixed with a piston rod of the material separating cylinder, and the other end of the material separating rod faces the operating panel;
the sorting positioning mechanism is positioned on one side of the material conveying groove; the sorting positioning mechanism comprises a plurality of positioning devices and a fixing plate, and the fixing plate is fixed on the top plate; the positioning device comprises a positioning cylinder and a positioning grid, the positioning cylinder is fixed on the fixing plate, the positioning grid is connected with a piston rod of the positioning cylinder, and the positioning grid is provided with a plurality of positioning grooves;
the sub-packaging mechanism comprises a plurality of material collecting pipes, a plurality of material collecting frames, a moving frame, a sliding rail, a sliding block, a partition plate and a partition plate lifting cylinder; the material collecting pipe is communicated with a material outlet of the material collecting frame;
the top plate is provided with a through groove, the through groove is positioned above the feeding hole of the material collecting frame, one side of the partition plate penetrates through the through groove, the other side of the partition plate is fixed with a piston rod of the partition plate lifting cylinder, and a cylinder body of the partition plate lifting cylinder is fixed on the bottom plate;
the upper opening and the lower opening of the movable frame are formed, and the movable frame is connected with the sliding rail through the sliding block.
As a further improvement of the utility model, the fixed plate is equipped with a plurality of spread groove, it still includes connecting plate and fastening element to select separately positioning mechanism, the connecting plate is equipped with the connecting hole, the connecting plate with the cylinder body of location cylinder is fixed, fastening element passes the connecting hole with the spread groove is fixed the location cylinder on the fixed plate.
As a further improvement of the utility model, the both sides position of the discharge gate of collection frame all is equipped with the elasticity dead lever, the material collecting pipe is located two between the elasticity dead lever.
The utility model discloses a material distribution device, semiconductor device transmit in the fortune silo, and semiconductor device's lead pin wears out the side of fortune silo, and semiconductor device because the action of gravity is landing downwards in the fortune silo one by one, and semiconductor device makes semiconductor device wafer test point up after the turn-over of stirring mechanism; the semiconductor device after turning over continues to slide downwards to a sorting positioning mechanism below and is stopped by a material separating mechanism; after the material separation rod is lifted up, the semiconductor devices slide down one by one, the material separation rod stops the semiconductor devices above, the positioning cylinder descends the positioning grid, the positioning grid blocks pins of the semiconductor devices, the semiconductor devices are accurately positioned at the target positions to be detected, the sorting positioning mechanism is provided with a detection probe, after the test is finished, the positioning grid is lifted up, the semiconductor devices continuously slide down to enter the test of the next position point, each positioning grid corresponds to a test station of different test positions of the wafer, and all test results are sequentially and correspondingly transmitted to the terminal; after the testing of all the position points is finished, the semiconductor devices are intercepted one by the material separating rod below the sorting positioning mechanism, the tested semiconductor devices sequentially enter the movable frame one by one, the movable frame is moved to the corresponding material collecting frame along the partition plate by controlling the rotation of the screw rod according to the testing result recorded by the terminal, the partition plate is immediately retracted into the top plate, the semiconductor devices in the movable frame lose the blocking effect of the partition plate below the movable frame and immediately fall into the material collecting frame, and the material collecting frames respectively and correspondingly collect defective products detected by different testing points and collect the defective products through the material collecting pipes below the movable frame.
The utility model relates to a divide material device compares advantage that has with prior art:
the utility model has the advantages that: (1) The semiconductor devices can be intercepted one by one through the material separation mechanism, and the pins of the semiconductor devices are intercepted through the positioning grids, so that the semiconductor devices can be quickly and accurately positioned at the detection positions, and the operation cost is low;
(2) Through setting up a plurality of material collecting pipes and collecting frame, the semiconductor device that will detect carries out categorised collection according to the test result, and the collection of the yields of being convenient for also is convenient for collect the different categorised collections of different substandard products according to the different classification of flaw kind, makes things convenient for subsequent processing.
Drawings
FIG. 1 is a schematic structural view of a material distributing device;
FIG. 2 is a schematic structural view of a sorting positioning mechanism;
FIG. 3 is a schematic view of a positioning device;
FIG. 4 is a schematic structural view of the dispensing mechanism;
FIG. 5 is a schematic view of a separator plate structure;
fig. 6 is a schematic view of a fixing rod structure.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the material distribution device of the present invention comprises an operation panel 1, two material conveying tanks 2, two material separating mechanisms 4, a separation positioning mechanism 5, and a distribution mechanism 6;
the operation panel 1 is an inclined plane, the material conveying groove 2 is vertically fixed on the operation panel 1, and the top, the bottom and one side of the material conveying groove 2 are provided with openings; the semiconductor chips in the carrier tank 2 can be transferred by gravity.
As shown in fig. 5, the operation panel 1 is provided with a bottom plate 12 and a top plate 11; the two ends of the sorting positioning mechanism 5 are provided with material separating mechanisms 4; the material separating mechanism 4 comprises a material separating rod 41 and a material separating cylinder 42, the material separating rod 41 is U-shaped, the material separating cylinder 42 is fixed on the bottom plate 12, the top plate 11 is provided with a through hole 111, the through hole 111 is positioned at one side of the material conveying groove 2, one end of the material separating rod 41 penetrates through the through hole 111 to be fixed with a piston rod of the material separating cylinder 42, and the other end of the material separating rod 41 faces the operation panel 1; the material separating cylinder 42 controls the lifting of the material separating rod 41, the through hole 111 plays a limiting role, when the material separating rod 41 moves downwards, the semiconductor device 7 above the material separating rod can be separated and blocked, the material separating rod 41 moves upwards, and the semiconductor device 7 continues to slide downwards.
As shown in fig. 2-3, the sorting positioning mechanism 5 is positioned at one side of the material conveying groove 2; the sorting positioning mechanism 5 comprises a plurality of positioning devices 51 and a fixing plate 52, and the fixing plate 52 is fixed on the top plate 11; the positioning device 51 comprises a positioning cylinder 511 and a positioning grid 512, the positioning cylinder 511 is fixed on the fixing plate 52, the positioning grid 512 is connected with a piston rod of the positioning cylinder 511, the positioning grid 512 is provided with a plurality of positioning grooves 513, and the number of the positioning grooves 513 can be set according to the number of pins of the semiconductor device 7;
in order to accommodate the testing requirements of different kinds of semiconductor devices 7, the positioning device 51 may be arranged to be detachable. The fixing plate 52 is provided with a plurality of connecting grooves 521, the sorting positioning mechanism 5 further comprises a connecting plate 514 and a fastening part 516, the connecting plate 514 is provided with a connecting hole 516, the connecting plate 514 is fixed with the cylinder body of the positioning cylinder 511, the fastening part 515 penetrates through the connecting hole 516 and the connecting grooves 521 to fix the positioning cylinder 511 on the fixing plate 52, the fastening part 515 is a combination of a bolt and a nut, the positioning device 51 is convenient to disassemble, and the positioning device 51 can be replaced or the position and the number of the positioning device 51 can be adjusted according to the requirements of different testing positions of different types of semiconductor devices 7 and wafers.
As shown in fig. 4-6, the sub-packaging mechanism 6 includes a plurality of material collecting pipes 61, a plurality of material collecting frames 62, a movable frame 63, a slide rail 64, a slide block 641, a partition plate 65, and a partition plate lifting cylinder 67; the discharge port of the collecting pipe 61 is communicated with the discharge port of the collecting frame 62, the collecting pipe 61 is divided into a good pipe and a plurality of defective pipes, in order to conveniently replace each collecting pipe 61, elastic fixing rods 66 are arranged at the positions of the two sides of the discharge port of the collecting frame 62, the collecting pipe 61 is inserted between the two elastic fixing rods 66, and the fixing rods 66 are elastic, so that the collecting pipe 61 can be conveniently detached on the premise that the collecting pipe 61 is tightly buckled due to the fact that the general weight of the semiconductor device 7 in the pipe is light.
The top plate 11 is provided with a through groove 112, the through groove 112 is positioned above the feeding hole of the collecting frame 62, one side of the clapboard 65 penetrates through the through groove 112, the other side of the clapboard 65 is fixed with a piston rod of the clapboard lifting cylinder 67, and a cylinder body of the clapboard lifting cylinder 67 is fixed on the bottom plate 12;
the movable frame 63 has an upper opening and a lower opening, the movable frame 63 is connected to the slide rail 64 through a slider 641, and the slider 641 can move back and forth through a lead screw (this driving method is prior art and not shown in the figure).
The utility model discloses a material distribution device, semiconductor device 7 transmits in fortune silo 2, and the pin of semiconductor device 7 wears out the side of fortune silo 2, and semiconductor device 7 is because the effect of gravity slides down in fortune silo 2 one by one, and semiconductor device 7 makes semiconductor device 7 wafer test point up after stirring mechanism 3 turns over; the semiconductor device 7 after turning over continues to slide downwards to the sorting positioning mechanism 5 below and is stopped by the material separating mechanism 4; after the material separating rod 41 is lifted, the semiconductor devices 7 slide downwards one by one, the material separating rod 41 stops the semiconductor device 7 above, the positioning cylinder 511 lowers the positioning grid 512, the positioning grid 512 blocks the pins of the semiconductor device 7, the semiconductor device 7 is accurately positioned at the target position for detection, the sorting and positioning mechanism 5 is provided with a detection probe, after the test is finished, the positioning grid 512 is lifted, the semiconductor device 7 continues to slide downwards to enter the test of the next position point, each positioning grid 512 corresponds to the test station of different test positions of the wafer, and all test results are sequentially and correspondingly transmitted to the terminal; after the tests of all the position points are finished, the semiconductor devices 7 are intercepted one by the material separating rod 41 below the sorting positioning mechanism 5, the tested semiconductor devices 7 sequentially enter the movable frame 63 one by one, the movable frame 63 is moved to the corresponding material collecting frame 62 along the partition plate 65 by controlling the rotation of the screw rod according to the test result recorded by the terminal, the partition plate 65 is retracted into the top plate 11 immediately, the semiconductor devices 7 in the movable frame 63 lose the blocking effect of the lower Fang Geban and immediately fall into the material collecting frame 62, and the material collecting frames 62 respectively and correspondingly collect defective products detected by different test points and collect the defective products through the material collecting pipes 61 below.
The photoelectric sensor can sense the semiconductor device 7, so that the operations of the material separation cylinder 42, the positioning cylinder 511 and the partition lifting cylinder 67 can be controlled.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (3)
1. A material distribution device is characterized by comprising an operation panel, two material conveying tanks, two material separation mechanisms, a separation positioning mechanism and a distribution mechanism;
the operation panel is an inclined plane, the material conveying groove is vertically fixed on the operation panel, and the top, the bottom and one side of the material conveying groove are provided with openings;
the operation panel is provided with a bottom plate and a top plate; the two ends of the sorting and positioning mechanism are provided with the material separating mechanisms;
the material separation mechanism comprises a material separation rod and a material separation cylinder, the material separation rod is U-shaped, the material separation cylinder is fixed on the bottom plate, a through hole is formed in the top plate and is located on one side of the material conveying groove, one end of the material separation rod penetrates through the through hole and is fixed with a piston rod of the material separation cylinder, and the other end of the material separation rod faces the operation panel;
the sorting positioning mechanism is positioned on one side of the material conveying groove; the sorting positioning mechanism comprises a plurality of positioning devices and a fixing plate, and the fixing plate is fixed on the top plate; the positioning device comprises a positioning cylinder and a positioning grid, the positioning cylinder is fixed on the fixing plate, the positioning grid is connected with a piston rod of the positioning cylinder, and the positioning grid is provided with a plurality of positioning grooves;
the sub-packaging mechanism comprises a plurality of material collecting pipes, a plurality of material collecting frames, a moving frame, a sliding rail, a sliding block, a partition plate and a partition plate lifting cylinder; the material collecting pipe is communicated with a material outlet of the material collecting frame;
the top plate is provided with a through groove, the through groove is positioned above the feeding hole of the material collecting frame, one side of the partition plate penetrates through the through groove, the other side of the partition plate is fixed with a piston rod of the partition plate lifting cylinder, and a cylinder body of the partition plate lifting cylinder is fixed on the bottom plate;
the upper opening and the lower opening of the movable frame are formed, and the movable frame is connected with the sliding rail through the sliding block.
2. The material separating device as claimed in claim 1, wherein the fixing plate is provided with a plurality of connecting slots, the separating and positioning mechanism further comprises a connecting plate and a fastening member, the connecting plate is provided with a connecting hole, the connecting plate is fixed with the cylinder body of the positioning cylinder, and the fastening member passes through the connecting hole and the connecting slots to fix the positioning cylinder on the fixing plate.
3. The material separating device as claimed in claim 1, wherein elastic fixing rods are arranged at two sides of the discharge port of the material collecting frame, and the material collecting pipe is located between the two elastic fixing rods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222854128.7U CN218401291U (en) | 2022-10-27 | 2022-10-27 | Material distributing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222854128.7U CN218401291U (en) | 2022-10-27 | 2022-10-27 | Material distributing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218401291U true CN218401291U (en) | 2023-01-31 |
Family
ID=85005470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222854128.7U Active CN218401291U (en) | 2022-10-27 | 2022-10-27 | Material distributing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218401291U (en) |
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2022
- 2022-10-27 CN CN202222854128.7U patent/CN218401291U/en active Active
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