CN218388101U - Circuit board, packaging body and consumer - Google Patents
Circuit board, packaging body and consumer Download PDFInfo
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- CN218388101U CN218388101U CN202222445467.XU CN202222445467U CN218388101U CN 218388101 U CN218388101 U CN 218388101U CN 202222445467 U CN202222445467 U CN 202222445467U CN 218388101 U CN218388101 U CN 218388101U
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- main control
- circuit
- chip
- mother substrate
- control circuit
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Abstract
The application provides a circuit board, packaging body and consumer. The circuit board comprises a mother substrate, a main control circuit and a controlled circuit. The mother substrate includes a first region and a second region outside the first region. The main control circuit is arranged in the first area and comprises a first main control circuit and a second main control circuit which are arranged in the first area in a replaceable mode, the first main control circuit comprises a first main control chip and a first peripheral circuit connected with the first main control chip, the second main control circuit comprises a second main control chip and a second peripheral circuit connected with the second main control chip, and the first main control chip and the second main control chip are different. The controlled circuit is arranged in the second area of the mother substrate in a wired mode and is used for being electrically connected with the main control circuit. First main control chip and second main control chip can replace each other for circuit board application scope is wider, and under the chip shortage circumstances, this application can reduce the work load and the cost of chip replacement, reduces the influence of chip shortage.
Description
Technical Field
The application relates to the technical field of chips, in particular to a circuit board, a packaging body and electric equipment.
Background
The chip is widely applied to various electronic products. With the increasing demand for chips, chip supply shortages occur. Because the replacement chip with completely consistent functions is difficult to find, the replacement of the chip needs to make great changes on the circuit board, and the chip replacement has large workload and high cost.
SUMMERY OF THE UTILITY MODEL
The application provides a circuit board, a packaging body and electric equipment which are easy to replace.
The application provides a circuit board, includes:
a mother substrate including a first region and a second region outside the first region;
the main control circuit is arranged in the first area and comprises a first main control circuit and a second main control circuit which are arranged in the first area in a replaceable manner, the first main control circuit comprises a first main control chip and a first peripheral circuit connected with the first main control chip, the second main control circuit comprises a second main control chip and a second peripheral circuit connected with the second main control chip, and the first main control chip and the second main control chip are different; and
and the controlled circuit is arranged in the second area of the mother substrate in a wiring manner and is used for being electrically connected with the main control circuit.
Optionally, the second main control chip includes one or more substitute chips for substituting functions of the first main control chip, and the substitute chips and the first main control chip have different or the same pins.
Optionally, a plurality of first pads are disposed on the periphery of the first region of the mother substrate, the controlled circuit is electrically connected to the plurality of first pads, and the first main control circuit is disposed on the first region of the mother substrate and electrically connected to the plurality of first pads.
Optionally, the circuit board further includes:
a sub-substrate having a plurality of second pads arranged on a periphery thereof, the second main control circuit being wired on the sub-substrate and electrically connected to the plurality of second pads,
wherein the sub substrate is alternatively soldered in the first region of the mother substrate, and the plurality of second pads on the sub substrate are electrically connected to the plurality of first pads on the mother substrate correspondingly.
Optionally, the first main control circuit and the second main control circuit may be alternatively wired in the first region of the mother substrate.
Optionally, when the first main control circuit is arranged in the first area of the mother substrate, the first area of the mother substrate has a first circuit trace, and the first main control circuit is electrically connected to the controlled circuit through the first circuit trace; when the second master control circuit is arranged in the first area of the mother substrate, the first area of the mother substrate is provided with a second circuit line, and the second master control circuit is electrically connected with the controlled circuit through the second circuit line.
Optionally, the first peripheral circuit and the second peripheral circuit include at least one of a crystal oscillator circuit, a power supply filter circuit, and a memory circuit.
The application provides a package comprising a circuit board as described in any of the above.
The application further provides an electric device which comprises the circuit board.
Optionally, the electric device includes an air conditioner.
In some embodiments, the first main control chip and the second main control chip can be replaced mutually, so that the application range of the circuit board is wider, the workload and the cost of chip replacement can be reduced under the condition of chip shortage, and the influence of chip shortage is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic structural diagram of an embodiment of a circuit board of the present application.
Fig. 2 is a schematic structural diagram of another embodiment of the circuit board of the present application.
Fig. 3 is a schematic structural diagram of another embodiment of the circuit board of the present application.
Fig. 4 is a schematic structural diagram of another embodiment of the circuit board of the present application.
Fig. 5 is a schematic structural diagram of an embodiment of the package of the present application.
Fig. 6 is a schematic structural diagram of an embodiment of the electric device of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of "first," "second," and similar terms in the description and in the claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms a, an, etc. do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise indicated, "front", "rear", "lower" and/or "upper" and the like are for convenience of description and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
The circuit board of the embodiment of the application comprises a mother substrate, a main control circuit and a controlled circuit. The mother substrate includes a first region and a second region outside the first region. The main control circuit is arranged in the first area, the main control circuit comprises a first main control circuit and a second main control circuit which are arranged in the first area in a replaceable mode, the first main control circuit comprises a first main control chip and a first peripheral circuit connected with the first main control chip, the second main control circuit comprises a second main control chip and a second peripheral circuit connected with the second main control chip, and the first main control chip and the second main control chip can be different. The controlled circuit is arranged in the second area of the mother substrate in a wiring mode and is used for being electrically connected with the main control circuit. First main control chip and second main control chip can replace each other for circuit board application scope is wider, and under the chip shortage circumstances, this application can reduce the work load and the cost of chip replacement, reduces the influence of chip shortage.
The application provides a circuit board, a packaging body and electric equipment. The circuit board, the package, and the electric device according to the present invention will be described in detail with reference to the accompanying drawings. The features of the following examples and embodiments may be combined with each other without conflict.
Fig. 1 is a schematic structural diagram of an embodiment of a circuit board 100 of the present application. As shown in fig. 1, the circuit board 100 includes a mother substrate 101, a main control circuit 104, and a controlled circuit 111. The mother substrate 101 is subjected to a processing procedure such as etching, and a desired circuit can be obtained thereon. The mother substrate 101 includes a first region 102 and a second region 103 outside the first region 102. In some embodiments, the first region 102 is a regular shape. In some embodiments, the first region 102 is rectangular. The first region 102 is rectangular, so that the typesetting and wiring of the circuit board 100 can be simpler and the structure is clear. In some embodiments, the first region 102 is located in the middle of the mother substrate 101. The first region 102 is located in the middle of the substrate 101 to ensure a proper space for the circuits thereon. A master circuit 104 is disposed in the first region 102, the master circuit 104 may be a processor circuit. The master control circuit 104 includes a first master control circuit 105 disposed in the first area 102. The first main control circuit 105 includes a first main control chip 107 and a first peripheral circuit 108 connected to the first main control chip 107. The first master chip 107 may be a processor chip. The controlled circuit 111 is wired in the second region 103 of the mother substrate 101 and electrically connected to the main control circuit 104. In the present embodiment, the controlled circuit 111 is electrically connected to the first master control circuit 105, and the first master control circuit 105 controls the controlled circuit 111.
A plurality of first pads 112 are arranged on the periphery of the first region 102 of the mother substrate 101, the controlled circuit 111 is electrically connected to the plurality of first pads 112, and the first main control circuit 105 is wired in the first region 102 of the mother substrate 101 and electrically connected to the plurality of first pads 112. The first pads 112 are used to make electrical connections to components on the circuit board 100.
Fig. 2 is a schematic structural diagram of another embodiment of the circuit board 100 of the present application. With reference to fig. 1-2, the master control circuitry 104 includes second master control circuitry 106. First master control circuitry 105 and second master control circuitry 106 may alternatively be provided in first zone 102. The first master circuit 105 and the second master circuit 106 include at least the same function. In this embodiment, the controlled circuit 111 is electrically connected to the second master control circuit 106, and the second master control circuit 106 controls the controlled circuit 111. The second main control circuit 106 includes a second main control chip 109 and a second peripheral circuit 110 connected to the second main control chip 109, and the first main control chip 107 and the second main control chip 109 may be different. The second main control chip 109 at least satisfies the whole functions of the first main control chip 107, so that the first main control circuit 105 and the second main control circuit 106 can be replaced with each other. When the first main control chip 107 is out of stock, the second main control chip 109 can be used for replacing, and vice versa, so that the application range of the circuit board 100 can be wider, and under the condition of chip shortage, another chip can be conveniently used for replacing, and the influence of chip shortage is reduced.
With continued reference to fig. 2, the second master chip 109 may include one or more substitute chips 1091 for substituting the functions of the first master chip 107, the substitute chips 1091 having different pins than the first master chip 107. The second main control chip 109 at least satisfies all functions of the first main control chip 107, and one or more substitute chips 1091 for substituting the first main control chip 107 may be used. When the required chip is out of stock, a plurality of substitute chips 1091 can be flexibly used to replace the first main control chip 107, and no additional design is needed, so that the workload of chip substitution is reduced. The substitute chip 1091 is different from the first master chip 107 and thus has different pins. Of course, in other embodiments, the substitute chip 1091 and the first master chip 107 may have the same pins.
In some embodiments, the circuit board 100 further includes a submount 120. A plurality of second pads 113 are disposed on the periphery of the sub-substrate 120, and the second main control circuit 106 is disposed on the sub-substrate 120 and electrically connected to the plurality of second pads 113. The sub-substrate 120 may be alternatively soldered in the first area 102 of the mother substrate 101, and the plurality of second pads 113 on the sub-substrate 120 are electrically connected to the plurality of first pads 112 on the mother substrate 101, so as to electrically connect the second master control circuit 106 and the controlled circuit 111, and the second master control circuit 106 may control the controlled circuit 111. When the first main control circuit 105 needs to be replaced by the second main control circuit 106, the second main control circuit 106 only needs to be arranged on the sub-substrate 120 in a wired mode, and the plurality of second bonding pads 113 corresponding to the plurality of first bonding pads 112 are designed on the periphery of the sub-substrate 120, so that when chips are replaced, the sub-substrate 120 only needs to be placed in the first area 102, the plurality of second bonding pads 113 on the sub-substrate 120 are respectively and correspondingly welded to the plurality of first bonding pads 112 on the mother substrate 101, a circuit does not need to be additionally designed on the mother substrate 101, the original wiring on the mother substrate 101 does not need to be changed, the original mother substrate 101 can be continuously used, the mother substrate 101 does not need to be replaced, and therefore cost is greatly reduced.
Fig. 3 is a schematic structural diagram of another embodiment of the circuit board 100 of the present application. As shown in fig. 3, the first main control circuit 105 is wired in the first region 102 of the mother substrate 101. The first region 102 of the mother substrate 101 has a first circuit trace 121. The first master circuit 105 is electrically connected to the controlled circuit 111 through the first line trace 121, so as to be able to control the controlled circuit 111. In some embodiments, the first line trace 121 is designed at the chip design stage.
Fig. 4 is a schematic structural diagram of another embodiment of the circuit board 100 of the present application. As shown in fig. 4, the second main control circuit 106 is wired in the first region 102 of the mother substrate 101. The first region 102 of the mother substrate 101 has a second line trace 122. The second master circuit 106 is electrically connected to the controlled circuit 111 through the second line trace 122, so as to be used for controlling the controlled circuit 111.
As shown in conjunction with fig. 3 and 4, the first and second main control circuits 105 and 106 may be alternatively wired to the first region 102 of the mother substrate 101. In some embodiments, in the chip manufacturing stage, when it is found that the first main control circuit 105 is not available and needs to be replaced by the second main control circuit 106, the second line trace 122 only needs to be redesigned in the first area 102 to meet the requirement of the second main control circuit 106, so that the first main control circuit 105 can be replaced by the second main control circuit 106. Because the original first main control circuit 105 is disposed in the first area 102 of the circuit board 100, when the first main control circuit 105 is replaced by the second main control circuit 106, only the wiring of the first area 102 needs to be changed, and the second circuit trace 122 needs to be rearranged, while the wiring in the second area 103 where the controlled circuit 111 of the original circuit board 100 is located is not affected, so that excessive rewiring is not needed, and the workload of chip replacement is reduced.
In some embodiments, the first peripheral circuitry 108 and the second peripheral circuitry 110 may include, for example, at least one of a crystal oscillator circuit 118, a power filter circuit 117, and a memory circuit 116. The first peripheral circuit 108 and the second peripheral circuit 110 are auxiliary circuits around the first main control chip 107 and the second main control chip 109. The first peripheral circuitry 108 and the first master control chip 107 are co-packaged in the first area 102, which may facilitate routing between the first master control circuitry 105 and the slave circuitry 111.
Fig. 5 is a schematic structural diagram of an embodiment of the package 200 of the present application. As shown in fig. 5, the package 200 may include the circuit board 100 as shown in any one of fig. 1-4. The package 200 may be made of a suitable material and may be used to package the circuit board 100, so as to better protect and fix the circuit board 100.
Fig. 6 is a schematic structural diagram of an embodiment of a power consuming device 300 according to the present application. As shown in fig. 6, the powered device 300 includes the circuit board 100 shown in any of fig. 1-4. In the present embodiment, the electric device 300 includes an air conditioner 301. The air conditioning apparatus 301 includes an intake vent 302, an outlet vent 303, a fan assembly 304, and a heat exchanger 307. The air inlet 302 and the air outlet 303 are oppositely arranged at two ends of the air conditioning equipment 301. The fan assembly 304 is disposed at an end of the air conditioner 301 near the air inlet 302 for driving air flow. The fan assembly 304 includes a drive motor 306 and fan blades 305 disposed on either side of the drive motor 306. The heat exchanger 307 is provided at an end of the air conditioner 301 near the outlet 303 for heat exchange. The heat exchanger 307 includes a package 200 in which the circuit board 100 is packaged. The circuit board 100 is used to control the heat exchanger 307 to exchange heat. In the cooling or dehumidifying condition of the air conditioner 301, the fan assembly 304 drives air from the air inlet 302 into the air conditioner 301 and to the heat exchanger 307, the circuit board 100 controls the heat exchanger 307 to operate, and the air exchanges heat with the refrigerant in the heat exchanger 307.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. A circuit board, comprising:
a mother substrate including a first region and a second region outside the first region;
the main control circuit is arranged in the first area and comprises a first main control circuit and a second main control circuit which are arranged in the first area in a replaceable manner, the first main control circuit comprises a first main control chip and a first peripheral circuit connected with the first main control chip, the second main control circuit comprises a second main control chip and a second peripheral circuit connected with the second main control chip, and the first main control chip and the second main control chip are different; and
and the controlled circuit is arranged in the second area of the mother substrate in a wiring mode and is used for being electrically connected with the main control circuit.
2. The circuit board of claim 1, wherein the second master chip comprises one or more substitute chips for substituting the function of the first master chip, the substitute chips having different or the same pins as the first master chip.
3. The circuit board of claim 2, wherein a plurality of first pads are disposed on the periphery of the first region of the mother substrate, the controlled circuit is electrically connected to the plurality of first pads, and the first master circuit is disposed on the first region of the mother substrate and electrically connected to the plurality of first pads.
4. The circuit board of claim 3, further comprising:
a sub-substrate having a plurality of second pads arranged on a periphery thereof, the second main control circuit being wired on the sub-substrate and electrically connected to the plurality of second pads,
wherein the sub substrate is alternatively soldered in the first region of the mother substrate, and the plurality of second pads on the sub substrate are electrically connected to the plurality of first pads on the mother substrate correspondingly.
5. The circuit board of claim 2, wherein the first and second master circuits are alternatively routed to the first area of the mother substrate.
6. The circuit board according to claim 5, wherein when the first main control circuit traces are disposed in the first area of the mother substrate, the first area of the mother substrate has first circuit traces, and the first main control circuit is electrically connected to the controlled circuit through the first circuit traces; when the second master control circuit is arranged in the first area of the mother substrate, the first area of the mother substrate is provided with a second line, and the second master control circuit is electrically connected with the controlled circuit through the second line.
7. The circuit board according to any one of claims 1 to 6, wherein the first peripheral circuit and the second peripheral circuit include at least one of a crystal oscillator circuit, a power filter circuit, and a memory circuit.
8. A package comprising the circuit board according to any one of claims 1 to 7.
9. An electric consumer, characterized in that it comprises a circuit board according to any one of claims 1 to 7.
10. The electrical device of claim 9, wherein the electrical device comprises an air conditioning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222445467.XU CN218388101U (en) | 2022-09-15 | 2022-09-15 | Circuit board, packaging body and consumer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222445467.XU CN218388101U (en) | 2022-09-15 | 2022-09-15 | Circuit board, packaging body and consumer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388101U true CN218388101U (en) | 2023-01-24 |
Family
ID=84974058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222445467.XU Active CN218388101U (en) | 2022-09-15 | 2022-09-15 | Circuit board, packaging body and consumer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218388101U (en) |
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2022
- 2022-09-15 CN CN202222445467.XU patent/CN218388101U/en active Active
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