CN218360405U - Automatic adhesive dispensing device of semiconductor production line - Google Patents
Automatic adhesive dispensing device of semiconductor production line Download PDFInfo
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- CN218360405U CN218360405U CN202222961246.8U CN202222961246U CN218360405U CN 218360405 U CN218360405 U CN 218360405U CN 202222961246 U CN202222961246 U CN 202222961246U CN 218360405 U CN218360405 U CN 218360405U
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Abstract
The utility model discloses an automatic adhesive deposite device of semiconductor production line relates to semiconductor production point and glues technical field, including the workstation main part, the bottom of workstation main part is provided with unable adjustment base, and the top both ends of workstation main part are provided with fixed support board, and the top of workstation main part is provided with the drive pneumatic cylinder, and the spout has been seted up at the top of workstation main part. The utility model is provided with the first motor, the first transmission screw rod, the first screw rod nut, the second screw rod nut and the second slider, the dispensing head is driven to move back and forth by opening the first motor, and the dispensing head is driven to move left and right by opening the second motor; the semiconductor needing glue dispensing is fixed through the fixed clamping plate by arranging the driving hydraulic cylinder, the hydraulic cylinder driving shaft, the fixed clamping plate, the limiting slide block and the sliding chute; through setting up hydraulic cylinder, lift drive shaft, a little glue bucket and the head of gluing, and then can adjust the point of gluing the head and glue the height for the device suitability improves.
Description
Technical Field
The utility model relates to a technical field is glued in semiconductor production point, in particular to automatic adhesive deposite device of semiconductor production line.
Background
Such as the patent: a glue dispensing device (application number: CN 202123293278.7) for producing semiconductor chips comprises a bottom plate, wherein a workbench is arranged on the bottom plate, a glue dispensing mechanism is arranged on the workbench and provided with a glue dispensing gun, a lifting mechanism is arranged between the workbench and the bottom plate, and the lifting mechanism is provided with a cam, a sliding groove and a buffer spring. Through the arrangement of the lifting mechanism, the first servo motor controls the cam to rotate, the cam drives the lug to synchronously rotate, the lug slides in the chute, meanwhile, the lug drives the movable seat to move in the vertical direction through the chute, and the movable seat moves in the vertical direction through the supporting seat and the workbench driving device, so that the height of the gluing device can be adjusted, and the operation of personnel is facilitated; the second servo motor controls the screw rod to rotate, and the nut seat drives the second air cylinder and the dispensing gun to move, so that the dispensing position is adjusted, and the labor intensity of workers is reduced.
However, when the dispensing device for producing the semiconductor chip is used for dispensing, the dispensing route of the dispensing head can be adjusted transversely, and the semiconductor can not be dispensed automatically in all directions, so that the dispensing device is inconvenient for users to use. Therefore, it is necessary to provide an automatic dispensing device for semiconductor manufacturing line to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an automatic adhesive deposite device of semiconductor production line to the glue route is glued to the point that can only the horizontal adjustment point of proposition in solving above-mentioned background art glues, can not accomplish the problem of gluing to the all-round automatic point of semiconductor.
In order to achieve the above object, the utility model provides a following technical scheme: an automatic glue dispensing device for a semiconductor production line comprises a workbench main body, wherein fixed supporting plates are arranged at two ends of the top of the workbench main body, a vertical plate is installed at the top of each fixed supporting plate, a first motor is installed inside each vertical plate, one end of each first motor is connected with a first transmission lead screw, a first lead screw nut is sleeved on the outer wall of each first transmission lead screw, a first sliding block is sleeved on the outer wall of each first lead screw nut, a transverse plate is fixed at the top of each first sliding block, and the first motor drives the first transmission lead screw to rotate by opening the first motor, so that the first lead screw nut moves back and forth along the first transmission lead screw under the action of the first transmission lead screw, and further drives the first sliding block and the transverse plate to move back and forth;
the inside of diaphragm installs the second motor, the one end of second motor is connected with second transmission lead screw, second screw-nut has been cup jointed to the outer wall of second transmission lead screw, states the outer wall of second screw-nut and is provided with the second slider, the inside of second slider is provided with hydraulic cylinder, hydraulic cylinder's bottom is provided with the lift drive shaft, through opening hydraulic cylinder for the lift drive shaft can drive the some glue bucket and the dispensing head reciprocates, and then can adjust the some height of gluing of dispensing head, makes the device suitability improve.
Preferably, the bottom of workstation main part is provided with unable adjustment base, the top of workstation main part is provided with the drive pneumatic cylinder, the drive pneumatic cylinder is provided with two sets ofly, and is two sets of the pneumatic cylinder drive shaft is all installed to one side of drive pneumatic cylinder, and wherein through setting up two sets of drive pneumatic cylinders and pneumatic cylinder drive shaft, it is fixed conveniently to treat adhesive deposite device both sides.
Preferably, the spout has been seted up at the top of workstation main part, the spout has been seted up two sets ofly, the top of spout is provided with solid fixed splint, gu fixed splint's bottom is provided with spacing slider, spacing slider is provided with two sets ofly, and wherein can carry out spacingly to solid fixed splint's removal through setting up two sets of spouts and two sets of spacing sliders, prevents that solid fixed splint from taking place the skew.
Preferably, the driving hydraulic cylinder and the hydraulic cylinder driving shaft drive the fixed clamping plate to move left and right on the workbench main body, wherein the driving hydraulic cylinder is opened, so that the hydraulic cylinder driving shaft drives the fixed clamping plate to move on the workbench main body, and then the semiconductor device to be subjected to glue dispensing is fixed through the fixed clamping plate.
Preferably, the first motor drives the first transmission screw rod to rotate, and the first transmission screw rod drives the first screw rod nut to linearly move along the outer wall of the first transmission screw rod.
Preferably, the top of workstation main part is connected with the bucket of gluing, the bottom of the bucket of gluing is provided with the dispensing head, wherein pours into the glue that needs when gluing through the bucket of gluing inside, and the rethread dispensing head flows out, and then treats the semiconductor of gluing and glue and carry out the point.
Preferably, the second motor drives the second transmission screw rod to rotate, the second transmission screw rod drives the second screw rod nut to linearly move along the outer wall of the second transmission screw rod, the second screw rod nut drives the second slider to linearly move along the outer wall of the second transmission screw rod, the lifting hydraulic cylinder and the lifting driving shaft drive the dispensing barrel and the dispensing head to move up and down, the second motor is opened to drive the second transmission screw rod to rotate, the second screw rod nut is driven to linearly move along the outer wall of the second transmission screw rod under the action of the second transmission screw rod, the second slider can be driven to linearly move under the action of the second screw rod nut, and the lifting hydraulic cylinder is opened to drive the lifting driving shaft to drive the dispensing barrel and the dispensing head to move up and down so as to adjust the dispensing height of the dispensing head.
The utility model discloses a technological effect and advantage:
1. by arranging the first motor, the first transmission screw rod, the first screw rod nut, the first slide block, the transverse plate, the second motor, the second transmission screw rod, the second screw rod nut and the second slide block, the first motor drives the first transmission screw rod to rotate by opening the first motor, so that the first screw rod nut moves back and forth along the first transmission screw rod under the action of the first transmission screw rod, the first slide block and the transverse plate are driven to move back and forth, the dispensing head is driven to move back and forth, the second motor drives the second transmission screw rod to rotate by opening the second motor, the second screw rod nut moves left and right along the outer wall of the second transmission screw rod, the second slide block is driven to move left and right, and the dispensing head is driven to move left and right;
2. the driving hydraulic cylinder is opened to drive the hydraulic cylinder driving shaft to drive the fixed clamping plate to move on the workbench main body, and meanwhile, the limit sliding block and the sliding chute can limit the movement of the fixed clamping plate, so that a semiconductor needing glue dispensing is fixed through the fixed clamping plate;
3. through setting up hydraulic cylinder, lift drive shaft, point and glue bucket and point and glue the head, through opening hydraulic cylinder for the lift drive shaft can drive the point and glue the bucket and glue the head and reciprocate with the point, and then can adjust the point of gluing the head and glue the height, makes the device suitability improve.
Drawings
Fig. 1 is the utility model relates to an overall structure schematic diagram of an automatic adhesive deposite device of semiconductor production line.
Fig. 2 is the schematic view of the explosion structure of the automatic glue dispensing device of the semiconductor production line.
Fig. 3 is a schematic view of a overlooking structure of the automatic glue dispensing device of the semiconductor production line.
Fig. 4 is a schematic view of the structure of the automatic glue dispensing device of the semiconductor production line according to the present invention.
In the figure: 1. a table main body; 2. a fixed base; 3. fixing the support plate; 4. driving the hydraulic cylinder; 5. a hydraulic cylinder drive shaft; 6. fixing the clamping plate; 7. a limiting slide block; 8. a chute; 9. a vertical plate; 10. a first motor; 11. a first drive screw; 12. a first lead screw nut; 13. a first slider; 14. a transverse plate; 15. a second motor; 16. a second transmission screw rod; 17. a second feed screw nut; 18. a second slider; 19. a lifting hydraulic cylinder; 20. a lifting drive shaft; 21. dispensing a glue barrel; 22. and (5) dispensing a glue head.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides an automatic adhesive deposite device of semiconductor production line as shown in fig. 1-4, including workstation main part 1, workstation main part 1's top both ends are provided with fixed support plate 3, the riser 9 is installed at the top of fixed support plate 3, the internally mounted of riser 9 has first motor 10, the one end of first motor 10 is connected with first transmission lead screw 11, first lead screw nut 12 has been cup jointed to the outer wall of first transmission lead screw 11, first slider 13 has been cup jointed to the outer wall of first lead screw nut 12, the top of first slider 13 is fixed with diaphragm 14, through opening first motor 10, make first motor 10 drive first transmission lead screw 11 and rotate, thereby make first lead screw nut 12 under the effect of first transmission lead screw 11 along first transmission lead screw 11 seesaw, and then drive first slider 13 and diaphragm 14 back-and-forth movement;
a second motor 15 is installed inside the transverse plate 14, one end of the second motor 15 is connected with a second transmission screw rod 16, a second screw rod nut 17 is sleeved on the outer wall of the second transmission screw rod 16, a second slider 18 is arranged on the outer wall of the second screw rod nut 17, the second motor 15 drives the second transmission screw rod 16 to rotate by opening the second motor 15, the second screw rod nut 17 is further driven to move left and right along the outer wall of the second transmission screw rod 16, the second slider 18 is further driven to move left and right, a lifting hydraulic cylinder 19 is arranged inside the second slider 18, a lifting driving shaft 20 is arranged at the bottom of the lifting hydraulic cylinder 19, the lifting driving shaft 20 can drive the dispensing barrel 21 and the dispensing head 22 to move up and down by opening the lifting hydraulic cylinder 19, the dispensing height of the dispensing head 22 can be adjusted, and the applicability of the device is improved.
The bottom of workstation main part 1 is provided with unable adjustment base 2, and the top of workstation main part 1 is provided with drive pneumatic cylinder 4, and drive pneumatic cylinder 4 is provided with two sets ofly, and pneumatic cylinder drive shaft 5 is all installed to one side of two sets of drive pneumatic cylinders 4, wherein through setting up two sets of drive pneumatic cylinders 4 and pneumatic cylinder drive shaft 5, conveniently treats adhesive deposite device both sides fixed.
Drive hydraulic cylinder 4 and pneumatic cylinder drive shaft 5 and drive solid fixed splint 6 and remove about in workstation main part 1, wherein through opening drive hydraulic cylinder 4 for pneumatic cylinder drive shaft 5 drives solid fixed splint 6 and moves on workstation main part 1, and then fixes the semiconductor device who treats the point and glues through solid fixed splint 6.
The top of workstation main part 1 is connected with some and is glued bucket 21, and the bottom of some gluing bucket 21 is provided with some and glues head 22, wherein pours into the glue that needs when gluing through some gluing bucket 21 inside, and rethread point glues head 22 and flows out, and then treats the semiconductor of some glue and carry out some glue.
The top of workstation main part 1 is connected with some and glues bucket 21, and the bottom of some bucket 21 is provided with some head 22 of gluing, wherein pours into the glue that needs when gluing into through some bucket 21 insides, and rethread some head 22 flows out, and then carries out some glue to the semiconductor of treating some gluing.
The second motor 15 drives the second transmission screw rod 16 to rotate, the second transmission screw rod 16 drives the second screw rod nut 17 to linearly move along the outer wall of the second transmission screw rod 16, the second screw rod nut 17 drives the second slider 18 to linearly move along the outer wall of the second transmission screw rod 16, the lifting hydraulic cylinder 19 and the lifting driving shaft 20 drive the dispensing barrel 21 and the dispensing head 22 to move up and down, the second transmission screw rod 16 is driven to rotate by opening the second motor 15, the second screw rod nut 17 is driven to linearly move along the outer wall of the second transmission screw rod 16 under the action of the second transmission screw rod 16, the second slider 18 can be driven to linearly move under the action of the second screw rod nut 17, the lifting driving shaft 20 drives the dispensing barrel 21 and the dispensing head 22 to move up and down by opening the lifting hydraulic cylinder 19, and the dispensing height of the dispensing head 22 can be conveniently adjusted.
The working principle is as follows: when the automatic glue dispensing device for the semiconductor production line is used, a user places a semiconductor needing glue dispensing between two fixed clamp plates 6 at the top of a workbench main body 1, opens a driving hydraulic cylinder 4 to enable a hydraulic cylinder driving shaft 5 to drive the fixed clamp plates 6 to move towards the semiconductor needing glue dispensing, further fixes the semiconductor needing glue dispensing through the fixed clamp plates 6, opens a lifting hydraulic cylinder 19 to enable a lifting driving shaft 20 to drive a glue dispensing barrel 21 and a glue dispensing head 22 to move downwards, further performs glue dispensing operation on the semiconductor needing glue dispensing, when the front and back glue dispensing positions of the glue dispensing head 22 need to be adjusted, can open a first motor 10 to enable the first motor 10 to drive a first transmission screw rod 11 to rotate, thereby make first screw-nut 12 under the effect of first transmission lead screw 11 along first transmission lead screw 11 seesaw, and then drive first slider 13 and diaphragm 14 back-and-forth movement, thereby drive dispensing head 22 back-and-forth movement, when needing to adjust dispensing head 22 about the point and glue the position, through opening second motor 15, make second motor 15 drive second transmission lead screw 16 and rotate, and then make second screw-nut 17 remove about along second transmission lead screw 16's outer wall, and then drive second slider 18 and remove about, thereby it removes about driving dispensing head 22, the function is glued to the automatic all-round regulation point of this semiconductor production line automatic adhesive deposite device has been realized.
Claims (7)
1. The utility model provides an automatic adhesive deposite device of semiconductor production line, includes workstation main part (1), its characterized in that: the automatic feeding device is characterized in that fixed supporting plates (3) are arranged at two ends of the top of the workbench main body (1), a vertical plate (9) is installed at the top of the fixed supporting plates (3), a first motor (10) is installed inside the vertical plate (9), one end of the first motor (10) is connected with a first transmission screw rod (11), a first screw nut (12) is sleeved on the outer wall of the first transmission screw rod (11), a first sliding block (13) is sleeved on the outer wall of the first screw nut (12), and a transverse plate (14) is fixed at the top of the first sliding block (13);
the lifting mechanism is characterized in that a second motor (15) is installed inside the transverse plate (14), one end of the second motor (15) is connected with a second transmission screw rod (16), a second screw rod nut (17) is sleeved on the outer wall of the second transmission screw rod (16), a second sliding block (18) is arranged on the outer wall of the second screw rod nut (17), a lifting hydraulic cylinder (19) is arranged inside the second sliding block (18), and a lifting driving shaft (20) is arranged at the bottom of the lifting hydraulic cylinder (19).
2. The automatic glue dispensing device of the semiconductor production line according to claim 1, characterized in that: the bottom of workstation main part (1) is provided with unable adjustment base (2), the top of workstation main part (1) is provided with drive pneumatic cylinder (4), drive pneumatic cylinder (4) are provided with two sets ofly, two sets of pneumatic cylinder drive shaft (5) are all installed to one side of drive pneumatic cylinder (4).
3. The automatic glue dispensing device of the semiconductor production line according to claim 1, characterized in that: spout (8) have been seted up at the top of workstation main part (1), two sets of have been seted up in spout (8), the top of spout (8) is provided with solid fixed splint (6), the bottom of solid fixed splint (6) is provided with stop block (7), stop block (7) are provided with two sets ofly.
4. The automatic glue dispensing device of the semiconductor production line as claimed in claim 2, wherein: the driving hydraulic cylinder (4) and the hydraulic cylinder driving shaft (5) drive the fixed clamping plate (6) to move left and right on the workbench main body (1).
5. The automatic glue dispensing device of the semiconductor production line according to claim 1, characterized in that: the first motor (10) drives the first transmission screw rod (11) to rotate, the first transmission screw rod (11) drives the first screw rod nut (12) to linearly move along the outer wall of the first transmission screw rod (11), the first screw rod nut (12) drives the first sliding block (13) to linearly move along the first transmission screw rod (11), and the first sliding block (13) drives the transverse plate (14) to linearly move along the first transmission screw rod (11).
6. The automatic glue dispensing device of the semiconductor production line according to claim 1, characterized in that: the top of workstation main part (1) is connected with some and is glued bucket (21), the bottom of some gluing bucket (21) is provided with some and glues head (22).
7. The automatic glue dispensing device of the semiconductor production line according to claim 1, characterized in that: the second motor (15) drives the second transmission screw rod (16) to rotate, the second transmission screw rod (16) drives the second screw rod nut (17) to linearly move along the outer wall of the second transmission screw rod (16), the second screw rod nut (17) drives the second sliding block (18) to linearly move along the outer wall of the second transmission screw rod (16), and the lifting hydraulic cylinder (19) and the lifting driving shaft (20) drive the dispensing barrel (21) and the dispensing head (22) to move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222961246.8U CN218360405U (en) | 2022-11-03 | 2022-11-03 | Automatic adhesive dispensing device of semiconductor production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222961246.8U CN218360405U (en) | 2022-11-03 | 2022-11-03 | Automatic adhesive dispensing device of semiconductor production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218360405U true CN218360405U (en) | 2023-01-24 |
Family
ID=84938761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222961246.8U Active CN218360405U (en) | 2022-11-03 | 2022-11-03 | Automatic adhesive dispensing device of semiconductor production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218360405U (en) |
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2022
- 2022-11-03 CN CN202222961246.8U patent/CN218360405U/en active Active
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