CN218328639U

CN218328639U - Micro-channel heat pipe applied to air conditioning system

Info

Publication number: CN218328639U
Application number: CN202222800132.5U
Authority: CN
Inventors: 刘鹏
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2023-01-17
Anticipated expiration: 2032-10-24

Abstract

The utility model provides a be applied to air conditioning system's microchannel heat pipe, including first pressure manifold and second pressure manifold, fixed mounting heat-conducting tube between first pressure manifold and the second pressure manifold, the inside of heat-conducting tube sets up the heat source, the outside that the centre of first pressure manifold and second pressure manifold corresponds the heat-conducting tube sets up a plurality of circumference evenly distributed's microchannel heat pipe, microchannel heat pipe's both ends are equallyd divide and are do not communicate with each other with first pressure manifold and second pressure manifold, this design can increase the area of contact between microchannel heat pipe and the heat-conducting tube, it is better to make its heat conduction effect, can reduce the heat and give off to all around, and improve thermal utilization ratio.

Description

Micro-channel heat pipe applied to air conditioning system

Technical Field

The utility model relates to an air conditioner heat transfer field, concretely relates to be applied to air conditioning system's microchannel heat pipe.

Background

The air conditioning system is a system for processing or adjusting the temperature, humidity, cleanliness and airflow speed of indoor air by a manual method, a heat exchanger is an important part in the air conditioning system, the heat exchanger is generally formed by communicating an evaporator and a condenser, a refrigerant in the heat exchanger absorbs heat and is gasified in the evaporator, the refrigerant enters the condenser and then is subjected to heat dissipation and liquefaction, the refrigerant enters the evaporator again, the circulation is repeated, and the heat of the evaporator is continuously transferred to the condenser, so that the aim of adjusting the air temperature is fulfilled.

The utility model patent with publication number CN206362024U discloses a compact microchannel heat pipe exchanger, which combines a condenser and an evaporator together, so that the structure is compact, the appearance volume is reduced, and the heat exchanger can be applied to small heat exchange occasions; however, the heat sources of the device are arranged at the front side and the rear side of the evaporator, and the heat is transferred to the flat tubes through the heat conducting plates, so that the heat of the heat sources can be dissipated to the periphery, the temperature of the surrounding air is easily influenced, the heat cannot be sufficiently absorbed by a refrigerant in the evaporator, and the utilization rate of the heat is low.

SUMMERY OF THE UTILITY MODEL

For solving the defects existing in the prior art, the utility model provides a micro-channel heat pipe applied to an air conditioning system.

The technical scheme of the utility model is that: the utility model provides a be applied to air conditioning system's microchannel heat pipe, includes first pressure manifold and second pressure manifold, fixed mounting heat-conducting tube between first pressure manifold and the second pressure manifold, the inside of heat-conducting tube sets up the heat source, the outside that the centre of first pressure manifold and second pressure manifold corresponds the heat-conducting tube sets up a plurality of circumference evenly distributed's microchannel heat pipe, the both ends of microchannel heat pipe are equallyd divide and are communicate with each other with first pressure manifold and second pressure manifold respectively.

Furthermore, the outer side surface of the heat conducting cylinder is provided with grooves corresponding to the micro-channel heat pipes, and the micro-channel heat pipes are embedded into the corresponding grooves.

Furthermore, the micro-channel heat pipe and the groove are spirally distributed around the heat conducting cylinder.

Furthermore, the first collecting pipe and the second collecting pipe are both in a circular ring shape, the first collecting pipe is located above the second collecting pipe, the side face of the first collecting pipe is connected with the upper collecting pipe of the condenser through a first pipeline, the side face of the second collecting pipe is connected with the lower collecting pipe of the condenser through a second pipeline, and the position of the condenser is higher than that of the first collecting pipe.

Furthermore, the outer side of the heat conducting cylinder is provided with a cylindrical heat insulating layer, and the micro-channel heat pipe and the heat conducting cylinder are wrapped by the heat insulating layer.

Further, the heat source is hot air.

The utility model provides a be applied to air conditioning system's microchannel heat pipe, the beneficial effect of this device is: this device is through being circumference evenly distributed with the microchannel heat pipe to make the heat source setting in the centre of microchannel heat pipe, make the refrigerant in the microchannel heat pipe can fully absorb the heat that the heat source gived off all around, set up the heat conduction section of thick bamboo in the centre of microchannel heat pipe, make the intraductal outside of inlaying in the heat conduction section of thick bamboo of microchannel heat, thereby can increase the area of contact between microchannel heat pipe and the heat conduction section of thick bamboo, it is better to make its heat conduction effect, can reduce the heat and give off all around, and improve thermal utilization ratio.

Drawings

Fig. 1 is a schematic structural diagram of one embodiment of the present invention;

fig. 2 is an enlarged view of a portion of the structure at i in fig. 1.

Detailed Description

To facilitate understanding of the present invention for those skilled in the art, embodiments of the present invention will be described below with reference to the accompanying drawings.

In the description of the present application, it is to be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The utility model provides a be applied to air conditioning system's microchannel heat pipe, as shown in fig. 1 and fig. 2 do the utility model discloses an implementation mode, including first pressure manifold 1 and second pressure manifold 2, first pressure manifold 1 and second pressure manifold 2 are the ring form, first pressure manifold 1 is located second pressure manifold 2's top, first pressure manifold 1's side is through the last pressure manifold that first pipeline 90 connects the condenser, second pressure manifold 2's side is through the lower pressure manifold that second pipeline 80 connects the condenser, condenser (prior art, this time no longer detailed description) the position of locating is higher than first pressure manifold 1's position, vertical columniform heat conduction section of thick bamboo 3 that sets up between first pressure manifold 1 and the second pressure manifold 2, heat conduction section of thick bamboo 3's upper and lower both ends respectively with

first pressure manifold

1 and 2 fixed connection of second pressure manifold, heat conduction section of thick bamboo 3's inside sets up, the heat source is hot-air, the outside that first pressure manifold 1 and second pressure manifold 2's centre correspond heat conduction section of thick bamboo 3 sets up a plurality of microchannel heat conduction section of thick bamboo 4 and is spiral helicine circumference evenly distributed's microchannel heat conduction pipe 4, the heat transfer can get into through the heat source through the communicating heat transfer to the first pressure manifold 2, then the heat source of the heat transfer pipeline of the first pressure manifold, it can get into through the first microchannel heat transfer to the first pressure manifold, the heat source, the heat transfer pipeline.

As shown in fig. 2, the outer side surface of the heat conducting tube 3 corresponding to the microchannel heat pipe 4 is provided with a groove 5, that is, the groove 5 is spiral, and the microchannel heat pipe 4 is embedded into the corresponding groove 5, so that heat can be sufficiently transferred to the microchannel heat pipe, thereby improving the heat absorption efficiency of the refrigerant.

As shown in fig. 1 and fig. 2, a cylindrical heat insulating layer 6 is disposed outside the heat conducting tube 3, and the heat insulating layer 6 wraps the microchannel heat pipe 4 and the heat conducting tube 3, so that heat dissipation to the outside can be reduced, and the heat can be fully absorbed by a refrigerant in the microchannel heat pipe.

As shown in fig. 1 and 2, since the upper heat collecting pipe 1 and the lower heat collecting pipe 2 are annular pipes and the heat conducting cylinder 3 is cylindrical with two open ends, i.e. a channel is formed at the axial line of the upper heat collecting pipe 1, the lower heat collecting pipe 2 and the heat conducting cylinder 3, when hot air passes through the channel, the refrigerant in the microchannel heat pipe can absorb the heat of the hot air through the heat conducting cylinder and change the hot air into cold air.

In summary, when hot air passes through the middle of the heat conduction cylinder, the refrigerant in the microchannel heat pipe can absorb heat of the hot air through the heat conduction cylinder, and the hot air becomes cold air, and the refrigerant after absorbing heat can be gasified, enters the first collecting pipe through the microchannel heat pipe, then enters the condenser through the first pipeline, and after heat dissipation of the condenser, the refrigerant becomes liquid again, and enters the second collecting pipe through the second pipeline, thereby forming a cycle.

This device is through being circumference evenly distributed with the microchannel heat pipe to make the heat source setting in the centre of microchannel heat pipe, make the refrigerant in the microchannel heat pipe can fully absorb the heat source to the heat that gives off all around, set up the heat conduction section of thick bamboo in the centre of microchannel heat pipe, make the outside of microchannel heat pipe embedded in the heat conduction section of thick bamboo, thereby can increase the area of contact between microchannel heat pipe and the heat conduction section of thick bamboo, it is better to make its heat conduction effect, can reduce the heat and give off all around, and improve thermal utilization ratio.

The above-mentioned embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a be applied to microchannel heat pipe of air conditioning system, includes first pressure manifold and second pressure manifold which characterized in that: the heat conducting tube is fixedly installed between the first collecting tube and the second collecting tube, a heat source is arranged inside the heat conducting tube, a plurality of micro-channel heat tubes which are uniformly distributed in the circumferential direction are arranged in the middle of the first collecting tube and the second collecting tube and correspond to the outer side of the heat conducting tube, and the two ends of each micro-channel heat tube are communicated with the first collecting tube and the second collecting tube respectively.

2. The micro-channel heat pipe applied to an air conditioning system as claimed in claim 1, wherein: the microchannel heat pipe is a flat pipe.

3. The micro-channel heat pipe applied to an air conditioning system as claimed in claim 1, wherein: the outer side surface of the heat conducting cylinder is provided with grooves corresponding to the micro-channel heat pipes, and the micro-channel heat pipes are embedded into the corresponding grooves.

4. The micro-channel heat pipe applied to an air conditioning system according to claim 3, wherein: the microchannel heat pipe and the groove are spirally distributed around the heat conducting cylinder.

5. The micro-channel heat pipe applied to an air conditioning system as claimed in claim 1, wherein: the first collecting pipe and the second collecting pipe are both in a circular ring shape, the first collecting pipe is located above the second collecting pipe, the side face of the first collecting pipe is connected with the upper collecting pipe of the condenser through a first pipeline, the side face of the second collecting pipe is connected with the lower collecting pipe of the condenser through a second pipeline, and the position of the condenser is higher than that of the first collecting pipe.

6. The micro-channel heat pipe applied to an air conditioning system as claimed in claim 1, wherein: the outer side of the heat conducting cylinder is provided with a cylindrical heat insulating layer, and the micro-channel heat pipe and the heat conducting cylinder are wrapped by the heat insulating layer.

7. The micro-channel heat pipe applied to an air conditioning system according to any one of claims 1 to 6, wherein: the heat source is hot air.