CN218291185U - Silicon chip combination for photovoltaic panel and silicon chip master slice, square rod, silicon rod and battery piece of silicon chip combination - Google Patents

Silicon chip combination for photovoltaic panel and silicon chip master slice, square rod, silicon rod and battery piece of silicon chip combination Download PDF

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CN218291185U
CN218291185U CN202222124916.0U CN202222124916U CN218291185U CN 218291185 U CN218291185 U CN 218291185U CN 202222124916 U CN202222124916 U CN 202222124916U CN 218291185 U CN218291185 U CN 218291185U
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silicon
silicon wafer
rod
silicon chip
slice
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付泽华
王一淳
马晓康
徐森炀
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Longi Green Energy Technology Co Ltd
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Longi Green Energy Technology Co Ltd
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Priority to PCT/CN2023/112667 priority patent/WO2024032787A1/en
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Abstract

The application provides a silicon wafer combination for a photovoltaic panel and a silicon wafer master slice, a square rod, a silicon rod and a battery piece of the silicon wafer combination, wherein the diameter of the silicon rod is 290-310 mm or 320-340 mm. Through the silicon rod of new size that this application provided, the preparation obtains the silicon chip master slice to obtain silicon chip, half of unidimensional, further obtain the battery piece of unidimensional, or directly prepare the battery piece master slice and further cut into the battery piece by the silicon chip master slice, thereby can satisfy under the prerequisite of different market demands, still reduce the cost of production owing to can obtain the battery piece of unidimensional and be favorable to the production management and control of silicon chip product moreover.

Description

Silicon chip combination for photovoltaic panel and silicon chip master slice, square rod, silicon rod and battery piece of silicon chip combination
Technical Field
The application relates to the technical field of solar cells, in particular to a silicon wafer combination for a photovoltaic panel and a silicon wafer master slice, a square rod, a silicon rod and a cell slice thereof.
Background
With the development of the photovoltaic module technology, various photovoltaic module products are in endlessly and rapidly changing, and the largest change point of the module products is on the upgrading of the product size on one hand, and on the other hand, the continuous upgrading of the battery technology, especially the upgrading of the module product size has become the main direction of industry competition, so that with the continuous upgrading of the module product size, the demand for silicon wafer products with different sizes is increased more and more so as to be capable of matching with the more competitive module product size.
On the other hand, with the continuous development of photovoltaic cell technology, the requirements of different cell types on silicon chip products are changed due to the difference in process and the difference in cell effect, so that the requirements of both a complete square silicon chip and a rectangular silicon chip are met, and the requirements of a half silicon chip are met.
Therefore, for the current silicon wafer manufacturing link, how to manufacture silicon wafer products of various specifications by a more cost-effective scheme is the key of deep research required in the silicon wafer manufacturing link, so that the market demand of mainstream square wafers can be met, the potential demand of rectangular wafers can be met, and the half-wafer product demand of future HJT batteries (amorphous silicon thin film heterojunction batteries) can be met.
At present, at the component end, along with the requirement for improving the component power, silicon chip products with different sizes are increasingly required; at the silicon chip end, the silicon chip products with the current traditional specifications mainly have the size of a square silicon chip, and the sizes are limited to only a few size specifications with the edge distances of 166mm, 182mm, 210mm and the like, so that the requirements of the silicon chip products with increasingly diverse components cannot be met at all; at the silicon chip end, the specifications of silicon chip products are more and more, and in the manufacturing schemes of different silicon chip products, because of the difference of the manufacturing modes, larger production cost difference exists between different silicon chips, and meanwhile, the production management and control of the silicon chip products are not facilitated by the numerous product manufacturing schemes.
Disclosure of Invention
In order to solve the problems in the prior art, the application provides a silicon rod, a square rod, a silicon wafer master slice, a silicon wafer combination, a battery slice master slice and a battery slice. The technical scheme of the application is as follows:
in one embodiment of the application, a silicon wafer combination for a photovoltaic panel is provided, and comprises a first silicon wafer and a second silicon wafer, wherein the first silicon wafer and the second silicon wafer are both rectangular in breadth shape; the first silicon slice has a web size of 166mm, and the second silicon slice has a web size of 83mm 166mm; or the breadth size of the first silicon slice is 182mm, and the breadth size of the second silicon slice is 91mm 182mm.
In an embodiment of the present application, a silicon wafer master for preparing the above silicon wafer combination is provided, in which a first silicon wafer and a second silicon wafer in the silicon wafer combination are obtained from the silicon wafer master; the silicon wafer mother sheet has a size of 166mm (249-255) mm, specifically including 166mm 249mm, 166mm 250mm, 166mm 251mm, 166mm 252mm,
166mm 253mm, 166mm 254mm, 166mm 255mm, etc.; alternatively, the silicon wafer mother wafer may have a web size of 182mm × 272 to 278mm, and specific examples thereof include 182mm × 272mm, 182mm × 273mm, 182mm × 274mm, 182mm × 275mm, 182mm × 276mm, 182mm × 277mm, and 182mm 278mm.
In one embodiment of the present application, a square rod for use in the preparation of the above-described silicon wafer master is provided, the square rod having a cross-sectional dimension of 166mm (249-255) mm, such as 166mm 249mm, 166mm 250mm, 166mm 251mm, 166mm 252mm, and,
166mm 253mm, 166mm 254mm, 166mm 255mm and the like; alternatively, the cross-sectional dimension of the square rod is 182mm × 272mm, 182mm × 273mm, 182mm × 274mm, 182mm × 275mm, 182mm × 276mm, 182mm × 277mm, 182mm 278mm, and the like.
In one embodiment of the present application, a silicon rod for preparing the square rod is provided, and the cross-sectional diameter of the silicon rod is 290mm to 310mm, specifically, 291mm, 292mm, 293mm, 294mm, 295mm, 296mm, 297mm, 298mm, 299mm, 300mm, 301mm, 302mm, 303mm, 304mm, 305mm, 306mm, 307mm, 308mm, 309mm, 310mm, etc. can be cited; or the cross-sectional diameter of the silicon rod is 320mm to 340mm, and specific examples thereof include 320mm, 321mm, 322mm, 323mm, 324mm, 325mm, 326mm, 327mm, 328mm, 329mm, 330mm, 331mm, 332mm, 333mm, 334mm, 335mm, 336mm, 337mm, 338mm, 339mm, 340mm, and the like.
In one embodiment of the present application, a battery piece is provided, wherein the battery piece is made of the silicon wafer combination.
In one embodiment of the present application there is provided a silicon wafer for a photovoltaic panel,
the breadth of the silicon slice is rectangular in shape,
the silicon wafer has a web size of 182mm × 272 to 278mm, and specific examples thereof include 182mm × 272mm, 182mm × 273mm, 182mm × 274mm, 182mm × 275mm, 182mm × 276mm, 182mm × 277mm, and 182mm × 278mm; or
The breadth size of the silicon wafer is 91mm 182mm; or alternatively
The silicon wafer has a width dimension of 91mm × 272 to 278mm, and specifically, 91mm × 272mm, 91mm × 273mm, 91mm × 274mm, 91mm × 275mm, 91mm × 276mm, 91mm × 277mm, 91mm × 278mm, and the like are exemplified.
In one embodiment of the present application, a wafer master is provided for making the above-described wafers, the wafer master having a web dimension of 182mm x (272-278) mm, specifically, for example, 182mm x 272mm, 182mm x 273mm, 182mm x 274mm, 182mm x 275mm, 182mm x 276mm, 182mm x 277mm, 182mm 278mm, and the like.
In one embodiment of the present application, there is provided a square bar for use in the production of the above silicon wafer master, the square bar having a cross-sectional dimension of 182mm × 272 to 278mm, specifically exemplified by 182mm × 272mm, 182mm × 273mm, 182mm × 274mm, 182mm × 275mm, 182mm × 276mm, 182mm × 277mm, 182mm 278mm and the like.
In one embodiment of the present application, a silicon rod for preparing the above square rod is provided, and the cross-sectional diameter of the silicon rod is 320mm to 340mm, specifically, 320mm, 321mm, 322mm, 323mm, 324mm, 325mm, 326mm, 327mm, 328mm, 329mm, 330mm, 331mm, 332mm, 333mm, 334mm, 335mm, 336mm, 337mm, 338mm, 339mm, 340mm, and the like can be enumerated.
In one embodiment of the present application, a battery piece is provided, and the battery piece is made of the silicon wafer.
The application provides a silicon chip combination and silicon chip master slice for photovoltaic panel, the square rod, silicon rod and battery piece, the silicon rod of new size through this application provides, the preparation obtains the silicon chip master slice, in order to obtain the silicon chip of unidimensional, half, further obtain the battery piece of unidimensional, or directly prepare the battery piece master slice by the silicon chip master slice and further cut into the battery piece, thereby can satisfy under the prerequisite of different market demands, still reduce into manufacturing cost owing to can obtain the battery piece of unidimensional, and be favorable to the production management and control of silicon chip product.
The above description is only an overview of the technical solutions of the present application, and in order to make the technical means of the present application more clearly understood, the present application is implemented by those skilled in the art according to the content of the description, and in order to make the above and other objects, features, and advantages of the present application more obvious, the following description is made by way of example of the embodiments of the present application.
Drawings
FIG. 1: a silicon wafer master slice segmentation schematic diagram;
FIG. 2 is a schematic diagram: and the relationship among the first silicon wafer, the second silicon wafer and the silicon rod is shown schematically.
Reference numerals:
1. a silicon rod; 2. a first silicon wafer; 3. and a second silicon wafer.
Detailed Description
The following embodiments of the present application are merely illustrative of specific embodiments for carrying out the present application and should not be construed as limiting the present application. Other changes, modifications, substitutions, combinations, and simplifications which may be made without departing from the spirit and principles of the present application are intended to be equivalent substitutions and are within the scope of the present application.
In a first embodiment of the present application, a silicon rod 1 is provided, and the cross-sectional diameter of the silicon rod 1 is 290mm to 310mm as shown in fig. 2. Thus, the silicon rod may first be machined into a square rod with a cross-sectional dimension of 166mm (249-255) mm. Further, the square bar may be cut into a wafer master having a dimension of 166mm (249-255) mm in width. Slicing the silicon wafer master slice to obtain a silicon wafer combination for the photovoltaic panel, wherein the silicon wafer combination comprises a first silicon wafer 2 and a second silicon wafer 3, and the breadth shapes of the first silicon wafer 2 and the second silicon wafer 3 are both rectangular; the first silicon wafer 2 had a dimension in width of 166mm and the second silicon wafer 3 had a dimension in width of 83mm 166mm (half wafer). Therefore, the first silicon wafer and the second silicon wafer can be processed into the battery pieces, and the requirements on at least two breadth sizes of the battery pieces on the market can be met simultaneously.
In a second embodiment of the present application, a silicon rod 1 is provided, wherein the silicon rod 1 has a cross-sectional diameter of 320mm to 340mm as shown in fig. 2. Thus, the silicon rods may first be machined into square rods with cross-sectional dimensions of 182mm (272 to 278) mm. Further, the square bar may be cut into silicon wafer master pieces having a web size of 182mm (272 to 278) mm. Slicing the silicon wafer master slice to obtain a silicon wafer combination for a photovoltaic panel, wherein the silicon wafer combination comprises a first silicon wafer 2 and a second silicon wafer 3, and the breadth shapes of the first silicon wafer 2 and the second silicon wafer 3 are both rectangular; the first wafer 2 had a dimension of 182mm and the second wafer 3 had a dimension of 91mm 182mm. Therefore, the first silicon wafer 2 and the second silicon wafer 3 can be processed into the battery pieces, and the requirements of at least two breadth sizes of the battery pieces on the market can be met at the same time.
In a third embodiment of the present application, a silicon rod 1 is provided, and as shown in fig. 2, the silicon rod 1 has a cross-sectional diameter of 320mm to 340mm. Thus, the silicon rods may first be machined into square rods with cross-sectional dimensions of 182mm (272 to 278) mm. Further, the square bar may be cut into silicon wafer master pieces having a web size of 182mm (272-278) mm. The 182mm silicon wafer master slice (272-278) mm can be directly prepared into 182mm
(272-278) mm cell pieces to meet market demand, or 182mm to be prepared
The (272-278) mm cell piece is further divided into two 91mm (272-278) mm cell pieces or three 91mm 182mm (half) cell pieces. So that it is possible to inform that the demands for the three different sizes of the battery pieces in the market are satisfied.
Of course, the requirement of three different sizes of cell pieces in the market can be met by dividing the 182mm x (272-278) mm silicon wafer master into two 91 x (272-278) mm silicon wafers or three 91mm x 182mm silicon wafers, and further preparing the 182mm x (272-278) mm silicon wafer master, the 91mm x (272-278) mm silicon wafers and the 91mm x 182mm silicon wafers (half wafers) into cell pieces.
In the three embodiments, when the cross section of the square rod is rectangular, the edge skin (referring to the upper part and the lower part of the silicon wafer master (the first silicon wafer 1 and the second silicon wafer breadth) with the same size can be reserved, so that the square rod can be conveniently used for manufacturing silicon wafers and battery pieces with other sizes. Therefore, compared with the prior art that the square rod has a square cross section and the flaw-piece is too narrow to be used, the solutions of the three embodiments can further increase the utilization rate of the silicon rod, thereby reducing the cost of the produced battery piece.
In the above embodiment, it is preferable that the square bar, the silicon wafer master, the first silicon wafer, the second silicon wafer, or the battery piece have rounded corners at four corners of the width thereof. The method can reduce the cracks on the edge of the silicon wafer and prevent the silicon wafer or the silicon wafer assembly and the battery piece from cracking under the action of external stress.
In particular, when the silicon rod 1 is machined into a square rod in each of the above embodiments, the four corners of the rectangular cross section of the square rod may be chamfered in an arc shape. That is, referring to fig. 2, regarding the silicon wafer master (the sum of the widths of the first silicon wafer 1 and the second silicon wafer) as a rectangular cross section of a square rod, four corners of the silicon wafer master may fall outside the edge of the silicon rod 1, so that an arc-shaped chamfer of the silicon wafer master (i.e., a chamfer of the rectangular cross section of the square rod) is formed by an arc of the silicon rod 1 itself, and thus the utilization rate of the silicon rod 1 may be increased.
It can be seen from the above embodiments that, by using the silicon rod with a new size provided by the present application (the diameter of the cross section of the silicon rod is 290mm to 310mm, or the diameter of the cross section of the silicon rod is 320mm to 340 mm), silicon wafer mother wafers are prepared to obtain silicon wafers and half wafers with different sizes, and further obtain battery pieces with different sizes, or the battery piece mother wafer is directly prepared from the silicon wafer mother wafer and further cut into battery pieces, so that on the premise that different market demands can be met, the production cost is reduced because battery pieces with different sizes can be obtained, and the production management and control of silicon wafer products (such as battery pieces) are facilitated.
While embodiments of the present application have been described above, the present application is not limited to the particular embodiments and applications described above, which are intended to be illustrative, instructional and not limiting. Those skilled in the art, having the benefit of this disclosure, may effect numerous modifications thereto and changes may be made without departing from the scope of the invention as defined by the appended claims.

Claims (10)

1. A silicon wafer assembly for a photovoltaic panel is characterized in that,
the silicon chip combination comprises a first silicon chip and a second silicon chip, and the breadth shapes of the first silicon chip and the second silicon chip are both rectangular;
the breadth size of the first silicon slice is 166mm, and the breadth size of the second silicon slice is 83mm 166mm; or the like, or, alternatively,
the breadth dimension of the first silicon slice is 182mm, and the breadth dimension of the second silicon slice is 91mm 182mm.
2. A silicon wafer master for preparing the silicon wafer assembly of claim 1,
the first silicon wafer and the second silicon wafer in the silicon wafer combination are obtained from the silicon wafer master slice;
the breadth size of the silicon wafer master slice is 166mm (249-255) mm; or
The silicon wafer master has a dimension of 182mm (272-278) mm across.
3. A square bar for use in preparing the silicon wafer master of claim 2,
the cross section of the square rod is 166mm (249-255) mm; or the like, or a combination thereof,
the cross-sectional dimension of the square rod is 182mm (272-278) mm.
4. A silicon rod for preparing the square rod of claim 3,
the diameter of the cross section of the silicon rod is 290-310 mm; or
The diameter of the cross section of the silicon rod is 320-340 mm.
5. A cell prepared from the silicon wafer assembly of claim 1.
6. A silicon wafer for a photovoltaic panel, characterized in that,
the breadth of the silicon chip is rectangular in shape,
the size of the silicon slice is 182mm (272-278) mm; or
The breadth size of the silicon wafer is 91mm 182mm; or
The silicon wafers had a web size of 91mm x (272-278) mm.
7. A silicon wafer master for preparing the silicon wafer of claim 6,
the breadth size of the silicon wafer mother slice is 182mm (272-278) mm.
8. A square bar for use in preparing the silicon wafer master of claim 7,
the cross-sectional dimension of the square rod is 182mm (272-278) mm.
9. A silicon rod for preparing the square rod of claim 8,
the diameter of the cross section of the silicon rod is 320-340 mm.
10. A cell, wherein the cell is made from the silicon wafer of claim 6.
CN202222124916.0U 2022-08-12 2022-08-12 Silicon chip combination for photovoltaic panel and silicon chip master slice, square rod, silicon rod and battery piece of silicon chip combination Active CN218291185U (en)

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CN202222124916.0U CN218291185U (en) 2022-08-12 2022-08-12 Silicon chip combination for photovoltaic panel and silicon chip master slice, square rod, silicon rod and battery piece of silicon chip combination
PCT/CN2023/112667 WO2024032787A1 (en) 2022-08-12 2023-08-11 Silicon wafer combination for photovoltaic panel and silicon wafer masterslice therefor, square bar, silicon rod, and cell

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024032787A1 (en) * 2022-08-12 2024-02-15 隆基绿能科技股份有限公司 Silicon wafer combination for photovoltaic panel and silicon wafer masterslice therefor, square bar, silicon rod, and cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024032787A1 (en) * 2022-08-12 2024-02-15 隆基绿能科技股份有限公司 Silicon wafer combination for photovoltaic panel and silicon wafer masterslice therefor, square bar, silicon rod, and cell

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