CN218254551U - Adjustable wafer center positioning device - Google Patents
Adjustable wafer center positioning device Download PDFInfo
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- CN218254551U CN218254551U CN202220404221.5U CN202220404221U CN218254551U CN 218254551 U CN218254551 U CN 218254551U CN 202220404221 U CN202220404221 U CN 202220404221U CN 218254551 U CN218254551 U CN 218254551U
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Abstract
The utility model discloses a wafer center positioner with adjustable belongs to the wafer processing field, include: a base, the top surface of which is provided with a supporting plate; the positioning ring is circumferentially and uniformly distributed with a plurality of positioning blocks with wedge-shaped positioning surfaces, and the diameter of the circumference where the positioning blocks are located is larger than that of the supporting plate; the lifting driving mechanism is fixed on the top surface of the base and used for driving the positioning ring to lift; the clamping jaw driving mechanism is used for driving the clamping jaws to synchronously stretch and retract; the top surface of the base is provided with a rotary driving mechanism for driving the rotary table to rotate. The utility model has the advantages of reasonable design, can carry out the center location to the wafer high-efficiently.
Description
Technical Field
The utility model relates to a wafer processing field, in particular to wafer center positioner with adjustable.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, and is a silicon wafer formed by grinding, polishing, and slicing a silicon ingot.
In the processing process of the wafer, the wafer needs to be positioned, but in the prior art, the device for positioning the wafer has the defect of complex structure and also has the problem that the wafer is easily damaged in the positioning process.
SUMMERY OF THE UTILITY MODEL
To the problems that the structure of the device for positioning the wafer is complex and the wafer is easily damaged in the prior art, the purpose of the utility model is to provide an adjustable wafer center positioning device.
In order to achieve the above purpose, the technical scheme of the utility model is that:
an adjustable wafer centering device, comprising:
the supporting device comprises a base, a supporting rod and a supporting plate, wherein the top surface of the base is fixedly provided with the supporting rod, and the top of the supporting rod is fixedly provided with the supporting plate which is horizontally arranged;
the positioning ring is positioned below the supporting plate and is arranged on the outer side of the supporting rod in a surrounding manner, at least four positioning blocks with wedge-shaped positioning surfaces are uniformly arranged on the positioning ring in the circumferential direction, and the diameter of the circumference where the positioning blocks are positioned is larger than that of the supporting plate;
the lifting driving mechanism is fixedly arranged on the top surface of the base and is used for driving the positioning ring to move along the vertical direction;
the rotary table is rotatably connected to the top surface of the base, is positioned below the positioning ring and has the same axis with the positioning ring, through holes for the support rod and the lifting driving mechanism to pass through are formed in the rotary table, at least four clamping jaws are uniformly arranged on the rotary table in the circumferential direction, the free ends of the clamping jaws protrude upwards from the top surface of the support plate, concave clamping grooves are further formed in the free ends of the clamping jaws, and a clamping jaw driving mechanism for driving the clamping jaws to synchronously stretch and retract is mounted on the rotary table;
and the rotary driving mechanism is fixedly arranged on the top surface of the base and is used for driving the rotary table to rotate.
Preferably, the jaw drive mechanism comprises:
the radial sliding grooves are uniformly distributed on the rotary table in the circumferential direction, the number of the radial sliding grooves is the same as that of the clamping jaws, and the clamping jaws are respectively connected in the sliding grooves in a sliding manner;
the driven gear is rotatably connected to the rotary table, a planar spiral groove is formed in the end face of one side of the driven gear, and a clamping block matched with the planar spiral groove is arranged on each clamping jaw;
the driving gear is rotatably connected to the rotary table and meshed with the driven gear;
and the clamping jaw stretching motor is fixedly arranged on the rotary table, and an output shaft of the clamping jaw stretching motor is mechanically connected with the driving gear.
Preferably, the radial sliding groove is arranged on one side of the top surface of the rotary table; the driven gear is rotatably connected to the circumferential side wall of the rotary table through a bearing, and the plane spiral groove is formed in one side of the top surface of the driven gear.
Further, clamping jaw actuating mechanism still includes limit switch, limit switch fixed mounting is in arbitrary in the radial spout, just limit switch with the flexible motor electric connection of clamping jaw.
Furthermore, a guide sliding rod is fixedly mounted on the top surface of the base and located in the through hole in the rotary table, and a guide sleeve matched with the guide sliding rod is arranged on the positioning ring.
Preferably, the lifting driving mechanism comprises an air cylinder fixedly mounted on the top surface of the base, and the air cylinder is located in a through hole in the turntable.
Preferably, the rotary driving mechanism includes a rotary motor, and the rotary motor drives the turntable to rotate through a gear transmission mechanism.
Further, a hollow shaft is coaxially and fixedly mounted on one side of the bottom surface of the rotary table, the hollow shaft is rotatably connected to the top surface of the base through a bearing, and the rotating motor is connected with the hollow shaft through a gear transmission mechanism.
Adopt above-mentioned technical scheme, the beneficial effects of the utility model reside in that: through the arrangement of the supporting plate, the wafer can be directly placed on the supporting plate for supporting; through the arrangement of the lifting positioning ring, after the wafer is placed on the supporting plate and the positioning ring rises, the positioning block on the positioning ring is used for preliminarily positioning the wafer, and then the positioning ring descends to enable the wafer to fall on the supporting plate again; due to the arrangement of the rotatable turntable and the plurality of clamping jaws capable of stretching out and drawing back synchronously on the turntable, the clamping jaws can synchronously rotate in the contraction process, so that the center of a wafer is limited to the position coincident with the rotation axis of the turntable quickly and accurately, the center of the wafer is positioned, the clamping jaws are reset after being opened, and the next wafer is positioned.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention.
In the drawing, 1-a base, 2-a supporting rod, 3-a supporting plate, 4-a positioning ring, 5-a positioning block, 6-a guide sliding rod, 7-a guide sleeve, 8-a lifting driving mechanism, 9-a rotary table, 10-a hollow shaft, 11-a rotary driving mechanism, 12-a clamping jaw, 13-a driven gear, 14-a driving gear and 15-a clamping jaw telescoping mechanism.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
It should be noted that, in the description of the present invention, the terms "upper", "lower", "left", "right", "front", "back", etc. indicate the orientation or position relationship of the structure of the present invention based on the drawings, and are only for the convenience of describing the present invention, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the technical scheme, the terms "first" and "second" are only used for referring to the same or similar structures or corresponding structures with similar functions, and are not used for ranking the importance of the structures, or comparing the sizes or other meanings.
In addition, unless expressly stated or limited otherwise, the terms "mounted" and "connected" are to be construed broadly, e.g., the connection may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two structures can be directly connected or indirectly connected through an intermediate medium, and the two structures can be communicated with each other. To those skilled in the art, the specific meanings of the above terms in the present invention can be understood in relation to the present scheme in specific terms according to the general idea of the present invention.
Example one
An adjustable wafer center positioning device, as shown in FIG. 1, comprises a base 1, a support rod 2, a support plate 3, a positioning ring 4, a lifting driving mechanism 8, a rotary table 9, a rotary driving mechanism 11,
The base 1 is a horizontally arranged plate-shaped structure as a whole and is provided with bolt holes for fixing. The top surface of the base 1 is fixedly provided with a supporting rod 2 which is arranged vertically, the top of the supporting rod 2 is fixedly provided with a supporting plate 3 which is arranged horizontally, and the supporting plate 3 is preferably of a disc-shaped structure, and the axis of the supporting plate coincides with the axis of the supporting rod 2.
The positioning ring 4 is in the form of a horizontally arranged annular disc, the top surface of which is circumferentially and evenly provided with at least four positioning blocks 5, for example four positioning blocks, having wedge-shaped positioning surfaces. The positioning ring 4 is disposed below the supporting plate 3, the positioning ring 4 is coaxially disposed around the supporting rod 2, and the diameter of the circumference where the positioning block 5 is located is configured to be larger than that of the supporting plate 3, so that after the positioning ring 4 is raised, the positioning block 5 can be raised above the top surface of the supporting plate 3, thereby positioning and supporting the wafer on the supporting plate 3. The wedge-shaped positioning surfaces of the positioning blocks 5 are arranged on one side facing the circle center, and the wedge-shaped positioning surfaces are inclined towards the circle center from top to bottom, so that the wafer automatically slides to the center under the action of the wedge-shaped positioning surfaces.
The top surface of the base 1 is also fixedly provided with two or more than two guide slide bars 6 which are vertically arranged and are uniformly distributed in the circumferential direction, and correspondingly, the positioning ring 4 is fixedly provided with a guide sleeve 7 matched with the guide slide bars 6. And the lifting driving mechanism 8 is fixedly installed on the top surface of the base 1, for example, an air cylinder, and the output end of the air cylinder is fixedly connected with one side of the bottom surface of the positioning ring 4, so as to drive the positioning ring 4 to move along the vertical direction. So set up for when holding ring 4 rose the position that the edge of the wedge locating surface of locating piece 5 and wafer contacted, the wafer can be by oneself the central point that falls to holding ring 4 under the effect of each wedge locating surface and put, thereby realize with the preliminary center location of wafer.
The turntable 9 is located below the positioning ring 4, the turntable 9 and the positioning ring 4 are coaxial, the turntable 9 is integrally of a vertically arranged cylindrical structure, a through hole is axially formed in the center of the turntable 9, and the support rod 2, the guide slide rod 6 and the lifting driving mechanism 8 all penetrate through the through hole. A hollow shaft 10 is coaxially and fixedly arranged on one side of the bottom surface of the rotary table 9, and the hollow shaft 10 is rotatably connected to the top surface of the base 1 through a bearing. The rotary driving mechanism 11 comprises a rotary motor, which is fixedly installed on the top surface of the base 1, and the rotary motor is connected with the hollow shaft 10 through a gear transmission mechanism.
At least four clamping jaws 12, for example four clamping jaws 12, are uniformly arranged on the circumference of the rotary table 9, the free ends of the clamping jaws 12 protrude upwards from the top surface of the support plate 3, the free ends of the clamping jaws 12 extend upwards and are recessed inwards to form clamping grooves, and the diameter of the circumference of the recessed position of each clamping jaw 12 is larger than the outer diameter of the positioning ring 4, so that the clamping jaws can pass through the positioning ring from the outside without obstacles. Meanwhile, a clamping jaw driving mechanism for driving the clamping jaws 12 to radially and synchronously extend and retract is mounted on the rotary table 9.
In this embodiment, the jaw driving mechanism includes a radial sliding slot, a driven gear 13, a driving gear 14, and a jaw extension motor 15. The four radial sliding grooves are formed in the top face side of the rotary table 9 and are circumferentially and uniformly distributed by taking the rotation axis of the rotary table 9 as a center, and the four clamping jaws 12 are respectively connected in the four radial sliding grooves in a sliding mode. The driven gear 13 is rotatably connected to the circumferential side wall of the rotary table 9 through a bearing, a planar spiral groove is formed in one side of the top surface of the driven gear 13, and a clamping block matched with the planar spiral groove is arranged on the lower side of each corresponding clamping jaw 12. The jaw extension motor 15 is fixedly installed on the side wall of the turntable 9 and located below the driven gear 13, and the driving gear 14 is fixedly installed on the output shaft of the jaw extension motor 15, and the driving gear 14 and the driven gear 13 are configured as spur gears that mesh with each other in the present embodiment. Normally, a battery for supplying power to the jaw retracting motor 15 is mounted on the turntable 9. Alternatively, after the lower end of the hollow shaft 10 passes through the bottom surface of the base 1, external electric power can be input into the jaw extension motor 15 on the turntable 9 by arranging an electrically conductive slip ring on the hollow shaft.
When the device is used, the wafer is firstly prevented from moving onto the supporting plate 3 by a conveying device such as a mechanical arm, and the wafer is supported by the supporting plate 3; then the lifting driving mechanism 8 works to drive the positioning ring 4 to ascend until the wedge-shaped positioning surface on the positioning block 5 contacts with the wafer, so as to preliminarily position the wafer, and then the positioning ring 4 descends to enable the wafer to fall onto the supporting plate 3 again; then, the rotary driving mechanism 11 drives the rotary table 9 to rotate, and in the rotating process, the four clamping jaws 12 are driven to be synchronously shortened through the clamping jaw telescopic motors 15, so that the center of the wafer is quickly and accurately limited to the position coinciding with the rotating axis of the rotary table 9 under the limitation of the clamping grooves on the free ends of the clamping jaws 12, and the center of the wafer is positioned; after the center of the wafer is positioned, the clamping jaw 12 is reset, the rotary table 9 stops rotating, and the positioning ring 4 descends, so that the reset is realized.
It will be appreciated that in order to prevent the chuck jaws 12 from excessively shortening and thus breaking the wafer, in a preferred embodiment, the chuck jaw driving mechanism is further configured to include a limit switch fixedly installed in any one of the radial sliding grooves, and the limit switch is electrically connected to the motor controller of the chuck jaw retracting motor 15. So set up for when the draw-in groove on four clamping jaws 12 all contacted with the edge of wafer, when the diameter of the circumference at draw-in groove place on clamping jaw 12 was the same with the diameter of wafer promptly, limit switch was triggered by clamping jaw 12 to instruct the flexible motor 15 stop work of clamping jaw, still can send the instruction of carrying out operation on next step to the host computer through wireless communication module usually.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.
Claims (8)
1. An adjustable wafer center positioning device is characterized in that: the method comprises the following steps:
the support device comprises a base, a support rod and a support plate, wherein the top surface of the base is fixedly provided with the support rod, and the top of the support rod is fixedly provided with the support plate which is horizontally arranged;
the positioning ring is positioned below the supporting plate and is arranged on the outer side of the supporting rod in a surrounding manner, at least four positioning blocks with wedge-shaped positioning surfaces are uniformly arranged on the positioning ring in the circumferential direction, and the diameter of the circumference where the positioning blocks are positioned is larger than that of the supporting plate;
the lifting driving mechanism is fixedly arranged on the top surface of the base and is used for driving the positioning ring to move along the vertical direction;
the turntable is rotatably connected to the top surface of the base and located below the positioning ring, the turntable and the positioning ring share the same axis, through holes for the support rod and the lifting driving mechanism to penetrate through are formed in the turntable, at least four clamping jaws are uniformly arranged on the turntable in the circumferential direction, the free ends of the clamping jaws protrude upwards from the top surface of the support plate, concave clamping grooves are further formed in the free ends of the clamping jaws, and clamping jaw driving mechanisms used for driving the clamping jaws to stretch synchronously are mounted on the turntable;
and the rotary driving mechanism is fixedly arranged on the top surface of the base and is used for driving the rotary table to rotate.
2. The adjustable wafer centering device of claim 1, wherein: the jaw drive mechanism includes:
the radial sliding chutes with the same number as the clamping jaws are uniformly distributed on the rotary table in the circumferential direction, and the clamping jaws are respectively connected in the sliding chutes in a sliding manner;
the driven gear is rotatably connected to the rotary table, a planar spiral groove is formed in the end face of one side of the driven gear, and a clamping block matched with the planar spiral groove is arranged on each clamping jaw;
the driving gear is rotatably connected to the rotary table and meshed with the driven gear;
and the clamping jaw stretching motor is fixedly arranged on the rotary table, and an output shaft of the clamping jaw stretching motor is mechanically connected with the driving gear.
3. The adjustable wafer centering device of claim 2, wherein: the radial sliding groove is arranged on one side of the top surface of the rotary table; the driven gear is rotatably connected to the circumferential side wall of the rotary table through a bearing, and the plane spiral groove is formed in one side of the top surface of the driven gear.
4. The adjustable wafer centering device of claim 2, wherein: the clamping jaw driving mechanism further comprises a limit switch, the limit switch is fixedly installed in any radial sliding groove, and the limit switch is electrically connected with the clamping jaw telescopic motor.
5. The adjustable wafer centering device of claim 1, wherein: the top surface fixed mounting of base has the direction slide bar, the direction slide bar is located in the through-hole on the revolving stage, just the holding ring is provided with the uide bushing of direction slide bar looks adaptation.
6. The adjustable wafer centering device of claim 5, wherein: the lifting driving mechanism comprises an air cylinder fixedly mounted on the top surface of the base, and the air cylinder is located in a through hole in the rotary table.
7. The adjustable wafer centering device of claim 1, wherein: the rotary driving mechanism comprises a rotary motor, and the rotary motor drives the rotary table to rotate through a gear transmission mechanism.
8. The adjustable wafer centering device of claim 7, wherein: the rotary table is characterized in that a hollow shaft is coaxially and fixedly mounted on one side of the bottom surface of the rotary table, the hollow shaft is rotatably connected to the top surface of the base through a bearing, and the rotary motor is connected with the hollow shaft through a gear transmission mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220404221.5U CN218254551U (en) | 2022-02-25 | 2022-02-25 | Adjustable wafer center positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220404221.5U CN218254551U (en) | 2022-02-25 | 2022-02-25 | Adjustable wafer center positioning device |
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| Publication Number | Publication Date |
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| CN218254551U true CN218254551U (en) | 2023-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220404221.5U Active CN218254551U (en) | 2022-02-25 | 2022-02-25 | Adjustable wafer center positioning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116381444A (en) * | 2023-05-26 | 2023-07-04 | 长春光华微电子设备工程中心有限公司 | Workbench structure for wafer test, clamping control method and test method |
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2022
- 2022-02-25 CN CN202220404221.5U patent/CN218254551U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116381444A (en) * | 2023-05-26 | 2023-07-04 | 长春光华微电子设备工程中心有限公司 | Workbench structure for wafer test, clamping control method and test method |
| CN116381444B (en) * | 2023-05-26 | 2023-08-25 | 长春光华微电子设备工程中心有限公司 | Workbench structure for wafer test, clamping control method and test method |
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