CN218214052U

CN218214052U - Heat radiation structure of computer chip

Info

Publication number: CN218214052U
Application number: CN202222671590.3U
Authority: CN
Inventors: 薛镇籍; 解智博; 李敏
Original assignee: Shanxi College of Applied Science and Technology
Current assignee: Shanxi College of Applied Science and Technology
Priority date: 2022-10-11
Filing date: 2022-10-11
Publication date: 2023-01-03
Anticipated expiration: 2032-10-11

Abstract

The utility model discloses a heat radiation structure of computer chip belongs to the computer chip field, a heat radiation structure of computer chip, including computer chip installation component, the top of computer chip installation component is provided with supplementary radiator unit, supplementary radiator unit includes the installing frame, the top of the inner wall of installing frame is rotated through the pivot and is connected with radiator fan, the inside of installing frame and the bottom that is located radiator fan are provided with the fin, the equal fixedly connected with connecting plate in both sides of installing frame, the bottom fixedly connected with of connecting plate supports the piece, support the bottom of piece and seted up flexible groove, telescopic spring fixedly connected with stopper is passed through to the inside in flexible groove, computer chip installation component includes the mounting base, the inside groove has been seted up to the inside of mounting base, it can simplify fin and radiator fan's dismantlement step, thereby can be convenient for the staff to carry out subsequent maintenance work, conveniently use.

Description

Heat radiation structure of computer chip

Technical Field

The utility model relates to a computer chip field, more specifically say, relate to a computer chip's heat radiation structure.

Background

At present, a computer chip generally performs auxiliary heat dissipation on the computer chip through a heat dissipation sheet and a heat dissipation fan, dust can be accumulated after the heat dissipation sheet and the heat dissipation fan work for a long time, the dust easily affects the heat dissipation effect of equipment, the heat dissipation sheet and the heat dissipation fan are generally disassembled through screwing screws in the prior art, an auxiliary disassembling tool is needed in the disassembling process, the operation steps are complex, and the computer chip is inconvenient for workers to use.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a heat radiation structure of computer chip, it can simplify fin and radiator fan's dismantlement step to can be convenient for the staff carries out subsequent maintenance work, conveniently uses.

2. Technical scheme

In order to solve the problem, the utility model adopts the following technical proposal.

A heat dissipation structure of a computer chip comprises a computer chip mounting component, wherein an auxiliary heat dissipation component is arranged at the top of the computer chip mounting component and comprises a mounting frame, the top of the inner wall of the mounting frame is rotatably connected with a heat dissipation fan through a rotating shaft, heat dissipation fins are arranged inside the mounting frame and at the bottom of the heat dissipation fan, connecting plates are fixedly connected to two sides of the mounting frame, the bottom of each connecting plate is fixedly connected with a resisting block, the bottom of each resisting block is provided with a telescopic groove, the inside of each telescopic groove is fixedly connected with a limiting block through a telescopic spring, the computer chip mounting component comprises a mounting base, an inner groove is formed inside the mounting base, the bottom of the inner wall of the inner groove is fixedly connected with a sliding block through a connecting spring, and the middle of the top of the bearing plate is fixedly connected with a bearing plate, the device separates the auxiliary heat dissipation assembly from the mounting base, and can simultaneously press two push rods during separation, so that extrusion springs on the two push rods are deformed, the equidirectional movement of the two push rods is improved, a limiting block can be separated from the inner part of the corresponding limiting groove indirectly through the movement of the two push plates, finally, the mounting frame is moved upwards to separate the two push rods, the disassembly work can be completed, the detachable design of the auxiliary heat dissipation assembly and the mounting base can conveniently adapt to different use environments, different use requirements of users can be conveniently met, and the whole disassembly process does not need to use auxiliary disassembly tools, thereby being beneficial to simplifying the operation steps of the equipment and being convenient for the use of the working personnel.

Further, the equal fixedly connected with sliding sleeve in both sides of mounting base, sliding sleeve's inside sliding connection has the catch bar, the one end of catch bar runs through mounting base and spacing groove in proper order and extends to the inside of spacing groove.

Furthermore, the one end fixedly connected with of catch bar extension to limiting groove inside promotes the piece, the other end fixedly connected with limiting plate of catch bar.

Furthermore, the outer surface of the push rod is sleeved with an extrusion spring.

Further, one end of the extrusion spring is fixedly connected with one side of the limiting plate, the other end of the extrusion spring is fixedly connected with one side of the pushing block, and the stability of the pushing rod during movement can be improved under the action of the elastic force of the extrusion spring.

Furthermore, the limiting groove is matched with the limiting block.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

(1) This scheme is separating supplementary radiator unit and mounting base, during the separation, can ann presses two catch bars simultaneously, make extrusion spring on two catch bars take place deformation, improve the syntropy removal of two catch bars, can make the stopper break away from the inside that corresponds the spacing groove through the removal of two catch bars indirectly, and finally, shift up the installing frame, make the two separation, can accomplish the dismantlement work, detachable design through supplementary radiator unit and mounting base, can conveniently adapt to different service environment, the staff of being convenient for carries out subsequent maintenance work, and whole dismantlement process need not with the help of supplementary extracting tool, thereby be favorable to the operating procedure of simplified equipment, make things convenient for the staff to use.

(2) This scheme is with supplementary radiator unit and mounting base installation back, and the fin in the installing frame will hug closely on the surface of chip body, through so setting up, can be favorable to improving the radiating efficiency of chip body, and fin and radiator fan set up in the inside of installing frame one by one, through so setting up, can further improve equipment's radiating efficiency, is convenient for use.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a three-dimensional view of the secondary heat sink assembly shown in FIG. 1;

FIG. 3 is a top view of FIG. 2;

fig. 4 is a schematic structural view of the computer chip mounting assembly shown in fig. 1.

The numbering in the figures illustrates:

1. a computer chip mounting assembly; 11. mounting a base; 12. an inner tank; 13. a connecting spring; 14. carrying a plate; 15. a slider; 16. a guide groove; 17. a guide pasting plate; 18. a chip body; 19. a limiting groove; 110. a sliding sleeve; 111. a push rod; 112. a compression spring;

2. an auxiliary heat dissipation assembly; 21. installing a frame; 22. a heat-dissipating fan; 23. a heat sink; 24. a connecting plate; 25. a resisting block; 26. a telescopic groove; 27. and a limiting block.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-4, a heat dissipation structure of a computer chip comprises a computer chip mounting assembly 1, an auxiliary heat dissipation assembly 2 is disposed on the top of the computer chip mounting assembly 1, the auxiliary heat dissipation assembly 2 includes a mounting frame 21, a heat dissipation fan 22 is rotatably connected to the top of the inner wall of the mounting frame 21 through a rotating shaft, a heat dissipation fin 23 is disposed inside the mounting frame 21 and at the bottom of the heat dissipation fan 22, connecting plates 24 are fixedly connected to both sides of the mounting frame 21, a support block 25 is fixedly connected to the bottom of the connecting plate 24, a telescopic slot 26 is formed at the bottom of the support block 25, a limit block 27 is fixedly connected to the inside of the telescopic slot 26 through a telescopic spring, the computer chip mounting assembly 1 includes a mounting base 11, an inner slot 12 is formed inside the mounting base 11, a bearing plate 14 is fixedly connected to the bottom of the inner wall of the inner slot 12 through a connecting spring 13, the middle of the top of the bearing plate 14 is fixedly connected with a sliding block 15, the inside of the sliding block 15 is provided with a guide groove 16, the inside of the guide groove 16 is provided with a guide pasting plate 17, the top of the guide pasting plate 17 is pasted with a chip body 18, the inside of the mounting base 11 and two sides of the inner groove 12 are both provided with limit grooves 19, the device separates the auxiliary heat dissipation component 2 from the mounting base 11, during separation, two push rods 111 can be simultaneously pressed to enable extrusion springs 112 on the two push rods 111 to deform, the equidirectional movement of the two push rods 111 is improved, a limit block 27 can be indirectly separated from the inside of the corresponding limit groove 19 through the movement of the two push plates, finally, the mounting frame 21 is upwards moved to separate the two, the disassembly work can be completed, through the detachable design of the auxiliary heat dissipation component 2 and the mounting base 11, the device can conveniently adapt to different use environments, different user demands of users are convenient to satisfy, and the whole dismantlement process need not with the help of supplementary extracting tool to be favorable to simplifying the operating procedure of equipment, make things convenient for the staff to use.

The equal fixedly connected with sliding sleeve 110 in both sides of mounting base 11, the inside sliding connection of sliding sleeve 110 has catch bar 111, and the one end of catch bar 111 runs through mounting base 11 and spacing groove 19 in proper order and extends to the inside of spacing groove 19.

The one end fixedly connected with catch block that catch bar 111 extends to limiting groove 19 inside, the other end fixedly connected with limiting plate of catch bar 111.

The outer surface of the push rod 111 is sleeved with an extrusion spring 112.

One end of the extrusion spring 112 is fixedly connected with one side of the limiting plate, the other end of the extrusion spring 112 is fixedly connected with one side of the pushing block, and the stability of the pushing rod 111 during movement can be improved through the elastic action of the extrusion spring 112.

The limiting groove 19 is matched with the limiting block 27.

The working principle is as follows: when the heat dissipation device is used, the chip body 18 can be fixed in the guide groove 16 in the sliding block 15 through the guide adhesive plate 17, after the fixing, the auxiliary heat dissipation assembly 2 and the mounting base 11 can be mounted, when the heat dissipation device is mounted, the abutting block 25 at the bottom of the mounting frame 21 can be inserted into the inner groove 12 in the mounting base 11, the bearing plate 14 can extrude the connecting spring 13 along with the entering of the abutting block 25, the connecting spring 13 can be elastically deformed, when the connecting spring 13 is compressed to the limit, the limiting block 27 can be indirectly driven to enter the corresponding limiting groove 19 through the elastic force action of the telescopic spring, and meanwhile, the heat dissipation fins 23 in the mounting frame 21 can be tightly attached to the surface of the chip body 18, so that the subsequent heat dissipation can be conveniently carried out;

the chip body 18 can be conveniently cooled by connecting the two, the chip body 18 can be primarily cooled by arranging the cooling fins 23, and the cooling fan 22 can further cool the chip body 18, so that the cooling efficiency of the equipment can be conveniently improved, and the service life of the equipment can be prolonged;

when it is not necessary to dispel the heat to chip body 18, can separate auxiliary heat dissipation assembly 2 and mounting base 11, during the separation, can ann presses two catch bars 111 simultaneously, make extrusion spring 112 on two catch bars 111 take place deformation, improve the equidirectional removal of two catch bars 111, can make stopper 27 break away from the inside that corresponds spacing groove 19 through the removal of two catch bars indirectly, finally, go up mounting frame 21, make the two separation, can accomplish the dismantlement work, detachable design through auxiliary heat dissipation assembly 2 and mounting base 11, can conveniently adapt to different service environments, be convenient for satisfy user's different user demands, thereby be favorable to the flexibility ratio of improve equipment, make things convenient for the staff to use.

The above is only a preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. A heat radiation structure of computer chip, includes computer chip installation component (1), its characterized in that: the top of computer chip installation component (1) is provided with supplementary radiator unit (2), supplementary radiator unit (2) are including installing frame (21), the top of the inner wall of installing frame (21) rotates through the pivot and is connected with radiator fan (22), the inside of installing frame (21) and the bottom that is located radiator fan (22) are provided with fin (23), the equal fixedly connected with connecting plate (24) in both sides of installing frame (21), the bottom fixedly connected with of connecting plate (24) supports piece (25), flexible groove (26) have been seted up to the bottom of supporting piece (25), the inside of flexible groove (26) is through expanding spring fixedly connected with stopper (27), computer chip installation component (1) is including mounting base (11), inside groove (12) has been seted up to the inside of mounting base (11), the bottom of inside groove (12) inner wall is through connecting spring (13) fixedly connected with loading board (14), the middle fixedly connected with sliding block (15) at loading board (14) top, guide way (16) have been seted up to the inside of mounting base (11), the inside of guide way (16) is provided with deflector (17) the limited mounting base (17), the top that the pasting body (17) has all set up the pasting of pasting chip (11), and the mounting base (11) has the mounting base (11), and the mounting base (11) has the inside of pasting the mounting base (17) has the pasting the mounting base (11) had A bit slot (19).

2. The heat dissipation structure of a computer chip according to claim 1, wherein: the equal fixedly connected with slip cap (110) in both sides of mounting base (11), the inside sliding connection of slip cap (110) has catch bar (111), the one end of catch bar (111) runs through mounting base (11) and spacing groove (19) in proper order and extends to the inside of spacing groove (19).

3. The heat dissipation structure of a computer chip according to claim 2, wherein: the one end fixedly connected with that catch bar (111) extend to spacing groove (19) inside promotes the piece, the other end fixedly connected with limiting plate of catch bar (111).

4. The heat dissipation structure of a computer chip according to claim 2, wherein: the outer surface of the push rod (111) is sleeved with an extrusion spring (112).

5. The heat dissipation structure of a computer chip according to claim 4, wherein: one end of the extrusion spring (112) is fixedly connected with one side of the limiting plate, and the other end of the extrusion spring (112) is fixedly connected with one side of the pushing block.

6. The heat dissipation structure of a computer chip according to claim 1, wherein: the limiting groove (19) is matched with the limiting block (27).