CN218213987U

CN218213987U - Server cooling system

Info

Publication number: CN218213987U
Application number: CN202221717409.1U
Authority: CN
Inventors: 桑彧; 章于道; 刘宏
Original assignee: Suzhou Narrowband Semiconductor Technology Co ltd
Current assignee: Suzhou Narrowband Semiconductor Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2023-01-03
Anticipated expiration: 2032-07-05

Abstract

The utility model belongs to the technical field of the server heat dissipation, a server cooling system is disclosed, include: an internal cooling water tank disposed on a CPU chip in a server chassis; the external water receiver is arranged outside the server case, the external water receiver is connected with the internal cooling water tank through a first connecting pipeline, a water pump is further arranged on the first connecting pipeline, and a second connecting pipeline is further arranged between the external water receiver and the internal cooling water tank; and the cold surface of the semiconductor refrigeration module is attached to the outer wall of the external water receiver. The utility model adopts split type water cooling, compared with the integral type water cooling liquid leakage that the whole water cooling device is arranged in the server case, the risk is greatly reduced; the heat dissipation performance is stronger than that of air cooling, and the heat dissipation performance and the temperature stability are higher than those of common water cooling in the aspect of long-time operation.

Description

Server cooling system

Technical Field

The utility model belongs to the technical field of the server heat dissipation, concretely relates to server cooling system.

Background

The network server is a core component of a computer local area network, a network operating system runs on the network server, the efficiency of the network server directly influences the efficiency of the whole network, the server can generate a lot of heat during working, and the heat dissipation of the server is always a problem watched by people.

At present, two heat dissipation modes of a server host on the market are mainly provided, namely air cooling heat dissipation and liquid cooling heat dissipation, wherein the air cooling heat dissipation is the most common heat dissipation mode, the structure is simple, the price is low, the safety and the reliability are realized, but the air cooling heat dissipation also has the defects that the rotation of a fan can bring noise, if the fan is not installed in place, the fan can vibrate in the operation process, electronic elements in the server can be damaged, the temperature of the air cooling heat dissipation is not ideal, the ultimate heat dissipation capacity is not strong due to water cooling, the liquid cooling heat dissipation is realized by replacing air with liquid for heat dissipation, the liquid mainly adopted at present is water, the liquid cooling heat dissipation is realized by pumping the water out of a water storage device by using a water pump, the water flows into a heat exchanger covered on a CPU chip through a water pipe, then the water flows out of the other port of the heat exchanger, and flows back to the water storage device through the water pipe. The liquid cooling heat dissipation has the advantages that the heat dissipation capacity is larger than that of air cooling heat dissipation, the price is higher than that of air cooling, along with accumulation of working time, the water temperature of the water tank is higher and higher, and the heat dissipation performance is worse and worse. Of course, oil-cooled heat dissipation is also available, but the application is not wide, the oil-cooled heat dissipation uses silicone oil, liquid leakage cannot cause damage to electronic components, and the cooling liquid used in the mode is expensive. Therefore, it is desirable to design a heat dissipation device for a server to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a server cooling system to the radiating temperature of forced air cooling who provides in solving above-mentioned background art is not ideal, and water tank temperature can be more and more high during the water-cooling heat dissipation, and heat dispersion also can be more and more poor, and the problem that oil-cooling coolant liquid is expensive.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a server heat dissipation system, comprising:

an internal cooling water tank disposed on a CPU chip in a server chassis;

the external water receiver is arranged outside the server case, the external water receiver is connected with the internal cooling water tank through a first connecting pipeline, a water pump is further arranged on the first connecting pipeline, and a second connecting pipeline is further arranged between the external water receiver and the internal cooling water tank;

and the cold surface of the semiconductor refrigeration module is attached to the outer wall of the external water receiver.

As a further improvement, the water pump is arranged outside the server case.

As a further improvement, the first connecting pipe has one end connected to the top of one side of the internal cooling water tank, and the second connecting pipe has one end connected to the bottom of the other side of the internal cooling water tank.

As a further improvement, the hot side of the semiconductor refrigeration module is provided with an aluminum radiator.

As a further improvement of the present invention, a fan is provided outside the aluminum heat sink.

As a further improvement, both sides of the semiconductor refrigeration module are coated with heat-conducting glue.

Through the technical scheme, the utility model discloses technical scheme's beneficial effect is:

the utility model discloses use semiconductor refrigeration module to paste on outside water receiver, cool down to the water in the outside water receiver, can reduce the temperature rising speed, be favorable to the long-time operation of CPU chip, stronger than the forced air cooling in the aspect of heat-sinking capability, possess heat dispersion and the temperature stability higher than ordinary water cooling in the aspect of long-time operation.

The utility model discloses a split type water-cooling compares in the risk greatly reduced who arranges whole water cooling plant in the whole integral type water-cooling weeping of arranging server machine incasement portion in.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall three-dimensional structure of the present invention.

Fig. 2 is a schematic view of a partial three-dimensional structure of the present invention.

Fig. 3 is a schematic view of the front view of the structure of the present invention.

Fig. 4 is a schematic side view of the structure of the present invention.

The reference numerals in the schematic drawings illustrate:

1. a server chassis; 2. a CPU chip; 3. an internal cooling water tank; 4. an external water reservoir; 5. a water pump; 6. a semiconductor refrigeration module; 7. an aluminum heat sink; 8. a fan; 9. a first connecting pipe; 10. a second connecting conduit.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides the following embodiments:

the utility model provides a server cooling system, including inside cooling water tank 3, outside water receiver 4, water pump 5 and semiconductor refrigeration module 6, inside cooling water tank 3 is arranged in on CPU chip 2 in server machine case 1, the bottom surface of inside cooling water tank 3 directly pastes on CPU chip 2, inside cooling water tank 3 is used for extracting the heat on CPU chip 2, outside water receiver 4 sets up and the server machine case 1 outside, outside water receiver 4 is inside to store the water that cools off, and outside water receiver 4 is located the outside of server machine case 1, reduce the risk of weeping, increase the security, connect through first connecting tube 9 between outside water receiver 4 and the inside cooling water tank 3, still be provided with water pump 5 on the first connecting tube 9, water pump 5 is arranged in extracting inside cooling water tank 3, still be equipped with second connecting tube 10 between outside water receiver 4 and the inside cooling water tank 3, realize the circulation through second connecting tube 10, when water pump 5 extracts inside cooling water tank 3 in the hot water, the hot water in outside 4 gets into inside cooling water tank 3 through second connecting tube 10, can be to CPU chip 2 business turn over heat dissipation.

Attached 4 outer walls in outside water receiver of cold face of semiconductor refrigeration module 6, semiconductor refrigeration module 6 can be cooled down to outside water receiver 4, when using for a long time, the water in inside cooling water tank 3 and outside water receiver 4 can the temperature more and more be high, and the cold face of semiconductor refrigeration module 6 can be cooled down to the water in outside water receiver 4, is favorable to CPU chip 2 to carry out work for a long time, possess than the stability that ordinary water-cooling is higher in the aspect of the long-time operation.

As a preferred embodiment of the present invention, the water pump 5 is disposed outside the server case 1, and is also for reducing the risk of liquid leakage.

As another preferred scheme of the utility model, the one end and the 3 one sides tops of internal cooling water tank of first connecting tube 9 are connected, and the one end and the 3 other sides bottoms of internal cooling water tank of second connecting tube 10 refer to fig. 1 and fig. 2, and is rational in infrastructure, ensures the cooling effect of internal cooling water tank 3 to CPU chip 2.

As another preferred scheme of the utility model, semiconductor refrigeration module 6's hot side is provided with aluminium radiator 7, and the heat of sparse semiconductor refrigeration module 6 hot side is come through aluminium radiator 7, and aluminium radiator 7 can increase flesh heat transfer area.

More preferably, a fan 8 is disposed outside the aluminum heat sink 7 to dissipate heat of the aluminum heat sink 7 by air convection.

As another preferred scheme of the utility model, semiconductor refrigeration module 6's two sides all scribbles the heat-conducting glue, increases the heat conduction effect, guarantees the heat transfer effect of cold face and hot face.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A server heat dissipation system, comprising:

an internal cooling water tank (3), the internal cooling water tank (3) being disposed on a CPU chip (2) in a server chassis (1);

the external water receiver (4) is arranged outside the server case (1), the external water receiver (4) is connected with the internal cooling water tank (3) through a first connecting pipeline (9), a water pump (5) is further arranged on the first connecting pipeline (9), and a second connecting pipeline (10) is further arranged between the external water receiver (4) and the internal cooling water tank (3);

the cold surface of the semiconductor refrigeration module (6) is attached to the outer wall of the external water receiver (4).

2. The server cooling system according to claim 1, wherein the water pump (5) is provided outside the server chassis (1).

3. The server cooling system according to claim 1, wherein one end of the first connection pipe (9) is connected to a top of one side of the internal cooling water tank (3), and one end of the second connection pipe (10) is connected to a bottom of the other side of the internal cooling water tank (3).

4. The server cooling system according to claim 1, wherein the hot side of the semiconductor cooling module (6) is provided with an aluminum heat sink (7).

5. The server cooling system according to claim 4, wherein a fan (8) is provided outside the aluminum heat sink (7).

6. The server cooling system according to claim 4, wherein both sides of the semiconductor cooling module (6) are coated with a thermally conductive glue.