CN218103703U - Domain controller - Google Patents
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- CN218103703U CN218103703U CN202221343434.8U CN202221343434U CN218103703U CN 218103703 U CN218103703 U CN 218103703U CN 202221343434 U CN202221343434 U CN 202221343434U CN 218103703 U CN218103703 U CN 218103703U
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Abstract
The utility model discloses a domain controller, which comprises a middle shell, at least two PCBA boards and at least one protective cover; the intermediate housing is arranged in a first direction; the PCBA is arranged on the middle shell and distributed on two opposite sides of the middle shell along the second direction; the PCBA boards are arranged along a first direction respectively; the protective cover is fixed on the side surface of the middle shell along the second direction end part, and covers the PCBA exposed on the side of the middle shell. The domain controller realizes the stacked arrangement by adopting the mode that the PCBA boards are arranged on two sides of the middle shell, and compared with the domain controller adopting the whole PCBA board to install all connectors in the prior art, the domain controller can obviously reduce the occupied area of the PCBA board, thereby reducing the occupied installation area of the domain controller and facilitating the arrangement of other controllers of the whole vehicle.
Description
Technical Field
The utility model relates to an automotive electronics technical field, more specifically say, relate to a domain controller.
Background
Along with the intelligent development of automobiles, more and more controllers are provided, and in order to reduce the cost of the controllers, reduce the weight of the whole automobiles and improve the integration degree, a plurality of functional devices are required to be connected and integrated into a general controller to form a domain controller.
Because domain controller has integrateed a plurality of functions, lead to its PCBA (Printed Circuit Board assembled) Board to need external a plurality of modules to carry out the information interaction, consequently will be equipped with a plurality of connectors, more connector can promote the Board area that occupies of whole PCBA Board, and it is big to lead to domain controller to occupy the installation area, and the influence arranges other controllers of whole car.
In summary, how to provide a domain controller with a small occupied installation area to avoid affecting other controllers arranged on a whole vehicle is an urgent problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a domain controller adopts the mode that a plurality of PCBA boards were arranged in middle casing both sides to realize range upon range of arranging, compares in the domain controller that adopts whole PCBA board installation all connectors among the prior art, can show and reduce the shared area of PCBA board to reduce the shared installation area of controller, be convenient for arrange other controllers of whole car.
In order to achieve the above object, the utility model provides a following technical scheme:
a domain controller, comprising:
an intermediate housing arranged in a first direction;
the PCBA boards are arranged on the middle shell and distributed on two opposite sides of the middle shell along a second direction; the PCBA boards are arranged along a first direction respectively;
and the protective cover is fixed on the side surface of the end part of the middle shell along the second direction and covers the PCBA exposed on the side of the middle shell.
Preferably, in the above domain controller, the protection cover includes an upper cover and a lower cover, the upper cover is fixed to one side of the middle housing along the second direction, and covers the first PCBA board exposed on the side of the middle housing; the lower cover is fixed on the other side of the middle shell along the second direction and covers the second PCBA exposed on the side of the middle shell.
Preferably, in the domain controller, the first PCBA board and the upper cover are respectively provided with a first positioning structure mutually matched with the middle housing;
the first positioning structure comprises two first positioning columns fixed in the middle shell and facing to the side face of the upper cover, two positioning holes arranged in the first PCBA board and two positioning holes arranged in the upper cover; the two positioning holes of the first PCBA board are respectively matched with the two first positioning columns, and the two positioning holes of the upper cover are respectively matched with the two first positioning columns; the upper cover and the first PCBA board are fastened to the middle shell through screws respectively.
Preferably, in the domain controller, the second PCBA board and the lower cover are respectively provided with a second positioning structure which is matched with the middle housing;
the second positioning structure comprises two second positioning columns fixed on the side face, facing the lower cover, of the middle shell, two positioning holes formed in the second PCBA and two positioning holes formed in the lower cover; two positioning holes of the second PCBA are respectively matched with the two second positioning columns, and two positioning holes of the lower cover are respectively matched with the two second positioning columns; the lower cover and the second PCBA board are fastened to the middle shell through screws respectively.
Preferably, in the domain controller, at least two PCBA boards are associated with each other through a floating board-to-board connector;
the first positioning column and the second positioning column are overlapped with each other along the projection of the second direction on the middle shell, and the connectors between the floating plates of the two PCBA plates are aligned and connected with each other along the second direction when the first PCBA plate and the second PCBA plate are respectively matched with the positioning columns.
Preferably, in the domain controller, one side of the middle shell along the second direction is provided with a first heat dissipation boss, and the first heat dissipation boss is aligned with the heat generating chip on the PCBA board along the second direction;
the other side of middle casing along the second direction is equipped with the second heat dissipation boss, the second heat dissipation boss aligns along the second direction with the chip that generates heat that is located this side PCBA board.
Preferably, in the domain controller, an area of an end surface of the first heat dissipation boss along the second direction exceeds an area of a top surface of the corresponding heat generating chip along the second direction, and a heat conductive adhesive is disposed between the end surface of the first heat dissipation boss along the second direction and the top surface of the corresponding heat generating chip along the second direction;
the area of the end face of the second heat dissipation boss along the second direction exceeds the area of the top face of the corresponding heat generating chip along the second direction, and heat conducting glue is arranged between the end face of the second heat dissipation boss along the second direction and the top face of the corresponding heat generating chip along the second direction.
Preferably, in the domain controller, a shielding cavity is disposed on one side of the upper cover facing the middle housing, a shielding cavity is disposed on one side of the middle housing facing the upper cover, and the upper cover and the first PCBA board are fastened to the middle housing by screws, so that the two shielding cavities jointly form a first shielding space; connectors of the first PCBA board extend out of the first shielded space, and remaining electronic components of the first PCBA board are located in the first shielded space;
a shielding cavity is arranged on one side, facing the middle shell, of the lower cover, a shielding cavity is arranged on one side, facing the lower cover, of the middle shell, and the lower cover and the second PCBA board are fastened to the middle shell through screws, so that the two shielding cavities jointly form a second shielding space; connectors of the second PCBA board extend out of the second shielded space, and remaining electronic components of the second PCBA board are located in the second shielded space.
Preferably, in the domain controller, heat dissipation ribs are uniformly arranged on three side surfaces around the middle shell at intervals, and the cross section of each heat dissipation rib along the direction perpendicular to the side surface is a diamond shape.
Preferably, in the domain controller, a step surface is provided at an edge of the upper cover corresponding to a side surface of the outer periphery of the middle housing where the heat dissipation rib is not provided, and the step surface is used for being engaged with the edge of the side surface of the outer periphery of the middle housing where the heat dissipation rib is not provided; in the lower cover with middle casing periphery does not set up the border that the side of heat dissipation muscle corresponds is equipped with the ladder face, this ladder face be used for with middle casing periphery does not set up the side border interlock of heat dissipation muscle each other.
The utility model provides a domain controller, which comprises a middle shell, at least two PCBA boards and at least one protective cover; the intermediate housing is arranged in a first direction; the PCBA boards are arranged on the middle shell and distributed on two opposite sides of the middle shell along the second direction; the PCBA boards are arranged along the first direction respectively; the protective cover is fixed on the side surface of the middle shell along the second direction end part, and covers the PCBA exposed on the side of the middle shell.
Above-mentioned domain controller adopts the mode that a plurality of PCBA boards were arranged in middle casing both sides to realize range upon range of arranging, compares in the domain controller that adopts all connectors of whole PCBA board installation among the prior art, can show the area that reduces the PCBA board and occupy to reduce the area of installation that the domain controller is occupied, be convenient for arrange other controllers of whole car.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded view of a domain controller according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of a domain controller according to an embodiment of the present invention;
fig. 3 is an assembly diagram of a first PCBA board and a second PCBA board provided by an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an intermediate housing according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of the other side of the middle housing according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an upper cover according to an embodiment of the present invention;
FIG. 7 is an enlarged view of portion A of FIG. 6;
fig. 8 is a schematic structural diagram of a lower cover according to an embodiment of the present invention;
FIG. 9 is an enlarged view of portion B of FIG. 8;
wherein, in fig. 1-9:
Detailed Description
The embodiment of the utility model discloses domain controller adopts the mode of a plurality of PCBA boards to arrange in middle casing both sides to realize range upon range of arranging, compares in the domain controller who adopts whole PCBA board installation all connectors among the prior art, can show and reduce the shared area of PCBA board to reduce the shared installation area of controller, be convenient for arrange other controllers of whole car.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-9, an embodiment of the present invention provides a domain controller, which includes a middle housing 4, at least two PCBA boards 21, and at least one protection cover; the intermediate housing 4 is arranged in a first direction; the PCBA boards 21 are arranged on the middle shell 4 and distributed on two opposite sides of the middle shell 4 along the second direction; the PCBA boards 21 are respectively arranged along a first direction; the protective cover is fixed to a side surface of the middle case 4 at the end portion in the second direction, and covers the PCBA board 21 exposed to the side of the middle case 4.
The first direction is perpendicular to the second direction, and when the domain controller is mounted on the vehicle body, the first direction is parallel to the horizontal direction, and the second direction is parallel to the vertical direction.
The domain controller provided by the embodiment realizes the stacked arrangement by adopting the mode that the PCBA boards 21 are arranged on two sides of the middle shell 4, and compared with the domain controller adopting the whole PCBA board to install all connectors in the prior art, the domain controller can obviously reduce the area occupied by the PCBA boards 21, thereby reducing the installation area occupied by the domain controller and facilitating the arrangement of other controllers of the whole vehicle.
In the above-mentioned domain controller, the protective cover includes upper cover 2 and lower cover 6, the upper cover 2 is fixed to one side along the second direction of the middle body 4, and the first PCBA board 3 exposed to this side of the middle body 4 of the cover; the lower cover 6 is fixed to the other side of the middle housing 4 in the second direction, and covers the second PCBA board 5 exposed on the side of the middle housing 4. The upper cover 2 and the lower cover 6 are fixed to the intermediate housing 4 by fasteners such as screws, respectively.
In order to improve the assembly efficiency, the first PCBA board 3 and the upper cover 2 are respectively provided with a first positioning structure which is matched with the middle shell 4; the first positioning structure comprises two first positioning columns 9 fixed on the side surface of the middle shell 4 facing the upper cover 2, two positioning holes arranged on the first PCBA board 3 and two positioning holes arranged on the upper cover 2; two positioning holes of the first PCBA board 3 are respectively matched with the two first positioning columns 9, and two positioning holes of the upper cover 2 are respectively matched with the two first positioning columns 9; the upper cover 2 and the first PCBA board 3 are fastened to the intermediate case 4 by screws, respectively.
The second PCBA board 5 and the lower cover 6 are respectively provided with a second positioning structure which is matched with the middle shell 4; the second positioning structure comprises two second positioning columns 11 fixed on the side surface of the middle shell 4 facing the lower cover 6, two positioning holes arranged on the second PCBA 5 and two positioning holes arranged on the lower cover 6; two positioning holes of the second PCBA board 5 are respectively matched with the two second positioning columns 11, and two positioning holes of the lower cover 6 are respectively matched with the two second positioning columns 11; the lower cover 6 and the second PCBA board 5 are fastened to the intermediate case 4 by screws, respectively.
In this embodiment, the two first positioning posts 9 form a uniform assembly standard for the middle housing 4, the first PCBA board 3 and the upper cover 2, so that the middle housing 4, the first PCBA board 3 and the upper cover 2 can be assembled conveniently; the two second positioning columns 11 enable the middle shell 4, the second PCBA board 5 and the lower cover 6 to form a unified assembly standard, and the middle shell 4, the second PCBA board 5 and the lower cover 6 are convenient to assemble.
In the domain controller, at least two PCBA boards 21 are associated with each other through the connectors 8 between the floating boards, and may be connected in series, in parallel, or in series and parallel, which is not limited in this embodiment.
The projections of the first positioning column 9 and the second positioning column 11 on the middle shell 4 along the second direction are mutually overlapped, and the connectors 8 between the floating plates of the two PCBA boards 21 are aligned and mutually connected along the second direction when the first PCBA board 3 and the second PCBA board 5 are respectively matched with the positioning columns.
The intermediate case 4 also has a heat sink function in addition to serving as an assembly base for the PCBA board 21. One side of the middle shell 4 along the second direction is provided with a first heat dissipation boss 10, and the first heat dissipation boss 10 is aligned with the heating chip on the PCBA board 21 along the second direction; the other side of the middle shell 4 along the second direction is provided with a second heat dissipation boss 12, and the second heat dissipation boss 12 is aligned with the heat generating chip on the side PCBA board 21 along the second direction.
Further, in the domain controller, an area of an end surface of the first heat dissipation boss 10 along the second direction exceeds an area of a top surface of the corresponding heat generating chip along the second direction, and a heat conductive adhesive is disposed between the end surface of the first heat dissipation boss 10 along the second direction and the top surface of the corresponding heat generating chip along the second direction; the area of the end surface of the second heat dissipation boss 12 along the second direction exceeds the area of the top surface of the corresponding heat generating chip along the second direction, and a heat conducting glue is arranged between the end surface of the second heat dissipation boss 12 along the second direction and the top surface of the corresponding heat generating chip along the second direction.
In the domain controller that this embodiment provided, heat dissipation boss and heat conduction glue cooperation can be with the heat quick conduction of the chip that generates heat to middle casing 4, and it is favorable in improving the radiating efficiency, provide the guarantee for each chip reliable operation that generates heat.
In addition, in the domain controller provided in this embodiment, the area of the end surface of the first heat dissipation boss 10 along the second direction exceeds the area of the top surface of the corresponding heat generating chip along the second direction, and the area of the end surface of the second heat dissipation boss 12 along the second direction exceeds the area of the top surface of the corresponding heat generating chip along the second direction, so as to increase the area of heat conduction between the heat generating chip and the heat dissipation boss to the maximum extent, and fully exert the heat dissipation effect of the heat dissipation boss.
Specifically, the area of the end surface of the first heat dissipation boss 10 along the second direction is slightly larger than the area of the top surface of the corresponding heat generating chip along the second direction, and the area of the end surface of the second heat dissipation boss 12 along the second direction is slightly larger than the area of the top surface of the corresponding heat generating chip along the second direction, so that the coverage area of the heat dissipation boss slightly exceeds the area of the top surface of the heat generating chip along the second direction, the top surface can be completely attached to the heat dissipation boss through the heat conductive adhesive, and the heat dissipation boss is prevented from being set to be too large and interfering with other electronic elements of the PCBA board 21.
A shielding cavity 16 is arranged on one side of the upper cover 2 facing the middle shell 4, a shielding cavity 14 is arranged on one side of the middle shell 4 facing the upper cover 2, and the upper cover 2 and the first PCBA board 3 are fastened on the middle shell 4 through screws 1, so that the shielding cavity 14 and the shielding cavity 16 jointly form a first shielding space; the connector of the first PCBA board 3 extends out of the first shielding space, and the rest electronic components of the first PCBA board 3 are positioned in the first shielding space; a shielding cavity 17 is arranged on one side of the lower cover 6 facing the middle shell 4, a shielding cavity 15 is arranged on one side of the middle shell 4 facing the lower cover 6, the lower cover 6 and the second PCBA board 5 are fastened on the middle shell 4 through screws 7, and the shielding cavity 15 and the shielding cavity 17 jointly form a second shielding space; the connectors of the second PCBA board 5 extend out of the second shielded space, and the remaining electronic components of the second PCBA board 5 are located in the second shielded space.
In the scheme provided by this embodiment, the first shielding space can shield other electronic components in the first PCBA board 3 except the connector, and the second shielding space can shield other electronic components in the second PCBA board 5 except the connector, so as to effectively ensure that the domain controller product has good EMC (Electromagnetic Compatibility) performance, and further enable the domain controller product to have certain waterproof and dustproof functions.
In the domain controller, the heat dissipation ribs 13 are uniformly arranged on three peripheral side surfaces of the middle shell 4 at intervals, and the cross sections of the heat dissipation ribs 13 in the direction perpendicular to the side surfaces of the middle shell 4 are rhombic, so that the heat of the adjacent heat dissipation ribs 13 is radiated to the surrounding environment as much as possible instead of being radiated to each other, and the heat dissipation capability of the domain controller is improved.
The domain controller that this embodiment provided adopts the passive heat dissipation mode, need not external heat abstractor, just only relies on middle casing 4 just can dispel the heat to the PCBA board 21 of both sides simultaneously.
Specifically, the middle shell 4 is cuboid, and the three peripheral sides of the middle shell are provided with radiating ribs 13; the heat dissipating ribs 13 are not provided at the other side face, which is used only for leading out the connectors of the PCBA board 21.
The edge 18 of the upper cover 2 corresponding to the side of the periphery of the middle housing 4 where the heat dissipation ribs 13 are not disposed is provided with a stepped surface, as shown in fig. 7, which is used for being engaged with the edge of the side of the periphery of the middle housing 4 where the heat dissipation ribs 13 are not disposed; the edge 19 of the lower cover 6 corresponding to the side of the outer periphery of the middle housing 4 where the heat dissipation ribs 13 are not provided is provided with a stepped surface for engaging with the edge of the side of the outer periphery of the middle housing 4 where the heat dissipation ribs 13 are not provided, as shown in fig. 9.
In the scheme that this embodiment provided, upper cover 2, lower cover 6 respectively with middle 4 assembly back interlocks of casing, can effectively reduce the transverse gap of upper cover 2 with middle 4 cooperation departments of casing, middle 4 and the 6 cooperation departments of lower cover, and then promote the EMC performance of domain controller, the structural style of above-mentioned mutual interlock simultaneously also can play certain waterproof and dustproof effect.
Specifically, in the domain controller, there are one middle housing 4 and two PCBA boards 21, and the two PCBA boards include the first PCBA board 3 and the second PCBA board 5 distributed on two sides of the middle housing 4, and the first PCBA board 5 and the second PCBA board 5 are associated with each other through the two floating board-to-board connectors 8. The embodiment adopts a double-board related structural form, so that the installation area occupied by the domain controller can be reduced, and more connectors in the domain controller can perform information interaction.
During assembly, the first PCBA board 3 and the upper cover 2 are positioned and installed on the middle shell 4 through 2 first positioning posts 9 on one side of the middle shell 4, and then are fastened through 10 uniformly distributed screws 1 to form a closed first shielding space for shielding other electronic elements except connectors in the first PCBA board 3; the second PCBA board 5 and the lower cover 6 are positioned and mounted on the middle housing 4 through 2 second positioning columns 11 on the other side of the middle housing 4, and then fastened through 10 evenly distributed screws 7 to form a closed second shielding space for shielding other electronic components except for connectors in the second PCBA board 5.
The structure of the upper cover 2 is shown in fig. 6, the structure of the lower cover 6 is shown in fig. 8, the upper cover 2 is provided with a shielding cavity 16, the lower cover 6 is provided with a shielding cavity 17, one side surface of the middle shell 4 is provided with a shielding cavity 14, and the other side surface is provided with a shielding cavity 15. The upper cover 2, the first PCBA board 3 and the middle shell 44 are fastened through 10 screws 1 which are uniformly distributed, so that the shielding cavity 16 and the shielding cavity 14 form a closed first shielding space, and the upper copper-laying area and the lower copper-laying area of the first PCBA board 3 are positioned in the first shielding space to shield other electronic elements except the connector in the first PCBA board 3; the lower cover 6, the second PCBA board 5 and the middle shell 4 are fastened through 10 evenly distributed screws 7, so that the shielding cavity 17 and the shielding cavity 15 form a closed second shielding space, and the upper copper laying area and the lower copper laying area of the second PCBA board 5 are located in the second shielding space to shield other electronic elements except connectors in the second PCBA board 5.
In order to further save the floor area of the control area, the PCBA board 21 can be further configured to be 3, 4, etc., and this embodiment is not limited.
When the number of the PCBA boards 21 is more than 3, the number of the middle housing 4 may be one, a plurality of PCBA boards 21 arranged in a stacked manner may be disposed on one side of the corresponding middle housing 4, and the PCBA boards 21 arranged in a stacked manner are supported by using support members such as hexagonal spacers or support plates.
Certainly, when the number of the PCBA boards 21 is more than 3, the number of the intermediate housings 4 may also be multiple, each intermediate housing 4 may be arranged in a stacked manner, one or more PCBA boards 21 may be arranged between adjacent intermediate housings 4 (when a plurality of PCBA boards 21 are arranged, each PCBA board 21 is supported by a support member such as a hexagonal spacer or a support plate), and adjacent intermediate housings 4 surround a shielding space for shielding electronic components except connectors in the PCBA boards 21 between the adjacent intermediate housings 4; the upper cover 2 and the lower cover 6 are fixed to the two middle cases 4 at both ends, respectively, and form shielding spaces, respectively.
In the above domain controller, the middle housing 4 is provided with a pin 20 for fitting a fixing member such as a bolt to assemble the entire domain controller to the automobile.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A domain controller, comprising:
an intermediate housing arranged in a first direction;
the PCBA boards are arranged on the middle shell and distributed on two opposite sides of the middle shell along a second direction; the PCBA boards are arranged along a first direction respectively;
and the protective cover is fixed on the side surface of the end part of the middle shell along the second direction and covers the PCBA exposed on the side of the middle shell.
2. The domain controller of claim 1, wherein the protective cover comprises an upper cover and a lower cover, the upper cover is fixed to one side of the middle housing along the second direction and covers the first PCBA board exposed to the one side of the middle housing; the lower cover is fixed on the other side of the middle shell along the second direction and covers the second PCBA exposed on the side of the middle shell.
3. The domain controller of claim 2, wherein the first PCBA board, the upper cover and the intermediate housing are respectively provided with a first locating formation which co-operates with each other;
the first positioning structure comprises two first positioning columns fixed on the side surface of the middle shell facing the upper cover, two positioning holes arranged on the first PCBA and two positioning holes arranged on the upper cover; two positioning holes of the first PCBA board are respectively matched with the two first positioning columns, and two positioning holes of the upper cover are respectively matched with the two first positioning columns; the upper cover and the first PCBA board are fastened to the middle shell through screws respectively.
4. The domain controller of claim 3, wherein the second PCBA board, the lower cover and the intermediate housing are respectively provided with a second locating formation which co-operates with each other;
the second positioning structure comprises two second positioning columns fixed in the middle shell and facing to the side face of the lower cover, two positioning holes arranged on the second PCBA and two positioning holes arranged on the lower cover; two positioning holes of the second PCBA are respectively matched with the two second positioning columns, and two positioning holes of the lower cover are respectively matched with the two second positioning columns; the lower cover and the second PCBA board are fastened to the middle shell through screws respectively.
5. The domain controller of claim 4, wherein at least two of the PCBA boards are interconnected by a floating board-to-board connector;
the first positioning column and the second positioning column are overlapped with each other along the projection of the second direction on the middle shell, and the connectors between the floating plates of the two PCBA plates are aligned and connected with each other along the second direction when the first PCBA plate and the second PCBA plate are respectively matched with the positioning columns.
6. The domain controller of claim 1, wherein one side of the middle housing along the second direction is provided with a first heat dissipation boss aligned with the heat generating chip on the PCBA board along the second direction;
the other side of middle casing along the second direction is equipped with the second heat dissipation boss, the second heat dissipation boss aligns along the second direction with the chip that generates heat that is located this side PCBA board.
7. The domain controller of claim 6, wherein an area of an end surface of the first heat-dissipating protrusion along the second direction exceeds an area of a top surface of the corresponding heat-generating chip along the second direction, and a thermally conductive adhesive is disposed between the end surface of the first heat-dissipating protrusion along the second direction and the top surface of the corresponding heat-generating chip along the second direction;
the area of the end face of the second heat dissipation boss along the second direction exceeds the area of the top face of the corresponding heat generating chip along the second direction, and heat conducting glue is arranged between the end face of the second heat dissipation boss along the second direction and the top face of the corresponding heat generating chip along the second direction.
8. The domain controller of claim 2, wherein a shielding cavity is provided in the upper cover towards one side of the middle housing, a shielding cavity is provided in the middle housing towards one side of the upper cover, the upper cover and the first PCBA board are fastened to the middle housing by screws, so that the two shielding cavities jointly form a first shielding space; connectors of the first PCBA board extend out of the first shielded space, and remaining electronic components of the first PCBA board are located in the first shielded space;
a shielding cavity is arranged on one side, facing the middle shell, of the lower cover, a shielding cavity is arranged on one side, facing the lower cover, of the middle shell, and the lower cover and the second PCBA board are fastened to the middle shell through screws, so that the two shielding cavities jointly form a second shielding space; connectors of the second PCBA board extend out of the second shielded space, and remaining electronic components of the second PCBA board are located within the second shielded space.
9. The domain controller of claim 2, wherein heat dissipating ribs are evenly spaced around three sides of the middle housing, the heat dissipating ribs having a diamond shape in cross section perpendicular to the sides.
10. The domain controller of claim 9, wherein an edge of the upper cover corresponding to a side of the outer periphery of the middle housing where the heat dissipation rib is not disposed is provided with a stepped surface for being engaged with an edge of the side of the outer periphery of the middle housing where the heat dissipation rib is not disposed; in the lower cover with middle casing periphery does not set up the border that the side of heat dissipation muscle corresponds is equipped with the ladder face, this ladder face be used for with middle casing periphery does not set up the side border interlock of heat dissipation muscle each other.
Priority Applications (1)
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CN202221343434.8U CN218103703U (en) | 2022-05-19 | 2022-05-19 | Domain controller |
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CN202221343434.8U CN218103703U (en) | 2022-05-19 | 2022-05-19 | Domain controller |
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CN218103703U true CN218103703U (en) | 2022-12-20 |
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CN202221343434.8U Active CN218103703U (en) | 2022-05-19 | 2022-05-19 | Domain controller |
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2022
- 2022-05-19 CN CN202221343434.8U patent/CN218103703U/en active Active
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