CN218096675U

CN218096675U - Semiconductor refrigerating device

Info

Publication number: CN218096675U
Application number: CN202221849134.7U
Authority: CN
Inventors: 张瑞钦; 王祺志; 黄智豪; 李治方; 梁永诒
Original assignee: Guangdong Aodaxin Refrigeration Technology Co ltd
Current assignee: Guangdong Aodaxin Refrigeration Technology Co ltd
Priority date: 2022-07-16
Filing date: 2022-07-16
Publication date: 2022-12-20
Anticipated expiration: 2032-07-16

Abstract

The utility model provides a semiconductor refrigerating device, which comprises a box body and a semiconductor refrigerating module, wherein the semiconductor refrigerating module comprises a semiconductor refrigerating piece, a cold radiator connected with the refrigerating end face of the semiconductor refrigerating piece and a radiator connected with the heating end face of the semiconductor refrigerating piece; the semiconductor refrigeration module is fixed on the top of the box body, the radiator is positioned on the outer top of the box body, and the cold radiator is positioned on the inner top of the box body; the box is provided with a drainage pipeline, and a water receiving tray is arranged between the lower part of the cold dispersing device and an inlet of the drainage pipeline. The utility model discloses a place the semiconductor refrigeration module in the box top and reduce the whole thickness (or the degree of depth) and the inside temperature of balanced box of product.

Description

Semiconductor refrigerating device

Technical Field

The utility model belongs to the technical field of refrigeration appliance technique and specifically relates to a semiconductor refrigerating device is related to.

Background

In the existing refrigerating devices such as refrigerators and freezers using semiconductor refrigerating sheets, a refrigerating module is usually disposed at the back of a box body, and the thickness (or depth) of the box body is designed to be large to meet the design requirement of storage capacity.

However, for the refrigeration device mainly embedded into the wall, the storage cabinet, the bathroom mirror and other embedded use environments, the refrigeration module is designed in the structure at the back of the box body in the prior art, so that the overall thickness (or depth) of the refrigeration device is large, and the design requirements of embedded use cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. The utility model provides a semiconductor refrigerating plant reduces the whole thickness (or the degree of depth) and the inside temperature of balanced box of product through arranging semiconductor refrigeration module in the box top.

The utility model provides a semiconductor refrigerating device, which comprises a box body and a semiconductor refrigerating module, wherein the semiconductor refrigerating module comprises a semiconductor refrigerating piece, a cold radiator connected with the refrigerating end face of the semiconductor refrigerating piece and a radiator connected with the heating end face of the semiconductor refrigerating piece; the semiconductor refrigeration module is fixed on the top of the box body, the radiator is positioned on the outer top of the box body, and the cold radiator is positioned on the inner top of the box body; a water receiving tray is arranged below the cold diffuser.

In some embodiments, the box body is provided with a drainage pipeline, and the water receiving tray is obliquely arranged from the lower part of the cold radiator towards the inlet of the drainage pipeline.

In some embodiments, the cabinet includes an outer shell, an inner shell, and an insulation layer filled between the outer shell and the inner shell, the drain line is hidden between the outer shell and the inner shell, and an inlet of the drain line is located on an inner sidewall of the cabinet.

In some embodiments, the top of the box body is provided with a mounting opening, a mounting bracket is arranged at the mounting opening, and the semiconductor refrigeration module is fixed in the mounting opening through the mounting bracket.

In some embodiments, a circulating air duct and a cold dissipation fan located in the circulating air duct are arranged at the inner top of the box body, an air inlet and an air outlet are arranged at intervals on the bottom side surface of the circulating air duct, and the cold dissipation fan is located in the circulating air duct.

In some embodiments, the area of the air outlet is not smaller than the area of the air inlet.

In some embodiments, an air duct cover is arranged in the box body, and the air duct cover and the inner top of the box body jointly enclose to form the circulating air duct.

In some embodiments, two opposite inner side walls of the box body are provided with a layer frame groove, two opposite side edges of the air duct cover are provided with assembling flanges, and the assembling flanges are clamped into the layer frame groove, so that the air duct cover is detachably assembled to the inner top of the box body.

In some embodiments, the water-receiving tray is disposed on the air duct cover; the air inlet and the air outlet are positioned on the bottom side surface of the air duct cover and are respectively positioned on two opposite sides of the water receiving tray.

In some embodiments, a probe mounting position is arranged on the bottom side surface of the air duct cover, a temperature probe is fixed on the probe mounting position, and the probe mounting position is close to the air inlet.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model prevents the semiconductor refrigeration module from influencing the whole thickness (or depth) of the box body by arranging the semiconductor refrigeration module at the top of the box body, so that the box body can be designed to have smaller thickness to meet the design requirements of products embedded in embedded use environments such as walls, storage cabinets, bathroom mirrors and the like; meanwhile, the cold air generated by the semiconductor refrigeration module has the sinking physical characteristic, and the top of the box body can sink quickly, so that the temperature of each part in the box body is more balanced, and the refrigeration performance of the product is improved.

Drawings

Fig. 1 is a schematic perspective view of a first embodiment of a semiconductor refrigeration device.

Fig. 2 is a schematic view of the internal structure of the first embodiment of the semiconductor cooling device.

Fig. 3 is a partially enlarged view of fig. 2.

Fig. 4 is a schematic perspective view of a second embodiment of the semiconductor refrigeration apparatus.

Fig. 5 is one of the schematic perspective views of the air duct cover.

Fig. 6 is a second schematic perspective view of the air duct cover.

Fig. 7 is a schematic perspective view of a second embodiment of the semiconductor refrigeration apparatus.

Fig. 8 is a partially enlarged view of fig. 7.

Detailed Description

To further clarify the technical solutions and effects adopted by the present application to achieve the intended purpose, the following detailed description is given with reference to the accompanying drawings and preferred embodiments according to the present application. In the following description, different "one embodiment" or "an embodiment" refers to not necessarily the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The utility model discloses a semiconductor refrigerating plant, concrete product mainly are refrigerator and various freezer. The utility model discloses a arrange semiconductor refrigeration module in box top, can reduce the whole thickness (or the degree of depth) of product, can enough satisfy the product and imbed the design requirement under the embedded service environment such as wall, locker, bathroom mirror, adopt the design of semiconductor refrigeration module overhead can also more effectively guarantee that the box internal temperature is balanced simultaneously, be favorable to improving refrigeration performance.

First embodiment

As shown in fig. 1 to 3, the semiconductor refrigeration device includes a box body 1 and a semiconductor refrigeration module 3, wherein a door body 2 is arranged on one side surface of the box body 1; the semiconductor refrigeration module 3 comprises a semiconductor refrigeration piece 31, a radiator 32 connected with the refrigeration end face of the semiconductor refrigeration piece 31 and a radiator connected with the heating end face of the semiconductor refrigeration piece 31 (the radiator comprises a radiating fin 33 or/and a radiating fan 34 additionally arranged on the radiating fin 33); the semiconductor refrigeration module 3 is fixed on the top of the box body 1, the radiator is positioned on the outer top of the box body 1, and the cold radiator 32 is positioned on the inner top of the box body 1.

By fixing the semiconductor refrigeration module 3 on the top of the box body 1, at least two beneficial technical effects are achieved as follows: firstly, the semiconductor refrigeration module 3 does not affect the overall thickness of the box body 1, so that the box body 1 can be designed to have smaller thickness (or depth) and meet the design requirements of being embedded into embedded service environments such as walls, storage cabinets, bathroom mirrors and the like; secondly, the cold air generated by the cold radiator 32 has the physical characteristic of sinking, and sinks downwards from the top of the box body 1, so that the temperature of each part in the box body 1 is more balanced, and the refrigerating performance of the product is improved.

Since the cold spreader 32 is located at the inner top of the case 1, condensed water is easily generated during use. In order to prevent the condensed water from falling down onto the refrigerated goods stored in the box body 1, the present embodiment is further modified as follows: a water receiving tray 4 is arranged below the cold diffuser 32. Specifically, the box body 1 is provided with a drainage pipeline 13, a water receiving tray 4 is arranged between the lower part of the cold diffuser 32 and an inlet of the drainage pipeline 13, so that condensed water generated by the cold diffuser 32 is received by the water receiving tray 4, and then the condensed water is guided to the drainage pipeline 13 by the water receiving tray 4 to be discharged, so that no condensed water exists on refrigerated articles, and the use experience of a user is improved.

The water pan 4 is disposed obliquely from below the diffuser 32 toward the inlet of the drain line 13. The water receiving tray 4 inclined to the inclined plane is used for improving the water guiding capacity, so that the water receiving tray 4 can be used for guiding the condensed water to the drainage pipeline 13 to be drained away quickly, and the phenomenon that the condensed water collected by the water receiving tray 4 overflows and falls down onto the refrigerated goods in the box body 1 due to excessive amount of the condensed water is avoided.

As is well known, in order to improve the refrigerating performance of the cabinet 1, the cabinet 1 includes an outer shell 11, an inner shell 12, and an insulation layer filled between the outer shell 11 and the inner shell 12. The drain line 13 is hidden between the outer shell 11 and the inner shell 12, the inlet of the drain line 13 is located on the inner side wall of the tank 1, and the outlet (i.e. drain outlet) of the drain line 13 is located on the outer side wall or bottom of the tank 1.

The top of the box body 1 is provided with an assembly opening 10, a mounting bracket 30 is arranged at the assembly opening 10, the mounting bracket 30 is normally hidden between the outer shell 11 and the inner shell 12, and the semiconductor refrigeration module 3 is fixed in the assembly opening 10 through the mounting bracket 30. The structure enables the semiconductor refrigeration module 3 to be assembled simply and is convenient for later disassembly and maintenance.

Second embodiment

As shown in connection with fig. 4 to 8. The internal top of the box body 1 is provided with a circulating air duct 100 and a cold air dispersing fan 5 positioned in the circulating air duct 100, the bottom side surface of the circulating air duct 100 is provided with an air inlet 61 and an air outlet 62 at intervals, and the cold air dispersing machine 32 is positioned in the circulating air duct 100. Under the action of the cooling fan 5, the cool air generated by the cooling fan 32 is blown out downwards from the air outlet 62, and the hotter air flow in the box body 1 enters the circulating air duct 100 upwards from the air inlet 61, so that the cool air forms an internal circulation in the box body 1, which is beneficial to further promoting the temperature balance of each part in the box body 1.

The area of the air outlet 62 is not smaller than that of the air inlet 61. For example, the area of the air outlet 62 is 1.2 times or more the area of the air inlet 61. This arrangement makes the cool air in the circulation duct 100 more smoothly blown out from the air outlet 62, and improves the circulation efficiency of the cool air in the cabinet 1 to further improve the overall cooling performance of the product.

An air duct cover 6 is arranged in the box body 1, and the air duct cover 6 and the inner top of the box body 1 jointly enclose to form the circulating air duct 100. Therefore, the air duct cover 6 has a semi-open structure, which simplifies the assembly structure of the product, so that after the semiconductor refrigeration module 3 and the cooling fan 5 are assembled on the box body 1, the air duct cover 6 is assembled to form the circulating air duct 100.

The two inner opposite side walls of the box body 1 are provided with rack grooves 121, the two opposite side edges of the air duct cover 6 are provided with assembling flanges 60, and the assembling flanges 60 are clamped in the rack grooves 121, so that the air duct cover 6 is detachably assembled to the inner top of the box body 1. The assembly structure is simple, and later maintenance and cleaning are convenient.

The water pan 4 is arranged on the air duct cover 6, and the air inlet 61 and the air outlet 62 are located on the bottom side surface of the air duct cover 6 and are respectively located on two opposite sides of the water pan 4. The structure integrates the water pan 4 and the air duct cover 6, and is beneficial to simplifying the integral structure of the product.

The bottom side surface of the air duct cover 6 is provided with a probe mounting position 63, a temperature probe is fixed on the probe mounting position 63, and the probe mounting position 63 is close to the air inlet 61, so that the temperature probe can sense the temperature of air flow flowing back from the air inlet 61 to the circulating air duct 100, and the temperature inside the box body 1 can be detected more accurately.

The centrifugal fan is preferentially adopted as the cooling fan 5, and the cooling fan is directly fixed on the inner top wall of the box body 1, so that the cooling fan has the advantages of large air quantity, easiness in installation, low working noise and the like.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor refrigerating device comprises a box body and a semiconductor refrigerating module, wherein the semiconductor refrigerating module comprises a semiconductor refrigerating sheet, a cold radiator connected with a refrigerating end face of the semiconductor refrigerating sheet and a heat radiator connected with a heating end face of the semiconductor refrigerating sheet; the method is characterized in that:

the semiconductor refrigeration module is fixed on the top of the box body, the radiator is positioned on the outer top of the box body, and the cold radiator is positioned on the inner top of the box body;

a water receiving tray is arranged below the cold diffuser.

2. The semiconductor cooling device according to claim 1, wherein: the box is equipped with the drain line, the water collector from the below of cold ware that looses is towards the slope of drain line's entry sets up.

3. The semiconductor cooling device according to claim 1, wherein: the box body comprises an outer shell, an inner shell and a heat insulation layer filled between the outer shell and the inner shell, the drainage pipeline is hidden between the outer shell and the inner shell, and an inlet of the drainage pipeline is located on the inner side wall of the box body.

4. The semiconductor cooling device according to claim 1, wherein: the semiconductor refrigeration device is characterized in that an assembly opening is formed in the top of the box body, an installation support is arranged at the assembly opening, and the semiconductor refrigeration module is fixed in the assembly opening through the installation support.

5. A semiconductor cooling device according to any one of claims 1 to 4, characterized in that: the air cooler is characterized in that a circulating air duct and a cooling fan located in the circulating air duct are arranged at the inner top of the box body, an air inlet and an air outlet are formed in the bottom side face of the circulating air duct at intervals, and the cooling fan is located in the circulating air duct.

6. The semiconductor refrigeration device according to claim 5, characterized in that: the area of the air outlet is not smaller than that of the air inlet.

7. The semiconductor refrigeration device according to claim 5, characterized in that: an air duct cover is arranged in the box body, and the air duct cover and the inner top of the box body jointly enclose to form the circulating air duct.

8. The semiconductor refrigeration device according to claim 7, characterized in that: the two opposite inner side walls of the box body are respectively provided with a layer frame groove, the two opposite side edges of the air duct cover are provided with an assembly flange, and the assembly flanges are clamped in the layer frame grooves, so that the air duct cover can be detachably assembled to the inner top of the box body.

9. A semiconductor refrigeration device according to claim 7, characterized in that: the water receiving tray is arranged on the air duct cover; the air inlet and the air outlet are positioned on the bottom side surface of the air duct cover and are respectively positioned on two opposite sides of the water receiving tray.

10. The semiconductor cooling device according to claim 9, wherein: the air duct cover is characterized in that a probe mounting position is arranged on the bottom side face of the air duct cover, a temperature probe is fixed on the probe mounting position, and the probe mounting position is close to the air inlet.