CN218050074U - Semiconductor device stitch positioning and bending mechanism - Google Patents
Semiconductor device stitch positioning and bending mechanism Download PDFInfo
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- CN218050074U CN218050074U CN202222341202.5U CN202222341202U CN218050074U CN 218050074 U CN218050074 U CN 218050074U CN 202222341202 U CN202222341202 U CN 202222341202U CN 218050074 U CN218050074 U CN 218050074U
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Abstract
The utility model discloses a semiconductor device stitch location mechanism of bending, it includes: the semiconductor device support comprises a bending head, a platform, a semiconductor device carrying platform, a stitch positioning stop block and an elastic limiting block, wherein a lifting driving device located above the semiconductor device carrying platform is arranged on the support, the bending head is arranged at the bottom of the lifting driving device, a stitch bending forming insert block located below the bending head is arranged on the semiconductor device carrying platform, the stitch positioning stop block is arranged on the semiconductor device carrying platform and located behind the stitch bending forming insert block, grooves corresponding to stitches on the semiconductor device are formed in the top of the stitch positioning stop block at intervals, and the elastic limiting block is arranged between a push plate and the stitch positioning stop block. Semiconductor device stitch location mechanism of bending, to semiconductor device's specification adaptability is good, can utilize the recess on the stitch location dog to carry out the one-to-one location of stitch on the semiconductor device, the easy and simple to handle of bending.
Description
Technical Field
The utility model relates to a semiconductor device produces technical field, especially relates to a semiconductor device stitch location mechanism of bending.
Background
Some semiconductor devices include pins, such as MOS devices, thyristors, etc., and the connection of the lines needs to be performed through the pins.
The pins of the semiconductor device are generally straight, but in order to accommodate the circuit location on a circuit board or other device, the pins of a portion of the semiconductor device need to be bent. Because the types, specifications, pins and the like of semiconductor devices are different, the conventional bending equipment is usually customized for a certain type of device, is difficult to adapt to the bending of pins on semiconductor devices with different specifications, and needs to be improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor device stitch location mechanism of bending can bend the stitch on the semiconductor device of multiple specification, extension application scope.
To achieve the purpose, the utility model adopts the following technical proposal:
a semiconductor device pin positioning and bending mechanism comprises: the semiconductor device loading platform comprises a folding elbow, a platform, a semiconductor device loading platform, a stitch positioning stop block and an elastic limiting block, wherein the semiconductor device loading platform is arranged on the platform, a support positioned in front of or on one side of the semiconductor device loading platform is arranged on the platform, a lifting driving device positioned above the semiconductor device loading platform is arranged on the support, the folding elbow is arranged at the bottom of the lifting driving device, a stitch bending forming insert block positioned below the bending head is arranged on the semiconductor device loading platform, the stitch positioning stop block is arranged on the semiconductor device loading platform and positioned behind the stitch bending forming insert block, grooves which correspond to stitches on the semiconductor device are formed in the top of the stitch positioning stop block at intervals, a transverse moving driving device positioned behind the semiconductor device loading platform is arranged on the platform, a push plate is arranged at the front end of the transverse moving driving device, the elastic limiting block is arranged between the push plate and the stitch positioning stop block, guide pillars horizontally penetrating through the push plate are arranged at the tail of the elastic limiting block, and elastic pieces positioned between the push plate and the elastic limiting block are arranged on the guide pillars.
Wherein, the lifting driving device and the transverse moving driving device respectively adopt cylinders.
Wherein, the elastic component adopts spring or elastic rubber cover.
The platform is provided with a sliding rail located below the push plate, and the sliding rail is provided with a sliding block connected with the bottom of the push plate.
Wherein the width of the groove corresponds to the width of the pin.
When the semiconductor device is placed on the semiconductor device carrier and is attached to the pin positioning stop block, the front end of the pin penetrates through the groove and extends to the pin bending forming insert block.
The bottom of the pin positioning stop block is provided with an insertion block extending downwards, the semiconductor device carrying platform is provided with a slot corresponding to the insertion block, and the side face of the semiconductor device carrying platform is provided with a first screw connected with the insertion block.
And a threaded hole corresponding to the first screw is formed in the side surface of the insertion block.
The tail end of the guide post is provided with a blocking piece positioned behind the push plate, and the blocking piece is provided with a second screw connected with the guide post.
The utility model has the advantages that: the utility model provides a semiconductor device stitch location mechanism of bending, it is spacing to carry out semiconductor device's front end through stitch location dog, and it is spacing to carry out semiconductor device's rear end elasticity through the elasticity stopper, with the specification adaptability to semiconductor device that promotes, simultaneously, utilize recess on the stitch location dog to carry out the one-to-one location of stitch on the semiconductor device, thereby realize semiconductor device's side direction location, stitch location dog can be changed, with the semiconductor device of the different stitch quantity of adaptation, utilize the cooperation that pushes down of book elbow and stitch shaping of bending insert at last, realize bending of stitch, the operation is simple and convenient, and wide application range.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic view of the structure of fig. 1 when the bending head is pressed down.
Detailed Description
The technical solution of the present invention is further described with reference to fig. 1 to 2 by specific examples.
The semiconductor device pin positioning and bending mechanism shown in fig. 1 and 2 comprises: the bending head 12, the platform 1, the semiconductor device carrier 21, the pin positioning stop block 16 and the elastic limit block 19, wherein the semiconductor device carrier 21 is arranged on the platform 1 and can be fixed through bolts, and the structure is stable.
The platform 1 is provided with a support 13 positioned in front of or on one side of the semiconductor device carrier 21, the support 13 is provided with a lifting drive device 4 positioned above the semiconductor device carrier 21, the bending head 12 is arranged at the bottom of the lifting drive device 4, and the lifting drive device 4 drives the bending head 12 to lift.
The semiconductor device carrying platform 21 is provided with a pin bending forming insert 10 positioned below the bending head 12, when the bending head 12 descends, the pin is bent by matching with the pin bending forming insert 10, and the bending head 12 and the pin bending forming insert 10 can be replaced to adapt to the bending requirements of different semiconductor device pins.
The pin positioning stop 16 is arranged on the semiconductor device carrier 21 and positioned behind the pin bending forming insert 10 to limit the front end of the semiconductor device 5. In this embodiment, the top of the pin positioning stopper 16 is provided with a groove 7 at intervals, which corresponds to the pins 11 on the semiconductor device 5 one by one, so as to perform the one-to-one positioning of the pins 11, the width of the groove 7 corresponds to the width of the pins 11, and the inclination of the pins 11 is corrected, so as to ensure the parallel extension of the pins 11.
In order to perform accurate positioning and avoid positioning of a wrong semiconductor device, it is necessary to design the pin positioning stoppers 16 corresponding to the semiconductor devices one to one, and to adapt to the semiconductor devices 5 with different pins by replacing the pin positioning stoppers 16. In this embodiment, the bottom of the pin positioning stopper 16 is provided with a plug 9 extending downward, and the semiconductor device stage 21 is provided with a slot corresponding to the plug 9 to position the plug 9.
In addition, the side surface of the semiconductor device carrying platform 21 is provided with a first screw 15 connected with the insertion block 9, the side surface of the insertion block 9 is provided with a threaded hole 8 corresponding to the first screw 15, the insertion block 9 is locked, and the structure is firm and the disassembly and assembly are convenient.
The platform 1 is provided with a transverse moving driving device 3 positioned behind a semiconductor device carrying platform 21, the front end of the transverse moving driving device 3 is provided with a push plate 6, in the embodiment, the lifting driving device 4 and the transverse moving driving device 3 respectively adopt air cylinders, can be controlled by a PLC controller to stretch, and can move the push plate 6 back and forth through the transverse moving driving device 3.
In order to improve the stability of the forward and backward movement of the push plate 6, in this embodiment, the platform 1 is provided with a slide rail 2 located below the push plate 6, and the slide rail 2 is provided with a slide block 14 connected with the bottom of the push plate 6 to support the push plate 6 in a sliding manner.
As shown in fig. 1, the elastic limiting block 19 is disposed between the push plate 6 and the pin positioning stopper 16, a guide post 20 horizontally penetrating through the push plate 6 is disposed at the tail of the elastic limiting block 19, in this embodiment, a blocking plate 17 located behind the push plate 6 is disposed at the tail end of the guide post 20, and a second screw 18 connected to the guide post 20 is disposed on the blocking plate 17 to fix the blocking plate 17. When the push plate 6 moves backwards, the guide post 20 and the elastic limiting block 19 are dragged to move backwards through the blocking piece 17, so that the semiconductor device 5 can be conveniently loaded and unloaded.
As shown in fig. 2, in order to limit the rear end of the semiconductor device 5, an elastic member 22 is disposed on the guide post 20 and located between the push plate 6 and the elastic limit block 19, in this embodiment, the elastic member 22 is a spring or an elastic rubber sleeve, and when the push plate 6 moves forward, the elastic member 22 pushes the guide post 20 and the elastic limit block 19 to move forward, so as to perform elastic limit on the rear end of the semiconductor device 5, thereby improving the specification adaptability of the semiconductor device 5.
As shown in fig. 2, when the semiconductor device 5 is placed on the semiconductor device carrier 21 and is abutted against the pin positioning stopper 16, the front end of the pin 11 penetrates through the groove 7 and extends to the pin bending forming insert 10, at this time, the bending head 12 descends and is matched with the pin bending forming insert 10 to rapidly bend the pin, after the bending is completed, the bending head 12 moves upwards, the traverse driving device 3 drives the push plate 6 to retreat and reset, and the semiconductor device 5 is blanked, so that the operation is simple and convenient.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (9)
1. The utility model provides a semiconductor device stitch location mechanism of bending for the location and the bending of stitch on the semiconductor device, its characterized in that includes: the semiconductor device loading platform comprises a folding elbow, a platform, a semiconductor device loading platform, a stitch positioning stop block and an elastic limiting block, wherein the semiconductor device loading platform is arranged on the platform, a support positioned in front of or on one side of the semiconductor device loading platform is arranged on the platform, a lifting driving device positioned above the semiconductor device loading platform is arranged on the support, the folding elbow is arranged at the bottom of the lifting driving device, a stitch bending forming insert block positioned below the bending head is arranged on the semiconductor device loading platform, the stitch positioning stop block is arranged on the semiconductor device loading platform and positioned behind the stitch bending forming insert block, grooves which correspond to stitches on the semiconductor device are formed in the top of the stitch positioning stop block at intervals, a transverse moving driving device positioned behind the semiconductor device loading platform is arranged on the platform, a push plate is arranged at the front end of the transverse moving driving device, the elastic limiting block is arranged between the push plate and the stitch positioning stop block, guide pillars horizontally penetrating through the push plate are arranged at the tail of the elastic limiting block, and elastic pieces positioned between the push plate and the elastic limiting block are arranged on the guide pillars.
2. The semiconductor device pin positioning and bending mechanism as claimed in claim 1, wherein the lifting driving means and the traverse driving means are respectively air cylinders.
3. The semiconductor device pin positioning and bending mechanism as claimed in claim 1, wherein the elastic member is a spring or an elastic rubber sleeve.
4. The semiconductor device pin positioning and bending mechanism according to claim 1, wherein a slide rail is disposed on the platform and below the push plate, and a slider connected to a bottom of the push plate is disposed on the slide rail.
5. The semiconductor device pin positioning and bending mechanism as claimed in claim 1, wherein the width of the groove corresponds to the width of the pin.
6. The semiconductor device pin positioning and bending mechanism according to claim 1, wherein when the semiconductor device is placed on the semiconductor device carrier and abuts against the pin positioning stopper, the front end of the pin passes through the groove and extends to the pin bending forming insert.
7. The semiconductor device pin positioning and bending mechanism according to claim 1, wherein an insertion block extending downward is disposed at a bottom of the pin positioning stop block, a slot corresponding to the insertion block is disposed on the semiconductor device carrier, and a first screw connected to the insertion block is disposed on a side surface of the semiconductor device carrier.
8. The semiconductor device pin positioning and bending mechanism as claimed in claim 7, wherein a threaded hole corresponding to the first screw is formed in a side surface of the insertion block.
9. The semiconductor device pin positioning and bending mechanism as claimed in claim 1, wherein a stop piece is disposed at the rear of the pushing plate at the tail end of the guide post, and a second screw connected to the guide post is disposed on the stop piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222341202.5U CN218050074U (en) | 2022-09-04 | 2022-09-04 | Semiconductor device stitch positioning and bending mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222341202.5U CN218050074U (en) | 2022-09-04 | 2022-09-04 | Semiconductor device stitch positioning and bending mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218050074U true CN218050074U (en) | 2022-12-16 |
Family
ID=84409128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222341202.5U Active CN218050074U (en) | 2022-09-04 | 2022-09-04 | Semiconductor device stitch positioning and bending mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218050074U (en) |
-
2022
- 2022-09-04 CN CN202222341202.5U patent/CN218050074U/en active Active
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