CN218039258U - Dampproofing LED structure - Google Patents
Dampproofing LED structure Download PDFInfo
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- CN218039258U CN218039258U CN202221746157.5U CN202221746157U CN218039258U CN 218039258 U CN218039258 U CN 218039258U CN 202221746157 U CN202221746157 U CN 202221746157U CN 218039258 U CN218039258 U CN 218039258U
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- Prior art keywords
- support
- injection molding
- bracket
- pin
- led structure
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- 238000001746 injection moulding Methods 0.000 claims abstract description 57
- 239000003292 glue Substances 0.000 claims abstract description 29
- 239000007787 solid Substances 0.000 claims abstract description 7
- 239000013078 crystal Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920006119 nylon 10T Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 241001465382 Physalis alkekengi Species 0.000 abstract description 2
- 230000008595 infiltration Effects 0.000 abstract description 2
- 238000001764 infiltration Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
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Abstract
The utility model discloses a damp-proof LED structure, which is provided with a bracket pin, an injection molding shell, a solid crystal area and a light-emitting lens; the surface of the support pin is provided with a glue fixing combination area, the injection molding shell is used for wrapping the support pin, a wiring pin is formed outside the injection molding shell extending from the lower part of the support pin, the glue fixing combination area is used for being bonded with the injection molding shell, an open cavity is formed above the support pin by the injection molding shell, a crystal fixing area is arranged in the cavity and used for fixing an LED chip, and the light emitting lens is arranged above the crystal fixing area and used for transmitting light rays emitted by the LED chip outwards; the dampproof LED structure provided by the embodiment of the utility model improves the bonding stability and the sealing performance of the bracket and the injection molding shell by arranging the glue fixing and combining area on the surface of the bracket pin; the technical problem of LED lamps and lanterns damage that LED structure sealing effect is poor, the easy infiltration leads to among the correlation technique is solved, a dampproofing LED structure that dampproofing effect is good, stability is high is provided.
Description
Technical Field
The utility model belongs to the technical field of the LED technique and specifically relates to a dampproofing LED structure is related to.
Background
The LED light source is used as an important device of a display screen and a lighting appliance which are commonly used, and is applied to various scenes requiring display screen advertisement and lighting. In the related art, the light source of the outdoor LED lamp generally wraps the LED chip in the injection molding housing. However, the injection molding casing cannot be well bonded and sealed with the support of the LED chip during injection molding, so that water seepage is likely to occur when the injection molding casing is applied in outdoor high-temperature and humid environments, the light source of the LED lamp is damaged, and the use stability of the injection molding casing is not high.
Therefore, it is a difficult problem for those skilled in the art to overcome the above-mentioned technical problem of damage to the LED lamp caused by water seepage when the LED lamp is applied in a high temperature and humid environment.
SUMMERY OF THE UTILITY MODEL
The present invention aims to solve at least one of the technical problems existing in the related art. Therefore, the utility model provides a dampproofing LED structure that humidity resistance is good, stability is high.
In a first aspect, an embodiment of the present invention provides a moisture-proof LED structure, which includes
The surface of the support pin is provided with an injection molding glue fixing combination area;
the injection molding shell is used for wrapping the support pins, the injection molding shell extends out of the lower portions of the support pins to form wiring pins, and the injection molding glue fixing combination area is used for being bonded with the injection molding shell; the injection molding shell forms an open cavity above the support pins;
the solid crystal area is arranged in the cavity and used for fixing the LED chip;
and the light-emitting lens is arranged above the die bonding area and is used for transmitting light rays emitted by the LED chip.
The utility model discloses dampproofing LED structure has following beneficial effect at least:
the embodiment of the utility model provides a dampproofing LED structure, be provided with support pin, injection moulding casing, solid brilliant district and light-emitting lens; the LED chip fixing device comprises a support pin, an injection molding and glue fixing combination area, an injection molding shell, a plastic injection shell, a die fixing area, an LED chip and a light emitting lens, wherein the surface of the support pin is provided with the injection molding and glue fixing combination area; the utility model provides a dampproofing LED structure, through set up the solid gluey bonding region of moulding plastics on the surface of support pin, improve support and the stability and the leakproofness of moulding plastics casing bonding; the technical problems that in the related art, an LED lamp is damaged due to the fact that the LED structure is poor in sealing effect and prone to water seepage are solved, and the moisture-proof LED structure is good in moisture-proof effect and high in stability.
According to the utility model discloses dampproofing LED structure of other embodiments, it glues the combination region including a plurality of pits that are the array and arrange to mould plastics admittedly.
According to other embodiments of the present invention, the moisture-proof LED structure comprises a first LED chip, a second LED chip, and a third LED chip; the bracket pin includes:
a first support pin as a wiring pin of the first LED chip; the first support pin comprises a first left support and a first right support, and the first left support and the first right support are arranged oppositely;
the second support pin is used as a wiring pin of the second LED chip; the second bracket pin comprises a second left bracket and a second right bracket, and the second left bracket and the second right bracket are oppositely arranged;
and the third support pin is used as a wiring pin of a third LED chip and comprises a third left support and a third right support, and the third left support and the third right support are arranged oppositely.
According to the utility model discloses dampproofing LED structure of other embodiments, first left side support first right side support the second left side support the second right side support the third left side support with the top horizontal part of third right side support with it all is provided with to mould plastics casing connected region mould plastics admittedly glue and combine the region.
According to the utility model discloses dampproofing LED structure of other embodiments, first left side support first right side support second left side support second right side support third left side support with all be provided with solid gluey connecting hole on the third right side support.
According to the utility model discloses dampproofing LED structure of other embodiments, the connecting lead of LED chip is the upwards prominent gold thread.
According to the utility model discloses dampproofing LED structure of other embodiments, the light-emitting lens is glued by the lens and is glued the point and form.
According to the utility model discloses dampproofing LED structure of other embodiments, the material of the casing of moulding plastics is plastic PA10T material.
According to the utility model discloses dampproofing LED structure of other embodiments, the top of the casing of moulding plastics is provided with a ring groove.
Drawings
FIG. 1 is a cross-sectional view of one embodiment of a moisture-resistant LED structure that utilizes a novel embodiment of the present invention;
fig. 2 is a schematic diagram of a support pin stamping structure when 3 LED chips are arranged in a moisture-proof LED structure according to the present invention;
fig. 3 is a schematic diagram of a pin structure of a bottom bracket of a moisture-proof LED structure according to an embodiment of the present invention.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the description of the embodiments of the present invention, if "a number" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "greater than", "lower" or "inner" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
Referring to fig. 1, an embodiment of the present invention provides a moisture-proof LED structure, which includes a support pin 100, an injection molding housing 200, an LED chip 300, a die attach area 400, and a light exit lens 500; the surface of the support pin 100 is provided with an injection molding glue fixing combination area 101, the injection molding glue fixing combination area 101 is used for being bonded with an injection molding shell 200, the injection molding shell 200 is used for wrapping the support pin 100, the support pin 100 extends out of the injection molding shell 200 from the lower side to form a wiring pin 103, and the injection molding shell 200 forms an open cavity 600 above the support pin 100. In this embodiment, the die attach region 400 is disposed above the support 100, the LED chip 300 is fixed in the die attach region 400, the light-emitting lens 500 is disposed above the die attach region 400, the light-emitting lens 500 covers the cavity 600, and the light-emitting lens 500 is used for transmitting light emitted by the LED chip 300. In this embodiment, the connection pins 103 formed by bending the injection molding housing 200 extend from the lower portion of the support pin 100 to serve as positive and negative terminals of the LED chip 300, wherein the support pin 100 is composed of sub-supports disposed on the left and right sides, and the lead 301 of the LED chip 300 is used for connecting the sub-supports on the left and right sides of the support pin 100 to form a circuit loop. The utility model provides a dampproofing LED structure, through set up the solid gluey bonding region of moulding plastics on the surface of support pin, improve support and the stability and the leakproofness of moulding plastics casing bonding; the technical problem of LED lamps and lanterns damage that LED structure sealing effect is poor, the easy infiltration leads to among the correlation technique is solved.
Referring to fig. 1, in some embodiments, in order to effectively bond and connect the plastic of the injection molding housing 200 on the inner side and the outer side of the support pin 100 during injection molding, glue fixing connection holes 102 are disposed on both the left side and the right side of the support pin 100. The glue fixing connection holes 102 are formed in the vertical area of the support pin 100 and used for connecting the plastic on the inner side and the outer side of the support pin 100 during injection molding.
Referring to fig. 2, in some embodiments, the injection molding glue fixing bonding area includes a plurality of recesses 101 arranged in an array. In this embodiment, a plurality of pits 101 arranged in an array are disposed on the surface of the support pin 100, and when injection molding is performed, the injection molding housing 200 can be bonded to the support 100 more firmly, so as to prevent the LED chip 300 or other electronic devices and electronic circuits inside the injection molding housing 200 from being damaged due to the loose joint between the injection molding housing 200 and the support pin 100 in a humid environment.
In combination with fig. 2 and 3, in some embodiments, in order to realize the diversity of LED lights, referring to fig. 2, there are provided a first LED chip 300, a second LED chip 310, and a third chip 320, which emit red, green, and blue light, respectively. In this embodiment, in order to adapt to the mounting connection of 3 LED chips 300, a first lead frame pin 100, a second frame pin 110, and a third frame pin 120 are provided, and a die attach area 400 is disposed in a central region of a platform formed by the first lead frame pin 100, the second frame pin 110, and the third frame pin 120. In this embodiment, the first support pin 100 includes a first left support and a first right support, the first left support and the first right support are disposed opposite to each other, the injection molding casing 200 extends from the lower portions of the first left support and the first right support, and then the connection terminals 103 (see fig. 3) are respectively bent from the bottom of the injection molding casing 200, and the 2 connection terminals 103 are respectively used as positive and negative pins of the first LED chip 300. The second support pins 110 include a second left support and a second right support, the second left support and the second right support are arranged oppositely, the injection molding casing 200 extends from the lower portion of the second left support and the lower portion of the second right support, the connection terminals 113 (refer to fig. 3) are respectively formed at the bottom of the injection molding casing 200 in a bending manner, and the 2 connection terminals 113 are respectively used as positive and negative pins of the second LED chip 310. The third support pins 120 include a third left support and a third right support, the third left support and the third right support are arranged oppositely, the injection molding casing 200 extends from the lower portion of the third left support and the lower portion of the third right support, the connecting terminals 123 (refer to fig. 3) are respectively formed at the bottom of the injection molding casing 200 in a bending manner, and the 2 connecting terminals 123 are respectively used as positive and negative pins of the third LED chip 320.
Referring to fig. 2, in some embodiments, the surfaces of the first left side bracket, the first right side bracket, the second left side bracket, the second right side bracket, the third left side bracket and the third right side bracket are respectively provided with an injection molding glue fixing bonding area 101, an injection molding glue fixing bonding area 111 and an injection molding glue fixing bonding area 121, and each injection molding glue fixing bonding area is set to be an ordered pit on the surface of the bracket respectively, so that each bracket is more tightly bonded with the injection molding shell during injection molding. It will be apparent that in some embodiments, the injection molded glue bond areas are provided on the surface of each bracket that contacts the injection molded housing 200. In addition, in some embodiments, the first left side bracket, the first right side bracket, the second left side bracket, the second right side bracket, the third left side bracket and the third right side bracket are all provided with glue fixing connecting holes on the left side and the right side for realizing effective connection of plastics on the inner side and the outer side.
Referring to fig. 1, in some embodiments, the connecting lead of the LED chip 300 is an upward protruding gold wire 301, the connecting lead 103 bent and formed after the bracket pins 100 extend out of the injection-molded housing 200 is arranged below the left side of the bracket, and serves as the positive electrode/negative electrode of the LED chip, and the connecting lead 103 bent and formed after the bracket pins 100 extend out of the injection-molded housing 200 is arranged below the right side of the bracket. In this embodiment, the connecting lead of the LED chip 300 is set to be the gold wire 301 protruding upward, so that the colloid below the gold wire 301 is minimized, the force generated by heating in the subsequent production process is small, the influence on the gold wire 301 is small, the stability of the gold wire 301 is high, namely, the stability of the moisture-proof LED structure is high.
Referring to fig. 2, correspondingly, in some embodiments, when the first chip 300, the second chip 310 and the third chip 320 are provided, gold wires for connecting the second chip 310 and the third chip 320 are provided as upward protruding gold wires for connecting the corresponding two-sided brackets. A first left bracket and a first right bracket of the first bracket pin 100 are respectively used as wiring pins at two ends of the first LED chip 300; the second left side bracket and the second right side bracket of the second bracket pin 110 serve as wiring pins at two ends of the second LED chip 310, and the third left side bracket and the third right side bracket of the third bracket pin 120 serve as wiring pins at two ends of the third LED chip 320.
Referring to fig. 1, in some embodiments, the top of the injection-molded housing 200 is provided with a circular groove 210, and the circular groove 210 enables the circular groove 210 to function as an isolation water tank when the moisture-proof LED structure of the embodiment of the present invention is used in a humid environment by providing the circular groove 210. In addition, in some embodiments, light-emitting lens 500 has the lens to glue the point and forms, glues through some lens in this embodiment and forms light-emitting lens 500 not only can make light-emitting lens 500 better with the adhesion of the casing of moulding plastics, dampproofing effect is more stable, glues through some lens and forms light-emitting lens 500 moreover and has saved the utility model discloses the production manufacturing cost of dampproofing LED structure.
To sum up, the embodiment of the utility model provides a dampproofing LED structure has solved the technical problem that relevant technology LED structure moisture resistance is poor, stability is not high and manufacturing cost is high, provides a dampproofing LED structure that moisture resistance is good, stability is high and manufacturing cost is low.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (9)
1. A moisture-proof LED structure is characterized by comprising
The surface of the support pin is provided with an injection molding glue fixing combination area;
the injection molding shell is used for wrapping the support pins, the injection molding shell extends out of the lower portions of the support pins to form wiring pins, and the injection molding glue fixing combination area is used for being bonded with the injection molding shell; the injection molding shell forms an open cavity above the support pins;
the solid crystal area is arranged in the cavity and used for fixing the LED chip;
and the light-emitting lens is arranged above the die bonding area and is used for transmitting light rays emitted by the LED chip.
2. The moisture resistant LED structure of claim 1, wherein the injection molded glue bond area comprises a plurality of dimples arranged in an array.
3. The moisture resistant LED structure of claim 1 or 2, wherein the LED chips comprise a first LED chip, a second LED chip, and a third LED chip; the bracket pin includes:
a first support pin as a wiring pin of the first LED chip; the first support pin comprises a first left support and a first right support, and the first left support and the first right support are arranged oppositely;
the second support pin is used as a wiring pin of the second LED chip; the second bracket pin comprises a second left bracket and a second right bracket, and the second left bracket and the second right bracket are oppositely arranged;
and the third support pin is used as a wiring pin of a third LED chip and comprises a third left support and a third right support, and the third left support and the third right support are arranged oppositely.
4. The moisture-proof LED structure according to claim 3, wherein the injection molding glue fixation combination area is arranged on the upper horizontal part of the first left side bracket, the first right side bracket, the second left side bracket, the second right side bracket, the third left side bracket and the third right side bracket and the injection molding shell connection area.
5. The moisture-proof LED structure according to claim 4, wherein glue fixing connection holes are formed in the first left side support, the first right side support, the second left side support, the second right side support, the third left side support and the third right side support.
6. The moisture-resistant LED structure of claim 5, wherein the connecting leads of the LED chip are upwardly protruding gold wires.
7. The moisture resistant LED structure of any one of claims 1, 2, 4 or 6, wherein the light exit lens is formed by lens glue dispensing.
8. The moisture-proof LED structure according to claim 7, wherein the injection-molded housing is made of a plastic PA10T material.
9. The moisture resistant LED structure of claim 1, wherein the top of the injection molded housing is provided with an annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221746157.5U CN218039258U (en) | 2022-07-06 | 2022-07-06 | Dampproofing LED structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221746157.5U CN218039258U (en) | 2022-07-06 | 2022-07-06 | Dampproofing LED structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218039258U true CN218039258U (en) | 2022-12-13 |
Family
ID=84379596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221746157.5U Active CN218039258U (en) | 2022-07-06 | 2022-07-06 | Dampproofing LED structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218039258U (en) |
-
2022
- 2022-07-06 CN CN202221746157.5U patent/CN218039258U/en active Active
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