CN218037451U

CN218037451U - High-speed optical transceiver module device

Info

Publication number: CN218037451U
Application number: CN202220993713.2U
Authority: CN
Inventors: 彭峰; 李林科; 吴天书; 杨现文; 张健
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2022-04-27
Filing date: 2022-04-27
Publication date: 2022-12-13
Anticipated expiration: 2032-04-27

Abstract

The utility model relates to the technical field of optical communication, and provides a high-speed optical transceiver module device, which comprises a base and an upper cover covered on the base, wherein the part of the base close to an optical port is an optical port part, a plurality of mounting holes for inserting optical transceiver device interfaces are arranged on the vertical wall of the optical port part, and a conductive gasket is arranged on the vertical wall; the device also comprises a conductive strip for eliminating a gap between the upper cover and the base, wherein the conductive strip is arranged at the edge of the surface of the upper cover facing the base. The utility model has good electromagnetic shielding effect through the matching of the conductive gasket and the conductive bar; through the radiator, a good radiating effect can be achieved, and heat on the base can be taken away quickly.

Description

High-speed optical transceiver module device

Technical Field

The utility model relates to an optical communication technical field specifically is a high speed light transceiver module device for the product solution of high density, high speed that optical communication, data center and network market use and design.

Background

According to the provision of the multisource agreement of the optical transceiver module, the optical communication module has the characteristic of hot plug, namely, the module can be connected with or disconnected from equipment under the condition of not switching off a power supply. Since the optical communication module is usually required to be inserted and pulled when in use, the module is usually required to be provided with an unlocking device, so that the module can be smoothly separated from the installation cage of the equipment. When the optical module is inserted into an installation cage of the equipment, the optical module is locked by mutual contact between structural steps on two sides of the optical module and a cage locking plate, so that the module is fixed in the cage to work, when the module needs to be pulled out outwards, a spring locking plate on the cage is jacked up by an unlocking part of an optical module pull ring, so that the optical module is unlocked, the module can be pulled out outwards at the moment, and finally the hot plug function of the optical module is realized. Therefore, the optical module needs to be structurally designed with an unlocking device to realize the function.

With the increasing transmission rate of optical modules, the optical transceiver module with high transmission rate is particularly easy to generate overproof electromagnetic radiation. The effective method for solving the electromagnetic radiation is to carry out electromagnetic shielding on the shell structure of the product. Electromagnetic shielding is to reduce interference or damage caused by electromagnetic waves by using the attenuation effect of a shielding body on the electromagnetic waves. For the electromagnetic shielding of conductor materials, the best effect is achieved by using an integral metal shell, but in practical application, due to the problems of assembly requirements and processing precision, gaps inevitably occur between a module base and an outer cover and between an optical device interface and the base, so that the electromagnetic shielding effect of the whole optical module shell is greatly influenced. Therefore, in order to improve the electromagnetic shielding performance of the optical module housing structure, it is necessary to eliminate or reduce holes and gaps from the inside to the outside of the module as much as possible in design.

The total power consumption of the high-speed optical transceiver module can exceed 15W at most, which causes the temperature of the optical module to rise very high, and therefore, the heat dissipation problem needs to be considered particularly in the structure of the optical module housing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high rate light transceiver module device can solve the partial defect among the prior art at least.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: a high-speed optical transceiver module device comprises a base and an upper cover covered on the base, wherein the part of the base close to an optical port is an optical port part, a plurality of mounting holes for inserting optical transceiver device interfaces are formed in the vertical wall of the optical port part, and a conductive gasket is arranged on the vertical wall; the device also comprises a conductive strip for eliminating a gap between the upper cover and the base, wherein the conductive strip is arranged at the edge of the surface of the upper cover facing the base.

Further, the conducting bar is arranged on the edge of the upper cover in a surrounding mode.

Furthermore, the optical transceiver further comprises fixture blocks used for fixing the optical transceiver on the base, and the fixture blocks are clamped on the base.

Further, the conducting gasket is clamped between the vertical wall and the clamping block.

Furthermore, a radiator is arranged on the surface of the base, which deviates from the upper cover.

Furthermore, the radiator comprises a block-shaped radiating main flat plate and a plurality of radiating teeth arranged on the surface of the radiating main flat plate, the radiating teeth are sequentially arranged along the same direction, each radiating tooth extends along the length direction of the radiating main flat plate, and a radiating channel is formed between every two adjacent radiating teeth.

Furthermore, a back groove is formed in the surface, deviating from the upper cover, of the base, and the radiator is clamped into the back groove.

Furthermore, the surface of the block-shaped heat dissipation main flat plate, which is positioned at the inlet or the outlet of the heat dissipation channel, is a guide inclined surface, and the guide inclined surface is matched with the groove wall of the back groove.

Further, still including the pull ring that is used for the unblock, the pull ring includes the handle and locates panel beating arm on the handle, be equipped with the pothook that is used for accepting spring force on the panel beating arm, still be equipped with a spacing arch on the panel beating arm, the release set bar is established to afterbody on the panel beating arm.

Furthermore, the upper cover is provided with two protruding enclosing barriers which can be enclosed with the base to form a space for the pull ring to be installed, and the two protruding enclosing barriers are respectively arranged on two sides of the upper cover.

Compared with the prior art, the beneficial effects of the utility model are that: the conductive gasket is matched with the conductive strip, so that a good electromagnetic shielding effect can be achieved; through the radiator, a good radiating effect can be achieved, and heat on the base can be taken away quickly.

Drawings

Fig. 1 is an exploded view of a high-speed optical transceiver module assembly according to an embodiment of the present invention;

fig. 2 is a combination diagram of a high-speed optical transceiver module device according to an embodiment of the present invention;

fig. 3 is an assembly diagram of a pull ring and a base of a high-speed optical transceiver module apparatus according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a base of a high-speed optical transceiver module apparatus according to an embodiment of the present invention;

fig. 5 is a schematic view of a first viewing angle of an upper cover of a high-speed optical transceiver module device according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a second view angle of an upper cover of a high-speed optical transceiver module device according to an embodiment of the present invention;

fig. 7 is a schematic view of a pull ring of a high-rate optical transceiver module apparatus according to an embodiment of the present invention;

fig. 8 is a schematic diagram of a fixture block of a high-speed optical transceiver module apparatus according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a heat sink of a high-speed optical transceiver module device according to an embodiment of the present invention;

in the reference symbols: 1. a base; 1.1, a spring mounting groove; 1.2, a pull ring mounting groove; 1.3, unlocking the groove; 1.4, mounting a PCBA; 1.5, screw holes; 1.6, a fixture block mounting groove; 1.7, mounting holes; 1.8, back grooves; 1.9, vertical walls; 2. PCBA board; 3. an upper cover; 3.1, mounting a hole groove by a screw; 3.2, a label slot; 3.3, protruding enclosing barriers; 3.4, a pull ring limiting groove; 3.5, conducting strips; 3.6, unlocking the movable groove by the pull ring; 4. a screw; 5. a clamping block; 5.1, tool holes; 5.2, U-shaped slotted holes; 5.3, a baffle plate; 6. an optical transceiver interface; 7. a conductive gasket; 8. a pull ring; 8.1, an unlocking bolt; 8.2, limiting bulges; 8.3, a hook; 8.4, a handle; 8.5, a sheet metal arm; 9. a spring; 10. a heat sink; 10.1, a heat dissipation main flat plate; 10.2, radiating teeth; 10.3, a guide inclined plane.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 6, an embodiment of the present invention provides a high-speed optical transceiver module device, which includes a base 1 and an upper cover 3 covering the base 1, where a portion of the base 1 near an optical port is an optical port, a vertical wall 1.9 of the optical port is provided with a plurality of mounting holes 1.7 for inserting an optical transceiver device interface 6, and the vertical wall 1.9 is provided with a conductive gasket 7; the device also comprises a conductive strip 3.5 for eliminating the gap between the upper cover 3 and the base 1, wherein the conductive strip 3.5 is arranged at the edge of the surface of the upper cover 3 facing the base 1. In this embodiment, the conductive gasket 7 and the conductive strip 3.5 can be matched to have a good electromagnetic shielding effect. Specifically, a portion of the chassis 1 near the optical port is defined as an optical port, and a mounting hole 1.7 is formed in a vertical wall 1.9 of the optical port on a side near the PCBA board 2, and the optical transceiver interface 6 can be inserted into the mounting hole 1.7, preferably four optical transceiver interfaces 6, and correspondingly four mounting holes 1.7. The conductive gasket 7 is arranged on the vertical wall 1.9, so that electromagnetic leakage of the light opening part can be prevented. And establish conducting strip 3.5 at the edge of upper cover 3, after upper cover 3 lid closed on base 1, this conducting strip 3.5 can press from both sides between upper cover 3 and base 1, and then can eliminate the clearance between upper cover 3 and the base 1 to inside electromagnetic wave leaks. Preferably, the conductive strip 3.5 is arranged around the edge of the upper cover 3.

In an optimized solution, please refer to fig. 3 and 4, the apparatus further includes a fixture block 5 for fixing each optical transceiver on the base 1, and the fixture block 5 is clamped on the base 1. In this embodiment, the optical transceiver is fixed on the base 1 through the fixture block 5, and the base 1 has a fixture block mounting groove 1.6 for the fixture block 5 to be inserted into. The fixture block 5 is M type, it includes tool hole 5.1, U type slotted hole 5.2 and baffle 5.3, and the light transceiver is blocked in U type slotted hole 5.2, and this U type slotted hole 5.2 is formed by baffle 5.3 and the middle post cooperation on the edge, and tool hole 5.1 conveniently fixes fixture block 5 on vertical wall 1.9. Preferably, the conductive gasket 7 is clamped between the vertical wall 1.9 and the fixture block 5.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 1, fig. 2 and fig. 9, a heat sink 10 is installed on a surface of the base 1 deviating from the upper cover 3. The heat radiator 10 comprises a block-shaped heat radiation main flat plate 10.1 and a plurality of heat radiation teeth 10.2 arranged on the surface of the heat radiation main flat plate 10.1, the heat radiation teeth 10.2 are sequentially arranged along the same direction, each heat radiation tooth 10.2 extends along the length direction of the heat radiation main flat plate 10.1, and a heat radiation channel is formed between every two adjacent heat radiation teeth 10.2. Two adjacent heat dissipation teeth 10.2 are arranged in parallel. The base 1 is provided with a back groove 1.8 on the surface deviating from the upper cover 3, and the heat sink 10 is clamped into the back groove 1.8. The surface of the block-shaped heat dissipation main flat plate 10.1 at the inlet or the outlet of the heat dissipation channel is a guide inclined surface 10.3, and the guide inclined surface 10.3 is matched with the groove wall of the back groove 1.8. In this embodiment, by providing the heat sink 10 on the base 1, a better heat dissipation effect can be achieved compared with the prior art in which the heat dissipation structure is provided on the upper cover 3, because the heat generating devices are all mounted on the base 1, the heat on the base 1 can be directly dissipated through the heat sink 10. The radiator 10 is conveniently arranged in the back groove 1.8 through the designed guide inclined plane 10.3.

As an optimization scheme of the embodiment of the utility model, please refer to fig. 1, fig. 2, fig. 3 and fig. 7, this device is still including the pull ring 8 that is used for the unblock, pull ring 8 includes handle 8.4 and locates the panel beating arm 8.5 on the handle 8.4, be equipped with the pothook 8.3 that is used for accepting spring 9 elasticity on the panel beating arm 8.5, still be equipped with a spacing arch 8.2 on the panel beating arm 8.5, the release cock 8.1 is established to the afterbody on the panel beating arm 8.5. In this embodiment, the pull ring 8 is integrally formed by a soft rubber handle 8.4 and a sheet metal unlocking piece by an encapsulation injection molding process. The middle areas of two sides of the metal plate are respectively provided with a clamping hook 8.3 used for receiving the elastic force of a spring 9, the middle areas of two sides are respectively provided with a limiting bulge 8.2, and the tail part of the pull ring 8 is provided with an unlocking bolt 8.1 capable of realizing the product unlocking function. Preferably, the upper cover 3 is provided with two protruding enclosing barriers 3.3 which can enclose the base 1 to form a space for the pull ring 8 to be installed, and the two protruding enclosing barriers 3.3 are respectively arranged on two sides of the upper cover 3. In this embodiment, the raised enclosure 3.3 may enclose a space for mounting the tab 8 with the base 1.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 1, fig. 2, fig. 3 and fig. 4, the base 1 further includes a spring mounting groove 1.1, a pull ring mounting groove 1.2, an unlocking groove 1.3, a PCBA plate mounting surface 1.4, a screw hole 1.5, etc. In the present embodiment, the upper cover 3 and the base 1 are fixed together by screws 4, which are installed in screw holes 1.5. The front end of the bottom of the base is provided with two spring mounting grooves 1.1 for mounting springs 9, the edge of the spring mounting groove is provided with a pull ring mounting groove 1.2 for mounting a sheet metal arm 8.5 of a pull ring, and the spring mounting groove is also provided with an unlocking groove 1.3 matched with an unlocking bolt 8.1. Within the base 1 there is a PCBA mounting face 1.4 for the PCBA board 2 to rest on.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 1, fig. 2, fig. 5 and fig. 6, the upper cover 3 further includes a screw mounting hole groove 3.1, a label groove 3.2, a pull ring limit 3.4, and a pull ring unlocking movable groove 3.6. In this embodiment, the screw mounting hole groove 3.1 can be matched with the mounting of the screw 4, the label groove 3.2 is provided on the outer surface of the upper cover 3, and the label can be pasted in the label groove 3.2. The pull ring limit 3.4 is respectively arranged on two sides and used for limiting the displacement range of the pull ring 8. And a pull ring unlocking movable groove 3.6 is arranged on the side surface of the upper cover 3 and is used for guiding and sliding the sheet metal arm 8.5.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high-rate optical transceiver module assembly, comprising: the optical transceiver device comprises a base and an upper cover covering the base, wherein the part of the base close to an optical port is an optical port part, a plurality of mounting holes for inserting optical transceiver device interfaces are formed in the vertical wall of the optical port part, and a conductive gasket is arranged on the vertical wall; the device also comprises a conductive strip for eliminating a gap between the upper cover and the base, wherein the conductive strip is arranged at the edge of the surface of the upper cover facing the base.

2. A high-rate optical transceiver module assembly as claimed in claim 1, wherein: the conducting bar is arranged on the edge of the upper cover in a surrounding mode.

3. A high-rate optical transceiver module apparatus as claimed in claim 1, wherein: the optical transceiver further comprises fixture blocks used for fixing the optical transceivers on the base, and the fixture blocks are clamped on the base.

4. A high-rate optical transceiver module apparatus as claimed in claim 3, wherein: the conducting gasket is clamped between the vertical wall and the clamping block.

5. A high-rate optical transceiver module apparatus as claimed in claim 1, wherein: and a radiator is arranged on the surface of the base, which deviates from the upper cover.

6. A high-rate optical transceiver module apparatus as claimed in claim 5, wherein: the radiator comprises a block-shaped radiating main flat plate and a plurality of radiating teeth arranged on the surface of the radiating main flat plate, the radiating teeth are sequentially arranged along the same direction, each radiating tooth extends along the length direction of the radiating main flat plate, and a radiating channel is formed between every two adjacent radiating teeth.

7. A high-rate optical transceiver module apparatus as claimed in claim 6, wherein: the base is provided with a back groove on the surface deviating from the upper cover, and the radiator is clamped into the back groove.

8. A high-rate optical transceiver module apparatus as claimed in claim 7, wherein: the surface of the block-shaped heat dissipation main flat plate, which is positioned at the inlet or the outlet of the heat dissipation channel, is a guide inclined surface, and the guide inclined surface is matched with the groove wall of the back groove.

9. A high-rate optical transceiver module apparatus as claimed in claim 1, wherein: still including the pull ring that is used for the unblock, the pull ring includes the handle and locates panel beating arm on the handle, be equipped with the pothook that is used for accepting spring force on the panel beating arm, still be equipped with a spacing arch on the panel beating arm, the lock plunger is separated to afterbody on the panel beating arm.

10. A high-rate optical transceiver module apparatus as claimed in claim 9, wherein: the upper cover is provided with two protruding enclosing barriers which can be enclosed with the base to form a space for the pull ring to be installed, and the two protruding enclosing barriers are respectively arranged on two sides of the upper cover.