CN218037199U - Heat radiation structure and mainboard testing device - Google Patents

Abstract

The utility model provides a heat dissipation structure and a mainboard testing device, which relates to the technical field of mainboard detection, wherein the heat dissipation structure comprises a heat conducting sheet group, a constant temperature device and a heat conducting pressing block which are arranged in sequence, and a heat conducting indium sheet is arranged below the edge of the heat conducting pressing block, so that high-efficiency heat dissipation is carried out, and the burning probability of a CPU is reduced; the constant temperature device is in communication connection with the temperature control main board and is provided with a temperature sensor, so that the ambient temperature is maintained under a constant temperature condition. The mainboard testing device comprises an upper pressing plate module, a drawer carrier plate module and a middle frame module; the upper pressing plate module is provided with a plurality of radiating assemblies and prepressing blocks; the drawer carrier plate module comprises a main plate carrier plate assembly used for carrying a main plate to be tested and a lower needle plate assembly used for testing, a guide sleeve is arranged on the main plate carrier plate assembly, and a needle plate guide pin corresponding to the guide sleeve is arranged on the lower needle plate assembly. The utility model discloses simple structure can realize the accurate location between heat abstractor and the mainboard CPU, ensures effectually to carry out temperature control.

Description

Heat radiation structure and mainboard testing arrangement

Technical Field

The utility model belongs to the technical field of the mainboard detects, concretely relates to heat radiation structure and mainboard testing arrangement.

Background

During the period of testing the program burned on the main board, the whole program is usually run according to the maximum power of the CPU, so the testing time of a general work station is longer. In the operation process of a mainboard test system for testing mainboard burning, a large amount of heat is often generated due to electric energy consumption, and if heat cannot be dissipated, circuit elements or chips in the system can be burnt out if the heat is not removed in time, so that the system fails. And the CPU works for a long time under a heavy load state, which easily causes the condition that the CPU is slow in processing and even crashes, and greatly influences the use of the computer.

In order to solve the above problems, a heat dissipation device is disposed in a frame of an electronic system, and in the prior art, a CPU of a computer mostly dissipates heat through a heat dissipation fan, thereby removing heat generated during the operation of the electronic system. However, the conventional fan has poor heat dissipation effect and very large heat dissipation power consumption, and the conventional heat dissipation fan has large volume, high noise, poor reliability and limited fan life.

Therefore, it is necessary to provide a motherboard CPU testing apparatus with a thermostatic control function, which not only can realize thermostatic control in the testing process and ensure the testing environment temperature, but also can make the position of the heat dissipation apparatus accurately correspond to the motherboard CPU, and has a better heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

Based on above problem, the utility model aims at the above-mentioned problem provide a heat radiation structure and mainboard testing arrangement.

In order to achieve the above object, the utility model provides a following technical scheme:

a heat dissipation structure comprises a heat conducting sheet set, a constant temperature device and a heat conducting pressing block which are sequentially arranged from top to bottom;

a heat conduction indium sheet is arranged below the edge of the heat conduction pressing block; and a temperature sensor is arranged on the heat conduction pressing block.

Preferably, the heat conducting sheet set comprises a plurality of layers of heat conducting sheets, and the heat conducting sheets are fixed on the heat conducting sheet bottom plate and are perpendicular to the heat conducting sheet bottom plate.

The utility model also provides a mainboard testing device, which comprises the heat dissipation structure as described in any one of the above items;

the drawer type frame comprises a drawer carrier plate module, an upper pressure plate module, a drawer type frame module and a middle frame module;

the upper pressing plate module and the middle frame module are fixedly connected through a lifting assembly, and the drawer carrier plate module is arranged between the upper pressing plate module and the middle frame module and movably connected with the middle frame module;

the upper pressure plate module is provided with a plurality of heat dissipation assemblies and a prepressing block;

the heat dissipation assembly comprises the heat dissipation structure and a turbofan;

the drawer carrier plate module comprises a main plate carrier plate assembly and a lower needle plate assembly, wherein the main plate carrier plate assembly is used for carrying a main plate to be tested, and the lower needle plate assembly is provided with a probe for testing the main plate to be tested;

the main board support plate assembly is provided with a plurality of guide sleeves, and the lower needle plate assembly is provided with needle plate guide pins corresponding to the guide sleeves.

Preferably, the heat dissipation structure is fixed on the heat dissipation block base through a bolt, and the pre-pressing block is fixed on the lower surface of the heat dissipation block base; the turbofan is fixed on the side surface of the heat conducting plate group.

Preferably, a plurality of limiting columns and pressure plate guide pins are arranged on the heat dissipation block base.

Preferably, the mainboard carrier board assembly comprises a carrier board for placing the mainboard to be tested; the guide sleeves are uniformly arranged on the carrier plate.

Preferably, the drawer carrier module is movably connected with the middle frame module through a carrying assembly; the carrying assembly comprises a driving device fixedly connected with the carrier plate and a linear guide rail, and a sensing piece used for sensing the position of the carrier plate is arranged on the linear guide rail.

Preferably, the lower needle plate assembly comprises a plurality of layers of needle plates which are stacked mutually, the needle plates are fixed on the signal transfer board card, and the signal transfer board card is connected with the test function board card.

Preferably, the middle frame module comprises a middle frame plate, the lifting assembly comprises a lifting guide post and a lifting cylinder which are fixed on the middle frame plate, the movable end of the lifting cylinder is fixedly connected with the movable frame of the upper pressure plate module, and the movable frame is further provided with a flange linear bearing which is connected with the lifting guide post in a matched mode.

Preferably, still include frame module and electric control module group, electric control module group is including being used for doing the power supply module of mainboard testing arrangement power supply with control the heat radiation module dispels the heat and thermostatic control's temperature control mainboard, thermostatic device and temperature control mainboard communication connection.

Compared with the prior art, the utility model discloses there is following advantage:

the utility model provides a heat radiation structure and mainboard testing arrangement.

The heat dissipation structure comprises a heat conduction sheet set, a constant temperature device and a heat conduction pressing block which are sequentially arranged from top to bottom, wherein in the use process of the structure, the heat conduction pressing block is tightly attached to a CPU on a mainboard to be tested, the heat conduction pressing block is attached with a heat conduction indium sheet, the heat generated by the CPU after simulating the real environment and running in full load can be effectively conducted away and quickly transmitted to the constant temperature device and the heat conduction sheet set, the heat conduction sheet set has a very large heat dissipation area, the high-efficiency heat dissipation can be carried out, the temperature of the CPU is reduced, and the burning-out probability of the CPU is reduced; constant temperature equipment and temperature control mainboard communication connection just be equipped with temperature sensor on the heat conduction briquetting, therefore temperature sensor real-time supervision current CPU ambient temperature to transmit to the temperature control mainboard, temperature control mainboard control constant temperature equipment can let ambient temperature maintain under the constant temperature condition, prolongs its life, guarantees its work efficiency.

The mainboard testing device with the heat dissipation structure provided by the utility model has the advantages that the structure is simple, the processing cost is low, the maintenance is convenient, after the mainboard to be tested is carried by the drawer carrier plate module, the upper pressure plate module is pressed down under the driving of the lifting assembly and is pressed on the mainboard to be tested; wherein the briquetting in advance can carry out the pre-compaction to the mainboard that awaits measuring, realizes preliminary location, when uide bushing and faller uide pin guarantee that the mainboard that awaits measuring descends, and carry out the accurate positioning between the lower needle board subassembly, test connection is quick, and radiator unit on the top board module simultaneously closely laminates with the mainboard that awaits measuring, realizes heat dissipation and thermostatic control through temperature control mainboard control heat radiation structure and turbofan, has ensured that the CPU on the mainboard that awaits measuring can not lead the damage because of the high temperature.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation structure of the present invention;

FIG. 2 is a schematic structural diagram of the middle main board testing device of the present invention;

FIG. 3 is an exploded view of the main board testing device of the present invention;

fig. 4 is a schematic structural view of an upper middle frame module according to the present invention;

fig. 5 is a schematic structural view of the upper platen module of the present invention;

FIG. 6 is a schematic structural view of a drawer carrier module according to the present invention;

FIG. 7 is a schematic structural diagram of a motherboard carrier assembly according to the present invention;

fig. 8 is a schematic structural diagram of the motherboard to be tested and the CPU mounted on the motherboard according to the present invention;

fig. 9 is a schematic structural view of the middle and lower needle plate assembly according to the present invention;

fig. 10 is a schematic structural view of a middle frame module according to the present invention;

fig. 11 is a schematic structural diagram of an electrical control module according to the present invention;

reference numerals:

1-an upper frame module; 2-an upper platen module; 3-drawer carrier module; 4-middle frame module;

5-an electric appliance control module; 101-a cover plate; 102-a fan; 103, feeding the box body; 104-stop switch; 105-a reset switch; 106-status indicator lights; 107-start switch;

201-a top plate; 202-a turbofan; 203-a heat dissipation structure; 204-a heat sink base; 205-pre-briquetting; 206-a limiting column; 207-platen guide pins; 208-a movable frame; 209-flange linear bearing; 210-a compression spring; 211-bolt; 2031-group of heat conducting fins; 2032-heat conducting sheet soleplate; 2033-a thermostatic device; 2034-heat conducting briquetting; 2035-a temperature sensor; 2036-heat-conducting indium sheet;

301-motherboard carrier assembly; 3011-a motherboard to be tested; 3012-a guide sleeve; 3013-a carrier plate; 3014-a sensor chip; 3015-linear guide; 3016-drawer frame;

302-lower needle board assembly; 3021-needle plate; 3022-testing the functional board card; 3023-signal transfer board card; 3024-Probe; 3025-needle board guide pins; 3026-CPU;

401-middle frame plate; 402-a magnet stand in place; 403-pressure regulating valve; 404-an in-and-out cylinder;

405-a lifting assembly; 4051-lifting guide post; 4052-lifting cylinder;

501-a switch; 502-power switch; 503-USB extender; 504-an industrial personal computer; 505-temperature control mainboard; 506-network cable interface; 507-lower box body; 508-solenoid valve group; 509-barometer.

Detailed Description

In order to make the purpose and technical solution of the embodiments of the present invention clearer, the embodiments of the present invention will be combined with the following, which is to clearly and completely describe the technical solution of the present invention.

In the description of the present application, it is to be understood that the terms "length," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. indicate orientations or positional relationships based on those illustrated in the drawings, which are merely for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered limiting of the present application.

The utility model provides a heat dissipation structure 203, which comprises a heat conducting sheet group 2031, a constant temperature device 2033 and a heat conducting pressing block 2034 which are arranged from top to bottom in sequence; the heat conduction briquetting 2034 mainboard 3011 that awaits measuring pastes tightly, the edge below of constant temperature equipment 2033 is provided with heat conduction indium piece 2036, can effectively lead away the heat that produces of full load operation after the true environment circular telegram of simulation of mainboard 3011 that awaits measuring, with heat fast transfer to constant temperature equipment 2033 and heat conduction piece group 2031. The heat conducting sheet group 2031 is formed by arranging a plurality of layers of heat conducting sheets, and the heat conducting sheets are fixed on the heat conducting sheet bottom plate 2032 and are perpendicular to the heat conducting sheet bottom plate 2032, so that the heat conducting sheet group has a large heat radiating area and can perform high-efficiency heat radiation, the temperature of the mainboard 3011 to be tested is reduced, and the burning probability of the mainboard 3011 to be tested is reduced; constant temperature equipment 2033 is connected with temperature control mainboard 505 communication just be equipped with temperature sensor 2035 on the heat conduction briquetting 2033, consequently temperature sensor 2035 real-time supervision mainboard 3011 ambient temperature that awaits measuring at present to transmit to temperature control mainboard 505, temperature control mainboard 505 control constant temperature equipment 2033 lets the mainboard 3011 ambient temperature that awaits measuring maintain under the constant temperature condition, prolongs its life, guarantees its work efficiency.

Based on heat radiation structure 203, the utility model also provides a mainboard testing arrangement, including last frame module 1, top board module 2, drawer support plate module 3, well frame module 4 and electrical control module group 5. The upper frame module 1 and the electrical control module 5 are the frame of the whole mainboard testing device, wherein the upper press plate module 2, the drawer carrier plate module 3 and the middle frame module 4 are all contained inside the upper frame module 1 and the electrical control module 5.

The upper frame module 1 comprises an uppermost cover plate 101 and an upper box body 103 with a frame structure, and a plurality of fans 102 are arranged on the side surface of the upper box body 103, so that heat dissipation inside the mainboard testing device can be realized; go up box 103 and still be provided with starting switch 107, stop switch 104 and reset switch 105, wherein starting switch 107 is both hands start button, can control the mainboard testing arrangement start and test, stop switch 104 is arranged in the pause of test procedure, reset switch 105 can be after once testing is accomplished, resumes top board module 2, drawer carrier plate module 3 and well frame module 4 to initial position.

The upper pressing plate module 2 and the middle frame module 4 are fixedly connected through a lifting assembly 405, the drawer carrier plate module 3 is arranged between the upper pressing plate module 2 and the middle frame module 4, and the drawer carrier plate module 3 is fixedly connected with the middle frame module 4 through a carrying assembly; therefore, before testing the mainboard 3011 to be tested, the mainboard 3011 to be tested is placed on the drawer carrier module 3 and transported to a testing station through the transporting component, and then the upper platen module 2 can be controlled by the lifting component 405 to move close to or away from the middle frame module 4; when the lifting component 405 controls the upper pressing plate module 2 to approach the middle frame module 4, the drawer carrier plate module 3 can be pressed to cling to the middle frame module 4.

The upper platen module 2 includes a top plate 201, a heat sink, a pre-pressing block 205, and a movable frame 208.

The heat dissipation assemblies are fixed on the heat dissipation block base 204 and comprise a plurality of heat dissipation structures 203 and turbofan 202, wherein the heat dissipation structures 203 and the turbofan 202 are consistent in number and are in one-to-one correspondence. The heat dissipation structure 203 includes a heat conduction sheet group 2031, a constant temperature device 2033 and a heat conduction pressing block 2034 which are sequentially arranged from top to bottom, wherein the heat conduction sheet group 2031 is of a laminated sheet structure, thereby greatly increasing the surface area of heat dissipation and improving the heat dissipation efficiency. The heat conducting sheet group 2031 is fixed on the heat conducting sheet bottom plate 2032, and the heat conducting indium sheet 2036 is attached to the side wall of the constant temperature device 2033, so that heat generated by full-load operation after the simulation of the real environment of the mainboard 3011 to be tested is conducted away effectively, and the mainboard 3011 to be tested of the mainboard 3011 to be tested is ensured not to be burnt out due to over-high temperature. The thermostat 2033 is connected to the motherboard 3011 to be tested and controlled by the thermostat 2033 in the electrical control module 5, so that the thermostat 2033 can be controlled to maintain at a fixed temperature. A temperature sensor 2035 is further disposed inside the heat dissipation structure 203, and the temperature sensor 2035 can detect the temperature of the thermostat 2033 to assist in temperature adjustment. The heat dissipation assembly is of a detachable structure, so that the heat dissipation assembly can be replaced to adapt to heat dissipation requirements of the to-be-tested mainboard 3011 of different models.

The heat conducting sheet base plate is provided with a plurality of bolts 211 and compression springs 210 for ensuring the parallelism of the heat dissipation structures 203 and maintaining the plurality of heat dissipation structures 203 at the same height.

A plurality of pre-pressing blocks 205 are fixed on the lower surface of the heat dissipation block base 204 and used for applying pre-pressing force to the mainboard 3011 to be tested to perform preliminary positioning. The heat dissipation block base 204 is provided with a plurality of through holes corresponding to the positions of the heat dissipation assemblies, and the gaps between the pre-pressing blocks 205 can also ensure that the heat dissipation assemblies cannot be shielded. The lower surface of the heat dissipation block base 204 is also uniformly fixed with a plurality of limiting columns 206 and a pressing plate guide pin 207, and when the upper pressing plate module 2 is driven by the lifting assembly 405 to be pressed downwards, the upper pressing plate module can be accurately pressed on the drawer carrier plate 3013 assembly.

The upper platen module 2 is fixedly connected with the lifting component 405 on the middle frame module 4 through the movable frame 208. Lifting component 405 includes lift guide post 4051 and lift cylinder 4052, lift cylinder 4052 the expansion end with the movable frame 208 fixed connection of top board module 2, still be equipped with on the movable frame 208 with the flange linear bearing 209 that lift guide post 4051 cooperation is connected. Therefore, the lifting guide pillar 4051 is inserted into the flange linear bearing 209, and when the lifting cylinder 4052 extends or contracts, the upper platen module 2 ascends or descends, wherein the lifting guide pillar 4051 and the flange linear bearing 209 are matched to slide relatively, so that a guiding effect is realized, and the movement direction of the upper platen module 2 is ensured to be vertical.

Drawer carrier module 3 includes mainboard carrier board subassembly 301 and lower needle board subassembly 302, mainboard carrier board subassembly 301 is used for carrying mainboard 3011 that awaits measuring, lower needle board subassembly 302 is equipped with and is used for the test mainboard 3011's probe 3024 awaits measuring.

Mainboard support plate subassembly 301 is including being used for placing mainboard 3011's that awaits measuring support plate 3013, before testing, mainboard support plate subassembly 301 is located the material loading position, and on mainboard support plate subassembly 301 was placed mainboard 3011 that awaits measuring to manual or automatic feeding's mode, mainboard support plate subassembly 301 removed the detection station under the drive of transport subassembly on.

The carrying assembly comprises a driving device fixedly connected with the carrier plate 3013 and a linear guide track 3015, and a sensing piece 3014 for sensing the position of the carrier plate 3013 is arranged on the linear guide track 3015. The driving device is an in-out cylinder 404 fixed on the middle frame module 4, and the in-out cylinder 404 performs direction adjustment through a pressure adjusting valve 403 to control the moving direction of the motherboard carrier assembly 301. The middle frame module 4 is further provided with an in-place magnet seat 402 which plays a role in mechanical limiting, when the detection is finished or the loading is required, the mainboard support plate assembly 301 moves to the in-place magnet seat 402 to stop moving, and the position at the moment is a loading position.

The lower needle board assembly 302 is used for testing the mainboard 3011 to be tested, the lower needle board assembly 302 comprises a plurality of layers of needle boards 3021 which are stacked mutually, the needle boards 3021 are stacked on the signal transfer board cards 3023, probes 3024 which are used for linking the mainboard 3011 to be tested are distributed on the needle boards 3021, the signal transfer board cards 3023 are connected with the test function board cards 3022, and a plurality of CPUs 3026 are installed on the test function board cards 3022.

A plurality of guide sleeves 3012 are uniformly arranged on the carrier 3013 of the main board carrier assembly 301, and the lower needle board assembly 302 is provided with guide pins 3021 corresponding to the guide sleeves 3012. Therefore, after the drawer carrier module 3 carries the main board 3011 to be tested, the upper board module 2 is driven by the lifting component 405 to be pressed down on the main board 3011 to be tested, wherein the pre-pressing block 205 contacts the main board 3011 to be tested, the guide pins 207 of the pressing board distributed on the upper board module 2 are inserted into the guide sleeves 3012 of the carrier board 3013, the main board 3011 to be tested can be pre-pressed and preliminarily positioned at the same time, and the pressing is continued, the guide sleeves 3012 and the guide pins 3021 of the needle boards 3021 on the lower needle boards 302 are aligned and cooperatively connected, so that when the main board 3011 to be tested is pressed down, the main board 3011 to be tested can be accurately positioned with the lower needle boards 302, the probes 3024 are accurately aligned with the main board 3011 to be tested to perform testing, at this time, the heat dissipation component on the upper board module 2 is tightly attached to the main board 3011 to be tested on the main board 3011 to be tested, the temperature of the main board 3011 to be tested is detected in real time in the testing process, and heat dissipation and thermostatic regulation are performed.

The electrical control module 5 comprises a lower box 507 which is a frame of the whole main board testing device, and a power supply component and an electrical control component which supply power to the main board testing device are arranged in the lower box 507. The power supply assembly comprises a power supply and a power switch 502, and the electric control assembly comprises a switch 501, a USB expander 503, an industrial personal computer 504, a network cable interface 506, an electromagnetic valve group 508, a barometer 509 and a temperature control mainboard 3011 to be tested. The side wall of the lower box body 507 is further provided with a plurality of fans 102, so that heat dissipation inside the electric control module 5 can be realized.

The utility model provides a pair of mainboard testing arrangement with thermostatic control function's theory of operation as follows:

step one, moving a main board carrier plate assembly 301 to a feeding station;

step two, the mainboard 3011 to be tested is placed on the mainboard carrier plate assembly 301 in a manual or automatic feeding mode;

thirdly, the main board carrier plate assembly 301 enters a detection station under the driving of the carrying assembly;

step four, pressing a start button with two hands, pressing the upper pressing plate module 2 downwards under the driving of the lifting assembly 405, wherein pressing plate guide pins 207 distributed on the upper pressing plate module 2 are inserted into a guide sleeve 3012 of the support plate 3013 to perform primary positioning, then pressing the prebuckling block 205 to contact the mainboard 3011 to be tested, and finally pressing the mainboard 3011 to be tested; continuing to press down, aligning and matching the guide sleeve 3012 of the carrier plate 3013 and the guide pin of the needle plate 3021 on the lower needle plate assembly 302, connecting the probe 3024 with the mainboard 3011 to be tested accurately, testing, closely attaching the heat dissipation assembly on the upper pressure plate module 2 to the mainboard 3011 to be tested on the mainboard 3011 to be tested, and adjusting and controlling the temperature in the testing process;

after the test is finished, displaying in an OK/NG mode through a display screen for operators to refer to, driving the upper pressure plate module 2 to ascend to a top position through lifting cylinders 4052 on two sides, and driving the main plate carrier plate assembly 301 to move to a feeding position through the carrying assembly;

and step six, manually or automatically taking out the tested mainboard 3011 to be tested, positioning the untested mainboard 3011 to be tested on the drawer carrier module 3, and repeating the operation to perform the test operation.

The above description is only for some embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, many variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.

Claims (10)

1. A heat radiation structure is characterized in that:

comprises a heat conducting plate group, a constant temperature device and a heat conducting pressing block which are arranged from top to bottom in sequence;

a heat-conducting indium sheet is arranged below the edge of the heat-conducting pressing block;

and a temperature sensor is arranged on the constant temperature device.

2. A heat dissipating structure according to claim 1, wherein: the heat conducting sheet set comprises a plurality of layers of heat conducting sheets, and the heat conducting sheets are fixed on the heat conducting sheet bottom plate and are perpendicular to the heat conducting sheet bottom plate.

3. A mainboard testing device is characterized in that:

comprising a heat dissipation structure as recited in any of claims 1-2;

the drawer frame comprises a drawer frame, an upper pressing plate module, a drawer carrier plate module and a middle frame module;

the upper pressing plate module and the middle frame module are fixedly connected through a lifting assembly, and the drawer carrier plate module is arranged between the upper pressing plate module and the middle frame module and movably connected with the middle frame module;

the upper pressure plate module is provided with a plurality of heat dissipation assemblies and a prepressing block;

the heat dissipation assembly comprises the heat dissipation structure and a turbofan;

the drawer carrier plate module comprises a main plate carrier plate assembly and a lower needle plate assembly, wherein the main plate carrier plate assembly is used for carrying a main plate to be tested, and the lower needle plate assembly is provided with a probe for testing the main plate to be tested;

the main board support plate assembly is provided with a plurality of guide sleeves, and the lower needle plate assembly is provided with needle plate guide pins corresponding to the guide sleeves.

4. A motherboard testing apparatus as recited in claim 3, wherein: the heat dissipation structure is fixed on the heat dissipation block base through a bolt, and the pre-pressing block is fixed on the lower surface of the heat dissipation block base; the turbofan is fixed on the side surface of the heat conducting plate group.

5. A motherboard testing apparatus as recited in claim 4, wherein: a plurality of limiting columns and a pressing plate guide pin are arranged on the radiating block base.

6. A motherboard testing apparatus as recited in claim 3, wherein: the mainboard carrier plate assembly comprises a carrier plate for placing the mainboard to be tested; the guide sleeves are uniformly arranged on the carrier plate.

7. A motherboard testing apparatus as recited in claim 3, wherein: the drawer carrier plate module is movably connected with the middle frame module through a carrying assembly; the carrying assembly comprises a driving device fixedly connected with the carrier plate and a linear guide rail, and a sensing piece used for sensing the position of the carrier plate is arranged on the linear guide rail.

8. A motherboard testing apparatus as recited in claim 3, wherein: the lower needle plate assembly comprises a plurality of layers of needle plates which are stacked mutually, the needle plates are fixed on a signal transfer board card, and the signal transfer board card is connected with a test function board card; and the test function board card is provided with a plurality of CPUs.

9. A motherboard testing apparatus as recited in claim 3, wherein: the middle frame module comprises a middle frame plate, the lifting assembly comprises a lifting guide post and a lifting cylinder which are fixed on the middle frame plate, the movable end of the lifting cylinder is fixedly connected with the movable frame of the upper pressure plate module, and the movable frame is further provided with a flange linear bearing which is connected with the lifting guide post in a matched mode.

10. A motherboard testing apparatus as recited in claim 3, wherein: still include frame module and electrical control module group, electrical control module group is including being used for doing the power supply module and the control of mainboard testing arrangement power supply the heat radiation module dispels the heat and thermostatic control's temperature control mainboard, thermostatic device with temperature control mainboard communication connection.

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