CN218006601U - High-speed signal circuit board, high-speed signal mainboard structure and electronic equipment - Google Patents
High-speed signal circuit board, high-speed signal mainboard structure and electronic equipment Download PDFInfo
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Abstract
The present application relates to the field of high-speed communication technologies, and in particular, to a high-speed signal circuit board, a high-speed signal motherboard structure, and an electronic device. Wherein, high-speed signal circuit board includes: the high-speed signal transmission line is electrically connected between the first high-speed signal module and the second high-speed signal module; the high-speed signal transmission line comprises a plurality of pairs of segmented transmission lines which are electrically connected in sequence, and the setting parameters of at least two pairs of segmented transmission lines are different; the setting parameters comprise line width and/or line distance. According to the technical scheme, the loss of the high-speed signal in the transmission process can be reduced, so that the integrity of the high-speed signal is improved, and the extra arrangement of chips such as a repeater is avoided, so that the cost is reduced.
Description
Technical Field
The present application relates to the field of high-speed communication technologies, and in particular, to a high-speed signal circuit board, a high-speed signal motherboard structure, and an electronic device.
Background
With the development of science and technology, the transmission rate of high-speed signals is higher and higher, and corresponding high-speed signal transmission lines need to be arranged. Aiming at the requirement that the main board space of a product is designed to be smaller and smaller, how to arrange a high-speed signal transmission line in the limited main board space makes the loss of the transmission line to a high-speed signal as low as possible, and further, the problem of signal integrity is improved, which becomes a difficult problem of product development.
At present, the loss of high-speed signals is reduced, the influence of a Board material and a laminated layer of a main Board on the loss of the high-speed signals is mainly considered, so that the improvement of the loss of the high-speed signals is reduced depending on the improvement of a Printed Circuit Board (PCB) Board material, and therefore after the signal consistency test following a signal protocol fails, the loss of the high-speed signals needs to be reduced by improving the whole PCB Board material or increasing a repeater, the integrity of the high-speed signals is ensured, and the PCB passes the high-speed signal consistency test. For small-sized products, such as smart devices like mobile phones and tablets, the cost of replacing the PCB with the plate is small and barely acceptable due to the small area of the PCB, but for medium-sized and large-sized products, such as notebooks, computers, servers and the like, the cost of replacing the PCB with the plate is greatly increased. In addition, the loss of high-speed signals is reduced by adding repeaters, resulting in additional cost increase.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to solve the above technical problems, and the present application provides a high-speed signal circuit board, a high-speed signal motherboard structure and an electronic device, which can reduce the loss of a high-speed signal in a transmission process, thereby being beneficial to improving the integrity of the high-speed signal, and avoiding additional arrangement of chips such as a repeater, thereby being beneficial to reducing the cost.
In a first aspect, an embodiment of the present application provides a high-speed signal circuit board, including:
the high-speed signal transmission device comprises a first high-speed signal module and a second high-speed signal module, wherein a high-speed signal transmission line is electrically connected between the first high-speed signal module and the second high-speed signal module;
the high-speed signal transmission line comprises a plurality of pairs of segmented transmission lines which are electrically connected in sequence, and setting parameters of at least two pairs of the segmented transmission lines are different; wherein the setting parameters comprise line width and/or line distance.
In one embodiment, the high speed signal line includes:
a first differential signal transmission line and a second differential signal transmission line, each of the first differential signal transmission line and the second differential signal transmission line including a set number of the segment transmission lines;
the segment transmission lines of the first differential signal transmission lines and the corresponding segment transmission lines of the second differential signal transmission lines constitute differential pair transmission lines.
In one embodiment, the line widths of the segmented transmission lines in the differential pair transmission lines are the same, and the lengths of the segmented transmission lines in the differential pair transmission lines are the same.
In one embodiment, a first pair of segmented transmission lines is arranged corresponding to a first set area on the high-speed signal circuit board, and a second pair of segmented transmission lines is arranged corresponding to a second set area on the high-speed signal circuit board;
the line width of the first pair of segmented transmission lines is larger than that of the second pair of segmented transmission lines, and the area of the first setting area is larger than that of the second setting area.
In one embodiment, a first pair of segmented transmission lines is arranged corresponding to a first set area on the high-speed signal circuit board, and a second pair of segmented transmission lines is arranged corresponding to a second set area on the high-speed signal circuit board;
the line distance of the first pair of segmented transmission lines is larger than that of the second pair of segmented transmission lines, and the area of the first setting area is larger than that of the second setting area.
In one embodiment, adjacent segmented transmission lines are electrically connected through a copper film.
In one embodiment, the included angle at the connection part of the adjacent segmented transmission lines is a preset angle; wherein the preset angle is an obtuse angle.
In one embodiment, the first high-speed signal module is a high-speed signal transmitting module and the second high-speed signal module is a high-speed signal receiving module.
In a second aspect, an embodiment of the present application further provides a high-speed signal motherboard structure, including any one of the high-speed signal circuit boards provided in the first aspect.
In a third aspect, an embodiment of the present application further provides an electronic device, including any one of the high-speed signal circuit boards provided in the first aspect, or including any one of the high-speed signal motherboard structures provided in the second aspect.
The high-speed signal circuit board that this application embodiment provided includes: the high-speed signal transmission line is electrically connected between the first high-speed signal module and the second high-speed signal module; the high-speed signal transmission line comprises a plurality of pairs of segmented transmission lines which are electrically connected in sequence, and the setting parameters of at least two pairs of segmented transmission lines are different; wherein the setting parameters comprise line width and/or line distance. From this, including many pairs of section transmission lines through setting up high-speed signal transmission line, the setting parameter of at least two pairs of section transmission lines is different, be favorable to realizing the high-speed signal transmission line based on different circuit board spatial position department sets up different linewidths and line spacing, can reduce the loss of high-speed signal in transmission process through setting up above-mentioned high-speed signal transmission line, reduce the distortion that high-speed signal transmitted to the other end from one end promptly, thereby be favorable to improving the integrality of high-speed signal, and need not additionally to set up chips such as repeater and avoided extra incremental cost, thereby make above-mentioned high-speed signal transmission line keep the advantage that the cost performance is higher in whole project research and development.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without any creative effort.
Fig. 1 is a schematic top view of a high-speed signal circuit board according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of an equivalent circuit of an RLGC according to an embodiment of the present application;
fig. 3 is a schematic top view of another high-speed signal circuit board according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the related art, the high-speed signal transmission line adopts a fixed line width and line distance, and the influence of the fixed line width and line distance of the transmission line on the loss of the high-speed signal is not considered.
To the technical problem that exists in the correlation technique, the embodiment of the present application provides a high-speed signal circuit board, including many pairs of segmented transmission lines by setting a high-speed signal transmission line, the setting parameters of at least two pairs of segmented transmission lines are different, which is beneficial to realizing a high-speed signal transmission line with different line widths and line distances based on different circuit board spatial positions, and by setting the high-speed signal transmission line, the loss of a high-speed signal in the transmission process can be reduced, that is, the distortion of the high-speed signal transmitted from one end to the other end is reduced, thereby being beneficial to improving the integrity of the high-speed signal, and no extra chip such as a repeater is required to be arranged, thereby avoiding extra cost increase, and further keeping the advantage of higher cost performance of the high-speed signal transmission line in the whole project research and development.
Fig. 1 is a schematic top view of a high-speed signal circuit board according to an embodiment of the present disclosure. As shown in fig. 1, the high-speed signal circuit board 10 includes: the device comprises a first high-speed signal module 11 and a second high-speed signal module 12, wherein a high-speed signal transmission line 13 is electrically connected between the first high-speed signal module 11 and the second high-speed signal module 12; the high-speed signal transmission line 13 comprises a plurality of pairs of segmented transmission lines which are electrically connected in sequence, and setting parameters of at least two pairs of segmented transmission lines are different; wherein the setting parameters comprise line width and/or line distance.
Specifically, the high-speed signal is a signal with a frequency greater than 50MHz, the first high-speed signal module 11 and the second high-speed signal module 12 are used for processing and transmitting the high-speed signal, and a high-speed signal transmission line 13 is electrically connected between the first high-speed signal module 11 and the second high-speed signal module 12. Among them, the high-speed signal transmission line 13 is an important component of a telecommunication system, and as a carrier for transmitting a high-speed signal, the high-speed signal transmission line 13 transmits an electromagnetic wave carrying high-speed information from one end to the other end. Illustratively, the high-speed signal transmission line 13 may be used to transmit a high-speed signal from the first high-speed signal module 11 to the second high-speed signal module 12, or to transmit a high-speed signal from the second high-speed signal module 12 to the first high-speed signal module 11.
The high-speed signal transmission line 13 is arranged in segments, that is, the high-speed signal transmission line 13 includes a plurality of pairs of segment transmission lines, and the plurality of pairs of segment transmission lines are electrically connected in sequence, so that high-speed signals can be transmitted between the first high-speed signal module 11 and the second high-speed signal module 12 through the plurality of pairs of segment transmission lines.
Illustratively, fig. 1 shows that the high-speed signal transmission line 13 includes five pairs of segment transmission lines, which are electrically connected in sequence. It should be noted that fig. 1 only exemplarily shows that the high-speed signal transmission line 13 includes five pairs of segment transmission lines, and the specific number of segment transmission lines included in the high-speed signal transmission line in the embodiment of the present application is not specifically limited herein.
The setting parameters of the at least two pairs of segmented transmission lines are different, and the setting parameters comprise line width and/or line distance, namely, the line width of the at least two pairs of segmented transmission lines is only different, or the line distance of the at least two pairs of segmented transmission lines is only different, or the line width and the line distance of the at least two pairs of segmented transmission lines are both different. Wherein the line width is the diameter of the segmented transmission line, and the line distance is the distance between a pair of segmented transmission lines.
The following is an exemplary description taking as an example that the setting parameters of two pairs of the five pairs of segment transmission lines are different. For example, the line width of the first pair of segment transmission lines is set to M1, the line widths of the second, third, fourth and fifth pair of segment transmission lines are set to M2, and the line distances of the first, second, third, fourth and fifth pair of segment transmission lines are all set to be the same, whereby the line widths of the two pairs of segment transmission lines of the five pair of segment transmission lines can be set to be different. Similarly, the line distances of the two pairs of the five pairs of the segmented transmission lines can be set to be different, and the line widths and the line distances of the two pairs of the five pairs of the segmented transmission lines can also be set to be different, which is not described in detail herein.
It should be noted that the setting parameters of three pairs of segment transmission lines in the five pairs of segment transmission lines may be set to be different, or the setting parameters of four pairs of segment transmission lines in the five pairs of segment transmission lines may be set to be different, or the setting parameters of the five pairs of segment transmission lines may be set to be different.
The line width and the line distance of the segmented transmission line influence the loss of the high-speed signal, namely the loss of the segmented transmission line to the high-speed signal is related to the line width and the line distance of the transmission line. Specifically, a corresponding RLGC equivalent model can be simulated according to the line width and the line distance of the segmented transmission line, and then a simulation test is carried out according to the RLGC equivalent model to obtain the relationship between the line width and the line distance of the segmented transmission line and the high-speed signal loss. Wherein R is L Representing the unit length of the segmented transmission line, L L Representing the inductance of the series circuit per unit length of the segmented transmission line, G L Representing the parallel conductance per unit length of the segmented transmission line induced by the medium, C L The capacitance of the segmented transmission line unit length is shown, and the simulation test of the high-speed signal loss through the RLGC equivalent model is a well-known technical means of those skilled in the art, and is not described herein again.
TABLE 1
Illustratively, table 1 shows the results of simulation tests performed by the RLGC equivalent model, i.e., the relationship between the line width and the line spacing of the segmented transmission lines and the high-speed signal loss. As can be seen from table 1, the loss of the transmission line for the high-speed signal is correspondingly reduced as the line width and line spacing of the transmission line are larger, and the loss of the transmission line for the high-speed signal is correspondingly increased as the line width and line spacing of the transmission line are smaller. Therefore, by arranging the segmented transmission lines, the high-speed signal transmission lines with different line widths and line distances can be arranged at different circuit board space positions, so that the space limitation of the circuit board is broken, the space of the circuit board is favorably reasonably utilized, and the high-density and low-loss circuit board is designed. Through the space of rational utilization circuit board, improve the space utilization of circuit board, and then the accessible adjusts the circuit board size, reduces the area of circuit board in project research and development, and then is favorable to reaching the purpose that reduces the research and development expense.
The working principle of the RLGC equivalent model is exemplarily explained below. The signal transmission lines with different line widths and line distances correspond to different RLGC equivalent models, and a second-order n-section lumped circuit model is used to simulate the ideal loss of the signal transmission lines, as shown in fig. 2, fig. 2 is a schematic diagram of an RLGC equivalent circuit provided in the embodiment of the present application.
Wherein the characteristic impedance Z of the signal transmission line 0 The first relation is used for obtaining the speed V of signal transmission, the second relation is used for obtaining the neper attenuation value alpha of the unit length of the signal transmission line n The first relational expression, the second relational expression and the third relational expression are obtained through the third relational expression, and are respectively as follows:
it should be noted that α is a when the high-speed signal loss is low n It can also be obtained by a fourth relation, as follows:
signal transmissionSignal attenuation value alpha of unit length of line dB Can be obtained by the fifth relation as follows:
wherein alpha is n Expressing the neper attenuation value, alpha, of the signal transmission line unit length dB Signal attenuation value, R, representing unit length of signal transmission line L Representing the series resistance per unit length of the signal transmission line, C L Indicating capacitance per unit length of signal transmission line, L L Indicating the inductance of the series circuit per unit length of the signal transmission line, G L Represents the parallel conductance per unit length of the signal transmission line caused by the medium, ω represents the sine wave angular frequency, V represents the signal transmission speed, Z 0 Which represents the characteristic impedance of the signal transmission line, and i represents an imaginary unit.
In the related technical scheme, the high-speed signal transmission line is provided with a fixed line width and line distance, when the high-speed signal transmission line is provided with the fixed line width and line distance, in order to take account of a limited area of a circuit board space, the high-speed signal transmission line with smaller line width and line distance is generally provided, when the line width and line distance of the transmission line are smaller, the loss of the transmission line to the high-speed signal is correspondingly increased, and therefore the loss of the high-speed signal in the whole transmission process is increased by setting the fixed line width and line distance.
When the high-speed signal transmission line is set with fixed line width and line distance, along with the increase of the length of the signal transmission line in the circuit board and the increase of the signal rate, the attenuation of signals is more serious, and in order to solve the problem of signal integrity, chips such as repeaters and the like are operated. The repeater mainly performs high-frequency compensation correction on the received high-speed signal in a circuit through linear equalization technologies such as equalization (equalization) and de-emphasis (de-emphasis), and transmits the high-speed signal through de-emphasis technology at a signal transmitting end, so that a receiving chip obtains sufficient signals, and the integrity problem of the high-speed signal is further improved. Therefore, the related art increases the design cost while improving the integrity of the high-speed signal by additionally providing a chip such as a repeater. However, the embodiment of the application can reduce the loss of high-speed signals in the whole transmission process by setting the transmission lines with different line widths and line distances at different circuit board space positions, avoids additionally setting chips such as repeaters and the like, and is favorable for reducing the cost.
The high-speed signal circuit board provided by the embodiment of the application comprises a first high-speed signal module and a second high-speed signal module, wherein a high-speed signal transmission line is electrically connected between the first high-speed signal module and the second high-speed signal module; the high-speed signal transmission line comprises a plurality of pairs of segmented transmission lines which are electrically connected in sequence, and the setting parameters of at least two pairs of segmented transmission lines are different; wherein the setting parameters comprise line width and/or line distance. From this, including many pairs of section transmission lines through setting up high-speed signal transmission line, the setting parameter of at least two pairs of section transmission lines is different, be favorable to realizing the high-speed signal transmission line based on different circuit board spatial position department sets up different linewidths and line spacing, can reduce the loss of high-speed signal in transmission process through setting up above-mentioned high-speed signal transmission line, reduce the distortion that high-speed signal transmitted to the other end from one end promptly, thereby be favorable to improving the integrality of high-speed signal, and need not additionally to set up chips such as repeater and avoided extra incremental cost, thereby make above-mentioned high-speed signal transmission line keep the advantage that the cost performance is higher in whole project research and development.
In some embodiments, with continued reference to fig. 1, the high-speed signal transmission line 13 includes a first differential signal transmission line 1301 and a second differential signal transmission line 1302, the first differential signal transmission line 1301 and the second differential signal transmission line 1302 each including a set number of segmented transmission lines; the segmented transmission lines in the first differential signal transmission line 1301 and the corresponding segmented transmission lines in the second differential signal transmission line 1302 constitute a differential pair transmission line.
Specifically, when the first differential signal transmission line 1301 and the second differential signal transmission line 1302 are used to form the high-speed signal transmission line 13, the segment transmission lines respectively included are paired, the first differential signal transmission line 1301 is used to transmit a positive signal of the high-speed signal, and the second differential signal transmission line 1302 is used to transmit a negative signal of the high-speed signal, or the first differential signal transmission line 1301 is used to transmit a negative signal of the high-speed signal, and the second differential signal transmission line 1302 is used to transmit a positive signal of the high-speed signal, which is not particularly limited herein.
Wherein the first differential signal transmission line 1301 and the second differential signal transmission line 1302 each include a plurality of segment transmission lines, and the number of segment transmission lines in the first differential signal transmission line 1301 and the number of segment transmission lines in the second differential signal transmission line 1302 are the same. As shown in fig. 1, the first differential signal transmission line 1301 includes five segment transmission lines, respectively a segment transmission line W1, a segment transmission line W2, a segment transmission line W3, a segment transmission line W4, and a segment transmission line W5; the second differential signal transmission line 132 also includes five segment transmission lines, segment transmission line S1, segment transmission line S2, segment transmission line S3, segment transmission line S4, and segment transmission line S5. Thus, the segment transmission line W1 and the segment transmission line S1 form a first pair of differential pair transmission lines 131, the segment transmission line W2 and the segment transmission line S1 form a second pair of differential pair transmission lines 132, the segment transmission line W3 and the segment transmission line S3 form a third pair of differential pair transmission lines 132, the segment transmission line W4 and the segment transmission line S4 form a fourth pair of differential pair transmission lines 134, and the segment transmission line W5 and the segment transmission line S5 form a fifth pair of differential pair transmission lines 135, i.e., the segment transmission line in the first differential signal transmission line 1301 and the corresponding segment transmission line in the second differential signal transmission line 1302 form a differential pair transmission line.
It should be noted that fig. 1 exemplarily shows five pairs of differential transmission lines, and as the product types are different, the PCB size and the routing length can be set up variously, for example, on the basis of fig. 1, a segmented transmission line W6 and a segmented transmission line S6, a segmented transmission line W7 and a segmented transmission line S7, etc. can also be set up continuously.
The differential signal is to transmit two signals with equal value and opposite phase from one end, such as the first high-speed signal module 11, to the second high-speed signal module 12, and a pair of traces carrying the differential signal, such as the first differential signal transmission line 1301 and the second differential signal transmission line 1302, is referred to as a pair of differential traces.
It should be noted that differential transmission is a signal transmission technology, and is different from the traditional method of one signal line and one ground line, and differential transmission transmits signals on two signal lines, and the two signals have equal amplitudes, 180 degrees phase difference, and opposite polarities. Compared with the traditional single signal wire, the differential signal has the following advantages: the anti-interference capability is strong, and noise does not influence the logic significance of signals; the electromagnetic interference can be effectively inhibited, and the electromagnetic interference to the outside is small; the timing sequence is accurately positioned, and the point of positive and negative jump of the difference of the signal amplitudes on the two lines is used as judgment logic.
Therefore, by arranging the differential pair transmission lines, the embodiment of the application can effectively utilize the advantages of the differential transmission technology, is beneficial to reducing the loss of high-speed signals, and further improves the integrity of the high-speed signals.
In one embodiment, with continued reference to fig. 1, the line widths of the segmented ones of the differential pair transmission lines are the same and the lengths of the segmented ones of the differential pair transmission lines are the same.
Specifically, the segment transmission lines of the first differential signal transmission lines 131 and the corresponding segment transmission lines of the second differential signal transmission lines 132 constitute a pair of differential pair transmission lines, the line widths of the segment transmission lines of the differential pair transmission lines are the same, and the lengths of the segment transmission lines are also the same. For example, the first pair of differential pair transmission lines includes a segment transmission line W1 and a segment transmission line S1, the line widths of the segment transmission line W1 and the segment transmission line S1 are the same, and the lengths of the segment transmission line W1 and the segment transmission line S1 are also the same. Therefore, the transmission speed of the high-speed signals of the differential pair transmission lines is ensured to be the same, namely the transmission speed of the positive signals of the high-speed signals is the same as that of the negative signals of the high-speed signals.
In one embodiment, the first pair of segmented transmission lines is arranged corresponding to a first set area on the high-speed signal circuit board, and the second pair of segmented transmission lines is arranged corresponding to a second set area on the high-speed signal circuit board; the line width of the first pair of segmented transmission lines is larger than that of the second pair of segmented transmission lines, and the area of the first setting area is larger than that of the second setting area.
Specifically, a corresponding pair of segmented transmission lines is arranged on a first set area on a high-speed signal circuit board, and the segmented transmission lines are used as a first pair of segmented transmission lines; and arranging a corresponding pair of segmented transmission lines on a second set area on the high-speed signal circuit board, and taking the segmented transmission lines as a second pair of segmented transmission lines. If the first setting region is a region with sufficient space, the second setting region is a region with limited space, that is, the area of the first setting region is larger than that of the second setting region, and at this time, the line width of the first pair of segment transmission lines corresponding to the first setting region is larger than that of the second pair of segment transmission lines corresponding to the second setting region.
Similarly, when the area of the first setting region is larger than that of the second setting region, the line distance of the first pair of segment transmission lines corresponding to the first setting region is larger than that of the second pair of segment transmission lines corresponding to the second setting region.
From this, can realize setting up the transmission line of less linewidth and line spacing in the limited position in circuit board space, set up the transmission line of great linewidth and line spacing in the sufficient position in circuit board space, through the high-speed signal transmission line that sets up different linewidths and line spacing in different circuit board spatial position department, the rational utilization circuit board space makes circuit board space utilization reach the biggest, when reducing mainboard circuit board space, is favorable to reducing the loss of high-speed signal in the whole transmission process.
In one embodiment, referring to fig. 1, adjacent segmented transmission lines are electrically connected by a copper film.
Specifically, a copper film is provided between the segment transmission line W1 and the segment transmission line W2, that is, between adjacent segment transmission lines, and the electrical connection between the segment transmission line W1 and the segment transmission line W2 is realized through the copper film. Through setting up the copper film, when high-speed signal from segmentation transmission line W1 to segmentation transmission line W2 transmission or from segmentation transmission line W2 to segmentation transmission line W1 transmission, reducible segmentation transmission line produces the impedance of sharp change, is favorable to smooth impedance when high-speed signal transmission, can avoid high-speed signal to cause high-speed signal's reflection because the abrupt change of line width when transmitting, and then influence high-speed signal's integrality.
In one embodiment, referring to fig. 1, the included angle at the connection of adjacent segmented transmission lines is a preset angle; wherein the preset angle is an obtuse angle.
Specifically, a preset angle is set at the joint of the segment transmission line W1 and the segment transmission line W2, namely, the adjacent segment transmission lines, where the preset angle is shown as α, where the preset angle is 135 degrees, that is, the preset angle is an obtuse angle, which is beneficial to maintaining the continuity of impedance during high-speed signal transmission, and can avoid the problem of high-speed signal incompleteness due to the reflection of high-speed signals caused by impedance discontinuity.
Note that, the included angle of the adjacent segment transmission lines at the connection is set to be a preset angle, and for the adjacent segment transmission lines to be electrically connected at the corner, for example, the segment transmission line W1 and the segment transmission line W2 are electrically connected at the corner. If the adjacent segmented transmission lines are in linear electric connection, for example, the segmented transmission line W2 and the segmented transmission line W3 are in linear electric connection, the preset angle does not need to be set, and the adjacent segmented transmission lines are in electric connection through a coating film.
Therefore, adjacent segmented transmission lines are electrically connected through the copper film, and when the adjacent segmented transmission lines are electrically connected at the corner, the included angle of the connection part is set to be a preset included angle, so that the impedance continuity of the transmission lines is favorably maintained, the signal reflection is reduced, and the signal integrity is favorably improved. With reference to table 1, when the impedance continuity of the transmission line is good, the relationship between the loss of the transmission line to the signal and the series resistance R and the parallel conductance G of the transmission line is large, and the relationship between the loss of the transmission line and the capacitance C and the inductance L of the transmission line is small. As shown in table 1, when the line width and the line distance of the transmission line are changed, the series resistance R and the parallel conductance G of the transmission line are also changed, and thus the loss of the transmission line to the signal is also changed.
In an embodiment, fig. 3 is a schematic top view of another high-speed signal circuit board provided in the embodiment of the present application. Referring to fig. 1 and 3, the first high-speed signal module 11 is a high-speed signal transmitting module, and the second high-speed signal module 12 is a high-speed signal receiving module.
Specifically, the first high-speed signal module 11 may be configured as a high-speed signal transmitting module, the high-speed signal transmitting module includes a signal transmitting end a, pad1 indicates an anode of a signal point of the transmitting end a as shown in fig. 3, pad2 indicates a cathode of the signal point of the transmitting end a, the second high-speed signal module 12 is configured as a high-speed signal receiving module, the high-speed signal receiving module includes a signal receiving end B, pad3 indicates an anode of a signal point of the receiving end B as shown in fig. 3, and pad4 indicates a cathode of the signal point of the receiving end B, so that it is possible to transmit a high-speed signal from the first high-speed signal module 11, the high-speed signal is transmitted to the second high-speed signal module 12 through the high-speed signal transmission line 13, and further, the second high-speed signal module 12 receives the high-speed signal. Alternatively, the second high-speed signal module 12 may be configured as a high-speed signal transmitting module, and the first high-speed signal module 11 may be configured as a high-speed signal receiving module, so that it is possible to transmit a high-speed signal from the second high-speed signal module 12, the high-speed signal being transmitted to the first high-speed signal module 11 through the high-speed signal transmission line 13, and further, the first high-speed signal module 11 receives the high-speed signal.
Therefore, the high-speed signal transmission line provided by the embodiment of the application comprises a plurality of segmented transmission lines, and transmission lines with different line widths and line distances are designed at different circuit board space positions, so that the space of the circuit board is reasonably utilized, and a high-density and low-loss circuit board is designed. Through the space of rational utilization circuit board, improve the space utilization of circuit board, and then the accessible adjusts the circuit board size, reduces the area of circuit board in project research and development, reaches the purpose that reduces research and development expense. The high-speed signal transmission line provided by the embodiment of the application reduces the loss of a high-speed signal in the transmission process and reduces the loss of the high-speed signal transmitted from one end to the other end. In addition, chips such as a repeater and the like do not need to be additionally arranged, so that the signal integrity is guaranteed, and meanwhile, the cost is not additionally increased.
On the basis of the foregoing embodiments, embodiments of the present application further provide a high-speed signal motherboard structure, including any one of the high-speed signal circuit boards provided in the foregoing embodiments, which has the same or similar beneficial effects, and thus, details are not repeated herein.
On the basis of the foregoing embodiments, an embodiment of the present application further provides an electronic device, including any one of the high-speed signal circuit boards provided in the foregoing embodiments, or including any one of the high-speed signal main board structures provided in the foregoing embodiments, which has the same or similar beneficial effects, and is not described in detail herein. The electronic device may be a mobile phone, a computer, etc., and is not limited herein.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A high-speed signal circuit board, comprising:
the high-speed signal transmission device comprises a first high-speed signal module and a second high-speed signal module, wherein a high-speed signal transmission line is electrically connected between the first high-speed signal module and the second high-speed signal module;
the high-speed signal transmission line comprises a plurality of pairs of segmented transmission lines which are electrically connected in sequence, and the setting parameters of at least two pairs of segmented transmission lines are different; wherein the setting parameters comprise line width and/or line distance.
2. The high-speed signal circuit board of claim 1, wherein the high-speed signal transmission line comprises:
a first differential signal transmission line and a second differential signal transmission line, each of the first differential signal transmission line and the second differential signal transmission line including a set number of the segment transmission lines;
the segment transmission lines of the first differential signal transmission lines and the corresponding segment transmission lines of the second differential signal transmission lines constitute differential pair transmission lines.
3. The high-speed signal circuit board of claim 2, wherein the line widths of the segmented transmission lines of the differential pair transmission lines are the same, and the lengths of the segmented transmission lines of the differential pair transmission lines are the same.
4. The high-speed signal circuit board of any one of claims 1-3, wherein a first pair of segmented transmission lines is disposed corresponding to a first defined area on the high-speed signal circuit board, and a second pair of segmented transmission lines is disposed corresponding to a second defined area on the high-speed signal circuit board;
the line width of the first pair of segmented transmission lines is larger than that of the second pair of segmented transmission lines, and the area of the first setting area is larger than that of the second setting area.
5. The high-speed signal circuit board of any one of claims 1-3, wherein a first pair of segmented transmission lines is disposed corresponding to a first defined area on the high-speed signal circuit board, and a second pair of segmented transmission lines is disposed corresponding to a second defined area on the high-speed signal circuit board;
the line distance of the first pair of segmented transmission lines is larger than that of the second pair of segmented transmission lines, and the area of the first setting area is larger than that of the second setting area.
6. A high speed signal circuit board according to any one of claims 1 to 3, wherein adjacent ones of the segmented transmission lines are electrically connected by a copper film.
7. The high-speed signal circuit board of any one of claims 1-3, wherein an included angle at a connection of adjacent segmented transmission lines is a preset angle; wherein the preset angle is an obtuse angle.
8. The high-speed signal circuit board of any one of claims 1-3, wherein the first high-speed signal module is a high-speed signal transmitting module and the second high-speed signal module is a high-speed signal receiving module.
9. A high-speed signal board structure comprising the high-speed signal circuit board according to any one of claims 1 to 8.
10. An electronic device comprising a high-speed signal circuit board according to any one of claims 1 to 8, or comprising a high-speed signal motherboard structure according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221626100.1U CN218006601U (en) | 2022-06-24 | 2022-06-24 | High-speed signal circuit board, high-speed signal mainboard structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221626100.1U CN218006601U (en) | 2022-06-24 | 2022-06-24 | High-speed signal circuit board, high-speed signal mainboard structure and electronic equipment |
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| CN218006601U true CN218006601U (en) | 2022-12-09 |
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| CN202221626100.1U Active CN218006601U (en) | 2022-06-24 | 2022-06-24 | High-speed signal circuit board, high-speed signal mainboard structure and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117453605A (en) * | 2023-12-26 | 2024-01-26 | 深圳市芯波微电子有限公司 | Signal output buffer, signal chip and printed circuit board |
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2022
- 2022-06-24 CN CN202221626100.1U patent/CN218006601U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117453605A (en) * | 2023-12-26 | 2024-01-26 | 深圳市芯波微电子有限公司 | Signal output buffer, signal chip and printed circuit board |
| CN117453605B (en) * | 2023-12-26 | 2024-04-12 | 深圳市芯波微电子有限公司 | Signal output buffer, signal chip and printed circuit board |
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