CN217983290U

CN217983290U - Cleaning and converting frame for frame type solder paste welding semiconductor product

Info

Publication number: CN217983290U
Application number: CN202221196995.XU
Authority: CN
Inventors: 凡青松; 杨文勇
Original assignee: Suzhou Ensitai Metal Technology Co ltd
Current assignee: Suzhou Ensitai Metal Technology Co ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-12-06
Anticipated expiration: 2032-05-17

Abstract

The utility model discloses a be used for frame class tin cream welding semiconductor product to wash conversion frame, including washing conversion frame main part and installing the board of placing in washing conversion frame main part upper end, wash conversion frame main part lower extreme both ends and all install the direction slide rail, it is two sets of be provided with the fly leaf between the direction slide rail, the wash port has been seted up to the inside bottom of fly leaf, the welding of fly leaf front end outer wall has the handle of drawing, fly leaf both sides outer wall all is fixed with the direction draw runner, the direction draw runner all inserts in the direction slide rail. The movable plate which can be drawn is arranged at the bottom end of the cleaning conversion frame main body, so that the semiconductor material can be placed in the movable plate for cleaning, the cleaning solution is discharged through the drainage hole at the bottom end of the movable plate, the cleaned semiconductor material can be drawn out together with the movable plate, a user can extract the semiconductor material independently, and the usability of the device during use is improved.

Description

Cleaning and converting frame for frame type solder paste welding semiconductor product

Technical Field

The utility model relates to a semiconductor product washs accessory technical field, especially relates to a be used for frame class tin cream welding semiconductor product to wash conversion frame.

Background

In the packaging production process of the semiconductor device, frame type tin paste welding products are sequentially placed on a cleaning basket in a sheet-like mode after being welded out of a furnace, and then are ultrasonically cleaned through a cleaning machine. Before ultrasonic cleaning by a cleaning machine, a cleaning basket needs to be placed on a stainless steel cleaning and converting frame, while the conventional cleaning and converting frame for welding a framework type tin paste on a semiconductor product basically can meet daily use requirements, but still has some defects and needs to be improved.

Most of the existing cleaning and converting frames for frame type solder paste welding semiconductor products in the market are designed in a traditional fixed integrated mode, in the practical use process, the semiconductor products need to be manually lifted from the cleaning and converting frames, and once the semiconductor products collide other positions of the cleaning and converting frames in the extracting process, the semiconductor products can be damaged.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a be used for frame class tin cream welding semiconductor product to wash conversion frame to solve the problem of proposing in the above-mentioned background art.

In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a be used for frame type tin cream welding semiconductor product to wash conversion frame, includes to wash conversion frame main part and installs the board of placing in washing conversion frame main part upper end, wash conversion frame main part lower extreme both ends and all install the direction slide rail, it is two sets of be provided with the fly leaf between the direction slide rail, the wash port has been seted up to the inside bottom of fly leaf, the welding of fly leaf front end outer wall has the handle of drawing, fly leaf both sides outer wall all is fixed with the direction draw, the direction draw all inserts in the direction slide rail, direction slide rail top all is provided with the locating part, the direction slide rail passes through the locating part and connects and the direction draw.

As a preferred technical scheme of the utility model, the locating part includes mount pad, location inserted bar, handle, spacing jack, direction slide bar and sliding sleeve, the mount pad is all installed to direction slide rail top outer wall, it has the location inserted bar to peg graft in the mount pad, location inserted bar top outer wall is fixed with the handle, direction slide bar top outer wall is fixed with spacing jack, mount pad one side is fixed with the direction slide bar, direction slide bar outer wall cover is equipped with the sliding sleeve, the sliding sleeve outer wall is fixed in the location inserted bar outer wall, direction slide bar outer wall winding has reset spring.

As a preferred technical scheme of the utility model, direction draw runner outer wall and direction slide rail inner wall fully contact, and the direction draw runner is sliding connection with the direction slide rail.

As a preferred technical scheme of the utility model, the handle is the design of ball form, and the handle outer wall is provided with anti-skidding decorative pattern.

As a preferred technical scheme of the utility model, reset spring both ends weld respectively with sliding sleeve outer wall and mount pad top outer wall, the sliding sleeve passes through reset spring and forms elastic connection with the mount pad.

As a preferred technical scheme of the utility model, the location inserted bar external diameter is the same with the spacing jack internal diameter on the direction draw runner, and inserts in the spacing jack location inserted bar bottom.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

1. the movable plate which can be pulled is arranged at the bottom end of the main body of the cleaning conversion frame, so that the semiconductor material can be placed in the movable plate for cleaning, the washing liquid is discharged through the drainage hole at the bottom end of the movable plate, the cleaned semiconductor material and the movable plate can be pulled out together, a user can extract the semiconductor material independently, the problem that the semiconductor product is possibly damaged due to the fact that the semiconductor product collides with other positions of the cleaning conversion frame in the extracting process is solved, and the usability of the device in use is improved;

2. through mutually supporting of the mounting seat, the positioning insertion rod, the handle, the limiting insertion hole, the guide sliding rod, the sliding sleeve and the reset spring, the positioning insertion rod can be quickly formed or the movable limiting effect on the guide sliding strip can be eliminated, the movable plate can be conveniently mounted and dismounted, and the convenience of the device in use is improved.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the structure of the active state of the present invention;

fig. 3 is a schematic view of the partial cross-sectional structure of the present invention;

fig. 4 is an enlarged view of a in fig. 3 according to the present invention;

in the drawings, the components represented by the respective reference numerals are listed below:

1. cleaning the conversion frame main body; 2. placing the plate; 3. a guide slide rail; 4. a movable plate; 5. a drain hole; 6. pulling a handle; 7. a guide slider; 8. a mounting seat; 9. positioning the inserted rod; 10. a grip; 11. limiting the jacks; 12. a guide slide bar; 13. a sliding sleeve; 14. a return spring.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1-4, a cleaning conversion frame for frame type solder paste welding semiconductor products comprises a cleaning conversion frame main body 1 and a placing plate 2 installed at the upper end of the cleaning conversion frame main body 1, wherein guide slide rails 3 are installed at both ends of the lower end of the cleaning conversion frame main body 1, a movable plate 4 is arranged between two sets of guide slide rails 3, a drain hole 5 is formed in the bottom end inside the movable plate 4, a pull handle 6 is welded on the outer wall of the front end of the movable plate 4, guide slide bars 7 are fixed on the outer walls of both sides of the movable plate 4, the guide slide bars 7 are all inserted into the guide slide rails 3, a limiting part is arranged at the top end of each guide slide rail 3, and the guide slide rails 3 are connected with the guide slide bars 7 through the limiting part;

through be provided with the fly leaf 4 of telescopic in washing conversion frame main part 1 bottom, let the semiconductor material can place and wash in fly leaf 4, and discharge the lotion through the wash port 5 of fly leaf 4 bottom, and can outwards take out the semiconductor material who washs the completion together with fly leaf 4, let the user can extract the semiconductor material alone, avoided colliding other positions departments of washing conversion frame at the in-process semiconductor product that draws, probably lead to the semiconductor product to produce the problem of damage, the ease for use when having improved the device and using.

In other embodiments, the limiting member comprises a mounting seat 8, a positioning insertion rod 9, a handle 10, a limiting insertion hole 11, a guiding sliding rod 12 and a sliding sleeve 13, the mounting seat 8 is mounted on the outer wall of the top end of the guiding sliding rail 3, the positioning insertion rod 9 is inserted in the mounting seat 8, the handle 10 is fixed on the outer wall of the top end of the positioning insertion rod 9, the limiting insertion hole 11 is fixed on the outer wall of the top end of the guiding sliding strip 7, the guiding sliding rod 12 is fixed on one side of the mounting seat 8, the sliding sleeve 13 is sleeved on the outer wall of the guiding sliding rod 12, the outer wall of the sliding sleeve 13 is fixed on the outer wall of the positioning insertion rod 9, and a reset spring 14 is wound on the outer wall of the guiding sliding rod 12;

when the semiconductor cleaning device is used, firstly, the two groups of handles 10 are pulled upwards, the positioning insertion rod 9 is driven by the acting force transmitted by the handles 10 to slide the sliding sleeve 13 upwards along the guide sliding rod 12, the reset spring 14 is driven by the extrusion deformation of the sliding sleeve 13, when the positioning insertion rod 9 completely leaves the limiting insertion hole 11 at the upper end of the guide sliding strip 7, the positioning insertion rod 9 removes the movement limiting effect on the guide sliding strip 7, the pull handle 6 can be pulled outwards, the movable plate 4 drives the guide sliding strip 7 to be drawn outwards along the guide sliding rail 3, then, the semiconductor material to be cleaned is placed in the movable plate 4, then, the guide sliding strips 7 at the two sides of the movable plate 4 are inserted into the guide sliding rail 3, when the guide sliding strip 7 drives the limiting insertion hole 11 to move to the lower end of the positioning insertion rod 9, the sliding sleeve 13 releases the elastic force to push the sliding sleeve 13 to slide downwards along the guide sliding rod 12, the positioning insertion rod 9 is driven by the acting force transmitted by the sliding sleeve 13 to move downwards, the lower end of the positioning insertion rod 9 is embedded into the limiting insertion hole 11 on the guide sliding strip 7, the movable plate 4 can be cleaned normally, the semiconductor material can be taken out, and the semiconductor material can be taken out, when the semiconductor cleaning device is repeatedly used, and the semiconductor material can be conveniently and the semiconductor cleaning device can be taken out.

In other embodiments, the outer wall of the guide slide bar 7 is in full contact with the inner wall of the guide slide rail 3, and the guide slide bar 7 is in sliding connection with the guide slide rail 3;

through the design, when the guide sliding strip 7 slides along the guide sliding rail 3, the guide sliding strip 7 can be ensured to drive the movable plate 4 to move smoothly and stably, and the semiconductor material in the movable plate 4 is prevented from being greatly vibrated.

In other embodiments, the grip 10 is designed in a spherical shape, and the outer wall of the grip 10 is provided with anti-slip patterns;

through this design, increased the area of contact between handle 10 and the user's hand, improved the frictional force between handle 10 and the hand simultaneously, be convenient for pull handle 10.

In other embodiments, two ends of the return spring 14 are respectively welded to the outer wall of the sliding sleeve 13 and the outer wall of the top end of the mounting seat 8, and the sliding sleeve 13 is elastically connected with the mounting seat 8 through the return spring 14;

through the design, when the guide sliding strip 7 drives the limiting insertion hole 11 to move to the lower end of the positioning insertion rod 9, the sliding sleeve 13 can push the sliding sleeve 13 to slide downwards along the guide sliding rod 12 under the elastic action of the return spring 14, and therefore the sliding sleeve 13 drives the positioning insertion rod 9 to be embedded into the limiting insertion hole 11 in the guide sliding strip 7.

In other embodiments, the outer diameter of the positioning insertion rod 9 is the same as the inner diameter of the limiting insertion hole 11 on the guide slide bar 7, and the bottom end of the positioning insertion rod 9 is inserted into the limiting insertion hole 11;

through this design, in the spacing jack 11 on positioning inserted bar 9 embedding direction draw runner 7 top, can prevent effectively that positioning inserted bar 9 from producing in spacing jack 11 and rocking, improved the stability when fly leaf 4 uses.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only the preferred embodiments of the present invention, and is not intended to limit the present invention, and that there may be various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a be used for frame class tin cream welding semiconductor product to wash conversion frame, includes to wash conversion frame main part (1) and installs and place board (2) in washing conversion frame main part (1) upper end, its characterized in that: the cleaning conversion frame is characterized in that guide sliding rails (3) are mounted at two ends of the lower end of the cleaning conversion frame main body (1), a movable plate (4) is arranged between the guide sliding rails (3), a drain hole (5) is formed in the bottom end of the inner portion of the movable plate (4), a pull handle (6) is welded on the outer wall of the front end of the movable plate (4), guide sliding strips (7) are fixed on the outer walls of two sides of the movable plate (4), the guide sliding strips (7) are inserted into the guide sliding rails (3), limiting parts are arranged at the top ends of the guide sliding rails (3), and the guide sliding rails (3) are connected with the guide sliding strips (7) through the limiting parts.

2. The cleaning and converting rack for frame type solder paste soldering semiconductor products as claimed in claim 1, wherein: the locating part includes mount pad (8), location inserted bar (9), handle (10), spacing jack (11), direction slide bar (12) and sliding sleeve (13), mount pad (8) are all installed to direction slide rail (3) top outer wall, it has location inserted bar (9) to peg graft in mount pad (8), location inserted bar (9) top outer wall is fixed with handle (10), direction draw runner (7) top outer wall is fixed with spacing jack (11), mount pad (8) one side is fixed with direction slide bar (12), direction slide bar (12) outer wall cover is equipped with sliding sleeve (13), sliding sleeve (13) outer wall is fixed in location inserted bar (9) outer wall, direction slide bar (12) outer wall winding has reset spring (14).

3. The cleaning and converting rack for frame type solder paste welding semiconductor products according to claim 1, characterized in that: the outer wall of the guide sliding strip (7) is in full contact with the inner wall of the guide sliding rail (3), and the guide sliding strip (7) is in sliding connection with the guide sliding rail (3).

4. The cleaning and converting rack for frame type solder paste welding semiconductor products according to claim 2, characterized in that: the grip (10) is designed in a spherical shape, and anti-skid patterns are arranged on the outer wall of the grip (10).

5. The cleaning and converting rack for frame type solder paste soldering semiconductor products as claimed in claim 2, wherein: reset spring (14) both ends weld respectively with sliding sleeve (13) outer wall and mount pad (8) top outer wall, sliding sleeve (13) form elastic connection through reset spring (14) and mount pad (8).

6. The cleaning and converting rack for frame type solder paste welding semiconductor products according to claim 2, characterized in that: the outer diameter of the positioning inserted bar (9) is the same as the inner diameter of a limiting insertion hole (11) in the guide sliding strip (7), and the bottom end of the positioning inserted bar (9) is inserted into the limiting insertion hole (11).