CN217946851U - Get and put material device and get and put material system - Google Patents

Abstract

The present disclosure provides a get and put material device, include: a substrate; a telescopic assembly supported by the base plate; the suction assembly is arranged on the telescopic assembly and sucks materials; the clamping assembly is supported by the substrate and clamps the material; the suction assembly and the clamping assembly are matched to hold materials, and the telescopic assembly enables the suction assembly to do telescopic motion when holding the materials. Also comprises a material taking and placing system.

Description

Material taking and placing device and material taking and placing system

Technical Field

The disclosure particularly relates to a material taking and placing device and a material taking and placing system.

Background

With the technical progress, products such as mobile phones and tablet computers are widely used, the production requirements of the corresponding products such as the mobile phones and the tablet computers are larger and larger, and the labor cost required by the production is increased.

In order to save increasing labor cost, improve the safety and reliability of product production and improve production efficiency, production companies strongly push production automation and replace manpower with equipment. With the continuous development of products such as mobile phones and tablet computers, mechanical modern devices are also required to be introduced to solve the problems.

In the prior art, the material taking and placing device for products such as mobile phones and tablet computers mostly adopts modes such as glass panels to absorb products, common industrial production cannot be suitable for different standards of different products, and the product cannot be protected by the suction force of the weight adjusting device of the product when the product is absorbed, for example, the suction force is smaller than the weight of the product, so that the product can be dropped in the product absorbing and transferring process of the device, and the product is damaged. And equipment suction means generally adopts the sucking disc, and the sucking disc moves the vacuum and absorbs the product downwards, but the downward power of sucking disc can not adjust, probably leads to the too big damage that causes the product, and this is the problem that prior art exists yet.

The industrial production automation equipment of products such as cell-phone, panel computer, the equipment production efficiency of prior art still has the needs of further promotion, can adopt the design of more stations to improve production efficiency.

SUMMERY OF THE UTILITY MODEL

In order to solve one of the above technical problems, the present disclosure provides a material taking and placing device and a material taking and placing system.

According to an aspect of the present disclosure, there is provided a material taking and placing device, including:

a substrate;

a telescoping assembly supported by the base plate;

the suction assembly is arranged on the telescopic assembly and sucks materials;

a clamping assembly supported by the substrate, the clamping assembly clamping a material;

the suction assembly and the clamping assembly are matched to hold materials, and the telescopic assembly enables the suction assembly to do telescopic motion when holding the materials.

According to at least one embodiment of this disclosure get material device, flexible subassembly includes:

the telescopic cylinder provides telescopic force and transmits the telescopic force to the suction assembly;

the guide column is connected with the suction assembly;

the guide sleeve is sleeved on the guide post, and the guide post is telescopically arranged on the base plate through the guide sleeve.

According to this at least one embodiment of this disclosure get put material device, flexible subassembly still includes pressure sensor, pressure sensor set up in flexible cylinder with absorb between the subassembly.

According to at least one embodiment of this disclosure get material device, absorb the subassembly and include:

the sucking disc is used for sucking materials;

the mounting plate is used for connecting the sucker, and a vacuum cavity is formed in the mounting plate; and

a cover plate sealing the vacuum chamber of the mounting plate;

the sucking disc and the cover plate are respectively arranged on two sides of the mounting plate.

According to this at least one embodiment of this disclosure get material device, the centre gripping subassembly includes:

the clamping cylinder provides clamping force;

the connecting rod transmits clamping force to the connecting block;

the connecting block receives the clamping force to perform clamping movement;

the claw presss from both sides and establishes in the connecting block, when the connecting block carries out the centre gripping motion, the claw presss from both sides the clamp and gets or release the material.

According to the material taking and placing device disclosed by the invention, the connecting blocks and the claw clamps are arranged in pairs.

According to the material taking and placing device disclosed by the invention, the connecting blocks correspond to the claw clamps in number one by one.

According to this at least one embodiment of this disclosure get material device, the centre gripping subassembly still includes the slide rail, the connecting block carries out clamping movement when moving along the slide rail.

According to an aspect of the present disclosure, there is also provided a material taking and placing system, including:

a support plate;

the material taking and placing device is arranged on the supporting plate;

the supporting plate is arranged to support a plurality of material taking and placing devices, and the material taking and placing devices are arranged at one end of the supporting plate.

According to the material taking and placing system, the supporting plate and the substrate of the material taking and placing device are integrally formed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of a material taking and placing device according to an embodiment of the present disclosure.

Fig. 2 is another structural schematic diagram of a material taking and placing device according to an embodiment of the disclosure.

FIG. 3 is a schematic view of a telescoping assembly in a collapsed configuration, according to one embodiment of the present disclosure.

FIG. 4 is a schematic structural view of a retraction assembly in an extended state according to one embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of a material taking and placing system according to an embodiment of the present disclosure.

Fig. 6 is a schematic illustration of a pick and place system in cooperation with a robot according to one embodiment of the present disclosure.

Attached pictureDescription of the invention

10 taking and placing device

100 substrate

200 telescoping assembly

210 telescopic cylinder

211 telescopic shaft

220 guide rod

230 guide sleeve

240 pressure sensor

300 suction assembly

310 suction cup

320 mounting plate

330 cover plate

340 suction plate

400 clamping assembly

410 clamping cylinder

420 connecting rod

430 connecting block

440 claw clamp

450 slide rail

20 get material system of putting

21 supporting the plate.

Detailed Description

The present disclosure will be described in further detail with reference to the drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limitations of the present disclosure. It should be further noted that, for the convenience of description, only the portions relevant to the present disclosure are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict. Technical solutions of the present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Unless otherwise indicated, the illustrated exemplary embodiments/examples are to be understood as providing exemplary features of various details of some ways in which the technical concepts of the present disclosure may be practiced. Thus, unless otherwise indicated, the features of the various embodiments/examples may be additionally combined, separated, interchanged, and/or rearranged without departing from the technical concept of the present disclosure.

The use of cross-hatching and/or shading in the drawings is generally used to clarify the boundaries between adjacent components. As such, unless otherwise noted, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, proportion, commonality between the illustrated components and/or any other characteristic, attribute, property, etc., of a component. Further, in the drawings, the size and relative sizes of components may be exaggerated for clarity and/or descriptive purposes. While example embodiments may be practiced differently, the specific process sequence may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in an order reverse to the order described. In addition, like reference numerals denote like parts.

When an element is referred to as being "on" or "over," "connected to" or "coupled to" another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. However, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there are no intervening elements present. For purposes of this disclosure, the term "connected" may refer to physically, electrically, etc., and may or may not have intermediate components.

For descriptive purposes, the present disclosure may use methods such as "below 8230; …," "below 8230;" \8230; below 8230; "," below 8230; "," "above 8230" "," "above", "at 8230;", "" above "," higher "and" side (e.g., spatially relative terms, such as "in the sidewalls" and the like, may be used herein to describe one element's relationship to another element(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "at 8230 \8230;" below "may encompass both an orientation of" above "and" below ". Further, the devices may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when the terms "comprises" and/or "comprising" and variations thereof are used in this specification, the presence of stated features, integers, steps, operations, elements, components and/or groups thereof are stated but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. It is also noted that, as used herein, the terms "substantially," "about," and other similar terms are used as approximate terms and not as degree terms, and as such, are used to interpret inherent deviations in measured values, calculated values, and/or provided values that would be recognized by one of ordinary skill in the art.

Fig. 1 is a schematic structural view of a material taking and placing device according to an embodiment of the present disclosure; fig. 2 is another schematic structural view of a material taking and placing device according to an embodiment of the present disclosure; FIG. 3 is a schematic structural view of a retraction assembly according to one embodiment of the present disclosure in a retracted state; FIG. 4 is a schematic structural view of a retraction assembly in an extended state according to one embodiment of the present disclosure.

As shown in fig. 1 to 4, the material taking and placing device includes a substrate 100, a telescopic assembly 200, a suction assembly 300 and a clamping assembly 400.

The substrate 100 supports the telescopic assembly 200, the suction assembly 300 and the clamping assembly 400;

the suction assembly 300 is arranged on the telescopic assembly 200, and the suction assembly 300 is used for sucking materials; the clamping assembly 400 is used for clamping materials;

the suction assembly 300 and the gripper assembly 400 cooperate to hold material and the retraction assembly 200 allows for a telescoping motion as the suction assembly 300 holds material.

According to the material taking and placing device of one embodiment of the present disclosure, the retractable assembly 200 is telescopically disposed on the substrate 100, and the retractable assembly 200 is connected to the suction assembly 300, so that the suction assembly 300 makes a telescopic motion along with the retractable assembly 200.

Fig. 1 to 4 illustrate the telescopic assembly 200, and as shown in the figure, the telescopic assembly 200 includes a telescopic cylinder 210, the telescopic cylinder 210 is disposed on the upper end surface of the base plate 100 and is fixedly connected to the base plate 100, and the telescopic cylinder 210 generates a telescopic force.

The telescopic cylinder 210 is provided to be connected to the suction assembly 300 and transmits the generated telescopic force to the suction assembly 300.

According to the material taking and placing device of one embodiment of the present disclosure, the telescopic assembly 200 is further provided with a guide post 220, the guide post 220 is configured to be connected with the suction assembly 300, and guides the suction assembly 300 to move along the moving direction of the guide post 220;

the number of the guiding pillars 220 may be several, preferably, the number of the guiding pillars 220 is four in one embodiment of the present disclosure, four guiding pillars 220 are all arranged such that the lower end is fixedly connected with the suction assembly 300, and the upper ends of the four guiding pillars 220 penetrate through the substrate 100;

the telescopic cylinder 210 is connected with the suction assembly 300, so that the suction assembly 300 performs telescopic motion, and the lower end of the guide column 220 is fixedly connected with the suction assembly 300, so that the suction assembly 300 moves along the motion direction of the guide column when performing telescopic motion;

the telescopic assembly 200 is further provided with guide sleeves 230, the guide sleeves 230 correspond to the guide posts 220 one by one, the guide sleeves 220 are sleeved with the guide sleeves 230, and the guide sleeves 230 are disposed at positions where the guide posts 220 penetrate through the through holes of the substrate 100, so that the guide posts 220 are telescopically disposed on the substrate 100 through the guide sleeves 230.

Moreover, the telescopic assembly 200 is further provided with a pressure sensor 240, and the pressure sensor 240 is arranged between the telescopic cylinder 210 and the suction assembly 300 and used for monitoring pressure data generated when the telescopic assembly 200 and the suction assembly 300 suck materials and ensuring protection of the materials when the materials are sucked.

FIG. 3 shows a schematic view of the retraction assembly 200 in a retracted state; fig. 4 shows a schematic configuration of the extended state of the telescopic assembly 200.

As can be seen from fig. 3 and 4, the telescopic cylinder 210 further includes a telescopic shaft 211, and the telescopic cylinder 210 generates a telescopic force to extend or contract the telescopic shaft 211; the telescopic shaft 211 is fixedly connected with the upper end of the pressure sensor 240, so that the pressure sensor 240 extends or contracts; the lower end of the pressure sensor 240 is fixedly coupled to the suction assembly 300 such that the suction assembly 300 is extended or contracted.

The lower end surface of the pressure sensor 240 and the lower end surface of the guide post 220 are disposed on the same plane.

The lower end surface of the pressure sensor 240 and the lower end surface of the guide post 220 are configured to be fixedly connected with the suction assembly 300.

According to the material taking and placing device of one embodiment of the present disclosure, the suction assembly 300 is used for sucking materials, as shown in fig. 1 to 4, the suction assembly 300 includes a mounting plate 320, and the lower end surface of the pressure sensor 240 and the lower end surface of the guide column 220 are disposed on the upper side of the mounting plate 320;

the mounting plate 320 is a plate-shaped structure, and a vacuum chamber is arranged inside the mounting plate 320 and used for breaking vacuum to release materials after the materials are sucked.

The surface of the mounting plate 320 may preferably be provided with a soft material to protect the material.

A cover plate 330 is arranged on the upper side of the mounting plate 320, and the cover plate 330 is used for sealing the vacuum cavity of the mounting plate 320; the cover plate 330 is disposed on the upper side of the mounting plate 320, is fixedly connected to the lower end surface of the pressure sensor 240, and does not intersect with the lower end surface of the guide post 220.

As shown in fig. 1 to 4, the suction assembly 300 further includes a suction cup 310 and a suction plate 340; the suction plate 340 is fixed on the mounting plate 320, the suction cup 310 is arranged on the suction plate 340, and the suction cup 310 is used for sucking materials. The suction cup 310 and the cover plate 330 are disposed on both sides of the mounting plate 320.

The suction cup 310 may be provided in plurality, and the suction cup 310 is fixedly coupled to the lower side of the suction plate 340. The telescopic assembly 200 enables the suction assembly 300 to do telescopic motion and approach or be far away from the material, the suction cup 310 sucks the material when the suction assembly 300 approaches the material, and the suction cup 310 sucks the material to move the material when the suction assembly 300 is far away from the material;

or, when the suction assembly 300 sucks the material and moves the material to the next point location, the suction assembly 300 sucks the material to be close to the placement point location, and releases the material by breaking vacuum through the vacuum cavity of the mounting plate 320, so as to transport the material.

As shown in fig. 1 to 4, according to the material taking and placing device of an embodiment of the present disclosure, a clamping assembly 400 is further provided, and the clamping assembly 400 includes a clamping cylinder 410, a connecting rod 420, a connecting block 430, a claw clamp 440, and a slide rail 450.

The clamping assembly 400 is used for being matched with the suction assembly 300 to hold materials, after the suction assembly 300 sucks the materials, the clamping assembly 400 clamps the materials through the claw clamp 440, and on the basis of sucking the materials, the materials are secondarily fixed through clamping the materials; effectively realize the stable maintenance to the material, solve unexpected circumstances such as dropping that probably appears in the material transportation.

The clamping cylinder 410 provides a clamping force; the connecting rod 420 connects the clamping cylinder 410 and the connecting block 430; preferably, one end of the connecting rod 420 is hinged to the clamping cylinder 410, the other end of the connecting rod 420 is hinged to the connecting block 430, and the connecting rod 420 transmits the clamping force to the connecting block 430; and the connecting block 430 is fixedly connected with the clamping jaw 440, and the connecting block 430 moves along the sliding rail 450 after receiving the clamping force, so that the clamping jaw 440 moves along with the moving direction of the connecting block 430, and the clamping or releasing of the material by the clamping jaw 440 is realized.

The upper end of the jaw clamp 440 is fixed with respect to the connecting block 430, and the lower end of the jaw clamp 440 is configured such that when the suction cup 310 sucks the material, the lower end of the jaw clamp 440 can contact the material and clamp the material.

The claw clips 440 are arranged in pairs, and the number of the claw clips 440 corresponds to the number of the connecting blocks 430 one by one, in the material taking and placing device of one embodiment of the present disclosure, preferably, the claw clips 440 are arranged in a pair, and the number of the corresponding connecting blocks 430 is arranged in two;

preferably, the connecting rod 420 is provided with two connecting rods, which connect the two connecting blocks 430, respectively.

As shown in fig. 1 to 4, the chucking cylinder 410 is fixedly coupled to an upper side of the substrate 100; the connecting rod 420 is connected to the clamping cylinder 410, and the two connecting rods of the connecting rod 420 move along with the movement of the clamping cylinder 410, so that the connecting blocks 430 connected to the two connecting rods respectively move;

the two connecting blocks 430 are slidably disposed on the slide rails 450, and the slide rails 450 are fixedly connected to the substrate 100;

the two connecting blocks 430 approach or move away from each other along the sliding rails 450, so that the claw clamps 440 fixedly connected with the two connecting blocks 430 approach or move away from each other, thereby clamping the material and releasing the material.

As shown in fig. 1 to 4, the chucking assembly 400 is partially disposed in a space of the telescopic assembly 200 on the upper side of the substrate 100, and the chucking assembly 400 is partially disposed in a space of the suction assembly 300 and the side of the substrate 100. The telescopic assembly 200, the suction assembly 300 and the clamping assembly 400 are arranged to be compact in structure in space, so that the volume of the material taking and placing device is effectively reduced; the applicability of the pick and place device according to some embodiments of the present disclosure is improved for different devices. It is especially suitable for the industries of mobile phones and miniature electronic equipment.

The clamp assembly 400 may also be implemented using a cam mechanism or a jaw electric cylinder.

According to an embodiment of the present disclosure, a material taking and placing system 20 is also provided.

Fig. 5 shows a schematic structural diagram of the material taking and placing system 20, the material taking and placing system 20 includes a support plate 21 and the material taking and placing device 10, and the material taking and placing device 10 is supported by the support plate 21.

According to the material taking and placing system of one embodiment of the present disclosure, the supporting plate 21 is configured to support a plurality of material taking and placing devices 10;

the support plate 21 is provided with a plurality of ports, and the material taking and placing device 10 is arranged at the ports of the support plate 21;

the supporting plate 21 and the substrate 100 of the material taking and placing device 10 may be integrally formed.

Preferably, the support plate 21 is provided with two ports, and the two ports are respectively provided with one material taking and placing device 10;

the support plate 21 is also provided with a mounting part for connecting external equipment;

fig. 6 shows a schematic diagram of the pick-and-place system 20 in use with a robot.

According to an embodiment of the present disclosure, the material taking and placing system 20 improves the work efficiency of material transfer by matching with external equipment and setting multiple material taking and placing devices.

The material taking and placing system 20 can transport materials only by controlling the supporting plate 21 to rotate.

According to the material taking and placing device 10 and the material taking and placing system 20 of one embodiment of the present disclosure, a control part is further provided, and the control part includes PLA, a relay, and the like, and is used for controlling the operation of the material taking and placing device 10 and the material taking and placing system 20.

In the description of the present specification, reference to the description of "one embodiment/mode", "some embodiments/modes", "example", "specific example", or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment/mode or example is included in at least one embodiment/mode or example of the present application. In this specification, the schematic representations of the terms used above are not necessarily intended to be the same embodiment/mode or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/aspects or examples and features of the various embodiments/aspects or examples described in this specification can be combined and combined by one skilled in the art without conflicting therewith.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

It will be understood by those skilled in the art that the foregoing embodiments are merely for clarity of illustration of the disclosure and are not intended to limit the scope of the disclosure. Other variations or modifications may be made to those skilled in the art, based on the above disclosure, and still be within the scope of the present disclosure.

Claims (10)

1. The utility model provides a get and put material device which characterized in that includes:

a substrate;

a telescoping assembly supported by the base plate;

the suction assembly is arranged on the telescopic assembly and sucks materials;

a clamping assembly supported by the substrate, the clamping assembly clamping a material;

the suction assembly and the clamping assembly are matched to hold materials, and the telescopic assembly enables the suction assembly to do telescopic motion when holding the materials.

2. The pick and place device of claim 1, wherein the telescoping assembly comprises:

the telescopic cylinder provides telescopic force and transmits the telescopic force to the suction assembly;

the guide post is connected with the suction assembly;

the guide sleeve is sleeved on the guide post, and the guide post is telescopically arranged on the base plate through the guide sleeve.

3. The material handling device of claim 2, wherein the telescoping assembly further comprises a pressure sensor disposed between the telescoping cylinder and the suction assembly.

4. The pick and place device of claim 1, wherein the suction assembly comprises:

the sucking disc is used for sucking materials;

the mounting plate is used for connecting the sucker, and a vacuum cavity is formed in the mounting plate; and

a cover plate sealing the vacuum cavity of the mounting plate;

the sucking disc and the cover plate are respectively arranged on two sides of the mounting plate.

5. The pick and place device of claim 1, wherein the clamping assembly comprises:

a clamping cylinder providing a clamping force;

the connecting rod transmits clamping force to the connecting block;

the connecting block receives the clamping force to perform clamping movement;

the claw presss from both sides and establishes in the connecting block, when the connecting block carries out the centre gripping motion, the claw presss from both sides the clamp and gets or release the material.

6. The pick and place device of claim 5, wherein the connecting block and the jaw are arranged in pairs.

7. The pick-and-place device as claimed in claim 6, wherein the number of the connecting blocks corresponds to the number of the claw clips one by one.

8. The pick and place device of claim 5, wherein the clamping assembly further comprises a slide rail along which the connecting block moves during the clamping movement.

9. A material handling system, comprising:

a support plate;

the material taking and placing device is arranged on the supporting plate;

the supporting plate is arranged to support a plurality of material taking and placing devices, and the material taking and placing devices are arranged at one end of the supporting plate.

10. The pick and place system of claim 9, wherein the support plate is integrally formed with the base plate of the pick and place device.

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