CN217945916U

CN217945916U - Plastic uptake device suitable for makeup PCB

Info

Publication number: CN217945916U
Application number: CN202222182145.0U
Authority: CN
Inventors: 丁仙财; 梁宏伟
Original assignee: Guangdong Xinleguang Photoelectric Technology Co ltd
Current assignee: Guangdong Xinleguang Photoelectric Technology Co ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2022-12-02
Anticipated expiration: 2032-08-18

Abstract

The utility model relates to a plastic uptake device suitable for jointed boards and PCBs, which comprises a plastic uptake disc main body, wherein the plastic uptake disc main body is provided with a PCB accommodating groove; the PCB accommodating groove comprises a first accommodating layer and a second accommodating layer; the first accommodating layer and the second accommodating layer have a height difference; the first accommodating layer is provided with a plurality of element avoiding grooves, and the second accommodating layer is provided with a plurality of supporting edges; the second accommodating layer is provided with a plurality of pressure-proof limiting columns; the pressure-proof limiting column is higher than the supporting edge. The utility model discloses a plastic uptake device suitable for makeup PCB can load two PCB branch boards simultaneously, and effectively prevents that two PCB from dividing board surface to take place to bump, scratch, has still practiced thrift production space, reduction in production cost.

Description

Plastic uptake device suitable for makeup PCB

Technical Field

The utility model relates to a LED equipment production technical field that is shaded especially relates to a plastic uptake device suitable for makeup PCB.

Background

As shown in fig. 1 and fig. 2, in the production process of the LED backlight product, the jointed PCB 40 needs to be split into two PCB sub-boards 50. When the jointed PCB 40 is divided into two PCB sub-boards 50, the two PCB sub-boards 50 are easy to be damaged and scratched during the processes of picking, placing and transporting.

If two sub-PCBs (printed Circuit Board) 50 are placed in the sub-boards of the two blister devices, the number of the blister devices to be occupied is doubled, the production cost is increased, and the space required by production is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, providing a plastic uptake device suitable for makeup PCB, can load two PCB branch boards simultaneously, and prevent effectively that two PCB from dividing board surface to take place to bump, scratch, still practiced thrift production space, reduction in production cost.

The purpose of the utility model is realized through the following technical scheme:

a plastic uptake device suitable for jointed boards and PCBs comprises a plastic uptake disc main body, wherein a PCB accommodating groove is formed in the plastic uptake disc main body;

the PCB accommodating groove comprises a first accommodating layer and a second accommodating layer; the first accommodating layer and the second accommodating layer have a height difference;

the first accommodating layer is provided with a plurality of element avoiding grooves, and the second accommodating layer is provided with a plurality of supporting edges;

the second accommodating layer is provided with a plurality of pressure-proof limiting columns; the pressure-proof limiting column is higher than the supporting edge.

In one embodiment, the plastic sucking disc main body is of a quadrilateral structure;

and two side edges of the plastic sucking disc main body are respectively provided with a first chamfer and a second chamfer, and the first chamfer is different from the second chamfer in structure.

In one embodiment, the first chamfer is a rounded chamfer.

In one embodiment, the second chamfer is a chamfer.

In one embodiment, the two ends of the PCB accommodating groove are respectively provided with a pick-and-place avoiding groove.

In one embodiment, the depth of the pick-and-place avoiding groove is deeper than the first accommodating layer.

In one embodiment, four corners of the PCB receiving groove are rounded.

In one embodiment, the plastic sucking disc body is a PET disc body.

In one embodiment, the surface resistance of the plastic sucking disc main body is 10^4 omega-10 ^9 omega.

In one embodiment, the pressure-proof limiting column is not higher than the top surface of the plastic sucking disc main body.

Compared with the prior art, the utility model at least possesses following technological effect:

the utility model discloses a divide into two first containing layer and the second containing layer that have the difference in height with the PCB accepting groove and be used for respectively one-to-one to hold two PCB boards after the branch board, realize that a plastic uptake device can hold two PCB branch boards simultaneously, reduce the use of plastic uptake device, practice thrift space, save material; when the PCB sub-boards are placed, the first PCB sub-board components are placed downwards on the first containing layer, and the components of the first PCB sub-boards are avoided through the component avoiding grooves, so that the components of the first PCB sub-boards are prevented from being scratched; the components of the second PCB sub-board are placed on the second accommodating layer in an upward mode, the back face of the first PCB sub-board is placed in a fit mode with the back face of the second PCB sub-board, and the components of the second PCB sub-board are prevented from being scratched;

when the plastic suction devices containing the PCB sub-boards are stacked in a stacked mode, the pressure-proof limiting columns just abut against the upper plastic suction device, and the upper plastic suction device is prevented from scratching components of a second PCB sub-board placed in the lower plastic suction device; the plastic suction device containing the PCB sub-boards can be stacked in a stacked manner, and the space utilization rate is improved; the problem that components of the second PCB sub-board are scratched due to stacking of the plastic suction devices is also avoided;

when the plastic suction devices are in an empty tray state, the plastic suction devices can be tightly and stably stacked and placed by stacking the plastic suction devices in the same direction, so that the space utilization rate is improved; when the blister devices are loaded with the PCB sub-boards, the blister devices can still be stacked, but the two adjacent blister devices are required to be stacked in a positive and negative staggered manner, namely the two adjacent blister devices rotate 180 degrees; thereby avoiding the PCB sub-board of the next layer from being crushed by the plastic suction device of the previous layer;

the taking and placing avoiding groove is arranged, so that the PCB is convenient to take and place, and the efficiency is improved;

the rounded corners of the PCB accommodating grooves are arranged, so that scratches on the corners of the PCB sub-boards are avoided;

the plastic suction device is light and durable in structure, has an anti-static effect, can well protect components of the PCB sub-board, and prevents the components of the PCB sub-board from being damaged.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic structural view of a PCB before being separated;

FIG. 2 is a schematic diagram of a first PCB sub-assembly of the PCB shown in FIG. 1;

fig. 3 is a schematic structural diagram (one) of a blister device suitable for jointed boards PCB according to the present invention;

fig. 4 is a schematic structural view (ii) of the blister device for jointed boards PCB of the present invention;

fig. 5 is a schematic structural view (iii) of the blister device suitable for the jointed PCB of the present invention.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 3, the utility model discloses a blister pack 10 suitable for makeup PCB, including blister tray main part 20, PCB accepting groove 30 has been seted up to blister tray main part 20.

As shown in fig. 3-5, in the present embodiment, the PCB housing groove 30 includes a first housing layer 100 and a second housing layer 200. The first receiving layer 100 and the second receiving layer 200 have a height difference. The first receiving layer 100 is formed with a plurality of device avoiding grooves 300, and the second receiving layer 200 is formed with a plurality of supporting ribs 400. In the present embodiment, the first receiving layer 100 is lower than the second receiving layer 200. The PCB accommodating groove 30 is divided into the first accommodating layer 100 and the second accommodating layer 200 with height difference for respectively accommodating the two PCB sub-boards 50 after the sub-boards are correspondingly arranged one by one, so that one blister device 10 can simultaneously accommodate the two PCB sub-boards 50, the use of the blister device 10 is reduced, the space is saved, and the materials are saved; when the PCB sub-boards are placed, the first PCB sub-board components are placed on the first accommodating layer 100 downwards, and the components of the first PCB sub-boards are avoided through the component avoiding grooves 300, so that the components of the first PCB sub-boards are prevented from being scratched; the components and parts of the second PCB sub-board are placed on the second containing layer 200 upwards, the back of the first PCB sub-board is attached to the back of the second PCB sub-board, and the components and parts of the second PCB sub-board are prevented from being scratched.

As shown in fig. 4, in the present embodiment, the second receiving layer 200 is provided with a plurality of pressure-proof limiting pillars 500; the pressure-proof limiting column 500 is higher than the supporting rib 400. The pressure-proof limiting column 500 is not higher than the top surface of the plastic sucking disc main body 20. When the plastic suction devices 10 containing the PCB sub-boards are stacked in a stacked mode, the pressure-proof limiting column 500 just props against the upper plastic suction device 10, and the upper plastic suction device 10 is prevented from scratching components of a second PCB sub-board placed in the lower plastic suction device 10; the blister device 10 containing the PCB sub-boards can be stacked in a stacked manner, and the space utilization rate is improved; and the problem that the components of the second PCB sub-board are scratched due to the stacking of the plastic suction devices 10 is also avoided.

As shown in fig. 3 and 4, the plastic chuck body 20 has a quadrangular structure in a preferred embodiment. The two sides of the plastic sucking disc main body 20 are respectively provided with a first chamfer 600 and a second chamfer 700, and the first chamfer 600 and the second chamfer 700 have different structures. In this embodiment, the first chamfer 600 is a circular-arc chamfer. The second chamfer 700 is a chamfer.

When the plastic suction devices 10 are in an empty tray state, the plastic suction devices 10 can be tightly and stably stacked and placed by stacking the plastic suction devices 10 in the same direction, so that the space utilization rate is improved; when the blister devices 10 are loaded with the PCB sub-boards 50, the blister devices 10 can still be stacked, but two adjacent blister devices 10 are stacked in a positive and negative staggered manner, that is, the two adjacent blister devices 10 rotate 180 degrees; thereby preventing the PCB sub-board 50 of the next layer from being crushed by the blister pack 10 of the previous layer.

As shown in fig. 3, in the present embodiment, the PCB accommodating groove 30 is respectively provided with a pick-and-place avoiding groove 800 at two ends thereof. The pick-and-place avoiding groove 800 is deeper than the first receiving layer 100. Get through setting up and put and dodge groove 800, make things convenient for getting of PCB minute board 50 to put, raise the efficiency.

As shown in fig. 5, in the present embodiment, four corners of the PCB receiving groove 30 are rounded 900. The rounded corners 900 of the PCB receiving grooves 30 are formed to prevent scratches from being formed on the corners of the PCB sub-board 50.

As shown in fig. 3, in the present embodiment, the plastic tray body 20 is a PET tray body. The surface resistance of the plastic sucking disc main body 20 is 10^4 omega-10 ^9 omega. The plastic suction device 10 has a light and durable structure, has an antistatic effect, can well protect components of the PCB sub-board 50, and prevents the components of the PCB sub-board 50 from being damaged.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A plastic uptake device suitable for jointed boards and PCBs is characterized by comprising a plastic uptake disc main body, wherein a PCB accommodating groove is formed in the plastic uptake disc main body;

2. The plastic uptake device suitable for jointed boards and PCBs as claimed in claim 1, wherein the plastic uptake disc main body is of a quadrilateral structure;

3. The blister device for jointed boards PCBs as claimed in claim 2, wherein the first chamfer is a rounded chamfer.

4. The blister device for jointed boards PCB as claimed in claim 2, wherein the second chamfer is a chamfer.

5. The plastic uptake device for jointed boards and PCBs as claimed in claim 1, wherein the two ends of the PCB receiving groove are respectively opened with access avoiding grooves.

6. The suction plastic device suitable for jointed boards and PCBs as claimed in claim 5, wherein the depth of the access avoiding groove is deeper than the first accommodating layer.

7. The suction plastic device for jointed boards, PCBs, as claimed in claim 1, wherein the PCB receiving groove has rounded corners.

8. The suction plastic device suitable for jointed boards and PCBs as claimed in claim 1, wherein the plastic tray body is a PET tray body.

9. The suction plastic device suitable for jointed boards and PCBs as claimed in claim 1, wherein the compression-proof limiting column is not higher than the top surface of the main body of the suction plastic tray.