CN217904884U - Intelligent power module and electrical equipment - Google Patents
Intelligent power module and electrical equipment Download PDFInfo
- Publication number
- CN217904884U CN217904884U CN202221732688.9U CN202221732688U CN217904884U CN 217904884 U CN217904884 U CN 217904884U CN 202221732688 U CN202221732688 U CN 202221732688U CN 217904884 U CN217904884 U CN 217904884U
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- Prior art keywords
- circuit board
- filling layer
- insulating material
- power module
- hole
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- 239000011810 insulating material Substances 0.000 claims abstract description 50
- 238000003466 welding Methods 0.000 claims description 14
- 238000002955 isolation Methods 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 8
- 238000002788 crimping Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 11
- 238000004880 explosion Methods 0.000 description 10
- 238000004382 potting Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses an intelligent power module and electrical equipment belongs to the electrical technology field. The intelligent power module includes: the first circuit board is provided with at least one power chip; the electric connecting piece is arranged on one side of the first circuit board, which is provided with the power chip; the second circuit board penetrates through the electric connecting piece and is arranged at intervals with the first circuit board; the first filling layer is arranged on one side of the first circuit board and wraps the power chip; the second filling layer is arranged on one side of the first filling layer, which is far away from the first circuit board; the first filling layer is made of a first insulating material, the second filling layer is made of a second insulating material, and the hardness of the second insulating material after curing is larger than that of the first insulating material after curing. The utility model provides the high security of IPM.
Description
Technical Field
The utility model relates to an electrical technology field, in particular to intelligent power module and electrical equipment.
Background
In the related art, an Intelligent Power Module (IPM) is a Power switch device, and has the advantages of small size, high Power density, and low cost.
One known IPM includes: the power circuit comprises a power circuit substrate, a built-in functional circuit board and a packaging shell; the built-in functional circuit board is directly welded on a terminal extending out of the power circuit substrate, then the packaging shell is covered on the built-in functional circuit board, the bottom opening of the packaging shell is blocked through the power circuit substrate, and finally glue is poured and cured to form a stack laminated packaging structure. During use, the power chip on the power circuit substrate in the IPM has a risk of explosion due to control strategy or interference.
At present, the existing IPM does not have an explosion-proof function, and when a power chip on a power circuit substrate explodes, explosion impact can damage an insulation isolation system on the surface of the circuit board with a built-in function, so that personal safety of a user is threatened.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an intelligence power module and electrical equipment, aim at solving above-mentioned current IPM and do not have explosion-proof function, when the chip in the module explodes, can destroy the insulating isolation system on built-in function circuit board surface, threatens the problem of user's personal safety.
In order to achieve the above object, the utility model provides an intelligent power module, include:
a first circuit board provided with at least one power chip;
at least one electric connector, wherein the electric connector is arranged on one side of the first circuit board, on which the power chip is arranged;
the second circuit board penetrates through the electric connecting piece and is arranged at intervals with the first circuit board;
the first filling layer is arranged on one side of the first circuit board and wraps the power chip arranged on the first circuit board;
the second filling layer is arranged on one side, away from the first circuit board, of the first filling layer;
the first filling layer is made of a first insulating material, the second filling layer is made of a second insulating material, and the hardness of the second insulating material after curing is larger than that of the first insulating material after curing.
In one embodiment, the upper surface and the lower surface of the second circuit board are both provided with electronic components; the smart power module further comprises:
the third filling layer is arranged on one side, away from the first filling layer, of the second filling layer, and wraps the electronic component arranged on the lower surface of the second circuit board;
the fourth filling layer is arranged on the upper surface of the second circuit board and wraps the electronic component arranged on the upper surface of the second circuit board;
the third filling layer and the fourth filling layer are made of a second insulating material; or the third filling layer is made of a second insulating material, and the fourth filling layer is made of a first insulating material; or, the third filling layer and the fourth filling layer both adopt a first insulating material.
In one embodiment, the first insulating material is silicone gel.
In one embodiment, the second insulating material is a resin.
In one embodiment, a plurality of power chips are arranged on one surface of the first circuit board facing the second circuit board, and the plurality of power chips form at least one power circuit;
the electronic components on the upper surface and the lower surface of the second circuit board form a primary side functional circuit, an isolation element and a secondary side functional circuit, the input end of the primary side functional circuit is electrically connected with the power circuit through the electric connecting piece, and the output end of the primary side functional circuit is electrically connected with the secondary side functional circuit through the isolation element.
In one embodiment, the second circuit board is provided with at least one first through hole corresponding to the at least one electrical connector;
the electric connecting piece penetrates through the corresponding first through hole and is electrically and mechanically connected with the second circuit board at the first through hole in a welding or crimping mode.
In one embodiment, the electrical connector comprises:
the bottom end of the welding seat is welded on the first circuit board;
the electric connection terminal, electric connection terminal's bottom is located in the welding hole of welding seat, electric connection terminal's the other end passes and corresponds first through-hole, and first through-hole department through the mode of welding or crimping with second circuit board realizes electric connection and mechanical connection.
In one embodiment, the smart power module further includes:
the first circuit board blocks the bottom opening of the shell, an accommodating space is defined by the first circuit board and the first circuit board, and the second circuit board is positioned in the accommodating space;
the shell is provided with a plurality of second through holes, and the top ends of part of the electric connecting pieces penetrate through the second through holes and extend out of the shell;
a first hole filling and sealing hole is formed in the top plate of the shell, and a second hole filling and sealing hole is formed in the position, corresponding to the first hole filling and sealing hole, of the second circuit board.
In a second aspect, the present application also provides an electrical device comprising the smart power module of any one of the above.
The utility model discloses technical scheme is through at least one electronic components of first circuit board one side of first filling layer cladding to deviate from one side second filling layer of first circuit board at first filling layer, wherein, first filling layer adopts first insulation material to make, the second filling layer adopts second insulation material to make, just hardness after the second insulation material solidification is greater than hardness after the first insulation material solidification. Therefore, in the embodiment, on the basis of the existing first filling layer formed by using the first insulating material, the second filling layer is formed on the side, away from the first circuit board, of the first filling layer by using the second insulating material with higher hardness, so that the second filling layer can play an explosion-proof role, and therefore when a power chip on the first circuit board is subjected to accidents such as explosion, the explosion shock wave is isolated on one side of the second filling layer, the reinforced insulation isolation system for preventing the explosion shock wave from damaging the surface of the second circuit board is avoided, and the safety of the IPM is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic diagram of an embodiment of an intelligent power module according to the present invention;
fig. 2 is an exploded view of an embodiment of the smart power module of the present invention, wherein the filling layer is not shown.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name(s) |
| 10 | |
20 | |
| 30 | |
40 | |
| 50 | Third filling layer | 60 | A |
| 70 | |
11 | |
| 21 | First through |
71 | Second through |
| 22 | Second filling and sealing hole | 72 | A first filling and sealing hole |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "secured" are to be construed broadly, and thus, for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The intelligent power module is provided, on the basis of the existing first filling layer 30 formed by using a first insulating material, the second filling layer 40 wrapping the second circuit board 20 is formed by using a second insulating material with higher hardness, the second filling layer 40 can play insulating protection and explosion-proof roles, so that when the electronic components on the first circuit board 10 are subjected to accidents such as explosion, the insulating isolation system on the second circuit board 20 and the components on the second circuit board 20 are prevented from being influenced, the reliability of the reinforced insulating capability of the IPM and the safety of the IPM are improved on one hand, and the loss caused by the electronic explosion on the first circuit board 10 is reduced on the other hand.
The concept of the present application is further illustrated below with reference to some specific examples.
The present application provides an intelligent power module.
Referring to fig. 1, in the present embodiment, an intelligent power module includes:
a first circuit board 10, the first circuit board 10 being provided with at least one power chip;
at least one electric connector 11, wherein the electric connector 11 is arranged on one side of the first circuit board 10, which is provided with the power chip;
the second circuit board 20 is arranged through the electric connector 11, and is spaced from the first circuit board 10;
the first filling layer 30 is arranged on one side of the first circuit board 10, and the first filling layer 30 wraps the power chip arranged on the first circuit board 10;
a second filling layer 40, wherein the second filling layer 40 is arranged on one side of the first filling layer 30, which is far away from the first circuit board 10;
the first filling layer 30 is made of a first insulating material, the second filling layer 40 is made of a second insulating material, and the hardness of the second insulating material after curing is greater than that of the first insulating material after curing.
In this embodiment, the first insulating material includes, but is not limited to, an insulating material with a good thermal conductivity, such as silicone gel; the second insulating material includes, but is not limited to, an insulating material such as resin, which has a high hardness after curing, and thus the second filling layer 40 has an explosion-proof function. Because the second filling layer 40 with the explosion-proof function is arranged on the side, away from the first circuit board 10, of the first filling layer 30, the second filling layer 40 can protect the insulation isolation system on the surface of the second circuit board 20 from being damaged when the chip explodes, and therefore the safety of the intelligent functional module is improved.
In this embodiment, the smart power module may be formed by secondary potting or tertiary potting. When the intelligent power module is formed after secondary encapsulation, the power device on the upper surface of the first circuit board 10 is covered by the first insulating material to form the first filling layer 30 in the primary encapsulation, and the electronic components on the upper and lower surfaces of the second circuit board 20 are covered by the second insulating material to form the second filling layer 40, the third filling layer 50 and the fourth filling layer 60 in the secondary encapsulation. When the intelligent power module is formed after three times of encapsulation, a first filling layer 30 is formed by covering the power device on the upper surface of the first circuit board 10 with a first insulating material in one time of encapsulation, a second filling layer 40 is formed on one side, away from the first circuit board 10, of the first filling layer 30 in the second time of encapsulation, a gap is formed between the second filling layer 40 and the electronic component arranged on the lower surface of the second circuit board 20, and a third filling layer 50 and a fourth filling layer 60 are formed on the lower surface and the upper surface of the second circuit board 20 respectively in the third time of encapsulation with the first insulating material; or, the first filling layer 30 is formed by covering the power device on the upper surface of the first circuit board 10 with the first insulating material in the first potting, the second filling layer 40 and the third filling layer 50 are formed on one side, away from the first circuit board 10, of the first filling layer 30 in the second potting with the second insulating material in the second potting, and the fourth filling layer 60 is formed on the upper surface of the second circuit board 20 in the third potting with the first insulating material in the third potting. It should be noted that, in the present application, the first, second, third, and fourth filling layers are only used for convenience of describing different embodiments, and when two adjacent layers use the same insulating material, the two layers are not actually layered, but formed by one-time encapsulation.
Preferably, as shown in fig. 1, electronic components are disposed on both the upper and lower surfaces of the second circuit board 20; the smart power module further comprises:
the third filling layer 50 is arranged on one side of the second filling layer 40, which is far away from the first filling layer 30, and the third filling layer 50 wraps the electronic components arranged on the lower surface of the second circuit board 20;
the fourth filling layer 60 is arranged on the upper surface of the second circuit board 20, and wraps the electronic components arranged on the upper surface of the second circuit board 20;
wherein, the third filling layer 50 and the fourth filling layer 60 both adopt a second insulating material; alternatively, the third filling layer 50 is made of a second insulating material, and the fourth filling layer 60 is made of a first insulating material; alternatively, the third filling layer 50 and the fourth filling layer 60 both use the first insulating material.
Preferably, a plurality of power chips are disposed on a surface of the first circuit board 10 facing the second circuit board 20, and the plurality of power chips constitute at least one power circuit;
the electronic components on the upper and lower surfaces of the second circuit board 20 constitute a primary side functional circuit, an isolation element and a secondary side functional circuit, the input end of the primary side functional circuit is electrically connected with the power circuit through the electric connector 11, and the output end of the primary side functional circuit is electrically connected with the secondary side functional circuit through the isolation element.
In this embodiment, the first circuit board 10 includes, but is not limited to, an aluminum-based resin copper clad laminate, a copper-based resin copper clad laminate, or a double-sided copper clad ceramic substrate, and a plurality of power chips are soldered on the first circuit board 10, and the plurality of power chips constitute a power circuit unit including, but not limited to, an inverter, a rectifier, etc.; the first filler layer 30 encapsulates the power circuit.
In the present embodiment, the second circuit board 20 is provided with a primary-side functional circuit electrically connected to the power circuit on the first circuit board 10 through the electrical connector 11, and a secondary-side functional circuit electrically connected to the primary-side functional circuit through an isolation element. Preferably, the primary side functional circuit includes, but is not limited to, an inverter driving circuit and/or a rectifier driving circuit; the secondary side functional circuit includes, but is not limited to, a signal sampling circuit, an overcurrent/overvoltage protection circuit, etc.
In this embodiment, the second circuit board 20 is provided with at least one first through hole 21 corresponding to at least one of the electrical connectors 11; the electric connector 11 passes through the corresponding first through hole 21, and is electrically and mechanically connected with the second circuit board 20 at the first through hole 21 by means of soldering or crimping. Preferably, said electrical connection means 11 comprise:
the bottom end of the welding seat is welded on the first circuit board 10;
the electric connection terminal, electric connection terminal's bottom is located in the welding hole of welding seat, electric connection terminal's the other end passes and corresponds first through-hole 21, and first through-hole 21 department through the mode of welding or crimping with second circuit board 20 realizes electric connection and mechanical connection.
Referring to fig. 2, in an embodiment, the smart power module further includes:
the bottom of the shell 70 is provided with an opening, the first circuit board 10 seals the opening at the bottom of the shell 70 and defines an accommodating space with the first circuit board 10, and the second circuit board 20 is located in the accommodating space;
a plurality of second through holes 71 are formed in the shell 70, and the top ends of part of the electric connectors 11 penetrate through the second through holes 71 and extend out of the shell 70;
a first hole 72 is formed in a top plate of the housing 70, and a second hole 22 is formed in a position of the second circuit board 20 corresponding to the first hole 72.
In this embodiment, the smart power module may be formed by secondary potting or tertiary potting.
During packaging, the electrical connector 11 on the first circuit board 10 penetrates through the through hole on the second circuit board 20, the second circuit board 20 is fixed above the first circuit board 10 through the supporting tool, then the second circuit board 20 is welded or pressed on the electrical connector 11, then the shell 70 is mounted on the first circuit board 10, and then the encapsulation is performed through the first encapsulation hole 72 and the second encapsulation hole 22.
It can be seen from the above that, in the embodiment, on the basis of the existing first filling layer 30 formed by using the first insulating material, the second filling layer 40 is formed on the side of the first filling layer 30 away from the first circuit board 10 by using the second insulating material with higher hardness after being cured, so that the second filling layer 40 can play an explosion-proof role, and thus when a power chip on the first circuit board 10 is subjected to an accident such as an explosion, the explosion shock wave is isolated on one side of the second filling layer 40, the explosion shock wave is prevented from damaging the reinforced insulation isolation system on the surface of the second circuit board 20, and the safety of the IPM is improved.
In a second aspect, the present application also provides an electrical device comprising a smart power module as described above. The specific structure of the intelligent power module refers to the above embodiments, and since the electrical appliance adopts all the technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated here.
The electrical device includes, but is not limited to, a frequency converter, which is not limited in this embodiment.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (9)
1. A smart power module, comprising:
the power supply comprises a first circuit board, a second circuit board and a power supply, wherein the first circuit board is provided with at least one power chip;
at least one electric connector, wherein the electric connector is arranged on one side of the first circuit board, which is provided with the power chip;
the second circuit board penetrates through the electric connecting piece and is arranged at an interval with the first circuit board;
the first filling layer is arranged on one side of the first circuit board and wraps the power chip arranged on the first circuit board;
the second filling layer is arranged on one side, away from the first circuit board, of the first filling layer;
the first filling layer is made of a first insulating material, the second filling layer is made of a second insulating material, and the hardness of the second insulating material after curing is larger than that of the first insulating material after curing.
2. The intelligent power module of claim 1, wherein electronic components are disposed on both the upper and lower surfaces of the second circuit board; the smart power module further includes:
the third filling layer is arranged on one side, away from the first filling layer, of the second filling layer and wraps the electronic component arranged on the lower surface of the second circuit board;
the fourth filling layer is arranged on the upper surface of the second circuit board and wraps the electronic component arranged on the upper surface of the second circuit board;
the third filling layer and the fourth filling layer are made of a second insulating material; or the third filling layer is made of a second insulating material, and the fourth filling layer is made of a first insulating material; or, the third filling layer and the fourth filling layer both adopt a first insulating material.
3. The smart power module of claim 1 wherein the first insulating material is a silicone gel.
4. The smart power module as recited in claim 1 wherein the second insulating material is a resin.
5. The smart power module as claimed in claim 2, wherein a plurality of power chips are disposed on a side of the first circuit board facing the second circuit board, and the plurality of power chips constitute at least one power circuit;
the electronic components on the upper surface and the lower surface of the second circuit board form a primary side functional circuit, an isolation element and a secondary side functional circuit, the input end of the primary side functional circuit is electrically connected with the power circuit through the electric connecting piece, and the output end of the primary side functional circuit is electrically connected with the secondary side functional circuit through the isolation element.
6. The intelligent power module as claimed in claim 1, wherein the second circuit board has at least one first through hole corresponding to the at least one electrical connector;
the electric connecting pieces penetrate through the corresponding first through holes and are electrically and mechanically connected with the second circuit board at the first through holes in a welding or crimping mode.
7. The smart power module of claim 6, wherein the electrical connection comprises:
the bottom end of the welding seat is welded on the first circuit board;
the electric connection terminal, electric connection terminal's bottom is located in the welding hole of welding seat, electric connection terminal's the other end passes and corresponds first through-hole, and first through-hole department through the mode of welding or crimping with second circuit board realizes electric connection and mechanical connection.
8. The smart power module of claim 1, further comprising:
the first circuit board blocks the bottom opening of the shell, an accommodating space is defined by the first circuit board and the first circuit board, and the second circuit board is positioned in the accommodating space;
the shell is provided with a plurality of second through holes, and the top ends of part of the electric connecting pieces penetrate through the second through holes and extend out of the shell;
a first hole filling and sealing hole is formed in the top plate of the shell, and a second hole filling and sealing hole is formed in the position, corresponding to the first hole filling and sealing hole, of the second circuit board.
9. An electrical device comprising the smart power module of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2022/115892 WO2024007432A1 (en) | 2022-06-16 | 2022-08-30 | Intelligent power module and electrical device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2022215131265 | 2022-06-16 | ||
| CN202221513126 | 2022-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217904884U true CN217904884U (en) | 2022-11-25 |
Family
ID=84133740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221732688.9U Active CN217904884U (en) | 2022-06-16 | 2022-07-06 | Intelligent power module and electrical equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN217904884U (en) |
| WO (1) | WO2024007432A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023240759A1 (en) * | 2022-06-16 | 2023-12-21 | 苏州汇川控制技术有限公司 | Intelligent power module and electrical device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270469A (en) * | 2007-04-19 | 2008-11-06 | Mitsubishi Electric Corp | Power module and its manufacturing method |
| JP6820934B2 (en) * | 2016-09-01 | 2021-01-27 | 三菱電機株式会社 | Power module and its manufacturing method |
| CN109300883B (en) * | 2018-10-31 | 2024-07-12 | 广东美的制冷设备有限公司 | High-integration electric control board and electric appliance |
| CN209183542U (en) * | 2018-12-25 | 2019-07-30 | 广东美的白色家电技术创新中心有限公司 | Intelligent power module and equipment |
| CN114388490A (en) * | 2022-01-14 | 2022-04-22 | 绍兴中芯集成电路制造股份有限公司 | Packaging structure and packaging method of intelligent power module |
-
2022
- 2022-07-06 CN CN202221732688.9U patent/CN217904884U/en active Active
- 2022-08-30 WO PCT/CN2022/115892 patent/WO2024007432A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023240759A1 (en) * | 2022-06-16 | 2023-12-21 | 苏州汇川控制技术有限公司 | Intelligent power module and electrical device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024007432A1 (en) | 2024-01-11 |
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