CN217884241U - Heat sink device - Google Patents

Abstract

The utility model discloses a heat abstractor, laminate each other the periphery of first thin slice and second thin slice sealed, and set up each fin between first thin slice and second thin slice with the vacuum laminating mode, and the fin is formed with a plurality of through-holes, when first thin slice, the second thin slice, and each fin vacuum laminating back, make each through-hole and two-layer thin slice or fin form a plurality of cavitys, when heat abstractor received external force and when crooked, there is not the bonding layer therefore can produce the dislocation according to stress between each fin, heat conduction fluid alright change the circulation efficiency of its phase transition according to cavity structures, in order to dispel the heat to electron device fast.

Description

Heat sink device

Technical Field

The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device with stacked cavities formed by staggered fins to improve heat dissipation efficiency.

Background

Electronic devices have become an indispensable helper in life, such as mobile phones and tablet phones, and for carrying and using, electronic devices tend to be light, thin and multifunctional, and thus, the density of electronic components in the electronic devices is increased, and local overheating is easily caused after long-term or high-frequency use.

At present, the heat dissipation method of the electronic device mainly utilizes simple methods such as opening holes, heat conduction, heat convection or disposing heat pipes, for example: taiwan patent TWM593721U, TWM610814U, however, these heat dissipation methods have not been able to satisfy the heat generated by the high-performance chip and the heat dissipation method of disposing a heat pipe in a light and thin electronic device, which results in the reduction of the heat dissipation efficiency inside the electronic device; therefore, how to effectively dissipate heat of a thin and precise electronic device is a problem to be solved.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems existing in the prior art, the utility model provides a heat dissipation device for improving the heat dissipation efficiency of a light and thin precise electronic device.

To achieve the above object, the heat dissipation device of the present invention mainly has a three-layer structure of a first thin sheet, a second thin sheet, and at least one heat sink, wherein the peripheries of the first thin sheet and the second thin sheet are mutually bonded and sealed, and each heat sink is disposed between the first thin sheet and the second thin sheet in a vacuum bonding manner, wherein each heat sink is formed with a plurality of through holes, and forms a plurality of cavities with the two thin sheets or the heat sinks, each cavity is filled with a heat conductive fluid, when the heat dissipation device is close to a heat source of an electronic device, the heat conductive fluid in each cavity gradually generates a phase change to dissipate heat of the electronic device; when the heat sink is bent by external force, no adhesive layer exists between the heat sinks, so that dislocation can be generated according to stress, the cavities are overlapped to enlarge the circulation space of the heat-conducting fluid, and the heat-conducting fluid can change the phase change circulation efficiency according to the cavity structure, so as to quickly dissipate heat of the electronic device.

The radiating fins are two, the two radiating fins are mutually overlapped, and the through holes of the two radiating fins are arranged in a vertically staggered manner, so that the cavities are formed by the through holes and the first thin sheet, the second thin sheet or the two mutually overlapped radiating fins.

The through holes are S-shaped, when the radiating fins are bent under the action of external force, dislocation is generated according to stress, the through holes are not staggered up and down, partial overlapping is generated, and a combined cavity with communicated cavities is formed.

Wherein, the through holes are hexagonal and are closely arranged in a honeycomb structure.

Wherein, one or a combination of one or a plurality of salient points, retaining walls and ribs which are arranged in a radial mode are formed in part or all of the through holes.

One or more flow guide parts are formed in part or all of the through holes, a first outlet and a second outlet are formed in the flow guide parts, and the first outlet and the second outlet are used for enabling the heat-conducting fluid to form a heat circulation path after the phase change reaction.

Wherein, the first outlet is gradually contracted from bottom to top, and the second outlet is gradually contracted from top to bottom.

One or more gaps are formed among part or all of the through holes so that the heat conduction fluid forms a heat circulation path after the phase change reaction.

Wherein, each gap is in a tapered shape from left to right or from right to left.

Wherein, the through holes are rhombohedrons and have a gradient with the surface of the heat sink.

Wherein, the first sheet and the second sheet are an aluminum foil bag which is formed integrally and is provided with an opening.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is an exploded view of the heat dissipating device of the present invention;

FIG. 2 is a structural view of the heat dissipating device of the present invention;

FIG. 3 isbase:Sub>A schematic cross-sectional view of the cross-section line A-A of the present invention;

fig. 4 is an exploded view of another heat dissipation device of the present invention;

FIG. 5 is a structural view of another heat dissipating device of the present invention;

fig. 6 is a schematic view of the heat dissipation device of the present invention;

FIG. 7 is a schematic cross-sectional view of line B-B of the present invention;

fig. 8 is a schematic view of another heat dissipation device according to the present invention;

FIG. 9 is a schematic cross-sectional view of the cross-section line C-C of the present invention;

fig. 10 shows an embodiment of a heat dissipation device of the present invention;

fig. 11 is another embodiment of the heat dissipation device of the present invention;

fig. 12 is another embodiment of the heat dissipation device of the present invention;

fig. 13 is another embodiment of the heat dissipation device of the present invention;

fig. 14 is a structural view of another heat dissipating device of the present invention;

fig. 15 shows another embodiment of the heat dissipation device of the present invention;

fig. 16 is a structural view of another heat dissipating device of the present invention;

fig. 17 is a schematic cross-sectional view of the cross-sectional line D-D of the present invention.

Description of the reference numerals

1. First sheet

2. Second sheet

3. Heat sink

31 through hole

32. Gap(s)

4. Cavity body

4a overlapping cavity

4b combined cavity

41. Salient points

42. Retaining wall

43. Convex rib

44. Flow guiding part

441. A first outlet

442. A second outlet

45. Channel

5. Heat transfer fluid

51. A first fluid

52. A second fluid.

Detailed Description

The technical solution in the embodiment of the present invention is clearly and completely described below with reference to the drawings (in the drawings, a-A, B-B, C-C, D-D is a cross section, and G is a gradient). In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

Please refer to fig. 1, which is an exploded view of the heat dissipating device of the present invention, as shown in the figure, the heat dissipating device of the present invention has a first sheet 1, a second sheet 2, and a heat dissipating fin 3, the peripheries of the first sheet 1 and the second sheet 2 are attached to each other and sealed, and the heat dissipating fin 3 is disposed between the first sheet 1 and the second sheet 2 in a vacuum manner, wherein the first sheet 1 and the second sheet 2 can be formed by combining polyethylene terephthalate (PET), aluminum (AL), and Linear low-density polyethylene (LLDPE), etc., and the heat dissipating fin 3 can be made of a metal or a composite material with better ductility such as silver, copper, aluminum, gold, etc., so that it has flexibility and lightweight property, and can be formed by printing with a 3D method, powder metallurgy, etc.; furthermore, in some embodiments, the first sheet 1 and the second sheet 2 may be an integrally formed aluminum foil bag, such as a food grade aluminum foil bag, having an opening on one side for receiving the heat sink 3.

Referring to fig. 2, which is a structural diagram of the heat dissipation device of the present invention, as shown in the figure, the heat dissipation plate 3 may be formed with a plurality of through holes 31, and each through hole 31 may be one or a combination of a rectangle, a circle, an ellipse, a polygon or an irregular shape; in some embodiments, some or all of the through holes 31 are regular hexagons and are closely arranged in a honeycomb structure, so that the heat sink 3 has the largest heat dissipation space.

Referring to fig. 3, which isbase:Sub>A schematic cross-sectional view ofbase:Sub>A cross-sectional linebase:Sub>A-base:Sub>A of the present invention, as shown in the figure, after the first sheet 1, the second sheet 2, and the heat sink 3 are vacuum bonded, each through hole 31 and the two sheets formbase:Sub>A plurality of cavities 4, each cavity 4 can be respectively filled withbase:Sub>A heat transfer fluid 5, the heat transfer fluid 5 is formed by mixingbase:Sub>A first fluid 51 andbase:Sub>A second fluid 52 which have different specific gravities and/or densities and are mutually insoluble, wherein the first fluid 51 can be formed by mixing an alcohol liquid with water, the second fluid 52 can bebase:Sub>A fluorine liquid, and after the first fluid 51 and the second fluid 52 are mixed, the second fluid 52 withbase:Sub>A higher specific gravity inbase:Sub>A normal state sinks below the first fluid 51, so that the heat transfer fluid 5 formsbase:Sub>A state where two layers of liquid liquids overlap; in addition, in some embodiments, in order to correspond to heat sources of different locations of the electronic device, the heat conducting fluid 5 in each chamber 4 may have the same or different volume ratios, and the volume ratio of the heat conducting fluid 5 in the chamber 4 may be 50% to 95%, such as 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, etc., wherein in order to enable the second fluid 52 to have a better natural convection effect during the phase change reaction, the preferred volume ratio of the heat conducting fluid 5 in the chamber 4 is 50%.

Referring to fig. 4 and 5, which are a schematic diagram of another heat dissipation device and a schematic diagram of another heat dissipation device of the present invention, and referring to fig. 3, in some embodiments, the heat dissipation device has a first sheet 1, a second sheet 2, and a plurality of stacked heat dissipation fins 3, the peripheries of the first sheet 1 and the second sheet 2 are attached and sealed with each other, and each heat dissipation fin 3 is disposed between the first sheet 1 and the second sheet 2 in a vacuum attachment manner, the heat dissipation fins 3 are not connected by adhesion, welding, or other attachment manners, so as to maintain the degree of freedom of bending of each heat dissipation fin 3, wherein the plurality of through holes 31 of the two heat dissipation fins 3 are staggered up and down, so that each through hole 31 and the two sheets or the heat dissipation fins 3 stacked with each other form a plurality of cavities 4, and each cavity 4 can be filled with a heat conductive fluid 5; please refer to fig. 6 and fig. 7, which are schematic diagrams of an implementation of the heat dissipation apparatus and a cross-sectional diagram of a cross-sectional line B-B of the present invention, when the heat dissipation apparatus is bent by an external force, there is no bonding layer between the heat dissipation sheets 3 and thus the heat dissipation sheets can be dislocated according to the stress, so that the plurality of through holes 31 are not staggered up and down to generate a partial overlap, and a plurality of overlapping cavities 4a are formed, and the heat transfer fluid 5 does not perform a phase change reaction in a single cavity 4 any more, and further a circulation is generated in the overlapping cavities 4 a.

Please refer to fig. 8 and fig. 9, which are schematic diagrams of another heat dissipating device according to the present invention and a cross-sectional diagram of a cross-sectional line C-C, respectively, as shown in the figures, in some embodiments, a plurality of through holes 31 of a part or all of two mutually overlapped heat dissipating fins 3 may be S-shaped and arranged in a vertically staggered manner, when the heat dissipating device is bent by an external force, no adhesive layer exists between the heat dissipating fins 3 and may be dislocated according to the stress, so that the plurality of through holes 31 are not arranged in a vertically staggered manner to partially overlap each other, thereby forming a combined cavity 4b in which all cavities 4 are communicated with each other, the heat conducting fluid 5 does not perform a phase change reaction in a single cavity 4, and further generates a circulation in the combined cavity 4b, and thus the heat conducting fluid 5 can change the circulation efficiency of the phase change according to the cavity structure, so as to rapidly dissipate heat of the electronic device.

Referring to fig. 10, in an embodiment of the heat dissipation device of the present invention, as shown in the drawing, in some embodiments, one or more bumps 41 may be formed in part or all of the cavity 4, when the second fluid 52 is heated to change from a liquid state to a gaseous state, the second fluid gradually condenses and adheres to each bump 41, and then gradually forms a liquid to fall down, so that the bumps 41 may increase the circulation efficiency of the heat conductive fluid 5 to generate a phase change, thereby rapidly dissipating heat from the electronic device; in some embodiments, the bumps 41 may be formed on the inner surface of the first sheet 1 or the second sheet 2 in advance by dispensing; in other embodiments, the bumps 41 may be formed by drilling, 3D printing, or powder metallurgy, etc. during the formation of the heat sink 3.

Referring to fig. 11, in another embodiment of the heat dissipation device of the present invention, as shown in the drawings, in some embodiments, one or more retaining walls 42 may be formed in part or all of the cavity 4, and when the second fluid 52 is heated and changes from a liquid state to a gaseous state, the second fluid gradually condenses and adheres to the retaining wall 42, and then gradually forms a liquid to fall down, so that the retaining wall 42 can increase the circulation efficiency of the heat conductive fluid 5 to generate a phase change, thereby rapidly dissipating heat from the electronic device; in some embodiments, each retaining wall 42 may be formed by gluing to form an external contour on the inner surface of the first sheet 1 or the second sheet 2; in other embodiments, the retaining walls 42 may be formed by drilling, 3D printing, or powder metallurgy, when the heat sink 3 is formed.

Referring to fig. 12, in another embodiment of the heat dissipation device of the present invention, as shown in the drawings, in some embodiments, one or more ribs 43 arranged radially may be formed in part or all of the cavity 4, when the second fluid 52 is heated and changes from a liquid state to a gaseous state, the second fluid gradually condenses and adheres to the ribs 43, and then gradually forms a liquid drop, so that the ribs 43 may increase the circulation efficiency of the heat conductive fluid 5 to generate a phase change, thereby rapidly dissipating heat from the electronic device; in some embodiments, each rib 43 may be formed by molding an external contour on the inner surface of the first sheet 1 or the second sheet 2; in other embodiments, the ribs 43 may be formed by drilling, 3D printing, or powder metallurgy, when the heat sink 3 is formed.

Referring to fig. 13, as another embodiment of the heat dissipating device of the present invention, as shown in the drawings, in some embodiments, a flow guiding portion 44 may be formed in part or all of the cavity 4, the flow guiding portion 44 may be a retaining wall 42, and has a first outlet 441 and a second outlet 442, the first outlet 441 and the second outlet 442 may be respectively tapered from bottom to top or from top to bottom, when the second fluid 52 is heated to be changed from a liquid state to a gaseous state, due to the flow resistance and the tapered outlet, the gasified second fluid 52 only forms a thermal circulation path along the tapered outlet, so that the flow guiding portion 44 can effectively increase the circulation efficiency of the phase change of the heat conducting fluid 5, so as to rapidly dissipate heat of the electronic device; in some embodiments, the flow guide portion 44 may be formed on the inner surface of the first sheet 1 or the second sheet 2 by glue in advance; in other embodiments, the guiding portion 44 can be formed by drilling, 3D printing, or powder metallurgy, etc. when the heat sink 3 is formed.

Referring to fig. 14 and 15, respectively, a structural diagram of another heat dissipating device of the present invention and another embodiment of the heat dissipating device of the present invention are shown, in some embodiments, when the heat dissipating fins 3 form a plurality of through holes 31, one or more gaps 32 are formed between the plurality of through holes 3 together according to the heat dissipating requirement of the electronic device, and each gap 32 may be uniformly tapered from left to right or from right to left, when the first sheet 1, the second sheet 2, and each heat dissipating fin 3 are vacuum-adhered, so that the gap 32 and one of the sheets form one or more channels 45 between part or all of the cavities 4, and when the second fluid 52 is heated to be changed from a liquid state to a gaseous state, due to the flow resistance and the tapered channels 45, the gasified second fluid 52 only follows the tapered channels 45 to form a heat circulating path, so that the channels 45 can effectively increase the circulating efficiency of phase change of the heat conducting fluid 5 to rapidly dissipate heat of the electronic device.

Referring to fig. 16 and 17, which are a schematic diagram of another heat dissipating device of the present invention and a schematic cross-sectional view of the cross-sectional line D-D of the present invention, as shown in the drawings, in some embodiments, since the heat sink 3 has a certain thickness, when the heat sink 3 forms a plurality of through holes 31, each through hole 31 can be formed as a rhombus, that is, a gradient G is formed between each through hole 31 and the surface of the heat sink 3 to increase the volume of the cavity 4, thereby increasing the cycle efficiency of the phase change of the heat transfer fluid 5. In addition, the flow guiding elements added to the chamber 4 in the above embodiments can be applied to the structure.

From the foregoing, the heat dissipating device of the present invention mainly has a structure with more than three layers, which are a first sheet, a second sheet, and each heat dissipating fin, wherein the peripheries of the first sheet and the second sheet are attached to each other and sealed, and the heat dissipating fins are disposed between the first sheet and the second sheet in a vacuum attachment manner, wherein the heat dissipating fins are formed with a plurality of through holes, after the first sheet, the second sheet, and the heat dissipating fins are vacuum attached to each other, the through holes and the two sheets form a plurality of cavities, each cavity can be filled with two heat conducting fluids with different specific gravities and/or densities and being immiscible with each other, and when the heat dissipating device is bent by external force, no adhesive layer is disposed between the heat dissipating fins, so that the heat conducting fluids can be dislocated according to stress, the cavities can be overlapped to expand the circulation space of the heat conducting fluids, thereby improving the circulation efficiency of the heat conducting fluids for generating phase changes, and effectively dissipating heat to the electronic device; therefore, after the implementation of the present invention, the purpose of providing a heat dissipation device for improving the heat dissipation efficiency of a light and thin precise electronic device can be achieved.

It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Claims (11)

1. The heat dissipating double-fuselage, set up on a heat source of an electronic device, characterized by, include:

a first sheet;

a second sheet closely connected with the periphery of the first sheet;

at least one heat sink, which is provided with a plurality of through holes and is vacuum-adhered between the first sheet and the second sheet to form a plurality of cavities; and

and the heat-conducting fluid is filled in each cavity to dissipate the heat generated by the heating source through heat conduction.

2. The heat dissipating device of claim 1, wherein there are two heat dissipating fins, the two heat dissipating fins are stacked on each other, and the through holes of the two heat dissipating fins are staggered up and down, so that each through hole and the first sheet, the second sheet, or the two heat dissipating fins stacked on each other form the cavities.

3. The heat dissipating device as claimed in claim 2, wherein the through holes are S-shaped, and when the fins are bent by an external force, the through holes are dislocated by stress, so that the through holes are not staggered up and down to partially overlap each other, thereby forming a combined cavity with the cavities communicating with each other.

4. The heat dissipating device of claim 1, wherein the through holes are hexagonal and are closely arranged in a honeycomb structure.

5. The heat dissipating device of claim 1, wherein one or a combination of one or more of bumps, dams, and radially-arranged ribs are formed in some or all of the through holes.

6. The heat dissipating device of claim 1, wherein one or more flow guiding portions are formed in part or all of the plurality of through holes, the flow guiding portions having a first outlet and a second outlet, the first outlet and the second outlet being used for the heat transfer fluid to form a thermal circulation path after the phase change reaction.

7. The heat dissipating device of claim 6, wherein the first outlet tapers from bottom to top and the second outlet tapers from top to bottom.

8. The heat dissipating device of claim 1, wherein one or more gaps are formed between some or all of the through holes for the heat conducting fluid to form a thermal circulation path after a phase change reaction.

9. The heat dissipating device of claim 8, wherein each notch is tapered from left to right or right to left.

10. The heat dissipating device of claim 1, wherein the through holes are rhombohedral with a gradient from the surface of the heat sink.

11. The heat dissipating device of claim 1, wherein the first sheet and the second sheet are integrally formed and have an aluminum foil pouch with an opening.

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