CN217881479U

CN217881479U - Chip embedded packaging structure with reinforcing structure

Info

Publication number: CN217881479U
Application number: CN202221891104.2U
Authority: CN
Inventors: 顾岚雁; 林河北; 解维虎; 胡慧雄; 阳小冬
Original assignee: Shenzhen Jinyu Semiconductor Co ltd
Current assignee: Shenzhen Jinyu Semiconductor Co ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2022-11-22
Anticipated expiration: 2032-07-20

Abstract

The utility model discloses an embedded packaging structure of chip with additional strengthening, comprising a base plate, nail is connected to bottom plate lower extreme fixedly connected with a plurality of, open the mounting groove in the bottom plate upper end, bottom plate upper end joint has the heat conduction top cap, be provided with the chip body between heat conduction top cap and the bottom plate, the foot is connected to the equal fixedly connected with a plurality of in chip body left end, right-hand member, front end and rear end, a plurality of connect the foot equidistance and distribute and each other contactless, heat conduction top cap lower extreme fixedly connected with heat dissipation mechanism, be provided with coupling mechanism between heat conduction top cap and the bottom plate jointly. A embedded packaging structure of chip with additional strengthening, the conducting strip in the heat dissipation mechanism can distribute away in chip body operation in-process in the heat conduction that will produce to the heat conduction top cap, and a plurality of stiffener in the heat dissipation mechanism has not only played the effect of strengthening the support, has also improved the effect of heat conduction.

Description

Chip embedded packaging structure with reinforcing structure

Technical Field

The utility model relates to a chip package technical field, in particular to embedded packaging structure of chip with additional strengthening.

Background

In modern society, we have increasingly depended on electronic products, and various electronic products are required to be complete, and both adults and children have electronic devices suitable for their use, but electronic products have no requirements of high speed, high quality and multifunctional processing performance, and the chip is the main component of these electronic devices, and because the chip is a way of miniaturizing the circuit and is often manufactured on the surface of a semiconductor wafer, so it is also called an integrated circuit, and when it is used as a high-precision component, the chip must be protected by a package structure, and there are at least the following disadvantages in the existing chip embedded package structure with a reinforcing structure: 1. the existing chip embedded packaging structure with the reinforcing structure does not have a heat dissipation function, and the use of the chip is influenced by overheating of the chip, even the chip is damaged; 2. the existing chip embedded packaging structure with the reinforcing structure is generally connected and fixed through adhesive, and the adhesive easily overflows to the chip to influence the performance of the chip, so that a novel chip embedded packaging structure with the reinforcing structure is provided.

SUMMERY OF THE UTILITY MODEL

The main object of the utility model is to provide an embedded packaging structure of chip with additional strengthening can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the technical proposal that:

the utility model provides an embedded packaging structure of chip with additional strengthening, includes the bottom plate, bottom plate lower extreme fixedly connected with a plurality of connects the nail, open the bottom plate upper end has the mounting groove, bottom plate upper end joint has the heat conduction top cap, be provided with the chip body between heat conduction top cap and the bottom plate, the equal fixedly connected with a plurality of chip body left end, right-hand member, front end and rear end is connected the foot, a plurality of connect the foot equidistance and distribute and each other not contact, heat conduction top cap lower extreme fixedly connected with heat dissipation mechanism, be provided with coupling mechanism between heat conduction top cap and the bottom plate jointly.

Preferably, a plurality of connect nail equidistance array distribution and each other contactless, chip body and a plurality of are connected the foot and are all located the mounting groove inside, and a plurality of are connected the foot and all pass through mounting groove and bottom plate fixed connection, chip body and a plurality of are connected the foot and are all located coupling mechanism and contactless.

Preferably, the heat dissipation mechanism comprises a heat conducting fin, and the lower end of the heat conducting fin is fixedly connected with a plurality of reinforcing rods.

Preferably, conducting strip and heat conduction top cap fixed connection, the conducting strip closely laminates with the chip body, a plurality of the stiffener equidistance distributes and each other contactless, a plurality of the stiffener is located respectively between a plurality of connection foot and each other contactless, a plurality of the stiffener lower extreme all closely laminates with the interior lower wall of mounting groove.

Preferably, coupling mechanism includes eight metal inserted sheets, the perk groove has all been opened to heat conduction top cap lower extreme left part, right part, front portion and rear portion, open the bottom plate upper end has eight J type slots.

Preferably, eight the metal inserted sheet all with heat conduction top cap fixed connection, eight the equal distance distribution of metal inserted sheet and eight J type slots and each other do not contact, eight the metal inserted sheet corresponds and alternates with eight J type slot positions respectively and is connected, the mounting groove is located between eight J type slots and does not contact, heat dissipation mechanism is located between the eight metal inserted sheets and does not contact, four the perk is got the groove equidistance and is distributed and each other do not contact, eight the metal inserted sheet all is located four perks and gets between the groove and each other do not contact.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. in the utility model, by arranging the heat dissipation mechanism, the lower end of the heat conducting fin in the heat dissipation mechanism is tightly attached to the upper end of the chip body, the upper end of the heat conducting fin is fixed at the lower end of the heat conducting top cover, the heat conducting fin can conduct the generated heat into the heat conducting top cover to be distributed in the running process of the chip body, and a plurality of reinforcing rods in the heat dissipation mechanism not only play a role of reinforcing support, but also improve the effect of heat conduction, so that the heat dissipation effect is better, and the heat dissipation speed is faster;

2. the utility model discloses in, through eight metal inserted sheets of heat conduction top cap lower extreme fixedly connected with, it has eight corresponding J type slots to open in the bottom plate upper end, during the installation, correspond eight metal inserted sheets and eight J type slots, press the heat conduction top cap and can accomplish the installation combination, the metal inserted sheet can follow J type slot and accomplish deformation pressing the in-process, perfect card is in J type slot, when needing to dismantle, it can carry out the split with the heat conduction top cap perk to get the groove through four perks of heat conduction top cap lower extreme, the installation is dismantled very simply, and do not need the viscose to fix, can avoid glue contact chip body and influence the chip performance.

Drawings

Fig. 1 is a schematic view of the overall structure of a chip embedded package structure with a stiffener structure according to the present invention;

fig. 2 is a schematic view illustrating a split of an overall structure of a chip embedded package structure with a stiffener structure according to the present invention;

fig. 3 is a schematic view of the overall structure of a heat dissipation mechanism of a chip embedded package structure with a stiffener structure according to the present invention;

fig. 4 is a schematic view of the overall structure of the connection mechanism of the chip embedded package structure with the reinforced structure of the present invention.

In the figure: 1. a base plate; 2. a connecting nail; 3. mounting grooves; 4. a chip body; 5. a connecting pin; 6. a thermally conductive top cover; 7. a heat dissipation mechanism; 8. a connecting mechanism; 71. a heat conductive sheet; 72. a reinforcing rod; 81. a metal insert; 82. a warping groove; 83. a J-shaped slot.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Referring to fig. 1-4, the present invention provides a technical solution:

the utility model provides an embedded packaging structure of chip with additional strengthening, includes bottom plate 1, its characterized in that: nail 2 is connected to 1 lower extreme fixedly connected with a plurality of bottom plate, open on 1 bottom plate has mounting

groove

3, 1 upper end joint of bottom plate has heat conduction top cap 6, be provided with chip body 4 between heat conduction top cap 6 and the bottom plate 1, 4 left ends of chip body, the right-hand member, the equal fixedly connected with a plurality of in front end and rear end is connected foot 5, 5 equidistance distributions of a plurality of connection foot and each other contactless, 6 lower extreme fixedly connected with heat dissipation mechanism 7 of heat conduction top cap, be provided with coupling mechanism 8 between heat conduction top cap 6 and the bottom plate 1 jointly.

In this embodiment, a plurality of connecting nails 2 are distributed in an array manner at equal intervals and are not in contact with each other, chip body 4 and a plurality of connecting pins 5 are located inside mounting groove 3, and a plurality of connecting pins 5 are all fixedly connected with bottom plate 1 through mounting groove 3, chip body 4 and a plurality of connecting pins 5 are located inside connecting mechanism 8 and are not in contact with each other, heat dissipation mechanism 7 includes conducting strip 71, a plurality of reinforcing rods 72 are fixedly connected with the lower end of conducting strip 71, and through being provided with heat dissipation mechanism 7, the upper end of chip body 4 is tightly attached to the lower end of conducting strip 71 in heat dissipation mechanism 7, the lower end of heat conduction top cover 6 is fixed to the upper end of conducting strip 71, and conducting strip 71 can distribute generated heat to heat conduction top cover 6 in the operation process of chip body 4, and a plurality of reinforcing rods 72 in heat dissipation mechanism 7 not only play the effect of reinforcing support, but also improve the effect of heat conduction, so that the heat dissipation effect is better, and the heat dissipation speed is faster.

In this embodiment, coupling mechanism 8 includes eight metal inserted

sheets

81, 6 lower extreme left parts of heat conduction top cap, the right part, anterior and rear portion all opened perk groove 82, it has eight J type slot 83 to open at bottom plate 1 upper end, eight metal inserted sheets 81 all with 6 fixed connection of heat conduction top cap, eight metal inserted sheets 81 and the equal distance distribution of eight J type slot 83 and each other contactless, eight metal inserted sheets 81 correspond with eight J type slot 83 position respectively and alternate the connection, mounting groove 3 is located between eight J type slot 83 and does not contact, heat dissipation mechanism 7 is located between eight metal inserted sheets 81 and does not contact, four perk groove 82 equidistance distribution and each other not contact, eight metal inserted sheets 81 all are located between four perk grooves 82 and each other contact, through eight metal inserted sheets 81 of fixedly connected with at 6 lower extreme of heat conduction top cap, it has eight corresponding J type slot 83 to open at 1 upper end of bottom plate, during the installation, correspond eight metal inserted sheets 81 with eight J type slot 83 and eight J type slot 83, press heat conduction top cap 6 can accomplish the erection block, it is very perfect to follow the deformation of J type slot 83 at the pressing the in-process, the heat conduction top cap can dismantle the chip and do not need to warp the chip and carry out the perk chip and the chip and dismantle the chip and carry out the perk through four chip and glue separation of heat conduction top cap 6 and the perk groove and do not need to dismantle the chip and carry out the perk chip and stick up the chip and glue separation and glue groove and take 4.

It is required to explain, the utility model relates to an embedded packaging structure of chip with additional strengthening, in the use, at first connect 5 installation fixed to bottom plate 1 upper end division mounting groove 3 inside with chip body 4 through a plurality of, insert heat conduction top cap 6 through eight metal inserted sheet 81 of lower extreme fixed connection in eight J type slots 83 of bottom plate 1 upper end division again, press heat conduction top cap 6 and install fixedly, when pressing heat conduction top cap 6, eight metal inserted sheet 81 can be atress follow J type slots 83 and deform, perfect with J type slots 83 joint together, chip body 4 can be hugged closely to heat conduction piece 71 that heat conduction top cap 6 lower extreme set up, a plurality of stiffener 72 that heat conduction piece 71 lower extreme set up all around distributes and contacts with bottom plate 1 between a plurality of connection foot 5, heat conduction piece 71 can be when the chip moves, heat conduction top cap 6 interior divergence of heat conduction that produces with chip body 4, a plurality of stiffener 72 has not only played the effect of strengthening the support, the efficiency of heat conduction has also been improved, the chip of accomplishing the installation is connected nail 2 and is connected the equipment through a plurality of bottom plate 1 lower extreme and can be connected the chip and the maintenance glue and can all take place the split and the chip and the whole chip and the chip and can be carried out through the maintenance split device and take place the simple split and stick up the split and glue 82 of chip.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an embedded packaging structure of chip with additional strengthening, includes bottom plate (1), its characterized in that: bottom plate (1) lower extreme fixedly connected with a plurality of connects nail (2), open bottom plate (1) upper end has mounting groove (3), bottom plate (1) upper end joint has heat conduction top cap (6), be provided with between heat conduction top cap (6) and bottom plate (1) chip body (4), foot (5), a plurality of are connected to the equal fixedly connected with a plurality of in chip body (4) left end, right-hand member, front end and rear end connect foot (5) equidistance and each other do not contact, heat conduction top cap (6) lower extreme fixedly connected with heat dissipation mechanism (7), be provided with coupling mechanism (8) between heat conduction top cap (6) and bottom plate (1) jointly.

2. The chip embedded package structure with the reinforced structure of claim 1, wherein: a plurality of connect nail (2) equidistance array distribution and each other contactless, chip body (4) and a plurality of are connected foot (5) and all are located mounting groove (3) inside, and a plurality of connect foot (5) and all pass through mounting groove (3) and bottom plate (1) fixed connection, chip body (4) and a plurality of are connected foot (5) and all are located coupling mechanism (8) and contactless.

3. The chip embedded package structure with the reinforced structure of claim 1, wherein: the heat dissipation mechanism (7) comprises a heat conducting fin (71), and a plurality of reinforcing rods (72) are fixedly connected to the lower end of the heat conducting fin (71).

4. The chip embedded package structure with the reinforced structure as claimed in claim 3, wherein: conducting strip (71) and heat conduction top cap (6) fixed connection, conducting strip (71) and chip body (4) closely laminate, a plurality of stiffener (72) equidistance distributes and not mutually contact, a plurality of stiffener (72) are located respectively and are connected between foot (5) and not mutually contact, a plurality of stiffener (72) lower extreme all closely laminate with lower wall in mounting groove (3).

5. The chip embedded package structure with the reinforced structure of claim 1, wherein: coupling mechanism (8) include eight metal inserted sheets (81), heat conduction top cap (6) lower extreme left part, right part, front portion and rear portion all opened perk and get groove (82), bottom plate (1) upper end is opened there are eight J type slots (83).

6. The chip embedded package structure with the reinforced structure as claimed in claim 5, wherein: eight metal inserted sheet (81) all with heat conduction top cap (6) fixed connection, eight equal distance distribution of metal inserted sheet (81) and eight J type slot (83) and each other do not contact, eight metal inserted sheet (81) correspond with eight J type slot (83) position respectively and alternate and be connected, mounting groove (3) are located between eight J type slot (83) and do not contact, heat dissipation mechanism (7) are located between eight metal inserted sheet (81) and do not contact, four the perk is got groove (82) equidistance and is distributed and each other do not contact, eight metal inserted sheet (81) all are located four perks and are got between groove (82) and each other do not contact.