CN217879982U - Laser direct imaging equipment capable of improving exposure power - Google Patents

Abstract

The utility model discloses a can improve exposure power's direct imaging equipment of laser, include: the micro-lens array comprises a control system, an integrated circuit board assembly, a micro-lens array assembly, a workbench and a movement mechanism arranged at the lower end of the workbench; the integrated circuit board assembly includes: the integrated circuit board is integrated with a circuit which controls the on-off of the laser light sources by the control system and a plurality of laser light sources which are pasted on the integrated circuit board and distributed in an array; the microlens array assembly includes: the light source array comprises a light transmitting plate and a plurality of focusing lenses which are arranged on the light transmitting plate and are integrally formed with the light transmitting plate, the focusing lenses correspond to a plurality of laser light sources in quantity and array mode, and light beams emitted by the laser light sources are incident to the corresponding focusing lenses, are focused on a photosensitive coating of the PCB after being transmitted and expose the photosensitive coating. The utility model provides high laser direct imaging equipment's exposure power.

Description

Laser direct imaging equipment capable of improving exposure power

Technical Field

The utility model belongs to the direct formation of image field of laser especially involves a can improve exposure power's direct imaging equipment of laser.

Background

Referring to fig. 1, in the conventional laser direct imaging apparatus, as a design common in the conventional laser direct imaging apparatus, a circuit board 10 is mounted in a recess 30 together with a plurality of imaging modules 20 arranged in a row, and each imaging module 20 is connected to the circuit board 10 through a wire 31. The groove 30 can move the plurality of imaging modules 20 and the circuit board 10 on the rail 40. The circuit board 10 incorporates a circuit (not shown) for controlling the operation of the plurality of imaging modules 20. Referring to fig. 2, as a simplified version of the imaging modules 20, each imaging module 20 includes at least a laser light source 21, an imaging lens 22 (the imaging lens 22 and the focusing lens herein function identically), and a lens barrel 23. A working table 52 is arranged below the imaging module 20, a moving mechanism 60 is connected to the lower surface of the working table 52, and the moving mechanism 60 drives the working table 52 to move in the X direction and/or the Y direction under the control of the control system 70.

When the photosensitive coating 51 on the PCB 50 needs to be exposed, the PCB 50 is first placed on the worktable 52, and the control system 70 controls the moving mechanism 60 to drive the worktable 52 to move in the X direction and/or the Y direction, so as to drive the PCB 50 to move in the X direction and/or the Y direction. The control system 70 controls the circuit board 10 to control the laser light source 21 to emit light according to a preset program. The light beams emitted by the laser light sources 21 of any group of imaging modules 20 are focused at the corresponding position 21A of the photosensitive coating 51 on the PCB 50 after being focused by the imaging lens 22, and expose the photosensitive coating 51, and the laser light beams emitted by the laser light sources of each other group of imaging modules 20 are also focused by the corresponding focusing lens, and then exposed at the corresponding position of the photosensitive coating 51.

However, referring to fig. 2, in each of the constituent image modules 20, a laser light source 21 and an imaging lens 22 are provided within a lens barrel 23. Since the lens barrel 23 has a certain outer diameter d, it occupies the space of the laser light source 21 on the groove 30, so that the number of the imaging modules 20 that can be installed on the groove 30 is reduced, and the distribution density of the focusing lens is low, and in order to ensure that the laser light sources are all located on the main optical axis of the focusing lens, it can be understood that the distribution density of the laser light source 21 becomes lower as the distribution density of the imaging lens 22 becomes lower, so that the exposure power of the whole laser direct imaging apparatus is lower.

SUMMERY OF THE UTILITY MODEL

The utility model provides a can improve exposure power's direct imaging equipment of laser, the problem that laser exposure power is low in its main aim at solution direct imaging equipment of laser.

The scheme of the utility model is as follows:

a laser direct imaging apparatus capable of increasing exposure power, comprising:

the device comprises a control system, an integrated circuit board assembly, a micro-lens array assembly, a workbench and a movement mechanism arranged at the lower end of the workbench;

the PCB to be exposed can be placed on the workbench, the upper end face of the PCB is coated with a photosensitive coating, and the moving mechanism drives the workbench to move in the X direction and/or the Y direction under the control of the control system so as to drive the PCB to move to a preset position;

the integrated circuit board assembly includes: the integrated circuit board is integrated with a circuit which controls the on-off of the laser light sources by the control system and a plurality of laser light sources which are pasted on the integrated circuit board and distributed in an array;

the microlens array assembly includes: the focusing lenses correspond to the laser light sources in quantity and array mode, and light beams emitted by each laser light source are incident to the corresponding focusing lens, are focused on the photosensitive coating of the PCB after being transmitted and expose the photosensitive coating;

each laser light source is positioned on the main optical axis of the corresponding focusing lens.

Furthermore, the laser module also comprises a cooling module which is arranged on the plane of the integrated circuit board opposite to the plurality of laser light sources.

The integrated circuit board further comprises two supporting plates which are respectively arranged at the left end and the right end between the integrated circuit board and the light-transmitting plate; the upper ends of the two supporting plates are connected with the lower end of the integrated circuit board; the lower ends of the two supporting plates are connected with the upper ends of the light-transmitting plates.

Further, the focusing lens is one of an aspherical lens, a self-focusing lens and a conical mirror.

Further, the images of the laser light source arrays are any one of rectangles, circles, diamonds and regular polygons.

Furthermore, the movement mechanism comprises an X-axis direction guide rail, a Y-axis direction guide rail, a first sliding block and a first motor which are arranged on the X-axis direction guide rail, and a second sliding block and a second motor which are arranged on the Y-axis direction guide rail; the workbench is arranged on the first sliding block and the second sliding block, the first motor controls the workbench to move along the X-axis direction through the first sliding block, and the second motor controls the workbench to move along the Y-axis direction through the second sliding block.

Furthermore, the cooling module is a copper block which is detachably connected to the plane of the integrated circuit board opposite to the laser light sources.

Furthermore, a plurality of grooves are formed in the end face, opposite to the integrated circuit board, of the copper block.

Further, the laser light source is a crystal diode.

Further, the control system is a chip processor.

The utility model has the advantages of:

1. because a plurality of laser light sources are integrated on the integrated circuit board in an array mode, and a plurality of focusing lenses are intensively arranged on the light-transmitting plate in the same array mode as the laser light sources, the focusing lenses form a micro lens array. Each focusing lens is not required to be arranged in a lens barrel as mentioned in the background technology, the space occupied by a plurality of lens barrels is reduced, the distance between every two adjacent focusing lenses is reduced, and therefore the distribution density of the laser light source and the distribution density of the focusing lenses are improved. When the photosensitive coating on the PCB needs to be exposed, the PCB is firstly placed on the workbench, the control system drives the movement mechanism at the lower end of the workbench to move, and the work is driven to move in the X-axis direction and/or the Y-axis direction until the PCB moves to the preset position. And then the control system controls the laser light sources to emit light through the integrated circuit board, and light beams emitted by each laser light source are transmitted through the corresponding focusing lens to expose the photosensitive coating. The distribution density of the laser light source is improved, so that the exposure power of the whole laser imaging equipment is also improved;

2. in the application, a plurality of laser light sources are attached to the integrated circuit board through a bonding process, the laser light sources and the circuit board which are originally in a separated state are integrated on the integrated circuit board, the defect that the laser light sources and the circuit board need to be connected through a wire in the background technology is overcome, the space is saved, and the miniaturization of the size of the laser direct imaging equipment is possible.

Drawings

FIG. 1 is a schematic diagram of a module connection of a prior art laser direct imaging apparatus;

FIG. 2 isbase:Sub>A cross-sectional view taken along A-A of FIG. 1 with the track omitted;

FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1 with the track omitted;

fig. 4 is a schematic diagram of module connection of the laser direct imaging device of the present invention;

FIG. 5 is a diagram showing the positional relationship among the PCB, the table and the moving mechanism;

FIG. 6 is a schematic diagram of a plurality of laser light source arrays distributed on an integrated circuit board and a plurality of focusing lens arrays distributed on a transparent plate;

FIG. 7 is a schematic view of the addition of a cooling module to that of FIG. 4;

fig. 8 is a schematic diagram of adding a cooling module on the basis of fig. 6.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used merely to describe differences and are not intended to indicate or imply relative importance, and moreover, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 4, the present invention discloses a laser direct imaging apparatus capable of improving exposure power, including: a control system 70, an integrated circuit board assembly, a microlens array assembly 80, a stage 52, and a motion mechanism 60 disposed at a lower end of the stage. The integrated circuit board assembly includes: an integrated circuit board 25 and a plurality of laser light sources 21, wherein a circuit for controlling the on/off of the plurality of laser light sources 21 by a control system 70 is integrated on the integrated circuit board 25, and the plurality of laser light sources 21 are mounted on the integrated circuit board 25 in an array distribution (refer to fig. 6); the integrated circuit board 25 is electrically connected to the controller 70, and the controller 70 controls the on/off of the plurality of laser light sources 21 and the magnitude of the output power through the integrated circuit board 25. The microlens array assembly 80 includes: the light-transmitting plate 81 and a plurality of focusing lenses 82 which are arranged on the light-transmitting plate and are integrally formed with the light-transmitting plate, and the number and the array mode of the plurality of focusing lenses 82 and the plurality of laser light sources 21 correspond to each other. The corresponding meanings here are to be understood as: after being incident to the focusing lens 82, the light beam emitted by each laser light source 21 is transmitted and focused on the photosensitive coating of the PCB and exposes the photosensitive coating. For example, in fig. 4, after the light beam emitted from one of the laser light sources 21 is transmitted through the focusing lens 82, the light beam is focused and exposed at a position 21A of the photosensitive coating 51 on the PCB 50, where the position 21A is an image point imaged after the laser light source 21 is transmitted through the focusing lens 82. Accordingly, it can be understood that each laser light source is located on the main optical axis of the corresponding focusing lens, so that each laser light source, the focusing lens and the image point are located on the main optical axis of the focusing lens. The table 52 is located below the PCB 50 for supporting the PCB 50, and a moving mechanism 60 is connected to a lower end of the table 52. The moving mechanism 60 is connected to the control system 70, the control system 70 controls and drives the moving mechanism 60 to work, the moving mechanism 60 drives the workbench 52 to move along the X direction and/or the Y direction (as shown in fig. 1), and the PCB 50 on the workbench 52 moves along the X direction and/or the Y direction along with the workbench 52, so as to facilitate the exposure of the photosensitive coating 51 by the plurality of laser sources.

As one of the embodiments, the above-mentioned moving mechanism 60 includes not shown: x-axis direction guide rail, Y-axis direction guide rail, first slider and first motor. The first sliding block and the first motor are arranged on the guide rail in the X-axis direction. The upper end of the first slide block is connected to the lower end of the workbench 52, and the lower end of the first slide block is connected to the guide rail in the X-axis direction; the first motor controls the first slider to move on the guide rail in the X-axis direction, so as to drive the workbench 52 to move on the guide rail in the X-axis direction, and the workbench 52 drives the PCB 51 to move in the X-axis direction. Similarly, the moving mechanism 60 further includes a second slider and a second motor disposed on the Y-axis direction guide rail; the upper end of the second slider is also connected to the working table 52, the lower end of the second slider is connected to the Y-axis direction guide rail, the second motor controls the second slider to move on the Y-axis direction guide rail, the working table 52 is driven to move on the Y-axis direction guide rail, and the working table 52 drives the PCB 51 to move in the Y-axis direction.

Because all focusing lenses are integrated on the micro-lens array component, each focusing lens does not need to be installed on a separate lens barrel 23 in the background technology, and the space occupied by the lens barrels 23 is saved, so that the distance d1 (see fig. 4) between every two focusing lenses 82 can be designed to be smaller than the distance d2 (see fig. 3) between two imaging lenses 22 in the prior art, more focusing lenses can be placed in the same area, the distribution of the focusing lenses is denser, and the number of laser light sources is increased in a unit area due to the one-to-one correspondence of the position relations between the laser light sources and the focusing lenses, so that the light-emitting density and the exposure power of the laser light sources are improved.

Further, referring to fig. 7 and 8, in order to remove heat generated when the laser light sources 21 on the integrated circuit board 25 operate, a cooling module 90 is connected to a plane of the integrated circuit board 25 opposite to the plurality of laser light sources 21. The cooling module 90 may be any device for air cooling, water cooling or natural cooling, such as a fan, a cavity filled with cold water, or a metal cooling block.

As an embodiment of the present application, the cooling module 90 is preferably a copper block, because the copper block dissipates heat quickly and can take away heat generated by the laser light source 21 in time. The copper block is detachably connected to the other side of the integrated circuit board 25 with respect to the laser light sources.

As a further optimization, in fig. 7 and 8, when the cooling module 90 is a copper block, a plurality of grooves 91 are formed on a side of the copper block opposite to the integrated circuit board (i.e., a lower end surface of the copper block), and the grooves 91 are designed to increase a heat dissipation area of the copper block, which is beneficial to accelerating volatilization of heat generated by the laser light source 21.

Referring to fig. 4 and 7, in order to couple the microlens array assembly 80 and the integrated circuit board 25 such that each laser light source 21 maintains a proper distance from its corresponding focusing lens 82, support plates 26 are provided at both left and right ends of the microlens array assembly 80 between the transparent plate 81 and the integrated circuit board 25, an upper end of each support plate 26 is coupled to a lower end of the integrated circuit board 25, and a lower end of each support plate 26 is coupled to an upper end of the transparent plate 81. It should be noted that, in the process of connecting the two supporting plates 26 to the integrated circuit board 25 and the transparent plate 81, it is necessary to ensure that each laser light source is located on the main optical axis of the corresponding focusing lens. Therefore, it can be understood that when the light-transmitting plate 81 is attached to the integrated circuit board 25 by the two support plates 26, each of the laser light sources 21 on the integrated circuit board 25 is located on the main optical axis of the focusing lens 82 corresponding thereto.

In the present application, the focusing lens 82 is preferably any one of an aspherical lens, a self-focusing lens, and a conical mirror. The aspheric lens, the self-focusing lens and the conical lens are selected, so that the occupied space of the aspheric lens, the self-focusing lens and the conical lens can be reduced, and the distribution density of the laser light source can be improved. It should be noted that, when the focusing lens is an aspheric lens, several aspheric lenses can be formed by pressing with a mold, that is, the transparent plate 81 and several focusing lenses 82 in fig. 4 and 7 can be formed by injection molding with a mold at one time. The material of the aspherical lens may be, for example, PMMA (acryl), PC (polycarbonate) or organic glass having excellent light transmission properties.

In the present application, the plurality of laser light sources mounted on the integrated circuit board 25 are distributed in an array, and an image formed by the plurality of laser light sources 21 in an array may be any one of a rectangle (see fig. 6 and 7), a circle, a diamond, and a regular polygon, and may also be designed to be distributed in other array shapes according to needs, for example, the array may be a triangle or an ellipse, which is not exhaustive and limited herein. It will be appreciated that the images formed by the focusing lenses 82 and the arrays of laser light sources 21 on the microlens array assembly 80 are identical to ensure that each laser light source 21 is on the primary optical axis of its corresponding focusing lens 82.

In the present application, the control system 70 controls the on/off time and the light output power of the plurality of laser light sources 21 according to a program written according to the graphic features of the image to be exposed. If an image stored in a computer is transferred onto a photosensitive ink layer on a PCB (i.e. a laser direct imaging process and an image exposure process), some portions of the image need to be exposed, the control system 70 in fig. 4 and 7 controls a built-in integrated circuit in the integrated circuit board 25, the integrated circuit controls the corresponding laser light source to be turned on, and if some portions do not need to be exposed, the corresponding laser light source is controlled not to be turned on (in an off state); if some parts need to be exposed with higher intensity, the integrated circuit controls the corresponding laser light source to emit light with higher power, and if some parts need to be exposed with lower intensity, the integrated circuit controls the corresponding laser light source to emit light with lower power.

Preferably, in the present application, the laser light source 21 is preferably a crystal diode which is easy to purchase and has good light extraction performance; the control system is preferably a chip processor.

The laser direct imaging equipment capable of improving the exposure power has the following advantages:

1. because the laser light sources are integrated on the integrated circuit board in an array mode, and the focusing lenses are intensively arranged on the light-transmitting plate in the same array mode as the laser light sources, the focusing lenses form a micro-lens array. Each focusing lens is not required to be arranged in a lens barrel as mentioned in the background technology, the space occupied by a plurality of lens barrels is reduced, the distance between every two adjacent focusing lenses is reduced, and therefore the distribution density of the laser light source and the distribution density of the focusing lenses are improved. When a photosensitive coating on the PCB needs to be exposed, the PCB is placed on a workbench, a movement mechanism at the lower end of the workbench is driven by a control system to move, and the PCB is driven to move in the X-axis direction and/or the Y-axis direction until the PCB moves to a preset position. And then the control system controls the laser light sources to emit light through the integrated circuit board, and light beams emitted by each laser light source are transmitted through the corresponding focusing lens to expose the photosensitive coating. The distribution density of the laser light source is improved, so that the exposure power of the whole laser imaging equipment is also improved;

2. in the application, a plurality of laser light sources are attached to the integrated circuit board through a bonding process, the laser light sources and the circuit board which are originally in a separated state are integrated on the integrated circuit board, the defect that the laser light sources and the circuit board need to be connected through a wire in the background technology is overcome, the space is saved, and the miniaturization of the size of the laser direct imaging equipment is possible.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the principles of the present invention.

Claims (10)

1. A laser direct imaging apparatus capable of increasing exposure power, comprising:

the micro-lens array comprises a control system, an integrated circuit board assembly, a micro-lens array assembly, a workbench and a movement mechanism arranged at the lower end of the workbench;

the PCB to be exposed can be placed on the workbench, a photosensitive coating is coated on the upper end face of the PCB, and the moving mechanism drives the workbench to move in the X direction and/or the Y direction under the control of the control system so as to drive the PCB to move;

the integrated circuit board assembly includes: the integrated circuit board is integrated with a circuit which controls the on-off of the laser light sources by the control system and the laser light sources which are pasted on the integrated circuit board and distributed in an array;

the microlens array assembly includes: the focusing lenses correspond to the laser light sources in quantity and array mode, and light beams emitted by the laser light sources are incident to the corresponding focusing lenses, are focused on the photosensitive coating of the PCB through transmission and expose the photosensitive coating;

wherein each laser light source is positioned on the main optical axis of the focusing lens corresponding to the laser light source.

2. The laser direct imaging apparatus capable of increasing exposure power according to claim 1, further comprising a cooling module disposed on a plane of the integrated circuit board opposite to the plurality of laser light sources.

3. The laser direct imaging apparatus capable of improving exposure power of claim 1, further comprising two support plates disposed at left and right ends between the integrated circuit board and the light-transmitting plate, respectively; the upper ends of the two supporting plates are connected with the lower end of the integrated circuit board; the lower ends of the two supporting plates are connected with the upper ends of the light-transmitting plates.

4. The laser direct imaging apparatus capable of increasing exposure power according to claim 1, wherein the focusing lens is one of an aspherical lens, a self-focusing lens and a conical mirror.

5. The laser direct imaging apparatus capable of increasing exposure power according to claim 1, wherein the image of the plurality of laser light source arrays is any one of a rectangle, a circle, a diamond, and a regular polygon.

6. The laser direct imaging apparatus capable of improving exposure power according to claim 1, wherein the moving mechanism includes an X-axis direction guide rail, a Y-axis direction guide rail, a first slider and a first motor provided on the X-axis direction guide rail, and a second slider and a second motor provided on the Y-axis direction guide rail; the workbench is arranged on the first sliding block and the second sliding block, the first motor controls the workbench to move along the X-axis direction through the first sliding block, and the second motor controls the workbench to move along the Y-axis direction through the second sliding block.

7. The laser direct imaging apparatus capable of increasing exposure power according to claim 2, wherein the cooling module is a copper block detachably attached to a plane of the integrated circuit board opposite to the plurality of laser light sources.

8. The laser direct imaging device capable of improving exposure power of claim 7, wherein a plurality of grooves are formed on the plane of the copper block opposite to the integrated circuit board.

9. The laser direct imaging apparatus capable of increasing exposure power according to claim 1, wherein the laser light source is a crystal diode.

10. The laser direct imaging apparatus capable of increasing exposure power according to claim 1, wherein the control system is a chip processor.

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