CN217860407U - Polishing device for semiconductor baking support - Google Patents
Polishing device for semiconductor baking support Download PDFInfo
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- CN217860407U CN217860407U CN202221980861.7U CN202221980861U CN217860407U CN 217860407 U CN217860407 U CN 217860407U CN 202221980861 U CN202221980861 U CN 202221980861U CN 217860407 U CN217860407 U CN 217860407U
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Abstract
The application belongs to the technical field of support grinding device, and discloses a grinding device of semiconductor baking support, including the workstation, its characterized in that: the bottom end of the workbench is fixedly connected with a base, the bottom end of the top plate is provided with a driving mechanism, the bottom end of the driving mechanism is provided with a polishing block, the top end of the workbench is fixedly connected with a fixed seat, one side of the top end of the fixed seat is provided with a movable frame, and one side of the movable frame is fixedly provided with a second clamping jaw; the bottom of the moving frame is provided with a moving assembly, and the moving assembly comprises a moving block, a threaded rod and a knob. The knob is rotated to drive the threaded rod to rotate, so that the moving block moves in the fixing seat, and meanwhile, the moving frame on the top end drives the second clamping jaws to move synchronously, so that the distance between the two clamping jaws can be adjusted, the supports with different lengths can be clamped and fixed, and then polishing is carried out, and the practicability of the device is improved.
Description
Technical Field
The application relates to the technical field of support grinding devices, more specifically relates to a grinding device of semiconductor baking support.
Background
Grinding, which is one of surface modification technologies, generally refers to a processing method for changing physical properties of a material surface by friction with the aid of a rough object (e.g., sand paper containing particles with higher hardness), and mainly aims to obtain specific surface roughness.
When the semiconductor baking support is produced, burrs can be generated on a pipeline of the support generally, the surface of the support needs to be treated at the moment, clamping mechanisms used by some conventional polishing devices are usually fixedly installed on a workbench surface by bolts, however, in the using process, the length of the support can be smaller than the clamping range of the clamping mechanisms, and the clamping mechanisms cannot move, so that the polishing devices cannot polish the semiconductor baking support well, the practicability of the device is reduced, and therefore, the polishing device for the semiconductor baking support is provided.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the application provides a polishing device for a semiconductor baking support bracket.
The application provides a polishing device of semiconductor baking support adopts following technical scheme:
the utility model provides a semiconductor bakes grinding device who holds in palm support, includes the workstation, its characterized in that: the bottom end of the workbench is fixedly connected with a base, the top end of the workbench is symmetrically and fixedly connected with support frames, the top ends of the two support frames are fixedly connected with a top plate, the bottom end of the top plate is provided with a driving mechanism, the bottom end of the driving mechanism is provided with a grinding block, the top end of the workbench is fixedly connected with a fixed seat, one side of the top end of the fixed seat is provided with a movable frame, and one side of the movable frame is fixedly provided with a second clamping jaw;
the bottom of the moving frame is provided with a moving assembly, the moving assembly comprises a moving block, a threaded rod and a knob, two ends of the threaded rod are respectively connected with inner walls of two sides of a fixing seat in a rotating mode, the other side of the top of the fixing seat is fixedly provided with a fixing frame, and a first clamping jaw is fixedly arranged on one side of the fixing frame.
Furthermore, one end of the threaded rod extends to one side of the fixed seat and is fixedly installed on one side of the knob, the moving block is sleeved on one end rod wall of the threaded rod, and the bottom end of the moving block is in sliding connection with the inner wall of the bottom of the fixed seat.
Through above-mentioned technical scheme, rotate the knob, can drive the movable block through the threaded rod and remove in the inside of fixing base, then drive the removal frame and the second jack catch on top and carry out synchronous motion.
Furthermore, a sliding groove is formed in the top end of the fixing seat, two folding plates are connected to the inside of the sliding groove in a sliding mode, and one side, opposite to the two folding plates, of each folding plate is fixedly connected with the two sides of the moving block respectively.
Through above-mentioned technical scheme, through setting up the folded sheet, when can preventing to polish, produced sweeps falls in the inside of fixing base.
Furthermore, the top of the moving block is slidably connected inside the sliding groove, and the top end of the moving block is fixedly mounted at the bottom end of the moving frame.
Through above-mentioned technical scheme, through setting up the fixed block, can drive the movable frame and slide on the top of fixing base.
Furthermore, actuating mechanism includes slide rail, slide, electric telescopic handle, drive case and connecting rod, the bottom fixed mounting of connecting rod is on the top of piece of polishing, the top fixed mounting of connecting rod is in the bottom of drive case.
Through above-mentioned technical scheme, through setting up the drive case, for the sanding block provides power, make its operation.
Furthermore, the top of drive case and electric telescopic handle's bottom fixed connection, electric telescopic handle's top and the bottom fixed connection of slide, the top of slide and the bottom sliding connection of slide rail, the top fixed connection of slide rail is in the bottom of roof.
Through above-mentioned technical scheme, through setting up slide rail and slide, can drive the piece of polishing and remove at the horizontal direction, adjust its position.
In summary, the present application includes at least one of the following advantageous technical effects:
(1) According to the utility model, the moving assembly is arranged at the bottom end of the moving frame, the knob is rotated to drive the threaded rod to rotate, so that the moving block moves in the fixed seat, and meanwhile, the moving frame at the top end drives the second clamping jaw to move synchronously, so that the distance between the two clamping jaws can be adjusted, and semiconductor drying support brackets with different lengths can be clamped and fixed, and then polished, and the practicability of the device is improved;
(2) The utility model discloses a, whole device simple structure conveniently uses, can polish the work of production better, and the help reduces the degree of difficulty of work of polishing.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present application;
FIG. 2 is a front cross-sectional structural view of the present application;
fig. 3 is an enlarged schematic view of the structure at a in fig. 1 of the present application.
The reference numbers in the figures illustrate:
1. a work table; 2. a base; 3. a support frame; 4. a top plate; 5. a slide rail; 6. a slide plate; 7. an electric telescopic rod; 8. a drive box; 9. a connecting rod; 10. grinding blocks; 11. a fixed seat; 12. a fixed mount; 13. a first jaw; 14. a knob; 15. a threaded rod; 16. a moving block; 17. a second jaw; 18. a movable frame; 19. and (5) folding the board.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments, and all other embodiments obtained by those of ordinary skill in the art without any inventive work based on the embodiments in the present application belong to the protection scope of the present application.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses grinding device of semiconductor baking support, including workstation 1, the bottom fixedly connected with base 2 of workstation 1, the top symmetry fixedly connected with support frame 3 of workstation 1, the top fixedly connected with roof 4 of two support frames 3, the bottom of roof 4 is provided with actuating mechanism, actuating mechanism's bottom is provided with sanding block 10, actuating mechanism includes slide rail 5, slide 6, electric telescopic handle 7, drive case 8 and connecting rod 9, the bottom fixed mounting of connecting rod 9 is on sanding block 10's top, the top fixed mounting of connecting rod 9 is in the bottom of drive case 8, the top of drive case 8 and the bottom fixed connection of electric telescopic handle 7, the top of electric telescopic handle 7 and the bottom fixed connection of slide 6, the top of slide 6 and the bottom sliding connection of slide rail 5, the top fixed connection of slide rail 5 is in the bottom of roof 4, the top fixedly connected with fixing base 11 of workstation 1, top one side of fixing base 11 is provided with removes frame 18, one side fixed mounting that removes frame 18 has second jack catch 17.
The bottom of the moving frame 18 is provided with a moving assembly, the moving assembly comprises a moving block 16, a threaded rod 15 and a knob 14, two ends of the threaded rod 15 are respectively connected with inner walls of two sides of a fixed seat 11 in a rotating mode, a fixed seat 12 is fixedly mounted on the other side of the top of the fixed seat 11, a first clamping jaw 13 is fixedly mounted on one side of the fixed seat 12, one end of the threaded rod 15 extends to one side of the fixed seat 11, the moving block 16 is fixedly mounted on one side of the knob 14, the moving block 16 is sleeved on one end rod wall of the threaded rod 15, a threaded hole matched with one end of the threaded rod 15 is formed in the moving block 16, the knob 14 is rotated clockwise, the threaded rod 15 is driven to rotate coaxially, the moving block 16 moves towards the center of the fixed seat 11, the bottom end of the moving block 16 is connected with the inner wall of the bottom of the fixed seat 11 in a sliding mode, a sliding groove is formed in the top of the fixed seat 11, two folding plates 19 are connected to the sliding mode inside of the sliding groove, one side, two opposite to the two folding plates 19 are respectively and fixedly connected with two sides of the moving block 16, the sliding groove is connected to the top end of the moving block 16 and fixedly mounted on the bottom end of the moving frame 18.
The implementation principle of the polishing device for the semiconductor baking support provided by the embodiment of the application is as follows: the knob 14 is rotated to drive the threaded rod 15 to rotate, and as the threaded hole matched with the threaded rod 15 is formed in the movable block 16, the movable block 16 can horizontally move in the fixed seat 11 along with the rotation of the threaded rod 15, then the movable frame 18 at the top end drives the second clamping jaw 17 to move, and when the required position is adjusted, the knob 14 stops rotating.
The above are preferred embodiments of the present application, and the scope of protection of the present application is not limited thereto, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (6)
1. The utility model provides a semiconductor bakes grinding device who holds in palm support, includes workstation (1), its characterized in that: the bottom end of the workbench (1) is fixedly connected with a base (2), the top ends of the workbench (1) are symmetrically and fixedly connected with supporting frames (3), the top ends of the two supporting frames (3) are fixedly connected with a top plate (4), the bottom end of the top plate (4) is provided with a driving mechanism, the bottom end of the driving mechanism is provided with a polishing block (10), the top end of the workbench (1) is fixedly connected with a fixed seat (11), one side of the top end of the fixed seat (11) is provided with a movable frame (18), and one side of the movable frame (18) is fixedly provided with a second clamping jaw (17);
the bottom of the moving frame (18) is provided with a moving assembly, the moving assembly comprises a moving block (16), a threaded rod (15) and a knob (14), two ends of the threaded rod (15) are rotatably connected with inner walls of two sides of the fixed base (11) respectively, the fixed frame (12) is fixedly mounted on the other side of the top of the fixed base (11), and a first clamping jaw (13) is fixedly mounted on one side of the fixed frame (12).
2. The polishing device for a semiconductor baking support according to claim 1, wherein: one end of the threaded rod (15) extends to one side of the fixed seat (11) and is fixedly installed on one side of the knob (14), the moving block (16) is sleeved on one end rod wall of the threaded rod (15), and the bottom end of the moving block (16) is in sliding connection with the inner wall of the bottom of the fixed seat (11).
3. The polishing device for a semiconductor baking support frame according to claim 1, wherein: the top end of the fixed seat (11) is provided with a sliding groove, the inside of the sliding groove is connected with two folding plates (19) in a sliding mode, and one sides, opposite to the two folding plates (19), of the two folding plates are fixedly connected with the two sides of the moving block (16) respectively.
4. The polishing device for a semiconductor baking support according to claim 1, wherein: the top of the moving block (16) is connected to the inside of the sliding groove in a sliding mode, and the top end of the moving block (16) is fixedly installed at the bottom end of the moving frame (18).
5. The polishing device for a semiconductor baking support according to claim 1, wherein: the driving mechanism comprises a sliding rail (5), a sliding plate (6), an electric telescopic rod (7), a driving box (8) and a connecting rod (9), the bottom end of the connecting rod (9) is fixedly installed at the top end of a grinding block (10), and the top end of the connecting rod (9) is fixedly installed at the bottom end of the driving box (8).
6. The polishing device for a semiconductor baking support frame according to claim 5, wherein: the top of drive case (8) and the bottom fixed connection of electric telescopic handle (7), the top of electric telescopic handle (7) and the bottom fixed connection of slide (6), the top of slide (6) and the bottom sliding connection of slide rail (5), the top fixed connection of slide rail (5) is in the bottom of roof (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221980861.7U CN217860407U (en) | 2022-07-29 | 2022-07-29 | Polishing device for semiconductor baking support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221980861.7U CN217860407U (en) | 2022-07-29 | 2022-07-29 | Polishing device for semiconductor baking support |
Publications (1)
Publication Number | Publication Date |
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CN217860407U true CN217860407U (en) | 2022-11-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202221980861.7U Active CN217860407U (en) | 2022-07-29 | 2022-07-29 | Polishing device for semiconductor baking support |
Country Status (1)
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CN (1) | CN217860407U (en) |
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2022
- 2022-07-29 CN CN202221980861.7U patent/CN217860407U/en active Active
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