CN217847893U - Distillation device and semiconductor cleaning equipment - Google Patents

Abstract

The utility model provides a distillation plant and semiconductor cleaning equipment for distillation semiconductor cleaning equipment exhaust liquid. The distillation device comprises a distillation chamber, a heating component and a condensing component; the distillation chamber is divided into a first sub-chamber, a second sub-chamber and a third sub-chamber; the first sub-cavity is used for containing liquid; the heating component is used for heating the liquid in the first sub-cavity so as to enable the liquid to be gasified into gas; the second sub-cavity is positioned above the first sub-cavity and communicated with the first sub-cavity; the condensation component is used for condensing the gas inside the second sub-cavity into liquid; the third sub-cavity is positioned on one side of the second sub-cavity and is communicated with the second sub-cavity; the third subchamber is adapted to collect liquid condensed within the second subchamber. The distillation device and the semiconductor cleaning equipment provided by the embodiment have the advantages of compact structure and small occupied area, and can improve the efficiency of a distillation process.

Description

Distillation device and semiconductor cleaning equipment

Technical Field

The utility model relates to a semiconductor manufacturing field specifically relates to a distillation plant and semiconductor cleaning equipment.

Background

In the manufacturing process of an Organic Light-Emitting Diode (OLED) display device, there are usually a plurality of cleaning processes. Taking the vapor deposition process as an example, after the metal mask plate adopted in the process is repeatedly used for a period of time, the metal mask plate needs to be cleaned by a cleaning agent and then can be put into use again. Specifically, most of cleaning agents used in the cleaning process are organic solvents; after the organic solvent is used for many times, the organic solvent becomes turbid, particulate matters exceed the standard, and the cleaning effect is influenced, so that the organic solvent needs to be distilled and purified regularly. Specifically, the distillation process is a separation process for separating the whole components by evaporating and condensing low-boiling components by utilizing the difference in boiling point of each component in a mixed liquid or liquid-solid system.

As shown in fig. 1, a conventional distillation apparatus generally includes a distillation tank 01 and a cooling tank 02 which are separately provided and connected by a U-shaped connection pipe 03; the distillation box 01 is used for distilling the recovered organic solvent, the distillation process is specifically to heat and gasify the organic solvent, and solid impurities which cannot be gasified can be separated in the process; the cooling tank 02 condenses the organic gas supplied through the connection pipe 03 and converts the condensed gas into an organic liquid. However, the existing distillation apparatus often occupies too large an area and has a complicated structure, which results in wasted space in a production workshop and is prone to malfunction. Moreover, since the gas generated during the distillation process is easily condensed in the U-shaped connection pipe and remains therein, the gas is easily lost during the transportation process, thereby causing a reduction in the efficiency of the distillation process.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a distillation plant and semiconductor cleaning equipment, it can solve among the prior art too big technical problem of distillation plant area to can improve the efficiency of distillation technology.

In order to achieve the purpose of the utility model, the utility model provides a distilling device which is used for distilling the liquid discharged by the semiconductor cleaning equipment; the device comprises a distillation chamber, a heating component and a condensing component; wherein the distillation chamber is divided into a first sub-chamber, a second sub-chamber, and a third sub-chamber; the second sub-cavity is positioned above the first sub-cavity and is communicated with the first sub-cavity; the third sub-cavity is positioned on one side of the second sub-cavity and is communicated with the second sub-cavity;

the first sub-cavity is used for containing the liquid; the heating component is used for heating the liquid contained in the first sub cavity so as to enable the liquid to be gasified into gas;

the condensing assembly is used for condensing the gas ascending into the second sub-cavity;

the third sub-chamber is for collecting liquid resulting from condensation within the second sub-chamber.

Optionally, the apparatus further comprises a separation member for separating the first sub-chamber and the second sub-chamber;

the separation assembly comprises a first separation plate and an air duct; wherein the content of the first and second substances,

the first separation plate is arranged between the first sub-cavity and the second sub-cavity, at least one connecting through hole is formed in the first separation plate, and two ends of the connecting through hole are respectively communicated with the second sub-cavity and the first sub-cavity;

the air guide pipes are positioned above the first partition plate, one ends of the air guide pipes are hermetically connected with the first partition plate, and the air guide pipes are communicated with the connecting through holes in a one-to-one correspondence manner; the other end of the air duct is communicated with the second sub-cavity.

Optionally, the condensing assembly comprises at least one condensing coil disposed inside the second sub-cavity;

the condensing coils are wound on the air guide pipes in a one-to-one correspondence manner and used for cooling the air in the air guide pipes.

Optionally, a second separation plate for separating the second sub-cavity from the third sub-cavity is arranged between the second sub-cavity and the third sub-cavity, a liquid outlet through hole is formed in the second separation plate, and two ends of the liquid outlet through hole are respectively communicated with the second sub-cavity and the third sub-cavity;

the first partition plate is positioned below the liquid outlet through hole, so that the liquid deposited on the first partition plate can overflow to the third sub-cavity through the liquid outlet through hole.

Optionally, the liquid discharged by the semiconductor cleaning equipment comprises an organic liquid and condensed water;

the bottom of the third sub-cavity is provided with a separation assembly, and the separation assembly is used for separating the organic liquid and the condensed water by utilizing the density difference between the organic liquid and the condensed water;

a first liquid discharge port is formed in the side face of the third sub-cavity and used for discharging the separated condensed water; and a second liquid outlet is formed in the bottom surface of the third sub-cavity and used for discharging the separated organic liquid.

Optionally, the separation assembly comprises a collection plate and a draft tube; wherein the content of the first and second substances,

the collecting plate divides the third sub-cavity into an upper space and a lower space, a drainage through hole is formed in the collecting plate, and two ends of the drainage through hole are respectively communicated with the upper space and the lower space;

the drainage tube is positioned in the lower space, and the liquid inlet end of the drainage tube is communicated with one end of the drainage through hole; the liquid outlet end of the drainage tube is communicated with the lower space.

Optionally, the separation assembly further comprises at least one riser disposed in the lower space, each riser being connected to a bottom surface and a side surface of the third sub-cavity to partition a plurality of sub-slots in the lower space;

the plurality of sub-grooves are arranged along the direction of the drainage tube pointing to the first drainage port.

Optionally, the pressure relief device further comprises a pressure detector and a pressure relief assembly;

the pressure detector is used for detecting the gas pressure inside the second subslot;

and the air inlet of the pressure relief assembly is communicated with the second sub-groove and is used for opening when the air pressure in the second sub-groove reaches a preset pressure threshold value so as to discharge the air in the second sub-groove.

Optionally, the second sub-cavity has an air outlet; the pressure relief assembly comprises a pressure relief pipeline and a condensation tank body; the air inlet of the pressure relief pipeline is communicated with the air outlet of the second sub-cavity, and the air outlet of the pressure relief pipeline is communicated with the condensation groove body; the condensation tank body is used for condensing the gas;

the condensation tank body is provided with a liquid outlet hole which is communicated with a liquid inlet of the first sub-cavity.

Optionally, a waste discharge port is formed at the bottom of the first sub-cavity; the waste discharge port is used for discharging sediment in the liquid;

the bottom surface of the first sub-cavity is obliquely arranged, so that the sediment at the bottom of the first sub-cavity flows to the waste discharge port.

As another technical solution, an embodiment of the present invention further provides a semiconductor cleaning apparatus, which includes a cleaning tank and a replacement tank; the cleaning tank is filled with first liquid for cleaning the surface of a piece to be cleaned; the replacement tank is filled with second liquid for replacing the first liquid remained on the surface of the piece to be cleaned; the semiconductor cleaning equipment is characterized by also comprising a mixed liquid separation device and the distillation device;

the distillation device is connected with a liquid outlet of the replacement tank through a pipeline and is used for distilling the liquid discharged from the replacement tank to obtain the second liquid; the distillation device is connected with the liquid inlet of the replacement tank through a pipeline and is used for conveying the second liquid obtained by distillation to the replacement tank;

and the mixed liquid separation device is connected with the liquid outlet and the liquid inlet of the distillation device and is used for separating the second liquid from the residual liquid in the distillation device after the distillation of the distillation device is finished and conveying the second liquid back to the distillation device.

The utility model discloses following beneficial effect has:

the utility model provides a pair of distillation plant divides the distillation chamber in order to be used for carrying on the first sub-chamber of liquid heating, be used for carrying on the gaseous second sub-chamber of condensation and be used for collecting the third sub-chamber of liquid to carry out the distillation flow of heating-condensation-recovery. Moreover, the second sub-chamber is located the top of first sub-chamber and communicates with it, and the third sub-chamber is located one side of second sub-chamber and communicates with it, like this, makes three sub-chamber communicate each other, compact structure, and can save the pipeline that is used for connecting the three to when reducing distillation plant's area, reduce the transmission consumption, and then improve distillation efficiency.

Drawings

FIG. 1 is a schematic structural view of a conventional distillation apparatus;

fig. 2 is a schematic structural diagram of a distillation apparatus provided in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the distillation apparatus and the semiconductor cleaning device provided by the present invention are described in detail below with reference to the accompanying drawings.

In order to solve the above-mentioned problems of the prior art, the present embodiment provides a distillation apparatus for distilling the liquid discharged from the semiconductor cleaning device, such as the organic cleaning agent after the cleaning process. The distillation apparatus comprises a distillation chamber 1, a heating assembly and a condensing assembly. Wherein the distillation chamber 1 is divided into a first sub-chamber 11, a second sub-chamber 12 and a third sub-chamber 13; the second sub-cavity 12 is positioned above the first sub-cavity 11 and is communicated with the first sub-cavity 11; the third sub-chamber 13 is located to one side of the second sub-chamber 12 and is in communication with the second sub-chamber 12. It should be noted that the third sub-cavity 13 is not limited to be located on a single side of the second sub-cavity 12, but may be located on multiple sides of the second sub-cavity 12 or surround the second sub-cavity 12.

The first sub-cavity 11 is used for containing liquid; the heating component is used for heating the liquid contained in the first sub-cavity 11 so as to enable the liquid to be gasified into gas; specifically, the heating temperature of the heating assembly may be set according to the boiling point of the liquid component desired to be obtained or separated. According to the principle of molecular thermal motion, the gas formed by gasification can continuously move in the space formed by the first sub-cavity 11 and the second sub-cavity 12, and the space is filled with the gas along with the change of gasification, namely, the gas generated by the first sub-cavity 11 can continuously flow into the second sub-cavity 12 communicated with the first sub-cavity. Moreover, the second sub-cavity 12 is directly arranged above the first sub-cavity 11, and a steam transmission pipeline does not need to be additionally arranged, so that the transmission distance of the organic gas and the loss in the transmission process can be reduced, and the distillation efficiency can be improved.

The condensing assembly serves to condense the gas rising inside the second sub-chamber 12 into a liquid. The third sub-chamber is for collecting liquid resulting from condensation within the second sub-chamber 12. Therefore, a condensate conveying pipeline is not required to be additionally arranged between the third sub-cavity 13 and the second sub-cavity 12, so that the liquid conveying distance and the loss in the conveying process can be reduced, and the distillation efficiency can be further improved.

As shown in fig. 2, in the present embodiment, the distillation chamber 1 is divided into a first sub-chamber 11, a second sub-chamber 12, and a third sub-chamber 13 which are communicated with each other, so that a complete heating-condensing-recycling distillation process can be completed inside the distillation chamber 1, and a pipeline for connecting the three can be omitted, thereby reducing the floor space of the distillation apparatus, reducing the transmission consumption, and further improving the distillation efficiency. Moreover, when the distillation device in the embodiment is overhauled, only one distillation chamber 1 is required to be overhauled by opening the chamber, and a plurality of chambers such as a distillation box and a cooling box do not need to be overhauled respectively, so that the overhauling efficiency is greatly improved.

In some embodiments, as shown in fig. 2, the distillation apparatus further comprises a separation assembly for separating the first sub-chamber 11 and the second sub-chamber 12. The partition assembly comprises a first partition plate 14 and an airway tube 15. The first separating plate 14 is arranged between the first sub-chamber 11 and the second sub-chamber 12, and is provided with at least one connecting through hole, and two ends of the connecting through hole are respectively communicated with the second sub-chamber 12 and the first sub-chamber 11. The air ducts 15 are positioned above the first partition plate 14 and communicated with the connecting through holes in a one-to-one correspondence manner; one end of the gas-guide tube 15 is connected with the first separating plate 14 in a sealing way, and the other end of the gas-guide tube 15 is communicated with the second sub-cavity 12 so as to guide gas into the upper part of the second sub-cavity 12. Because the liquid in the first sub-cavity 11 is continuously gasified, correspondingly, the first sub-cavity 11 continuously conveys gas to the second sub-cavity 12, and therefore an upward gas flow is formed inside the gas guide pipe 15; and the airflow, after flowing into the second sub-chamber 12 from the upper port of the air duct 15, will collide with the top wall and the side wall of the second sub-chamber 12 and then flow downward into the space surrounded by the outer peripheral surface of the air duct 15 and the inner wall of the second sub-chamber 12, and will not flow back to the inside of the first sub-chamber 11 through the air duct 15. In some preferred embodiments, as shown in fig. 2, the edge of the first partition wall 14 is sealingly connected to the inner wall of the distillation chamber 1.

In some embodiments, as shown in fig. 2, a second separation plate 122 is disposed between the second sub-chamber 12 and the third sub-chamber 13 for separating the second sub-chamber from the third sub-chamber 13, a liquid outlet hole is formed in the second separation plate 122, and two ends of the liquid outlet hole 121 are respectively communicated with the second sub-chamber 12 and the third sub-chamber 13. Because the edge of the lower port of the gas-guide tube 15 is hermetically connected with the first partition plate 14, the liquid generated in the second subchamber 12 can also be stored in the shallow groove surrounded by the upper surface of the first partition plate 14, the outer peripheral surface of the gas-guide tube 15, the inner wall of the second subchamber 12 and the surface of the second partition plate 122. On this basis, the first partition plate 14 is located below the liquid outlet through hole 121, so that the liquid stored above the first partition plate 14 can overflow into the third sub-cavity 13 through the liquid outlet through hole 121, and the liquid is introduced into the third sub-cavity 13, thereby realizing automatic collection of the liquid. In some preferred embodiments, the first partition plate 14 may be inclined at an angle to promote the liquid to flow toward the liquid outlet through hole 121.

In some specific embodiments, the flow guiding through hole is, for example, a square hole; accordingly, the air duct 15 provided corresponding to each square hole is, for example, a square tube. Furthermore, the air duct 15 is connected with the first partition plate 14 by welding to ensure the sealing performance of the connection.

In some embodiments, the condensing assembly comprises a condensing coil 2 disposed inside the second sub-chamber 12; specifically, the condensing coil 2 is a spiral cooling pipe, which can maintain a lower temperature at all times and is less than or equal to the liquefaction temperature of the gas inside the second sub-cavity 12, so as to condense the gas through contact. As shown in fig. 2, the condensing coil 2 is wound on the air duct 15 in a one-to-one correspondence manner, so that the organic gas can directly contact with the condensing coil 2 when flowing into the second sub-chamber 12 from the upper port of the air duct 15 and continuously flowing downwards to the space enclosed by the outer peripheral surface of the air duct 15 and the inner wall of the second sub-chamber 12, so as to be liquefied into liquid rapidly and be deposited on the first partition plate 14, thereby improving the condensing efficiency.

However, the arrangement of the condensing assembly in this embodiment is not limited to this, for example, in other embodiments, the condensing assembly may further include a condensing coil disposed around the outside of the second sub-chamber 12, so as to condense the organic gas inside the second sub-chamber 12 by lowering the temperature of the second sub-chamber 12 as a whole; the arrangement mode of the condensation component is convenient for installation and maintenance of the condensation component.

Since some semiconductor cleaning processes use organic liquid as cleaning agent, and the liquid may directly contact with air during the period from the liquid discharge from the semiconductor cleaning equipment to the start of distillation, a certain amount of water is not necessarily mixed in the liquid to be distilled, and accordingly, a certain amount of water vapor is mixed in the gas formed by vaporization of the liquid, and a certain amount of condensed water may be mixed in the liquid formed by condensation; it can be seen that in order to obtain a pure organic liquid, the condensed water must be separated from the liquid. In order to solve this technical problem, in some embodiments, the bottom of the third sub-chamber 13 is provided with a separation assembly 131, and the separation assembly 131 is used for separating organic liquid and condensed water contained in the liquid; in particular, the separation assembly 131 can utilize the property that water is immiscible with the organic liquid and has a density much less than that of the organic liquid to float the water above the organic liquid to separate the two. A first liquid discharge port 133 is formed in the side surface of the third sub-cavity 13 and is used for discharging separated condensed water; a second liquid outlet 134 is disposed at the bottom of the third sub-chamber 13 for discharging the separated organic liquid, so as to obtain a pure organic liquid.

In some embodiments, the separation assembly includes a collection plate 131 and a draft tube 132 positioned below the collection plate 131. Wherein the collecting plate 131 is positioned at the top of the separation assembly and is higher than the first liquid discharge port 133 of the third sub-chamber 13, and can divide the third sub-chamber 13 into an upper space and a lower space; the collecting plate 131 is provided with a drainage through hole, and two ends of the drainage through hole are respectively communicated with the upper space and the lower space, so that liquid flowing into the upper space of the third sub-cavity 13 is concentrated and flows out of the lower space through the drainage through hole. The drainage tube 132 is positioned in the lower space, and the liquid inlet end of the drainage tube is communicated with one end of the drainage through hole; the liquid outlet end of the drainage tube is communicated with the lower space.

In some preferred embodiments, the liquid outlet end of the drainage tube 132 extends to the bottom of the third sub-cavity 13, so that the collected liquid can flow into the third sub-cavity 13 from the bottom, thereby avoiding causing large disturbance to the liquid accumulated in the third sub-cavity 13, ensuring the layering effect of the liquid, and improving the efficiency of separating condensed water.

In some preferred embodiments, as shown in fig. 2, the separation assembly further comprises at least one riser 135 disposed in the lower space of the third sub-chamber 13, wherein the bottom end of each riser 135 is connected to the bottom surface and the side surface of the third sub-chamber 13, and the top end of each riser 135 is spaced from the collecting plate 131 to divide a plurality of sub-grooves in the lower space of the third sub-chamber 13, and the plurality of sub-grooves are arranged along the drainage tube in the direction toward the first drainage port 133. Specifically, the sub-tank directly communicated with the drainage tube 132 is the first sub-tank, and the sub-tank directly communicated with the first drainage port 133 is the last sub-tank; after the first sub-tank is full of liquid, the liquid overflows to the adjacent sub-tank, and so on until the liquid collected in the last sub-tank reaches the first drainage port 133, so that the condensed water on the upper layer of the liquid can be drained through the first drainage port 133. In this way, the inlet flow flowing out of the draft tube 132 may cause direct disturbance to the liquid in the first sub-tank only, and the disturbance caused by the inlet flow may be weakened as the liquid sequentially side-overflows to other sub-tanks, so that the liquid inside the last sub-tank directly communicated with the first drain port 133 may be kept stable, thereby improving the liquid separation effect.

Taking the structure of the third subchamber 13 as shown in fig. 2 as an example, the first drainage port 133 is arranged at the opposite side of the drainage tube 132; the plate surface of the riser 135 is disposed perpendicular to the plane formed between the first drain port 133 and the draft tube 132.

In some embodiments, the bottom of the first sub-chamber 11 is opened with a waste outlet 111 for discharging non-gasified deposits in the organic liquid. Further, the bottom surface of the first sub-chamber 11 is inclined so as to promote the movement of the sediment at the bottom of the first sub-chamber 11 toward the waste discharge port 111.

In some embodiments, the heating assembly comprises a plurality of heating rods 3, the plurality of heating rods 3 being evenly distributed inside the first sub-chamber 11 to transfer heat to the organic liquid by direct contact. Specifically, the set temperature of the heating rod 3 may be set according to the boiling point of the liquid to be obtained or separated.

However, the arrangement of the heating element in this embodiment is not limited to this, for example, in other embodiments, the heating element may also be arranged outside the first sub-cavity 11 to heat the organic liquid inside the first sub-cavity 11 by heating the whole first sub-cavity 11; alternatively, in other embodiments, the heating assembly may also employ a heating ring, a heating grid, or other shaped heater.

When the heating assembly heats the liquid contained in the first sub-cavity 11, the liquid is gasified to form a large amount of gas; at excessive power of the heating assembly, the large amount of gas may cause a sharp increase in the gas pressure inside the second sub-chamber 12, and may even cause cracking of the retort chamber wall. To avoid this, in some embodiments, the distillation apparatus further comprises a pressure detector 5 and a pressure relief assembly 4. Wherein the pressure detector 5 is used for detecting the gas pressure inside the second sub-cavity 12. The air inlet and the second sub-chamber 12 intercommunication of pressure relief subassembly 4 for open when the inside gas pressure of second sub-chamber 12 reaches preset pressure threshold value, with the inside gas of the sub-chamber 12 of exhaust second, thereby carry out the pressure release to the sub-chamber 12 of second.

In actual production, the pressure relief assembly 4 can be switched on and off by adopting an electromagnetic valve; and pressure detector 5 can be connected with external control ware to can judge whether it reaches preset pressure threshold value according to the pressure value that pressure detector 5 detected by external control ware, and send corresponding signal of telecommunication to the solenoid valve according to the judged result, thereby realize the automatic pressure release to second sub-chamber 12. Moreover, the external controller can also control the power of the heating assembly according to the pressure value detected by the pressure detector 5, specifically, when the pressure value reaches a preset pressure threshold value, the power of the heating assembly is controlled to be reduced, otherwise, the power of the heating assembly is controlled to be increased, so that the heating assembly can be heated at the maximum power while the cracking of the chamber wall caused by overlarge pressure is avoided, and the distillation efficiency is improved as much as possible.

In some embodiments, the second subchamber 12 has an air outlet at the top; the pressure relief assembly 4 includes a pressure relief pipeline 41 and a condensation tank 44. Wherein, the air inlet of the pressure relief pipeline 41 is communicated with the air outlet of the second sub-cavity 1, and the air outlet of the pressure relief pipeline 41 is communicated with the condensation groove body 44; the condensation tank 44 is used for condensing the gas delivered to the interior thereof. The condensation trough 44 has a liquid outlet hole, which is communicated with the liquid inlet of the first sub-cavity 11.

Further, in some preferred embodiments, the pressure relief assembly 4 further comprises a first fluid line 42, a second fluid line 43, and a recovery tank 45. Wherein, the liquid inlet of the first liquid conveying pipeline 42 is communicated with the liquid outlet hole of the condensation groove body 44, and the liquid outlet of the first liquid conveying pipeline 42 is communicated with the recovery groove body 45, so that the liquid can flow into the recovery groove body 45; the liquid inlet of the second infusion pipeline 43 is communicated with the recovery groove body 45, and the liquid outlet through hole of the second infusion pipeline 43 is communicated with the liquid inlet arranged on the side surface of the first sub-cavity 11 so as to recover the liquid and distill the liquid again.

Specifically, as shown in fig. 2, a main liquid inlet 112 is further formed on a side surface of the first sub-chamber 11, and is used for adding the liquid to be distilled into the first sub-chamber 11 before the distillation starts.

As another embodiment, the present embodiment also provides a semiconductor cleaning apparatus. Specifically, as shown in fig. 3, the semiconductor cleaning apparatus includes a cleaning tank 10 and a replacement tank 20; wherein, the cleaning tank 10 contains a first liquid for cleaning the surface of the object to be cleaned, for example, to wash away the residual photoresist on the surface of the metal mask plate, and the first liquid is NMP (N-methyl pyrrolidone), for example, and has a higher boiling point; the replacement tank 20 contains a second liquid for replacing the first liquid remaining on the surface of the workpiece to be cleaned, specifically, the second liquid is hydrofluoroether, which has a low boiling point and a low molecular tension, and can replace the first liquid attached to the metal mask plate.

The semiconductor cleaning apparatus further includes a mixed liquid separating device 50 and a distillation device 60 in the above-described embodiments. Also, as shown in fig. 3, in some preferred embodiments, the semiconductor cleaning apparatus further includes two sets of recovery tanks 30 and supply tanks 40, the two sets of recovery tanks 30 and supply tanks 40 being disposed corresponding to the cleaning tank 10 and the replacement tank 20, respectively. The recovery tank 30 buffers the liquid discharged from the cleaning tank 10 or the replacement tank 20, and the supply tank 40 buffers the first liquid transferred to the cleaning tank 10 or the second liquid transferred to the replacement tank 20.

As shown in fig. 3, the distillation apparatus 60 is connected to the drain port of the replacement tank 20 via a line and the recovery tank 30, and is used for distilling the liquid discharged from the replacement tank 20 to obtain a second liquid; the distillation device 60 is connected with the liquid inlet of the replacement tank 20 through a pipeline and the supply tank 40, and is used for conveying the second liquid obtained by distillation to the replacement tank 20.

The mixed liquid separation device 50 is connected to the distillation device 60, and is configured to separate the second liquid from the remaining liquid in the distillation device 60 after the distillation device 60 completes distillation, and to send the second liquid back to the supply tank 40; preferably, as shown in FIG. 3, the mixed liquid separator 50 is connected to the recovery tank 30 of the replacement tank 20 via a pipe so that the second liquid is introduced into the liquid inlet of the distillation apparatus 60 via the recovery tank 30.

In some embodiments, as shown in fig. 3, the semiconductor cleaning apparatus further comprises a vacuum distiller 70, the vacuum distiller 70 is connected to the liquid drain of the cleaning tank 10 through a pipeline and the recycling tank 30, and is used for distilling the liquid drained from the cleaning tank 10 to obtain a first liquid; the vacuum distiller 70 is connected to the liquid inlet of the wash tank 10 through a pipe and a supply tank 40 for delivering the second liquid obtained by distillation to the wash tank 10. The mixed liquid separating device 50 is also used to separate the second liquid from the remaining liquid inside the distillation device 60 after the distillation device 60 completes the distillation. The mixed liquid separation apparatus 50 is also connected to the recovery tank 30 of the cleaning tank 10 to separate the first liquid from the remaining liquid of the distillation apparatus 60 and convey it to the vacuum distillation machine 70 for secondary distillation.

The distillation plant that this embodiment provided, through dividing the distillation chamber into first sub-chamber, the sub-chamber of second and the sub-chamber of third, make the distillation flow of heating-condensation-recovery can accomplish at the distillation chamber to make distillation plant compact structure, reduce distillation plant's area, can save the pipeline that is used for connecting the three moreover, thereby reduce the transmission and consume, and then can improve distillation efficiency.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (11)

1. A distillation device is used for distilling liquid discharged by a semiconductor cleaning device; the device is characterized by comprising a distillation chamber, a heating component and a condensing component; wherein the distillation chamber is divided into a first sub-chamber, a second sub-chamber, and a third sub-chamber; the second sub-cavity is positioned above the first sub-cavity and is communicated with the first sub-cavity; the third sub-cavity is positioned on one side of the second sub-cavity and is communicated with the second sub-cavity;

the first sub-cavity is used for containing the liquid; the heating component is used for heating the liquid contained in the first sub-cavity so as to enable the liquid to be gasified into gas;

the condensing assembly is used for condensing the gas ascending into the second sub-cavity;

the third subchamber is adapted to collect liquid that condenses within the second subchamber.

2. Distillation apparatus according to claim 1, further comprising a separation assembly for separating the first sub-chamber and the second sub-chamber;

the separation assembly comprises a first separation plate and an air guide pipe; wherein the content of the first and second substances,

the first separation plate is arranged between the first sub-chamber and the second sub-chamber, at least one connecting through hole is formed in the first separation plate, and two ends of the connecting through hole are respectively communicated with the second sub-chamber and the first sub-chamber;

the air guide pipes are positioned above the first partition plate, one end of each air guide pipe is hermetically connected with the first partition plate, and the air guide pipes are communicated with the connecting through holes in a one-to-one correspondence manner; the other end of the air duct is communicated with the second sub-cavity.

3. Distillation apparatus according to claim 2, wherein the condensing assembly comprises at least one condensing coil disposed inside the second sub-chamber;

the condensing coils are wound on the air guide pipes in a one-to-one correspondence mode and used for cooling air in the air guide pipes.

4. The distillation device according to claim 2, wherein a second separation plate for separating the second sub-chamber from the third sub-chamber is arranged between the second sub-chamber and the third sub-chamber, the second separation plate is provided with a liquid outlet through hole, and two ends of the liquid outlet through hole are respectively communicated with the second sub-chamber and the third sub-chamber;

the first partition plate is positioned below the liquid outlet through hole, so that the liquid deposited on the first partition plate can overflow to the third sub-cavity through the liquid outlet through hole.

5. The distillation apparatus according to claim 1, wherein the liquid discharged from the semiconductor cleaning device includes an organic liquid and condensed water;

the bottom of the third sub-cavity is provided with a separation assembly, and the separation assembly is used for separating the organic liquid and the condensed water by utilizing the density difference between the organic liquid and the condensed water;

a first liquid discharge port is formed in the side face of the third sub-cavity and used for discharging the separated condensed water; and a second liquid outlet is formed in the bottom surface of the third sub-cavity and used for discharging the separated organic liquid.

6. Distillation apparatus according to claim 5, wherein the separation assembly comprises a collection plate and a draft tube; wherein the content of the first and second substances,

the collecting plate divides the third sub-cavity into an upper space and a lower space, a drainage through hole is formed in the collecting plate, and two ends of the drainage through hole are respectively communicated with the upper space and the lower space;

the drainage tube is positioned in the lower space, and the liquid inlet end of the drainage tube is communicated with one end of the drainage through hole; the liquid outlet end of the drainage tube is communicated with the lower space.

7. The distillation apparatus of claim 6, wherein the separation assembly further comprises at least one riser disposed in the lower space, each riser connected to a bottom surface and a side surface of the third sub-cavity to separate a plurality of sub-slots in the lower space;

the plurality of sub-grooves are arranged along the direction of the drainage tube pointing to the first drainage port.

8. The distillation apparatus of claim 1, further comprising a pressure detector and a pressure relief assembly;

the pressure detector is used for detecting the gas pressure inside the second subslot;

and the air inlet of the pressure relief assembly is communicated with the second sub-groove and is used for opening when the air pressure in the second sub-groove reaches a preset pressure threshold value so as to discharge the air in the second sub-groove.

9. The distillation apparatus of claim 8, wherein the second sub-chamber has an air outlet; the pressure relief assembly comprises a pressure relief pipeline and a condensation tank body; the air inlet of the pressure relief pipeline is communicated with the air outlet of the second sub-cavity, and the air outlet of the pressure relief pipeline is communicated with the condensation groove body; the condensation tank body is used for condensing the gas;

the condensation groove body is provided with a liquid outlet hole which is communicated with the liquid inlet of the first sub-cavity.

10. The distillation device according to claim 1, wherein a waste discharge port is formed at the bottom of the first sub-cavity; the waste discharge port is used for discharging sediment in the liquid;

the bottom surface of the first sub-cavity is obliquely arranged, so that the sediment at the bottom of the first sub-cavity flows to the waste discharge port.

11. A semiconductor cleaning apparatus includes a cleaning tank and a replacement tank; the cleaning tank is filled with first liquid for cleaning the surface of a piece to be cleaned; the replacement tank is filled with second liquid for replacing the first liquid remained on the surface of the piece to be cleaned; characterized in that the semiconductor cleaning apparatus further comprises a mixed liquid separating means and the distillation apparatus according to any one of claims 1 to 10;

the distillation device is connected with a liquid outlet of the replacement tank through a pipeline and is used for distilling the liquid discharged from the replacement tank to obtain the second liquid; the distillation device is connected with the liquid inlet of the replacement tank through a pipeline and is used for conveying the second liquid obtained by distillation to the replacement tank;

and the mixed liquid separation device is connected with the liquid outlet and the liquid inlet of the distillation device and is used for separating the second liquid from the residual liquid in the distillation device after the distillation of the distillation device is finished and conveying the second liquid back to the distillation device.

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