CN217768363U

CN217768363U - MOSPET semiconductor device

Info

Publication number: CN217768363U
Application number: CN202221091980.7U
Authority: CN
Inventors: 张志�; 周伟伟
Original assignee: Nanjing Weipan Microelectronics Co ltd
Current assignee: Nanjing Weipan Microelectronics Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-11-08
Anticipated expiration: 2032-05-09

Abstract

The utility model belongs to the technical field of the MOSFET semiconductor device, especially, be a MOSPET semiconductor device, the device comprises a device body, the mounting groove that the linear array distributes is seted up to one side of device body, it is connected with the pin to rotate through the pivot on the mounting groove inner wall, sliding connection has the pin in the mounting groove, set up the draw-in groove that the linear array distributes on the pin, the one end that the pin is close to the mounting groove notch is provided with the limited subassembly, the other end and the draw-in groove plug-in connection of pin, and the other end of pin is provided with the limited pin pivoted elastic component, the utility model discloses, through setting up the pin to set up the draw-in groove on the pin, utilize the pin to block the pin, thereby make the pin can't break away from the device body, when needing adjustment pin length, can promote the pin, make pin overlength part slide in the mounting groove can, simultaneously, the pin can restrict pin always and break away from the device body to this suitability and the practicality that have improved the device body.

Description

MOSPET semiconductor device

Technical Field

The utility model relates to a MOSFET semiconductor device technical field specifically is a MOSPET semiconductor device.

Background

The MOSFET semiconductor device is also called a MOSFET, and is a field effect transistor widely used in analog circuits and digital circuits, and can be divided into two types of "N-type" and "P-type" according to the difference in polarity of "channels" (working carriers), which are commonly called NMOSFET and PMOSFET.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a MOSPET semiconductor device has solved the pin that present MOSFET semiconductor device used and can not adjust length according to actual demand, and the pin fracture back, can lead to the unable problem of using of whole MOSFET semiconductor device.

(II) technical scheme

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

the MOSPET semiconductor device comprises a device body, wherein a mounting groove which is distributed in a linear array mode is formed in one side of the device body, a buckling rod is connected to the inner wall of the mounting groove in a rotating mode through a rotating shaft, a pin is connected in the mounting groove in a sliding mode, a clamping groove which is distributed in the linear array mode is formed in the pin, a limiting component is arranged at one end, close to a notch of the mounting groove, of the buckling rod, the other end of the buckling rod is connected with the clamping groove in an inserting mode, and a limiting elastic component for limiting the buckling rod to rotate is arranged at the other end of the buckling rod.

Further, elastic component includes thick pole and thin pole of mutual plug-in connection, thick pole rotates through the pivot to be connected on the mounting groove inner wall, stria and thin pole sliding connection that the other end of thick pole was seted up, the first spring of one end fixedly connected with of thin pole, first spring are located the stria, the other end of thin pole rotates through the pivot to be connected on detaining the pole.

Furthermore, it includes the threaded rod to inject the subassembly, threaded rod threaded connection is in the screw hole of seting up on the device body, and the expansion end of threaded rod is contradicted with the one end of detaining the pole and is connected.

Further, sliding connection has the current conducting plate in the mounting groove, one side of current conducting plate is contradicted with the one end of pin and is connected, the opposite side fixedly connected with second spring of current conducting plate, the one end of second spring is contradicted on the mounting groove inner wall.

Furthermore, the outer side of the pin is slidably sleeved with a conductive ring, and the conductive ring is fixedly connected in the mounting groove.

(III) advantageous effects

Compared with the prior art, the utility model provides a MOSPET semiconductor device possesses following beneficial effect:

1. the utility model discloses, through setting up the knot pole to set up the draw-in groove on the pin, utilize the knot pole to block the pin, thereby make the unable separation device body of pin, when needing adjustment pin length, can promote the pin, make pin overlength part slide in the mounting groove can, simultaneously, the knot pole can restrict the pin always and break away from the device body, with this suitability and the practicality that has improved the device body.

2. The utility model discloses, through setting up the threaded rod, when the pin on the installation body is taken out and changed to needs, can rotate the threaded rod, make the expansion end extrusion of threaded rod detain the one end of pole perk to the one end that the pin was detained to the messenger detains the pole breaks away from the draw-in groove that sets up on the pin, with this messenger's pin breaks away from the constraint, and can be smooth from the mounting groove roll-off, the device easy operation is convenient, has avoided the device body because of the problem that the pin fracture can't be used

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic perspective view of the cross section of the device body of the present invention;

FIG. 3 is a schematic structural view of a cross section of the device body of the present invention;

fig. 4 is a partially enlarged view of a point a in fig. 2.

In the figure: 1. a device body; 2. a pin; 3. a card slot; 4. a threaded rod; 5. mounting grooves; 6. a conductive plate; 7. conducting rings; 8. a buckle rod; 9. an elastic component; 901. a thick rod; 902. a thin rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

As shown in fig. 1 to 4, an embodiment of the present invention provides a mostat semiconductor device, including a device body 1, a mounting groove 5 disposed in a linear array distribution is formed on one side of the device body 1, a buckle rod 8 is rotatably connected to an inner wall of the mounting groove 5 through a rotating shaft, a pin 2 is slidably connected to the mounting groove 5, a slot 3 disposed in the pin 2 and disposed in the linear array distribution, a limiting component is disposed at an end of the buckle rod 8 close to a slot of the mounting groove 5, the other end of the buckle rod 8 is connected to the slot 3 in an inserting manner, and an elastic component 9 is disposed at the other end of the buckle rod 8 for limiting the rotation of the buckle rod 8;

when needing to adjust 2 lengths of pin, can promote pin 2, make the position of 2 overlengths of pin slide in mounting groove 5, and simultaneously, detain pole 8 in the mounting groove 5 through elastic component 9's elasticity, make the one end plug-in connection who detains pole 8 in the draw-in groove 3 that corresponds, thereby make pin 2 can only slide in on mounting groove 5, and can not the roll-off, wherein, the one end that detains pole 8 and be located mounting groove 5 notch is provided with the limited subassembly, the other end of detaining pole 8 then is used for with draw-in groove 3 plug-in connection, and set up elastic component 9.

As shown in fig. 4, in some embodiments, the elastic component 9 includes a thick rod 901 and a thin rod 902 which are connected to each other in an inserting manner, the thick rod 901 is rotatably connected to the inner wall of the mounting groove 5 through a rotating shaft, a thin groove formed at the other end of the thick rod 901 is slidably connected to the thin rod 902, one end of the thin rod 902 is fixedly connected with a first spring, the first spring is located in the thin groove, and the other end of the thin rod 902 is rotatably connected to the buckle rod 8 through the rotating shaft;

the thick stick 901 allows a part of the thin stick 902 to be ejected out of the slot cavity by the elastic force of the first spring in the slot, so that the whole elastic assembly 9 has elasticity, and thus one end of the buckle rod 8 is always pressed by the thin stick 902 and has elasticity.

As shown in fig. 2 and 3, in some embodiments, the limiting component includes a threaded rod 4, the threaded rod 4 is screwed into a threaded hole formed in the device body 1, and a movable end of the threaded rod 4 is in interference connection with one end of the buckle rod 8;

utilize the instrument to rotate threaded rod 4, make the expansion end of threaded rod 4 pass the screw hole to the one end of 8 perks of extrusion knot pole, thereby the one end that makes 8 knot poles of knot detain draw-in groove 3 breaks away from draw-in groove 3, with this make pin 2 bai hold in the palm the constraint, can freely roll off or slide in to mounting groove 5.

As shown in fig. 2 and 3, in some embodiments, a conductive plate 6 is slidably connected in the mounting groove 5, one side of the conductive plate 6 is abutted against one end of the pin 2, the other side of the conductive plate 6 is fixedly connected with a second spring, and one end of the second spring is abutted against the inner wall of the mounting groove 5;

the current-conducting plate 6 makes the current-conducting plate 6 move and extrude the pin 2 to the 2 directions of pin all the time through the elasticity of second spring to this makes pin 2 and current-conducting plate 6 conflict each other and electric connection, current-conducting plate 6 and the chip electric connection in the device body 1.

As shown in fig. 2 and 3, in some embodiments, a conductive ring 7 is slidably sleeved outside the pin 2, and the conductive ring 7 is fixedly connected in the mounting groove 5;

the conducting ring 7 is electrically connected with the chip in the device body 1, and the conducting ring 7 is used for contacting and electrically connecting with the pin 2, so that poor contact between the pin 2 and the conducting plate 6 is avoided.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A mostat semiconductor device, comprising a device body (1), characterized in that: the device comprises a device body (1) and is characterized in that a mounting groove (5) with linear array distribution is formed in one side of the device body (1), a buckling rod (8) is connected to the inner wall of the mounting groove (5) in a rotating mode through a rotating shaft, a pin (2) is connected to the mounting groove (5) in an sliding mode, a clamping groove (3) with linear array distribution is formed in the pin (2), a limiting component is arranged at one end, close to a mounting groove (5) notch, of the buckling rod (8), the other end of the buckling rod (8) is connected with the clamping groove (3) in an inserting mode, and the other end of the buckling rod (8) is provided with a limiting elastic component (9) for rotating the buckling rod (8).

2. A moshot semiconductor device in accordance with claim 1, wherein: the elastic component (9) comprises a thick rod (901) and a thin rod (902) which are connected in an inserting mode, the thick rod (901) is rotatably connected to the inner wall of the mounting groove (5) through a rotating shaft, a fine groove formed in the other end of the thick rod (901) is connected with the thin rod (902) in a sliding mode, a first spring is fixedly connected to one end of the thin rod (902) and located in the fine groove, and the other end of the thin rod (902) is rotatably connected to the buckling rod (8) through the rotating shaft.

3. A moshot semiconductor device in accordance with claim 1, wherein: the limiting component comprises a threaded rod (4), the threaded rod (4) is in threaded connection with a threaded hole formed in the device body (1), and the movable end of the threaded rod (4) is in abutting connection with one end of the buckling rod (8).

4. A moshot semiconductor device in accordance with claim 1, wherein: sliding connection has current conducting plate (6) in mounting groove (5), one side and the one end of pin (2) of current conducting plate (6) are contradicted and are connected, the opposite side fixedly connected with second spring of current conducting plate (6), the one end of second spring is contradicted on mounting groove (5) inner wall.

5. A moshot semiconductor device in accordance with claim 1, wherein: the outer side of the pin (2) is slidably sleeved with a conducting ring (7), and the conducting ring (7) is fixedly connected in the mounting groove (5).